Electromechanical Relays Selection Guide

Transcription

1 Electromechanical Relays Selection Guide Latching JAN Non-Latching RF Surface-Mount Established Reliability Loopback PST Environmental Attenuated

2 Switching Solutions Teledyne Relays has been the world s innovative leader in the manufacture of ultraminiature, hermetically sealed, electromechanical and solid-state switching products for more than 0 years. The company s comprehensive product line meets a wide range of requirements for defense and aerospace, industrial, commercial, medical and RF & wireless applications. Business Focus MIL QPL & COTS Solid-State Relays MIL QPL & COTS Electromechanical Relays HiRel (Space) Electromechanical Relays RF & Microwave Relays & Coaxial Switches Industrial Solid-State Relays Switching Matrices Markets Commercial & Military Aviation Defense & Aerospace Telecom/Communications (Wireless) Instrumentation & Test Industrial Power & Motion Control Medical Applications Product Assurance Under an aggressive Total Quality Management (TQM) program, Teledyne Relays has embraced a continuous improvement culture. With recognized certifi cations such as Boeing D-, MIL-STD-0, AS/EN/ JISQ00:00 (Rev C) and ISO 00:00 Teledyne Relays has become a primary supplier of switching solutions with the highest quality and reliability to industry leaders around the world. Technical Service & Customer Support Teledyne Relays provides easy access to technical service and customer support. Our websites make it easy to fi nd technical information, buy products and even get responses within hours. Switching solutions are only a mouse click away at or at teledyne-europe.com. Information about coax switches is available at Teledyne Relays offer superior signal integrity up to 0 Gbps. See the RF relays section in our website.

3 Table of Contents RF RELAYS Series Description Page LB/GLB/SGLB LoopBack Relay with Built-in AC Bypass Capacitors - RF/GRF/SGRF/SRF00 High Repeatability, Broadband TO- Relays, Non-Latching DPDT RF/GRF/SGRF/SRF0 - RF/GRF/SGRF00 RF/GRF/SGRF0 High Repeatability, Broadband Centigrid Relays, Non-Latching DPDT GRF Surface-Mount Centigrid RF Relays, Non-Latching DPDT RF/GRF RF/GRF High Repeatability, Broadband TO- Relays, Non-Latching SPDT RF/GRF Broadband TO- RF Relays, Magnetic-Latching SPDT RF/ High Power DPDT Half-Size Crystal Can Relay 0 GRF Surface-Mount TO- RF Relays, Magnetic-Latching DPDT 0 RF0/GRF0 Broadband RF Relays, Magnetic-Latching DPDT RF/GRF/SGRF Surface-Mount PST TO- Relay RF0/RF High Repeatability TO- Relays, Normally Closed, Bypass RF0/RF High Repeatability TO- Relays, Normally Open, Bypass A0/GA0 Broadband Attenuator RF Relay A/GA Broadband Attenuator RF Relay COMMERCIAL RELAYS C Centigrid Relays (CMOS Compatible), Magnetic-Latching DPDT Centigrid Relays, Non-Latching DPDT TO- Relays, Non-Latching DPDT TO- Relays, Magnetic-Latching DPDT TO- Relays, Non-Latching Sensitive DPDT COMMERCIAL SURFACE-MOUNT RELAYS S Surface-Mount Centigrid Relays, Non-Latching DPDT S Surface-Mount Centigrid Relays, Non-Latching Sensitive DPDT S Surface-Mount Centigrid Relays, Non-Latching DPDT S Surface-Mount TO- Relays, Magnetic-Latching DPDT See specifi c series for additional features and options Continued on next page 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

4 Table of Contents ESTABLISHED RELIABILITY RELAYS Series Description Page ER Centigrid Relays, Non-Latching DPDT 0 ERC Centigrid Relays (CMOS Compatible), Non-Latching DPDT 0 ER Centigrid Relays, Non-Latching Sensitive DPDT ERC Centigrid Relays (CMOS Compatible), Non-Latching Sensitive DPDT ER TO- Relays, Non-Latching SPDT ER TO- Relays, Non-Latching Sensitive SPDT ER TO- Relays, Non-Latching DPDT ER TO- Relays, Non-Latching Sensitive DPDT / Half-Size Crystal Can, Magnetic-Latching DPDT ER TO- Relays, Magnetic-Latching SPDT ER0 TO- Relays, Magnetic-Latching DPDT ER TO- Relays, Magnetic-Latching DPDT MILITARY QUALIFIED (JAN) RELAYS J Centigrid Relays, Non-Latching DPDT JC Centigrid Relays (CMOS Compatible), Non-Latching DPDT J Centigrid Relays, Non-Latching Sensitive DPDT JC Centigrid Relays (CMOS Compatible), Non-Latching Sensitive DPDT J TO- Relays, Non-Latching SPDT J TO- Relays, Non-Latching Sensitive SPDT J TO- Relays, Non-Latching DPDT J TO- Relays, Non-Latching Sensitive DPDT J Half-Size Crystal Can, Magnetic-Latching DPDT 0 J TO- Relays, Magnetic-Latching SPDT 0 J0 TO- Relays, Magnetic-Latching DPDT J TO- Relays, Magnetic-Latching DPDT See specifi c series for additional features and options Continued on next page Page (00) (0) 0 TELEDYNE RELAYS

5 Table of Contents HIGH-PERFORMANCE RELAYS Description Page H/H High-Temperature (00 C) TO- Relays, Non-Latching DPDT H High-Temperature (00 C) TO- Relays, Magnetic-Latching DPDT K High-Shock TO- Relays, Non-Latching DPDT K High-Shock TO- Relays, Magnetic-Latching DPDT V/V High-Vibration TO- Relays, Non-Latching DPDT APPENDIX Signal Integrity Eye Diagrams - RoHS and Reach Certifi cate of Compliance Part Numbering System - Handling Guidelines Relay Operation Spacer Pad Options 0 Spreader Pad Options Ground Pin Options Established Reliability Program - Teledyne Relays HI-REL Program GRF Option TO- Relays with straight butt pins for surfacemount applications * RF Relays Only SGRF Option TO- Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only GRF Option Centigrid Relays with straight butt pins for surface-mount applications * RF Relays Only SGRF Option TO- Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only SRF Option Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only /S Option Relays with 0. trimmed leads See Appendix: Part Numbering System Spacer Pad Option Relays with polyester fi lm pad to space between PCB and Relay Header See Appendix: Spacer Pad Options Spreader Pad Option Relays with Diallyl Phthalate pad to spread pins See Appendix: Spreader Pad Options /Q, /R Option Relays with solder dipped leads. Pb/Sn (0/0) or RoHS solder available See Appendix: Part Numbering System See specifi c series for additional features and options 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

6 LOOPBACK RELAYS RF RF Series LB/GLB/SGLB Electromechanical Relays The LoopBack Series relays combines to DPDT electromechanical relays in one package that includes an internal bypass path for Automated Test Equipment (ATE) applications. The LoopBack combines the technology of two Teledyne SGRF0 Series relays and eliminates the need for external PCB traces in loop back applications. This innovation results in superior signal integrity and RF performance while taking minimal board space. The internal structure of the LoopBack relays reduces the number of discontinuities and shortens the signal path during loop back testing, providing lower insertion loss and higher signal integrity performance than two SGRF0 Series relays. This LoopBack Relay is available with surface mount ground shield and J-lead confi guration to provide improved high data rate and high frequency performance and ease of surface mount attachment. Two DPDT Relays Capacitor Value 00 = 00nF 00 = 0nF Mounting LB = Thru-hole GLB = Surface-Mount Ground Shield (Stub) SGLB = Surface-Mount Ground Shield(J-Lead) Temperature Storage: C to + C Operating: C to + C LB Part Number Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations LB GLB SGLB,,, Coil, 00, 00, 00 Frequency (GHz) DC- DC- DC- AC Bypass Path (Thru-CAP) Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) Through Path Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) AC Bypass Path (Thru-CAP) Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) Through Path Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) GLB SGLB DC TEST JITTER INSPECTION BIST LOOPBACK DPDT ATE AT SPEED CHARACTERIZATION CAP CAP DUT TX Slow speed signals routed to ATE RX (Contacts shown in De-Energized position) Figure : Single LoopBack Relay DPDT Figure : DPDT Relays with external capacitors Schematics as viewed from terminals Page (00) (0) 0 TELEDYNE RELAYS

7 LOOPBACK RELAYS Dual SGRF0 Loopback Single LB Loopback.Gbps PRBS0.Gbps PRBS0 RF Dual SGRF0 Loopback Single LB Loopback. Gbps PRBS0. Gbps PRBS0 X DPDT relay LoopBack relay oss (db) Insertion Lo P - SN P - SN Dual RF0 - P P - SN P - SN Dual RF0 - P Frequency (MHz) A single LB has better Insertion Loss performance than SGRF0 relays in a LoopBack application 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

8 RF RELAYS Series RF00/RF0 Electromechanical Relays The RF00 and RF0 TO- relays are designed to provide improved RF signal repeatability over the frequency range. The RF00 Series is offered with a standard or sensitive coil. The GRF00 and GRF0 TO- relays feature a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The SGRF00 and SGRF0 TO- relays extend performance advantages over similar RF devices that simply offer formed leads for surface mounting. Excellent Signal integrity up to Gbps+ Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance DPDT Non-Latching Coil Type 00 = Standard Coil 0 = Sensitive Coil Diode Option D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) SRF = Surface Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF00 RF00D RF0 RF0D GRF00 GRF00D GRF0 GRF0D SGRF00 SGRF00D SGRF0 SGRF0D SRF00 SRF00D Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) 0 DC-. : : : DC-. : : : :.0 0 DC-. : : : : DC-. : : 0. SRF0 SRF0D : : For RF00DD & RF0DD values please see Datasheet Schematics as viewed from terminals D 0D 00DD 0DD Page (00) (0) 0 TELEDYNE RELAYS

9 RF RF RF RELAYS Gbps Eye Height Eye Width Jitter P-P mv. ps.0 ps Gbps Eye Height Eye Width Jitter P-P mv. ps 0. ps 0 Gbps Eye Height Eye Width Jitter P-P mv. ps. ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

10 RF RELAYS RF Series RF00/RF0 Electromechanical Relays The RF00 and RF0 Centigrid relays are designed to provide improved RF signal repeatability over the frequency range. The GRF00 and GRF0 Centigrid relays feature a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The SGRF00 and SGRF0 Centigrid relays extend performance advantages over similar RF devices that simply offer formed leads for surface mounting. DPDT Non-Latching Coil Type 00 = Standard Coil 0 = Sensitive Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF00 RF0 GRF00 GRF0 Frequency (GHz) VSWR (max) Typical RF Performance Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) 0 DC-. : : : Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations 0 DC-. : : : : SGRF00 SGRF0 0 DC-. : : : :.0 Series GRF Electromechanical Relays The GRF Centigrid relay is a hermetically sealed, armature relay for.ghz RF applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-topole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The GRF extends performance advantages over similar RF devices that simply offer formed leads for surface mounting. The Series GRFD has an internal discrete silicon diode for coil suppression. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations DPDT Non-Latching Coil Type = Standard Coil Diode Option D = Internal diode for coil transient suppression Mounting GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C GRF GRFD Frequency (GHz) VSWR (max) Typical RF Performance Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : 0 0. Schematics as viewed from terminals GRF GRFD Page (00) (0) 0 TELEDYNE RELAYS

11 RF RELAYS Series RF/RF Electromechanical Relays The RF/RF relays are designed to provide improved RF signal repeatability over the frequency range. These relays are highly suitable for use in attenuator and other RF circuits. The GRF offers monotonic insertion loss to GHz. This improvement in RF insertion loss over the frequency range makes these relays highly suitable for use in attenuator and other RF circuits. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF SPDT Non-Latching Coil Type = Standard Coil = Sensitive Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C RF GRF Frequency (GHz) Typical RF Performance VSWR (max) Isolation Across Contacts (db) (min) Insertion Loss (db) (max) DC-. : : : : 0. DC-. : : : : 0.0 Schematics as viewed from terminals RF DC-. : : : 0 0. Series RF Electromechanical Relays The RF series relay is an ultraminiature, hermetically sealed, magnetic-latching relay featuring extremely low intercontact capacitance for exceptional RF performance well into the C band. Its low profi le and small size make it ideal for applications where extreme packaging density and/or close PC board spacing are required. Due to its minimal mass, many relays may be used to confi gure replacements for bulkier switching solutions at substantial savings in weight. The RF design has been optimized by increasing the distance between the set/reset contacts. This design improvement makes these unique relays the perfect choice for use in RF attenuators, RF switching matrices and other RF applications requiring high isolation, low insertion loss and low VSWR. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contactto-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. -. : 0. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations SPDT Magnetic-Latching Coil Type = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C _ + + _ SCHEMATIC (Coil A Last Energized) RF GRF Frequency (GHz) Typical RF Performance Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page VSWR (max) Isolation Across Contacts (db) (min) Insertion Loss (db) (max) DC-. : : : 0.0 DC-. : : :.

12 RF RELAYS Series RF/RF Electromechanical Relays The Series RF/ The Series RF is an industry-standard, half-size, latching crystal can relay. These relays are highly suitable for high RF power applications (RF Power Handling) and other RF circuits. Teledyne Relays Series RF offers: all welded construction, wire leads, gold-plated or solder-coated, matched seal for superior hermeticity, gold-plated contact assembly, modernized assembly process and advanced cleaning techniques. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance DPDT Magnetic-Latching Mounting RF = Thru-hole Temperature Storage: C to + C Operating: C to + C RF RF Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-.0: : : RF RF B A A X Y X B A A X Y X Y Y B B A B B A SCHEMATIC (Coil X Last Energized) (Bottom View) Series GRF Electromechanical Relays The Series GRF relay is a hermetically sealed, RF relay designed from inception for surface mount applications. This magnetic-latching relay features extremely low internal circuit losses for exceptional time and frequency domain response characteristics through and beyond the UHF spectrum and into the S band. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides an RF ground interface that results in improved high-frequency performance as well as parametric repeatability. The GRF extends performance advantages over similar RF devices that simply offer formed leads for surface mounting. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations Typical RF Performance DPDT Magnetic-Latching Coil Type = Standard Coil Mounting GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C GRF Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : GRF Schematics as viewed from terminals SCHEMATIC (Coil A Last Energized) Page 0 (00) (0) 0 TELEDYNE RELAYS

13 RF RELAYS Series RF0/GRF0 Electromechanical Relays The Series RF0 relay is a hermetically sealed, magnetic-latching relay featuring extremely low intercontact capacitance for exceptional RF performance over the full UHF spectrum. Its low profi le height and.00 (. mm) grid spaced terminals make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The GRF0 features a unique ground shield that isolates and shields each lead to ensure excellent contactto-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations Typical RF Performance RF DPDT Magnetic-Latching Coil Type 0 = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature RF0 Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : 0. Storage: C to + C Operating: C to + C GRF0 DC-. : : : SCHEMATIC (Coil B Last Energized) Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

14 RF RELAYS Series RF/GRF/SGRF Electromechanical Relays The Series RF/GRF/SGRF relay is an ultraminiature, hermetically sealed, magnetic-latching relay featuring low intercontact capacitance for exceptional RF performance from DC- GHz. Its low profi le and small size make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The RF Series features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance PST Magnetic-Latching Coil Type = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF RFD GRF GRFD Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-.0: : : : 0. Contact Factory SGRF SGRFD Contact Factory RF + 0 GRF SGRF + + SCHEMATIC (Coil B Last Energized) (Bottom View) - SCHEMATIC (Coil B Last Energized) (Bottom View) RFD GRFD SGRFD Schematics as viewed from terminals For GRF and SGRF case to be grounded SCHEMATIC (Coil B Last Energized) (Bottom View) - SCHEMATIC (Coil B Last Energized) (Bottom View) Page (00) (0) 0 TELEDYNE RELAYS

15 RF RELAYS Series RF0/RF Electromechanical Relays The ultraminiature RF0 and RF relays are designed with an internal bypass (through path), when the coil is de-energized, to provide low insertion loss and VSWR through the bypass and simplicity of design for the user. Relays have improved RF insertion loss repeatability over the frequency range from DC to GHz. Highly suitable for use in attenuator, linear amplifi er and other RF circuits. N.C. bypass confi guration Repeatable insertion loss Broad Bandwidth Metal Enclosure for EMI shielding Ground pin option to improve ground case RF grounding High isolation between control and signal path Typical RF Performance RF Normally Closed Bypass Coil Type 0 = Standard Coil Frequency (GHz) N.O. (max) VSWR Bypass (max) Isolation (db) N.O. (min) Bypass (min) Insertion Loss (db) N.O. (max) Bypass (max) = Sensitive Coil Mounting RF = Thru-hole RF0 0 DC-. :. : :. : Temperature -. :. : Storage: C to + C Operating: C to + C RF 00 DC-. :. : :. : RF0 RF -. :. : Series RF0/RF Electromechanical Relays The ultraminiature RF0 and RF relays are designed with an internal bypass (through path), when the coil is energized, to provide low insertion loss and VSWR through the bypass and simplicity of design for the user. The RF0 and RF relays have improved RF insertion loss repeatability over the frequency range from DC to GHz. Highly suitable for use in attenuator, linear amplifi er and other RF circuits. N.O. bypass confi guration Repeatable insertion loss Broad Bandwidth Metal Enclosure for EMI shielding Ground pin option to improve ground case RF grounding High isolation between control and signal path Normally Open Bypass Coil Type 0 = Standard Coil = Sensitive Coil Mounting RF = Thru-hole Temperature Storage: C to + C Operating: C to + C RF0 RF Frequency (GHz) N.C. (max) Typical RF Performance VSWR Bypass (max) Isolation (db) N.C. (min) Bypass (min) Insertion Loss (db) N.C. (max) Bypass (max) 0 DC-. :. : :. : :. : DC-. :. : :. : RF0 RF -. :. : Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

16 RF RELAYS RF Series A0 Electromechanical Relays The Series A0 ultraminiature Attenuator Relays are designed for attenuating RF signals in 0-ohm systems over a frequency range from DC to GHz. Their low profi le and small grid spacing makes them ideal for use when packaging density is a prime consideration. The A0 relays eliminate the need for additional external resistors. These single section, switchable attenuator relays have internal matched thin fi lm attenuator pads in L, T or Pi confi gurations, as applicable. Relays are available in fi xed increments of,,,,,,, 0, and 0 db, which can be used singly or in combination to achieve the attenuation levels desired. The GA0 features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent phase linearity Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Attenuator Coil Type A0 = Standard Coil Mounting A = Thru-hole GA = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C A0 Frequency (GHz) Typical RF Performance Attenuated Path (Typ.) VSWR Thru Path (Max.) Insertion Loss (db) Typ. Max. 0 DC-.0 :.0 : :.0 : :. : DC-.0 :.0 : Attenuator Pad 0 GA :.0 : :.0 : SCHEMATIC (Bottom View) 0 Series A Electromechanical Relays The Series A highly repeatable ultraminiature attenuator relays are designed for attenuating RF signals in 0-ohm systems over a frequency range from DC to GHz. Their low profi le and small grid spacing makes them ideal for use when packaging density is a prime consideration. The A relays eliminate the need for additional external resistors/attenuators. These single section, switchable attenuator relays have an internal matched thin fi lm attenuator pad in a Pi confi guration. Relays are available in a fi xed increment of 0 db. (Other values available) The GA features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Attenuator Coil Type A = Standard Coil Mounting A = Thru-hole GA = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C A Frequency (GHz) Typical RF Performance Attenuated Path (Typ.) VSWR Thru Path (Max.) Insertion Loss (db) Typ. Max. 0 DC-.0 :.0 : :.0 : :. : See Datasheet 0 DC-.0 :.0 : Attenuator Pad GA :.0 : :.0 : SCHEMATIC (Bottom View) :.0 : Page (00) (0) 0 TELEDYNE RELAYS

17 COMMERCIAL RELAYS Series C Electromechanical Relays The C Centigrid magnetic-latching relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic operating function and internal structure are similar to Teledyne s TO-, relay series. The C is capable of meeting Teledyne Relays TR requirements. The Series C relay has internal silicon diodes for coil suppression, Zener diodes to protect the MOSFET gate inputs, and N-channel enhancement-mode MOSFET chips, which enable direct relay interfacing with most microprocessor and IC logic families (CMOS, TTL and MOS). The C magnetic-latching relay is ideally suited for applications where coil operating power must be minimized. The relays can be operated with a short-duration pulse. After the contacts have transferred, no external coil power is required. The magnetic-latching feature of the Series C relay provides a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching CMOS Feature Internal power MOSFET driver and diode coil suppression Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration 0 g s Temperature Storage: C to + C Operating: C to + C C Coil Current (ma) Min. 0+ Max. Operating Latch and Power Reset (mw) (Max) PIN : GATE A PIN : SUPPLY PIN : GATE B PIN 0: + SUPPLY C.. 0. Resistive: A/Vdc..0. Inductive: 00mA/Vdc (0mH)... Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv COMMERCIAL SCHEMATIC (Coil A Last Energized) Series Electromechanical Relays The Centigrid relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The Series relay has an internal discrete silicon diode for coil transient suppression. By virtue of its inherently low intercontact capacitance and contact circuit losses, the relay is an excellent subminiature RF switch for frequencies well into the UHF spectrum. Applications include telecommunications, test instruments, mobile communications, attenuators, and automatic test equipment. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C Schematics as viewed from terminals D P.U.V (max.) Operating Power (mw) D. Resistive: A/Vdc. 0 Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv P.U.V = Pick-Up 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

18 COMMERCIAL RELAYS Series Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the Series relays are some of the most versatile ultraminiature relays available because of their small size and low coil power dissipation. The Series D relay has an internal discrete silicon diode for coil transient suppression. The hybrid Series TN relay has an internal silicon diode and transistor driver. The integrated packaging of the relay with its associated semiconductor devices greatly reduces PC board fl oor space requirements as well as component installation costs. By virtue of its inherently low intercontact capacitance and contact circuit losses, the has proven to be excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the TO- relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options P.U.V (max.) Base Current to Turn On ( TN only) D = Internal diode for coil Resistive: A/Vdc COMMERCIAL transient suppression TN = Internal transistor driver and coil transient suppression diode Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C D TN..0 Inductive: 00mA/Vdc (0mH) 0.. Lamp: 00mA/Vdc 0..0 Low Level: 0 to 0 ua/0 to 0 mv D TN Schematics as viewed from terminals Series Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the relay has become one of the most versatile ultraminiature relays available because of its small size and low coil power dissipation. The Series D relay has discrete silicon diodes for coil transient suppression. The Series magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse and after the contacts have transferred, no external coil power is required. The magnetic-latching feature of the Series provides a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C D Set & Reset. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv D SCHEMATIC (Coil A Last Energized) (Bottom View) SCHEMATIC (Coil A Last Energized) (Bottom View) Page (00) (0) 0 TELEDYNE RELAYS

19 COMMERCIAL RELAYS Series Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the Series relay is one of the most versatile ultraminiature relays available because of their small size and low coil power dissipation. The sensitive relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series D relay has an internal discrete silicon diode for coil transient suppression. The hybrid Series TN relay has an internal silicon diode and transistor driver. The integrated packaging of the relay with its associated semiconductor devices greatly reduces PC board fl oor space requirements as well as component installation costs. By virtue of its inherently low intercontact capacitance and contact circuit losses, the has proven to be excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the TO- relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Coil Diode Options D = Internal diode for coil transient suppression TN = Internal transistor driver and coil transient suppression diode Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C D TN P.U.V (max.) Base Current to Turn On ( TN only) Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv COMMERCIAL Operating: C to + C 0 D TN Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

20 COMMERCIAL SURFACE-MOUNT RELAYS Series S & S Electromechanical Relays The Series S Surface Mount Centigrid Relay is an ultraminiature, hermetically sealed, armature relay. The low profi le height.0 (. mm) and.00 (. mm) lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder refl ow processes. The basic design and internal construction are identical to the Series & Centigrid relays, and are capable of meeting Teledyne Relays TR requirements. The SD and SDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The sensitive S surface mount Centigrid Relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities COMMERCIAL SURFACE-MOUNT DPDT Non-Latching Coil Type S = Standard Coil S = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s to 000 g s msec, Hz half-sine Acceleration 0 g s Temperature Storage: C to + C Operating: C to + C S SD SDD S SD SDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv S S SD SD SDD SDD Schematics as viewed from terminals Page (00) (0) 0 TELEDYNE RELAYS

21 COMMERCIAL SURFACE-MOUNT RELAYS Series S Electromechanical Relays The S surface mount Centigrid relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed surface-mount leads are pre-tinned to make the relays ideal for all types of surface-mount solder refl ow processes. The basic design and internal structure are similar to Teledyne s DPDT Centigrid relay. (see page ) The SD relay has an internal discrete silicon diode for coil transient suppression. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C S SD Series S Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board surface mounting, its small size and low coil power dissipation make the S relay one of the most versatile ultraminiature relays available. The Series SD and SDD utilize discrete diodes for coil suppression and polarity reversal protection. The Series S magnetic-latching relays are ideally suited for applications where power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series S relays provide a memory capability, since the relays will not reset upon removal of coil power. S P.U.V (max.) Operating Power (mw) SD. 0 Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities COMMERCIAL SURFACE-MOUNT DPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C Schematics as viewed from terminals S SD SDD 0 S Set & Reset SD. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv SDD SCHEMATIC (Coil A Last Energized) SCHEMATIC (Coil A Last Energized) SCHEMATIC (Coil A Last Energized) 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

22 ESTABLISHED RELIABILITY T R RELAYS Series ER Electromechanical Relays The Series ER Centigrid relay is an ultraminiature, hermetically sealed, armature relay. Its low profi le height. ( mm) and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic design and internal construction are similar to the standard Teledyne DPDT TO- relay (e.g., Series ER). The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. By virtue of its inherently low intercontact capacitance and contact circuit losses, the ER relay has proven to be an excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the ER relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ERD ERDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv ESTABLISHED RELIABILITY Series ERC Electromechanical Relays The ERC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The Series ERC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement mode MOSFET chip, which enables direct relay interfacing with most Microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ERC Coil Current (ma) Min. Max. Operating Power (mw) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration...0 Resistive: A/Vdc 0... Inductive: 00mA/Vdc (0mH)... Lamp: 00mA/Vdc... Low Level: 0 to 0 ua/0 to 0 mv PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE ER ERD ERDD ERC P.U.V = Pick-Up Schematics as viewed from terminals Page 0 (00) (0) 0 TELEDYNE RELAYS

23 ESTABLISHED RELIABILITY T R RELAYS Series ER Electromechanical Relays The ER sensitive Centigrid relay retains the same features as the ER standard Centigrid relay with only a minimal increase in profi le height. (. mm). Its.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, and its low profi le make the ER relay ideal for applications where high packaging density is important. The Series ERD and ERDD have internal discrete silicon diodes for coil suppression and polarity reversal protection. The sensitive ER Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ERD ERDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Series ERC Electromechanical Relays The sensitive ERC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The sensitive ERC Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw, typical). The advantages of reduced heat dissipation and power supply demands are a plus. The sensitive Series ERC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement-mode MOSFET chip that enables direct relay interfacing with most microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ERC Coil Current (ma) Min. Max. Operating Power (mw) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Resistive: A/Vdc Inductive: 00mA/Vdc (0mH).. 0. Lamp: 00mA/Vdc.. 0. Low Level: 0 to 0 ua/0 to 0 mv PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE ESTABLISHED RELIABILITY ER ERD ERDD ERC Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

24 ESTABLISHED RELIABILITY T R RELAYS Series ER & ER Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed specifi cally for high-density PC board mounting, its small size and low coil power dissipation make the ER relay one of the most versatile ultraminiature relays available. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. The sensitive ER relay has a high resistance coil, thus requiring extremely low operating power (0 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by minimizing the number of external components needed to drive the relay. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities ESTABLISHED RELIABILITY SPDT Non-Latching Coil Type ER = Standard Coil ER = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection T = Internal transistor drive and coil transient suppression diode Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ER ERD ERD ERDD ERDD ER ERD ERDD ERT ER ERD ERDD ERT P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv ERT ERT Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out Page (00) (0) 0 TELEDYNE RELAYS