Electromechanical Relays Selection Guide

Transcription

1 Electromechanical Relays Selection Guide Latching JAN Non-Latching RF Surface-Mount Established Reliability Loopback PST Environmental Attenuated

2 Switching Solutions Teledyne Relays has been the world s innovative leader in the manufacture of ultraminiature, hermetically sealed, electromechanical and solid-state switching products for more than 0 years. The company s comprehensive product line meets a wide range of requirements for defense and aerospace, industrial, commercial, medical and RF & wireless applications. Business Focus MIL QPL & COTS Solid-State Relays MIL QPL & COTS Electromechanical Relays HiRel (Space) Electromechanical Relays RF & Microwave Relays & Coaxial Switches Industrial Solid-State Relays Switching Matrices Markets Commercial & Military Aviation Defense & Aerospace Telecom/Communications (Wireless) Instrumentation & Test Industrial Power & Motion Control Medical Applications Product Assurance Under an aggressive Total Quality Management (TQM) program, Teledyne Relays has embraced a continuous improvement culture. With recognized certifi cations such as Boeing D-, MIL-STD-0, AS/EN/ JISQ00:00 (Rev C) and ISO 00:00 Teledyne Relays has become a primary supplier of switching solutions with the highest quality and reliability to industry leaders around the world. Technical Service & Customer Support Teledyne Relays provides easy access to technical service and customer support. Our websites make it easy to fi nd technical information, buy products and even get responses within hours. Switching solutions are only a mouse click away at or at teledyne-europe.com. Information about coax switches is available at Teledyne Relays offer superior signal integrity up to 0 Gbps. See the RF relays section in our website.

3 Table of Contents RF RELAYS Series Description Page LB/GLB/SGLB LoopBack Relay with Built-in AC Bypass Capacitors - RF/GRF/SGRF/SRF00 High Repeatability, Broadband TO- Relays, Non-Latching DPDT RF/GRF/SGRF/SRF0 - RF/GRF/SGRF00 RF/GRF/SGRF0 High Repeatability, Broadband Centigrid Relays, Non-Latching DPDT GRF Surface-Mount Centigrid RF Relays, Non-Latching DPDT RF/GRF RF/GRF High Repeatability, Broadband TO- Relays, Non-Latching SPDT RF/GRF Broadband TO- RF Relays, Magnetic-Latching SPDT RF/ High Power DPDT Half-Size Crystal Can Relay 0 GRF Surface-Mount TO- RF Relays, Magnetic-Latching DPDT 0 RF0/GRF0 Broadband RF Relays, Magnetic-Latching DPDT RF/GRF/SGRF Surface-Mount PST TO- Relay RF0/RF High Repeatability TO- Relays, Normally Closed, Bypass RF0/RF High Repeatability TO- Relays, Normally Open, Bypass A0/GA0 Broadband Attenuator RF Relay A/GA Broadband Attenuator RF Relay COMMERCIAL RELAYS C Centigrid Relays (CMOS Compatible), Magnetic-Latching DPDT Centigrid Relays, Non-Latching DPDT TO- Relays, Non-Latching DPDT TO- Relays, Magnetic-Latching DPDT TO- Relays, Non-Latching Sensitive DPDT COMMERCIAL SURFACE-MOUNT RELAYS S Surface-Mount Centigrid Relays, Non-Latching DPDT S Surface-Mount Centigrid Relays, Non-Latching Sensitive DPDT S Surface-Mount Centigrid Relays, Non-Latching DPDT S Surface-Mount TO- Relays, Magnetic-Latching DPDT See specifi c series for additional features and options Continued on next page 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

4 Table of Contents ESTABLISHED RELIABILITY RELAYS Series Description Page ER Centigrid Relays, Non-Latching DPDT 0 ERC Centigrid Relays (CMOS Compatible), Non-Latching DPDT 0 ER Centigrid Relays, Non-Latching Sensitive DPDT ERC Centigrid Relays (CMOS Compatible), Non-Latching Sensitive DPDT ER TO- Relays, Non-Latching SPDT ER TO- Relays, Non-Latching Sensitive SPDT ER TO- Relays, Non-Latching DPDT ER TO- Relays, Non-Latching Sensitive DPDT / Half-Size Crystal Can, Magnetic-Latching DPDT ER TO- Relays, Magnetic-Latching SPDT ER0 TO- Relays, Magnetic-Latching DPDT ER TO- Relays, Magnetic-Latching DPDT MILITARY QUALIFIED (JAN) RELAYS J Centigrid Relays, Non-Latching DPDT JC Centigrid Relays (CMOS Compatible), Non-Latching DPDT J Centigrid Relays, Non-Latching Sensitive DPDT JC Centigrid Relays (CMOS Compatible), Non-Latching Sensitive DPDT J TO- Relays, Non-Latching SPDT J TO- Relays, Non-Latching Sensitive SPDT J TO- Relays, Non-Latching DPDT J TO- Relays, Non-Latching Sensitive DPDT J Half-Size Crystal Can, Magnetic-Latching DPDT 0 J TO- Relays, Magnetic-Latching SPDT 0 J0 TO- Relays, Magnetic-Latching DPDT J TO- Relays, Magnetic-Latching DPDT See specifi c series for additional features and options Continued on next page Page (00) (0) 0 TELEDYNE RELAYS

5 Table of Contents HIGH-PERFORMANCE RELAYS Description Page H/H High-Temperature (00 C) TO- Relays, Non-Latching DPDT H High-Temperature (00 C) TO- Relays, Magnetic-Latching DPDT K High-Shock TO- Relays, Non-Latching DPDT K High-Shock TO- Relays, Magnetic-Latching DPDT V/V High-Vibration TO- Relays, Non-Latching DPDT APPENDIX Signal Integrity Eye Diagrams - RoHS and Reach Certifi cate of Compliance Part Numbering System - Handling Guidelines Relay Operation Spacer Pad Options 0 Spreader Pad Options Ground Pin Options Established Reliability Program - Teledyne Relays HI-REL Program GRF Option TO- Relays with straight butt pins for surfacemount applications * RF Relays Only SGRF Option TO- Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only GRF Option Centigrid Relays with straight butt pins for surface-mount applications * RF Relays Only SGRF Option TO- Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only SRF Option Relays with Gull-Wing (J-Lead) pins for surface-mount applications * RF Relays Only /S Option Relays with 0. trimmed leads See Appendix: Part Numbering System Spacer Pad Option Relays with polyester fi lm pad to space between PCB and Relay Header See Appendix: Spacer Pad Options Spreader Pad Option Relays with Diallyl Phthalate pad to spread pins See Appendix: Spreader Pad Options /Q, /R Option Relays with solder dipped leads. Pb/Sn (0/0) or RoHS solder available See Appendix: Part Numbering System See specifi c series for additional features and options 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

6 LOOPBACK RELAYS RF RF Series LB/GLB/SGLB Electromechanical Relays The LoopBack Series relays combines to DPDT electromechanical relays in one package that includes an internal bypass path for Automated Test Equipment (ATE) applications. The LoopBack combines the technology of two Teledyne SGRF0 Series relays and eliminates the need for external PCB traces in loop back applications. This innovation results in superior signal integrity and RF performance while taking minimal board space. The internal structure of the LoopBack relays reduces the number of discontinuities and shortens the signal path during loop back testing, providing lower insertion loss and higher signal integrity performance than two SGRF0 Series relays. This LoopBack Relay is available with surface mount ground shield and J-lead confi guration to provide improved high data rate and high frequency performance and ease of surface mount attachment. Two DPDT Relays Capacitor Value 00 = 00nF 00 = 0nF Mounting LB = Thru-hole GLB = Surface-Mount Ground Shield (Stub) SGLB = Surface-Mount Ground Shield(J-Lead) Temperature Storage: C to + C Operating: C to + C LB Part Number Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations LB GLB SGLB,,, Coil, 00, 00, 00 Frequency (GHz) DC- DC- DC- AC Bypass Path (Thru-CAP) Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) Through Path Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) AC Bypass Path (Thru-CAP) Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) Through Path Single-Ended Bit Gbps Eye Height (mv) Eye Width (ps) Jitter p-p (ps) GLB SGLB DC TEST JITTER INSPECTION BIST LOOPBACK DPDT ATE AT SPEED CHARACTERIZATION CAP CAP DUT TX Slow speed signals routed to ATE RX (Contacts shown in De-Energized position) Figure : Single LoopBack Relay DPDT Figure : DPDT Relays with external capacitors Schematics as viewed from terminals Page (00) (0) 0 TELEDYNE RELAYS

7 LOOPBACK RELAYS Dual SGRF0 Loopback Single LB Loopback.Gbps PRBS0.Gbps PRBS0 RF Dual SGRF0 Loopback Single LB Loopback. Gbps PRBS0. Gbps PRBS0 X DPDT relay LoopBack relay oss (db) Insertion Lo P - SN P - SN Dual RF0 - P P - SN P - SN Dual RF0 - P Frequency (MHz) A single LB has better Insertion Loss performance than SGRF0 relays in a LoopBack application 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

8 RF RELAYS Series RF00/RF0 Electromechanical Relays The RF00 and RF0 TO- relays are designed to provide improved RF signal repeatability over the frequency range. The RF00 Series is offered with a standard or sensitive coil. The GRF00 and GRF0 TO- relays feature a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The SGRF00 and SGRF0 TO- relays extend performance advantages over similar RF devices that simply offer formed leads for surface mounting. Excellent Signal integrity up to Gbps+ Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance DPDT Non-Latching Coil Type 00 = Standard Coil 0 = Sensitive Coil Diode Option D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) SRF = Surface Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF00 RF00D RF0 RF0D GRF00 GRF00D GRF0 GRF0D SGRF00 SGRF00D SGRF0 SGRF0D SRF00 SRF00D Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) 0 DC-. : : : DC-. : : : :.0 0 DC-. : : : : DC-. : : 0. SRF0 SRF0D : : For RF00DD & RF0DD values please see Datasheet Schematics as viewed from terminals D 0D 00DD 0DD Page (00) (0) 0 TELEDYNE RELAYS

9 RF RF RF RELAYS Gbps Eye Height Eye Width Jitter P-P mv. ps.0 ps Gbps Eye Height Eye Width Jitter P-P mv. ps 0. ps 0 Gbps Eye Height Eye Width Jitter P-P mv. ps. ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

10 RF RELAYS RF Series RF00/RF0 Electromechanical Relays The RF00 and RF0 Centigrid relays are designed to provide improved RF signal repeatability over the frequency range. The GRF00 and GRF0 Centigrid relays feature a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The SGRF00 and SGRF0 Centigrid relays extend performance advantages over similar RF devices that simply offer formed leads for surface mounting. DPDT Non-Latching Coil Type 00 = Standard Coil 0 = Sensitive Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF00 RF0 GRF00 GRF0 Frequency (GHz) VSWR (max) Typical RF Performance Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) 0 DC-. : : : Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations 0 DC-. : : : : SGRF00 SGRF0 0 DC-. : : : :.0 Series GRF Electromechanical Relays The GRF Centigrid relay is a hermetically sealed, armature relay for.ghz RF applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-topole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. The GRF extends performance advantages over similar RF devices that simply offer formed leads for surface mounting. The Series GRFD has an internal discrete silicon diode for coil suppression. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations DPDT Non-Latching Coil Type = Standard Coil Diode Option D = Internal diode for coil transient suppression Mounting GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C GRF GRFD Frequency (GHz) VSWR (max) Typical RF Performance Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : 0 0. Schematics as viewed from terminals GRF GRFD Page (00) (0) 0 TELEDYNE RELAYS

11 RF RELAYS Series RF/RF Electromechanical Relays The RF/RF relays are designed to provide improved RF signal repeatability over the frequency range. These relays are highly suitable for use in attenuator and other RF circuits. The GRF offers monotonic insertion loss to GHz. This improvement in RF insertion loss over the frequency range makes these relays highly suitable for use in attenuator and other RF circuits. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF SPDT Non-Latching Coil Type = Standard Coil = Sensitive Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C RF GRF Frequency (GHz) Typical RF Performance VSWR (max) Isolation Across Contacts (db) (min) Insertion Loss (db) (max) DC-. : : : : 0. DC-. : : : : 0.0 Schematics as viewed from terminals RF DC-. : : : 0 0. Series RF Electromechanical Relays The RF series relay is an ultraminiature, hermetically sealed, magnetic-latching relay featuring extremely low intercontact capacitance for exceptional RF performance well into the C band. Its low profi le and small size make it ideal for applications where extreme packaging density and/or close PC board spacing are required. Due to its minimal mass, many relays may be used to confi gure replacements for bulkier switching solutions at substantial savings in weight. The RF design has been optimized by increasing the distance between the set/reset contacts. This design improvement makes these unique relays the perfect choice for use in RF attenuators, RF switching matrices and other RF applications requiring high isolation, low insertion loss and low VSWR. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contactto-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. -. : 0. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations SPDT Magnetic-Latching Coil Type = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C _ + + _ SCHEMATIC (Coil A Last Energized) RF GRF Frequency (GHz) Typical RF Performance Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page VSWR (max) Isolation Across Contacts (db) (min) Insertion Loss (db) (max) DC-. : : : 0.0 DC-. : : :.

12 RF RELAYS Series RF/RF Electromechanical Relays The Series RF/ The Series RF is an industry-standard, half-size, latching crystal can relay. These relays are highly suitable for high RF power applications (RF Power Handling) and other RF circuits. Teledyne Relays Series RF offers: all welded construction, wire leads, gold-plated or solder-coated, matched seal for superior hermeticity, gold-plated contact assembly, modernized assembly process and advanced cleaning techniques. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance DPDT Magnetic-Latching Mounting RF = Thru-hole Temperature Storage: C to + C Operating: C to + C RF RF Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-.0: : : RF RF B A A X Y X B A A X Y X Y Y B B A B B A SCHEMATIC (Coil X Last Energized) (Bottom View) Series GRF Electromechanical Relays The Series GRF relay is a hermetically sealed, RF relay designed from inception for surface mount applications. This magnetic-latching relay features extremely low internal circuit losses for exceptional time and frequency domain response characteristics through and beyond the UHF spectrum and into the S band. The GRF features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides an RF ground interface that results in improved high-frequency performance as well as parametric repeatability. The GRF extends performance advantages over similar RF devices that simply offer formed leads for surface mounting. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations Typical RF Performance DPDT Magnetic-Latching Coil Type = Standard Coil Mounting GRF = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C GRF Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : GRF Schematics as viewed from terminals SCHEMATIC (Coil A Last Energized) Page 0 (00) (0) 0 TELEDYNE RELAYS

13 RF RELAYS Series RF0/GRF0 Electromechanical Relays The Series RF0 relay is a hermetically sealed, magnetic-latching relay featuring extremely low intercontact capacitance for exceptional RF performance over the full UHF spectrum. Its low profi le height and.00 (. mm) grid spaced terminals make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The GRF0 features a unique ground shield that isolates and shields each lead to ensure excellent contactto-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to 0Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations Typical RF Performance RF DPDT Magnetic-Latching Coil Type 0 = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) Temperature RF0 Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-. : : : 0. Storage: C to + C Operating: C to + C GRF0 DC-. : : : SCHEMATIC (Coil B Last Energized) Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

14 RF RELAYS Series RF/GRF/SGRF Electromechanical Relays The Series RF/GRF/SGRF relay is an ultraminiature, hermetically sealed, magnetic-latching relay featuring low intercontact capacitance for exceptional RF performance from DC- GHz. Its low profi le and small size make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The RF Series features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact and pole-to-pole isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent Signal integrity up to Gbps Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Typical RF Performance PST Magnetic-Latching Coil Type = Standard Coil Mounting RF = Thru-hole GRF = Surface-Mount (Stub) SGRF = Surface-Mount (J-Lead) Temperature Storage: C to + C Operating: C to + C RF RFD GRF GRFD Frequency (GHz) VSWR (max) Pole to Pole (min) Isolation (db) Across Contacts (min) Insertion Loss (db) (max) DC-.0: : : : 0. Contact Factory SGRF SGRFD Contact Factory RF + 0 GRF SGRF + + SCHEMATIC (Coil B Last Energized) (Bottom View) - SCHEMATIC (Coil B Last Energized) (Bottom View) RFD GRFD SGRFD Schematics as viewed from terminals For GRF and SGRF case to be grounded SCHEMATIC (Coil B Last Energized) (Bottom View) - SCHEMATIC (Coil B Last Energized) (Bottom View) Page (00) (0) 0 TELEDYNE RELAYS

15 RF RELAYS Series RF0/RF Electromechanical Relays The ultraminiature RF0 and RF relays are designed with an internal bypass (through path), when the coil is de-energized, to provide low insertion loss and VSWR through the bypass and simplicity of design for the user. Relays have improved RF insertion loss repeatability over the frequency range from DC to GHz. Highly suitable for use in attenuator, linear amplifi er and other RF circuits. N.C. bypass confi guration Repeatable insertion loss Broad Bandwidth Metal Enclosure for EMI shielding Ground pin option to improve ground case RF grounding High isolation between control and signal path Typical RF Performance RF Normally Closed Bypass Coil Type 0 = Standard Coil Frequency (GHz) N.O. (max) VSWR Bypass (max) Isolation (db) N.O. (min) Bypass (min) Insertion Loss (db) N.O. (max) Bypass (max) = Sensitive Coil Mounting RF = Thru-hole RF0 0 DC-. :. : :. : Temperature -. :. : Storage: C to + C Operating: C to + C RF 00 DC-. :. : :. : RF0 RF -. :. : Series RF0/RF Electromechanical Relays The ultraminiature RF0 and RF relays are designed with an internal bypass (through path), when the coil is energized, to provide low insertion loss and VSWR through the bypass and simplicity of design for the user. The RF0 and RF relays have improved RF insertion loss repeatability over the frequency range from DC to GHz. Highly suitable for use in attenuator, linear amplifi er and other RF circuits. N.O. bypass confi guration Repeatable insertion loss Broad Bandwidth Metal Enclosure for EMI shielding Ground pin option to improve ground case RF grounding High isolation between control and signal path Normally Open Bypass Coil Type 0 = Standard Coil = Sensitive Coil Mounting RF = Thru-hole Temperature Storage: C to + C Operating: C to + C RF0 RF Frequency (GHz) N.C. (max) Typical RF Performance VSWR Bypass (max) Isolation (db) N.C. (min) Bypass (min) Insertion Loss (db) N.C. (max) Bypass (max) 0 DC-. :. : :. : :. : DC-. :. : :. : RF0 RF -. :. : Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

16 RF RELAYS RF Series A0 Electromechanical Relays The Series A0 ultraminiature Attenuator Relays are designed for attenuating RF signals in 0-ohm systems over a frequency range from DC to GHz. Their low profi le and small grid spacing makes them ideal for use when packaging density is a prime consideration. The A0 relays eliminate the need for additional external resistors. These single section, switchable attenuator relays have internal matched thin fi lm attenuator pads in L, T or Pi confi gurations, as applicable. Relays are available in fi xed increments of,,,,,,, 0, and 0 db, which can be used singly or in combination to achieve the attenuation levels desired. The GA0 features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Excellent phase linearity Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Attenuator Coil Type A0 = Standard Coil Mounting A = Thru-hole GA = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C A0 Frequency (GHz) Typical RF Performance Attenuated Path (Typ.) VSWR Thru Path (Max.) Insertion Loss (db) Typ. Max. 0 DC-.0 :.0 : :.0 : :. : DC-.0 :.0 : Attenuator Pad 0 GA :.0 : :.0 : SCHEMATIC (Bottom View) 0 Series A Electromechanical Relays The Series A highly repeatable ultraminiature attenuator relays are designed for attenuating RF signals in 0-ohm systems over a frequency range from DC to GHz. Their low profi le and small grid spacing makes them ideal for use when packaging density is a prime consideration. The A relays eliminate the need for additional external resistors/attenuators. These single section, switchable attenuator relays have an internal matched thin fi lm attenuator pad in a Pi confi guration. Relays are available in a fi xed increment of 0 db. (Other values available) The GA features a unique ground shield that isolates and shields each lead to ensure excellent contact-to-contact isolation. This ground shield provides a ground interface that results in improved high-frequency performance as well as parametric repeatability. Hermetically Sealed High to ESD Metal Enclosure for EMI shielding High Repeatability Broader bandwidth Through-hole or surface-mount confi gurations RF Attenuator Coil Type A = Standard Coil Mounting A = Thru-hole GA = Surface-Mount (Stub) Temperature Storage: C to + C Operating: C to + C A Frequency (GHz) Typical RF Performance Attenuated Path (Typ.) VSWR Thru Path (Max.) Insertion Loss (db) Typ. Max. 0 DC-.0 :.0 : :.0 : :. : See Datasheet 0 DC-.0 :.0 : Attenuator Pad GA :.0 : :.0 : SCHEMATIC (Bottom View) :.0 : Page (00) (0) 0 TELEDYNE RELAYS

17 COMMERCIAL RELAYS Series C Electromechanical Relays The C Centigrid magnetic-latching relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic operating function and internal structure are similar to Teledyne s TO-, relay series. The C is capable of meeting Teledyne Relays TR requirements. The Series C relay has internal silicon diodes for coil suppression, Zener diodes to protect the MOSFET gate inputs, and N-channel enhancement-mode MOSFET chips, which enable direct relay interfacing with most microprocessor and IC logic families (CMOS, TTL and MOS). The C magnetic-latching relay is ideally suited for applications where coil operating power must be minimized. The relays can be operated with a short-duration pulse. After the contacts have transferred, no external coil power is required. The magnetic-latching feature of the Series C relay provides a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching CMOS Feature Internal power MOSFET driver and diode coil suppression Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration 0 g s Temperature Storage: C to + C Operating: C to + C C Coil Current (ma) Min. 0+ Max. Operating Latch and Power Reset (mw) (Max) PIN : GATE A PIN : SUPPLY PIN : GATE B PIN 0: + SUPPLY C.. 0. Resistive: A/Vdc..0. Inductive: 00mA/Vdc (0mH)... Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv COMMERCIAL SCHEMATIC (Coil A Last Energized) Series Electromechanical Relays The Centigrid relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The Series relay has an internal discrete silicon diode for coil transient suppression. By virtue of its inherently low intercontact capacitance and contact circuit losses, the relay is an excellent subminiature RF switch for frequencies well into the UHF spectrum. Applications include telecommunications, test instruments, mobile communications, attenuators, and automatic test equipment. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C Schematics as viewed from terminals D P.U.V (max.) Operating Power (mw) D. Resistive: A/Vdc. 0 Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv P.U.V = Pick-Up 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

18 COMMERCIAL RELAYS Series Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the Series relays are some of the most versatile ultraminiature relays available because of their small size and low coil power dissipation. The Series D relay has an internal discrete silicon diode for coil transient suppression. The hybrid Series TN relay has an internal silicon diode and transistor driver. The integrated packaging of the relay with its associated semiconductor devices greatly reduces PC board fl oor space requirements as well as component installation costs. By virtue of its inherently low intercontact capacitance and contact circuit losses, the has proven to be excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the TO- relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options P.U.V (max.) Base Current to Turn On ( TN only) D = Internal diode for coil Resistive: A/Vdc COMMERCIAL transient suppression TN = Internal transistor driver and coil transient suppression diode Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C D TN..0 Inductive: 00mA/Vdc (0mH) 0.. Lamp: 00mA/Vdc 0..0 Low Level: 0 to 0 ua/0 to 0 mv D TN Schematics as viewed from terminals Series Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the relay has become one of the most versatile ultraminiature relays available because of its small size and low coil power dissipation. The Series D relay has discrete silicon diodes for coil transient suppression. The Series magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse and after the contacts have transferred, no external coil power is required. The magnetic-latching feature of the Series provides a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C D Set & Reset. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv D SCHEMATIC (Coil A Last Energized) (Bottom View) SCHEMATIC (Coil A Last Energized) (Bottom View) Page (00) (0) 0 TELEDYNE RELAYS

19 COMMERCIAL RELAYS Series Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, the Series relay is one of the most versatile ultraminiature relays available because of their small size and low coil power dissipation. The sensitive relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series D relay has an internal discrete silicon diode for coil transient suppression. The hybrid Series TN relay has an internal silicon diode and transistor driver. The integrated packaging of the relay with its associated semiconductor devices greatly reduces PC board fl oor space requirements as well as component installation costs. By virtue of its inherently low intercontact capacitance and contact circuit losses, the has proven to be excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the TO- relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Coil Diode Options D = Internal diode for coil transient suppression TN = Internal transistor driver and coil transient suppression diode Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C D TN P.U.V (max.) Base Current to Turn On ( TN only) Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv COMMERCIAL Operating: C to + C 0 D TN Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

20 COMMERCIAL SURFACE-MOUNT RELAYS Series S & S Electromechanical Relays The Series S Surface Mount Centigrid Relay is an ultraminiature, hermetically sealed, armature relay. The low profi le height.0 (. mm) and.00 (. mm) lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder refl ow processes. The basic design and internal construction are identical to the Series & Centigrid relays, and are capable of meeting Teledyne Relays TR requirements. The SD and SDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The sensitive S surface mount Centigrid Relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities COMMERCIAL SURFACE-MOUNT DPDT Non-Latching Coil Type S = Standard Coil S = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s to 000 g s msec, Hz half-sine Acceleration 0 g s Temperature Storage: C to + C Operating: C to + C S SD SDD S SD SDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv S S SD SD SDD SDD Schematics as viewed from terminals Page (00) (0) 0 TELEDYNE RELAYS

21 COMMERCIAL SURFACE-MOUNT RELAYS Series S Electromechanical Relays The S surface mount Centigrid relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profi le height.0 (. mm) and.00 (. mm) grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed surface-mount leads are pre-tinned to make the relays ideal for all types of surface-mount solder refl ow processes. The basic design and internal structure are similar to Teledyne s DPDT Centigrid relay. (see page ) The SD relay has an internal discrete silicon diode for coil transient suppression. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C S SD Series S Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board surface mounting, its small size and low coil power dissipation make the S relay one of the most versatile ultraminiature relays available. The Series SD and SDD utilize discrete diodes for coil suppression and polarity reversal protection. The Series S magnetic-latching relays are ideally suited for applications where power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series S relays provide a memory capability, since the relays will not reset upon removal of coil power. S P.U.V (max.) Operating Power (mw) SD. 0 Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities COMMERCIAL SURFACE-MOUNT DPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s msec, 0 g s to 00 Hz half-sine Temperature Storage: C to + C Operating: C to + C Schematics as viewed from terminals S SD SDD 0 S Set & Reset SD. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv SDD SCHEMATIC (Coil A Last Energized) SCHEMATIC (Coil A Last Energized) SCHEMATIC (Coil A Last Energized) 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

22 ESTABLISHED RELIABILITY T R RELAYS Series ER Electromechanical Relays The Series ER Centigrid relay is an ultraminiature, hermetically sealed, armature relay. Its low profi le height. ( mm) and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic design and internal construction are similar to the standard Teledyne DPDT TO- relay (e.g., Series ER). The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. By virtue of its inherently low intercontact capacitance and contact circuit losses, the ER relay has proven to be an excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the ER relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ERD ERDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv ESTABLISHED RELIABILITY Series ERC Electromechanical Relays The ERC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The Series ERC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement mode MOSFET chip, which enables direct relay interfacing with most Microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ERC Coil Current (ma) Min. Max. Operating Power (mw) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration...0 Resistive: A/Vdc 0... Inductive: 00mA/Vdc (0mH)... Lamp: 00mA/Vdc... Low Level: 0 to 0 ua/0 to 0 mv PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE ER ERD ERDD ERC P.U.V = Pick-Up Schematics as viewed from terminals Page 0 (00) (0) 0 TELEDYNE RELAYS

23 ESTABLISHED RELIABILITY T R RELAYS Series ER Electromechanical Relays The ER sensitive Centigrid relay retains the same features as the ER standard Centigrid relay with only a minimal increase in profi le height. (. mm). Its.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, and its low profi le make the ER relay ideal for applications where high packaging density is important. The Series ERD and ERDD have internal discrete silicon diodes for coil suppression and polarity reversal protection. The sensitive ER Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ERD ERDD P.U.V (max.) D.O.V min. max Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Series ERC Electromechanical Relays The sensitive ERC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The sensitive ERC Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw, typical). The advantages of reduced heat dissipation and power supply demands are a plus. The sensitive Series ERC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement-mode MOSFET chip that enables direct relay interfacing with most microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ERC Coil Current (ma) Min. Max. Operating Power (mw) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Resistive: A/Vdc Inductive: 00mA/Vdc (0mH).. 0. Lamp: 00mA/Vdc.. 0. Low Level: 0 to 0 ua/0 to 0 mv PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE ESTABLISHED RELIABILITY ER ERD ERDD ERC Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

24 ESTABLISHED RELIABILITY T R RELAYS Series ER & ER Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed specifi cally for high-density PC board mounting, its small size and low coil power dissipation make the ER relay one of the most versatile ultraminiature relays available. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. The sensitive ER relay has a high resistance coil, thus requiring extremely low operating power (0 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by minimizing the number of external components needed to drive the relay. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities ESTABLISHED RELIABILITY SPDT Non-Latching Coil Type ER = Standard Coil ER = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection T = Internal transistor drive and coil transient suppression diode Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER ER ERD ERD ERDD ERDD ER ERD ERDD ERT ER ERD ERDD ERT P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv ERT ERT Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out Page (00) (0) 0 TELEDYNE RELAYS

25 ESTABLISHED RELIABILITY T R RELAYS Series ER & ER Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed specifi cally for high-density PC board mounting, its small size and low coil power dissipation make the ER relay one of the most versatile ultraminiature relays available. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. The sensitive ER relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series ERD and ERDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid ERT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by minimizing the number of external components needed to drive the relay. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Coil Type ER = Standard Coil ER = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection T = Internal transistor drive and coil transient suppression diode Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s 0 Operating & Storage: C to + C ER ER ERD ERD ERDD ERDD ERT ERT ER ERD ERDD ERT ER ERD ERDD ERT Schematics as viewed from terminals P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 ua Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 ua Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv P.U.V = Pick-Up D.O.V = Drop-Out ESTABLISHED RELIABILITY 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

26 ESTABLISHED RELIABILITY T R RELAYS Series, Electromechanical Relays The Series is an industry-standard, half-size, latching crystal can relay. It has a wide range of switching capabilities ranging from low level to amps. The Series J/ latching relay confi guration is doublepole double-throw (DPDT), so the relay offers excellent switching density and versatility. Half-Size Crystal Can Features: Low level to amps Wide range of switching capabilities Smallest relay package capable of switching amps Modernized assembly process Lead-free (gold-plated wire lead only) All welded construction Wire leads, gold-plated or solder-coated Matched seal for superior hermeticity Gold-plated contact assembly Modernized assembly process Advanced cleaning techniques DPDT Magnetic-Latching Vibration 0G, 0-00 Hz (Sinusoidal) Shock 00G, msec half-sine (Specifi ed Pulse) Temperature Operating & Storage: C to + C B A A X Set & Reset Min. Max. B A A X.0. Resistive: A/Vdc.. Inductive: 0.A/Vdc (0mH)..0 Intermediate Current: 0.A/Vdc Lamp: 0.A/Vdc Low Level: 0 to 0 ua/0 to 0 mv Y X Y X Y Y B B A B B A ESTABLISHED RELIABILITY Series ER Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, its small size and low coil power dissipation make the ER relay one of the most versatile ultraminiature relays available. The Series ERD and ERDD utilize discrete silicon diodes for coil suppression and polarity reversal protection. The Series ER magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series ER provides a memory capability, since the relays will not reset upon removal of coil power. SPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C *See Schematics on Page ER ERD ERDD SCHEMATIC (Coil X Last Energized) (Bottom View) SCHEMATIC (Coil X Last Energized) (Bottom View) Set & Reset All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Page (00) (0) 0 TELEDYNE RELAYS

27 ESTABLISHED RELIABILITY T R RELAYS Series ER0 & ER Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, its small size and low coil power dissipation make the ER0 & ER relays some of the most versatile ultraminiature relays available. The Series ER0D/ERD and ER0DD/ERDD utilize discrete silicon diodes for coil suppression and polarity reversal protection. The Series ER0/ER magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series ER0/ ER relays provide a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching Grounding Options 0 = Common = Individual Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C ER0 ER ER0D ERD ER0DD ERDD Set & Reset. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv ER0 ER0D ER0DD ESTABLISHED RELIABILITY ER ERD ERDD ER ERD ERDD Schematics Shown with Coil A Last Energized Schematics as viewed from terminals 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

28 MILITARY QUALIFIED (JAN) RELAYS Series J Electromechanical Relays The Series J Centigrid relay is an ultraminiature, hermetically sealed, armature relay. Its low profi le height. ( mm) and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic design and internal construction are similar to the standard Teledyne DPDT TO- relay (e.g., Series J). The Series JD and JDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. By virtue of its inherently low intercontact capacitance and contact circuit losses, the J relay has proven to be an excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the J relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C J (M0/) JD (M0/) JDD (M0/) P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv MILITARY QUALIFIED (JAN) Series JC Electromechanical Relays The JC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The Series JC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement mode MOSFET chip, which enables direct relay interfacing with most Microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature JC (M/) Coil Current (ma) Min. Max. Operating Power (mw) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration...0 Resistive: A/Vdc 0... Inductive: 00mA/Vdc (0mH)... Lamp: 00mA/Vdc... Low Level: 0 to 0 ua/0 to 0 mv g s P.U.V = Pick-Up D.O.V = Drop-Out Operating & Storage: C to + C Schematics as viewed from terminals 0 + J JD JDD JC PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE Page (00) (0) 0 TELEDYNE RELAYS

29 MILITARY QUALIFIED (JAN) RELAYS Series J Electromechanical Relays The J sensitive Centigrid relay retains the same features as the J standard Centigrid relay with only a minimal increase in profi le height. (. mm). Its.00 (. mm) grid spaced terminals, which preclude the need for spreader pads, and its low profi le make the J relay ideal for applications where high packaging density is important. The Series JD and JDD have internal discrete silicon diodes for coil suppression and polarity reversal protection. The sensitive J Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C J (M0/) JD (M0/) JDD (M0/) P.U.V (max.) D.O.V min. max Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Series JC Electromechanical Relays The sensitive JC Centigrid relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profi le height and.00 (. mm) grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The sensitive JC Centigrid relay has a high resistance coil, thus requiring extremely low operating power (00 mw, typical). The advantages of reduced heat dissipation and power supply demands are a plus. The sensitive Series JC utilizes an internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement-mode MOSFET chip that enables direct relay interfacing with most microprocessor and IC logic families (CMOS, TTL and MOS). DPDT Non-Latching CMOS Feature Internal power MOSFET driver, Zener diode gate protection, and diode coil suppression Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C JC (M/) Coil Current (ma) Min. Max. Operating Power (m W ) P.U.V (max.) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities Resistive: A/Vdc Inductive: 00mA/Vdc (0mH).. 0. Lamp: 00mA/Vdc.. 0. Low Level: 0 to 0 ua/0 to 0 mv PIN : + SUPPLY PIN : SUPPLY PIN 0: GATE MILITARY QUALIFIED (JAN) Schematics as viewed from terminals J JD JDD JC P.U.V = Pick-Up D.O.V = Drop-Out 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

30 MILITARY QUALIFIED (JAN) RELAYS Series J & J Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed specifi cally for high-density PC board mounting, its small size and low coil power dissipation make the J relay one of the most versatile ultraminiature relays available. The Series JD and JDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid JT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. The sensitive J relay has a high resistance coil, thus requiring extremely low operating power (0 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series JD and JDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid JT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities MILITARY QUALIFIED (JAN) SPDT Non-Latching Coil Type J = Standard Coil J = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection T = Internal transistor drive and coil transient suppression diode Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C J J JD JD JDD JDD J (M0/) JD (M0/) JDD (M0/) JT (M/) J (M0/0) JD (M0/) JDD (M0/) JT (M/) P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv JT JT P.U.V = Pick-Up D.O.V = Drop-Out Schematics as viewed from terminals Page (00) (0) 0 TELEDYNE RELAYS

31 MILITARY QUALIFIED (JAN) RELAYS Series J & J Electromechanical Relays The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for lowlevel switching from dry circuit to ampere. Designed specifi cally for high-density PC board mounting, its small size and low coil power dissipation make the J relay one of the most versatile ultraminiature relays available. The Series JD and JDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid JT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. The sensitive J relay has a high resistance coil, thus requiring extremely low operating power (00 mw typical). The advantages of reduced heat dissipation and power supply demands are a plus. The Series JD and JDD relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. The hybrid JT relay features an internal silicon suppression diode and transistor driver. This hybrid package reduces required PC board fl oor space by reducing the number of external components needed to drive the relay. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Coil Type J = Standard Coil J = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection T = Internal transistor drive and coil transient suppression diode Vibration Shock 0 g s g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s Operating & Storage: C to + C J J JD JD JDD JDD J (M0/) JD (M0/) JDD (M0/0) JT (M/) J (M0/) JD (M0/) JDD (M0/) JT (M/) P.U.V (max.) D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 ua Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 ua Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv MILITARY QUALIFIED (JAN) 0 JT JT Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

32 MILITARY QUALIFIED (JAN) RELAYS Series J Electromechanical Relays The Series J is an industry-standard, half-size, latching crystal can relay. It has a wide range of switching capabilities ranging from low level to amps. The Series J latching relay confi guration is double-pole double-throw (DPDT), so the relay offers excellent switching density and versatility. Half-Size Crystal Can Features: Low level to amps Wide range of switching capabilities Smallest relay package capable of switching amps Modernized assembly process Qualifi ed to MIL-PRF0/ Lead-free (gold-plated wire lead only) All welded construction Wire leads, gold-plated or solder-coated Matched seal for superior hermeticity Gold-plated contact assembly Modernized assembly process Advanced cleaning techniques DPDT Magnetic-Latching Vibration 0G, 0-00 Hz (Sinusoidal) Shock 00G, msec half-sine (Specifi ed Pulse) Temperature Operating & Storage: C to + C Y J (M0/) B A A X Y X J Set & Reset Min. Max..0. Resistive: A/Vdc.. Inductive: 0.A/Vdc (0mH)..0 Intermediate Current: 0.A/Vdc Lamp: 0.A/Vdc Low Level: 0 to 0 ua/0 to 0 mv B B A SCHEMATIC (Coil X Last Energized) (Bottom View) Series J Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, its small size and low coil power dissipation make the J relay one of the most versatile ultraminiature relays available. The Series JD and JDD utilize discrete silicon diodes for coil suppression and polarity reversal protection. The Series J magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series J provides a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities MILITARY QUALIFIED (JAN) SPDT Magnetic-Latching Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration Temperature 0 g s *See Schematics on Page Operating & Storage: C to + C J (M0/) JD (M0/) JDD (M0/) Set & Reset. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Page 0 (00) (0) 0 TELEDYNE RELAYS

33 MILITARY QUALIFIED (JAN) RELAYS Series J0 & J Electromechanical Relays The magnetic-latching TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, its small size and low coil power dissipation make the J0 & J relays some of the most versatile ultraminiature relays available. The Series J0D/JD and J0DD/JDD utilize discrete silicon diodes for coil suppression and polarity reversal protection. The Series J0/J magnetic-latching relays are ideally suited for applications where coil power dissipation must be minimized. The relays can be operated with a short duration pulse. After the contacts have transferred, no external holding power is required. The magnetic-latching feature of the Series J0/ J relays provide a memory capability, since the relays will not reset upon removal of coil power. All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Magnetic-Latching Grounding Options J0 = Common J = Individual Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration Shock 0 g s 00 g s msec, to 000 Hz half-sine Acceleration Temperature J0 (M0/) J (M0/) J0D (M0/) JD (M0/) J0DD (M0/0) JDD (M0/0) Set & Reset. Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv g s Operating & Storage: C to + C J0 J0D J0DD Schematics Shown with Coil A Last Energized Schematics as viewed from terminals J JD JDD MILITARY QUALIFIED (JAN) J JD JDD 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

34 HIGH-PERFORMANCE RELAYS Series H, H & H Electromechanical Relays - High Temperature The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, these TO- relays are some of the most versatile ultraminiature relays available because of their small size and low coil power dissipation. The H Series high-temperature TO- relays are designed for reliable operation in elevated ambient temperatures up to 00 C. Special material selection and processing provide assurance of freedom from contact contamination and mechanical malfunctioning that might otherwise be caused by ultra high ambient temperature conditions. Typical applications: Oil exploration (down-hole) instrumentation High-Temperature industrial and process control instrumentation All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities H = DPDT Non-Latching H = DPDT Non-Latching H = DPDT Magnetic- Latching Coil Type H = Standard Coil H = Standard Coil H = Sensitive Coil Vibration 0 g s to 000 Hz Shock H = g s msec, half-sine H = g s msec, half-sine H = 00 g s Acceleration 0 g s Temperature Operating & Storage: C to +00 C H H H P.U.V (max.) Set & Reset D.O.V min. max Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0.0 Lamp: 00mA/Vdc 00. Low Level: 0 to 0 ua/0 to 0 mv HIGH PERFORMANCE Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out H H SCHEMATIC (Coil A Last Energized) H Page (00) (0) 0 TELEDYNE RELAYS

35 HIGH-PERFORMANCE RELAYS Series K & K Electromechanical Relays - High Shock The TO- relay, originally conceived and developed by Teledyne, has become one of the industry standards for low-level switching from dry circuit to ampere. Designed for high-density PC board mounting, its small size and low coil power dissipation make the TO- relay one of the most versatile subminiature relays available. The K Series high-shock TO- relays are designed to withstand shock levels up to 000 g s,. msec duration. Special material selection and construction details provide assurance that critical elements of the relay structure and mechanism will not be permanently displaced or damaged as a result of extremely high g level shocks. Typical applications: Commercial avionics aircraft control Commercial aircraft control systems Transportation systems (rail/truck) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities K = DPDT Non-Latching K = DPDT Magnetic- Latching Vibration 0 g s to 000 Hz Shock K = g s msec, half-sine 000 g s, 0. msec axial plane, half-sine 000 g s, 0. msec side planes, half-sine K = 00 g s msec, half-sine 00 g s, 0. msec axial plane, half-sine 0 g s, 0. msec side planes, half-sine Acceleration 0 g s Temperature Operating & Storage: C to + C K K P.U.V (max.) Set & Reset D.O.V min. max Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc 0. Inductive: 00mA/Vdc (0mH) 0. Lamp: 00mA/Vdc 00.0 Low Level: 0 to 0 ua/0 to 0 mv K SCHEMATIC (Coil A Last Energized) K Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out HIGH PERFORMANCE 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

36 HIGH-PERFORMANCE RELAYS Series V & V Electromechanical Relays - High Vibration The V and V TO- relays, originally conceived and developed by Teledyne, have become the industry standards for low level switching from dry circuit to ampere in high-vibration environments. Designed for high-density PC board mounting, these TO- relays are some of the most versatile ultraminiature relay available because of their small size and low coil power dissipation. The V Series high-vibration relays are designed to withstand vibration levels of 0 to 0 g s at the frequencies noted, when tested on a resonant beam for 0 to 0 seconds, in the axis parallel to contact motion (x-axis), or 00 g s Hz for 0 minutes in the x-axis. A unique magnetic circuit prevents contact opening (chatter) in excess of 0 microseconds under vibration or shock conditions. Typical applications: Avionics aircraft control Aircraft control systems Transportation systems (rail/truck) All welded construction Unique uni-frame design providing high magnetic effi ciency and mechanical rigidity High force/mass ratio for resistance to shock and vibration Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities DPDT Non-Latching Coil Type V = Standard Coil V = Sensitive Coil Diode Options D = Internal diode for coil transient suppression DD = Internal diode for coil transient suppression and polarity reversal protection Vibration 0 g s at 0 ± Hz 0 g s at 0 ± Hz 0 g s at 00 ± Hz Shock 0 g s msec, half-sine Acceleration 0 g s Temperature Operating & Storage: C to + C V DV DDV V DV P.U.V (max.) D.O.V min. max Resistive: A/Vdc Inductive: 00mA/Vdc (0mH). 0.. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc. 0.. Inductive: 00mA/Vdc (0mH). 0.. Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv Resistive: A/Vdc Inductive: 00mA/Vdc (0mH) Lamp: 00mA/Vdc Low Level: 0 to 0 ua/0 to 0 mv V V DV DV DDV HIGH PERFORMANCE Schematics as viewed from terminals P.U.V = Pick-Up D.O.V = Drop-Out Page (00) (0) 0 TELEDYNE RELAYS

37 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES LB AC BYPASS (Capacitor Gbps Normally Closed Gbps +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps Bit Rate Eye Height Eye Width Jitter P-P Gbps 0 mv.0 ps. ps Bit Rate Eye Height Eye Width Jitter P-P Gbps mv. ps. ps SERIES GLB AC BYPASS (Capacitor Gbps Normally Closed Gbps +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps Bit Rate Eye Height Eye Width Jitter P-P Gbps mv. ps. ps Bit Rate Eye Height Eye Width Jitter P-P Gbps mv. ps 0. ps SERIES SGLB AC BYPASS (Capacitor Gbps Normally Closed Gbps +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps 0 ps 0 ps 0 ps 0 ps 0 ps 00 ps Bit Rate Eye Height Eye Width Jitter P-P Gbps mv. ps. ps Bit Rate Eye Height Eye Width Jitter P-P Gbps mv. ps. ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

38 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES RF00/RF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv 0. ps.. ps 0. mv. ps..00 ps SERIES SRF00/SRF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.. ps. mv. ps..00 ps SERIES GRF00/GRF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv 0.0 ps.. ps. mv. ps.. ps Page (00) (0) 0 TELEDYNE RELAYS

39 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES SGRF00/SGRF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv.0 ps.. ps. mv 0. ps.. ps PATTERN GENERATOR SETTINGS 0 Gbps Random Pulse Pattern Generator - PRBS signal PRBS output of 00mV P-P (nominal) RF PCB effect (negligible) not removed from measurement Data shown is typical of both poles 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

40 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES RF00 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.0. ps. mv.0 ps.. ps SERIES GRF00 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv 0.0 ps.0. ps. mv. ps 0.. ps Page (00) (0) 0 TELEDYNE RELAYS

41 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES SGRF00 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv.0 ps..00 ps. mv. ps.0. ps SERIES GRF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.. ps. mv 0. ps.. SERIES RF/RF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.. ps. mv.0 ps..00 ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

42 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES GRF/GRF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0.0 mv. ps.. ps. mv 0. ps 0.. ps SERIES RF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0. mv. ps.. ps. mv. ps.. ps SERIES GRF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv.0 ps.. ps. mv. ps..00 ps Page 0 (00) (0) 0 TELEDYNE RELAYS

43 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES GRF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv 0. ps.. ps. mv. ps.. ps SERIES RF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0. mv. ps. 0. ps. mv. ps. 0. ps SERIES GRF0 Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv.0 ps.. ps 0. mv.0 ps. 0. ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

44 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES RF Typical Path +0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps.0 mv 0. ps.. ps SERIES GRF Normally Closed +0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps.0 mv 0. ps.. ps SERIES SGRF Normally Closed +0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps.0 mv 0. ps.. ps Page (00) (0) 0 TELEDYNE RELAYS

45 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES RF0/RF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.. ps. mv 0. ps.. ps SERIES RF0/RF Normally Closed Normally Open +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.. ps. mv 0. ps.. ps SERIES A0 Attenuated Path Thru Path +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv. ps.0.00 ps 0. mv. ps. 0. ps 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

46 APPENDIX: SIGNAL INTEGRITY EYE DIAGRAMS SERIES GA0 Attenuated Path Thru Path +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps.0 mv. ps.. ps 0. mv. ps.0. ps SERIES A Attenuated Path Thru Path +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps.0 mv. ps.. ps. mv.0 ps.. ps SERIES GA Attenuated Path Thru Path +0 mv +0 mv -0 mv -0 mv 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps 0 ps. mv.0 ps.. ps. mv. ps.0. ps PATTERN GENERATOR SETTINGS 0 Gbps Random Pulse Pattern Generator - PRBS signal PRBS output of 00mV P-P (nominal) RF PCB effect (negligible) not removed from measurement Data shown is typical of both poles Page (00) (0) 0 TELEDYNE RELAYS

47 RoHS and REACH CERTIFICATE OF COMPLIANCE RoHS It is hereby stated and certifi ed that Teledyne Relays complies with the Restrictions on Hazardous Substances (RoHS) Directives to the extent herein: Teledyne Relays does not use any of the Restricted Substances specifi ed by the RoHS Directives (listed below) as components in TO- and Centigrid Electromechanical Relay products, nor are these substances employed during any electromechanical relay manufacturing process: Lead Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls (PBB s) Polybrominated Diphenyl Ethers (PBDE s) However, upon request from the Customer, relay leads may be coated with solder, which contains 0% tin and 0% lead. REACH It is hereby stated and certifi ed that Teledyne Relays complies with the Registration Evaluation Authorization and Restriction of Chemicals (REACH) Directives to the extent stated herein: Teledyne Relays is a manufacturer of articles. Teledyne Relays has taken the initiative to review the () substances that are under consideration for treatment as Substances of Very High Concern (SVHC) candidates. Teledyne Relays confirmed that our relays do not contain any of the listed substances in concentration >0.% weight per supplied article, substance or preparation weight. For Additional Information please us at: [email protected] 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

48 APPENDIX: TELEDYNE RELAYS PART NUMBERING SYSTEM LoopBack Relays Relay Series LB YZ Ground Pin (Optional) Y = Center Position Z = Center Position Blank = No ground pin Relay Series GLB= Stub Pins SGLB = SMT J-Leads Ground Pin (Optional) Y = Center Position Z = Center Position Blank = No ground pin SGLB YZ Coil = V = V Capacitance 00= 00nF 00 = 0nF Coil = V = V Capacitance 00= 00nF 00 = 0nF Relay Series Ground Pin Option (See Appendix) * Not Applicable for GRF Relays RF Relays (Except Attenuator Relays) RF00 X - / S Q Q = Solder-Coated Leads G = Gold-Plated Leads (RoHS Compliant) R = RoHS Compliant Solder S = 0. Leads No Suffi x = 0. Leads ( =. V) T R Established Reliability Relays Established Reliability Designator Relay Series Ground Pin Option (See Appendix) Pad Option (See Appendix) ( =. V) ER Y M - A / S Q Q = Solder-Coated Leads G = Gold-Plated Leads (RoHS Compliant) R = RoHS Compliant Solder S = 0. Leads W =. Leads No Suffi x = 0. Leads Screening and Reliability Level (See Appendix for Screening Options) General Note: Parts ordered without suffi x may be supplied with Solder-Coated or Gold-Plated leads Parts ordered with Solder-Coated leads will have (Sn0/Pb0) Parts ordered with RoHS Solder-Coated leads will have (Sn./Cu0.) Not Applicable to GRF relays SMT=Surface Mount Technology Page (00) (0) 0 TELEDYNE RELAYS

49 APPENDIX: TELEDYNE RELAYS PART NUMBERING SYSTEM Military Qualified (JAN) Relays Military (JAN) Designator Relay Series Ground Pin Option (See Appendix) Pad Option (See Appendix) J Z M - P L Screening and Reliability Level (See Appendix for Screening Options) P = 0. Leads W =. Leads No Suffi x = 0. Leads ( =. V) Relay Series Commercial Surface Mount Relays S - / R Q = Solder-Coated Leads (Surface Mount Relays are Solder-Coated by default) R = RoHS Compliant Solder ( =. V) Commercial Relays, (Except Surface Mount Relays) Y M - / S Q Relay Series Ground Pin Option (See Appendix) Pad Option (See Appendix) Q = Solder-Coated Leads G = Gold-Plated Leads (RoHS Compliant) R = RoHS Compliant Solder S = 0. Leads No Suffi x = 0. Leads ( =. V) High Performance Relays DV X M - / S G Relay Series Q = Solder-Coated Leads Ground Pin Option (See Appendix) Pad Option (See Appendix) G = Gold-Plated Leads (RoHS Compliant) R = RoHS Compliant Solder S = 0. Leads W =. Leads No Suffi x = 0. Leads ( =. V) General Note: Parts ordered without suffi x may be supplied with Solder-Coated or Gold-Plated leads. Parts ordered with Solder-Coated leads will have (Sn0/Pb0) Parts ordered with RoHS Solder-Coated leads will have (Sn./Cu0.) 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

50 Handling Guidelines for TO- and Centigrid Relays ) Do not drop, throw or in any way mishandle individual relays, cartons containing relay packs, or individual relay packs. ) Store unused relays in a humidity controlled, shock and vibration-free environment. Storage temperature range limits -ºC to + ºC, however, when possible, relays should be stored in a ºC environment. ) Observe normal good practice in the handling and storage of any relay packs marked as static sensitive. ) When removing relays from packaging, do so with care. If removing relays from Styrofoam packaging, remove relays carefully as pouring them from the packaging may cause damage to the relay. If removing from bulk packaging, gently pour the relays from the container, taking care to not allow the relays to drop from the container onto the new surface, to prevent unnecessary shock. Do not allow relays to fall onto the fl oor. ) When transferring relays to the production area after unpacking, do not drop, throw, or mishandle the relays in any way. When removing relays from the container, pouring is acceptable but again should be done gently and in a way as to not allow the relays to drop. ) Attached relay spreader pads and insulating pads should not be removed from the relays. ) Relays should not be exposed to any process or environment that exceeds any limits within this guide or any published specifi cation that applies to the relay. ) Relays are hermetically sealed. Damaged to the casing or glass-to-metal seals will compromise the relays performance and reliability. ) Never subject relays to ultrasonic cleaning environments. 0) Unless otherwise specifi ed, do not subject relays to solder refl ow temperatures above 0ºC, minute maximum. ) Do not stack heavy object directly onto relays. ) Excessive handling of relay leads with bare hands, or exposure of the relay leads with other contaminating sources can compromise their solderability. ) Avoid exceeding -pound pull strength of the terminals. ) Avoid subjecting magnetic latching relays to large magnetic fi elds. Do not handle magnetic latching relays with magnetic holding tools. ) Avoid bending the fl ange, the base of the relays or bending/forming the leads in a manner which may result in deformation of the fl ange or base of the relays. Any such deformation, or handling, which results in visible deformations or dents to any part of the relays (including the cover) may compromise the precisely assembled internal parts of the relays, causing degradation of performance or potential permanent damage and may void the warranty. Page (00) (0) 0 TELEDYNE RELAYS

51 Relay Operation Latching Relays and Non-Latching Relays Maximum Coil Non-Latching Relays Only Nominal Relay must not drop out Relay must operate Pick-up or Set/Reset Maximum Hold Maximum Relay may or may not operate (undefined) Relay must not operate (unspecified) INCREASING COIL VOLTAGE DECREASING COIL VOLTAGE Relay may or may not drop out (undefined) Drop-out Minimum Relay must drop out 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

52 APPENDIX: Spacer Pads Pad designation and bottom view dimensions Height For use with the following: Dim. H Max. Ø.0 [.] (REF) Dim H MAX ER, ERD, ERDD. (.), D, TN,.00 (.) RF00, RF0, RF0 ER0, ERD, ER0DD,, ERD, ERDD, ER, ERD,.0 (.) ERDD,, D, RF ERT, ERT, ER, ERD, ERDD.00 (0.) M Pad for TO-, D, TN, RF0, RF, RF.0 (0.) RF.0 (.) ER, ERD, ERDD, ERT. (.) Dim H MAX ER, ERD, ERDD.00 (0.) RF.00 (.) M Pad for TO- RF.0 (0.), D.0 (.) Dim H MAX ER, ERD, ERDD, J, JD, JDD.00 (.) ER, ERD, ERDD, J, JD, JDD.00 (0.) RF00. (.00) M Pad for Centigrid. [.] (REF) RF0.0 (0.) C, A.0 (.) Dim H MAX ERC, JC.00 (.). [.] (REF) ERC, JC.00 (0.) RF0. (.) M Pad for Centigrid Notes:. Spacer pad material: Polyester fi lm.. To specify an M or M spacer pad, refer to the mounting variants portion of the part numbering example in the applicable datasheet.. Dimensions are in inches (mm).. Unless otherwise specifi ed, tolerance is ±.00 (. mm).. Add 0 mω to the contact resistance shown in the datasheet.. Add 0.0 oz. (0. g) to the weight of the relay assembly shown in the datasheet. A0.0 (.) Page 0 (00) (0) 0 TELEDYNE RELAYS

53 APPENDIX: Spreader Pads Pad designation and bottom view dimensions Height For use with the following: Dim. H Max..00 [.].0 [.].0 [.] MAX SQ.00 [.0] M Pad / /.00 [.].00 [.] Dim H MAX.0 [.] MIN.0 [0.] (REF) ERT, JT, ER, ERD ERDD, J, JD, JDD. (.) ERT, JT, D, TN. (.) ERT, JT, ER, ERD ERDD, J, JD, JDD. (.) ERT, JT, D, TN.0 (.) ER0, J0, ER0D, J0D ER0DD, J0DD, ER, J ERD, JD, ERDD JD, ERDD, JDD,. (0.).0 [.] SQ.00 [.] ERT ER, ERD, ERDD J, JD, JDD. (.0).00 [.].00 [.].0 [.] Dim H MAX, D. (.) ER, ERD, ERDD, D. (.).00 [.].0 [.].00 [.] M Pad / /.0 [.] MAX SQ.00 [.0] M Pad / / /.0 [.].00 [.].00 [.].0 [.] Dim H MAX.0 [.] MIN ERT ER, ERD, ERDD. (.), D. (.) ER, ERD, ERDD, ERTX ERX, ERDX, ERDDX ERTX. (.) X, DX, TNX. (.) ER0X, ER0DX, ER0DDX ERX, ERDX, ERDDX. (0.) ERX, ERDX ERDDX, X, DDX ER, ERD, ERDD ERTX ERX, ERDX, ERDDX ERTX. (.) X, DX, TNX.0 (.) Notes:. Spreader pad material: Diallyl Phthalate.. To specify an M, M or M spreader pad, refer to the mounting variants portion of the part number example in the applicable datasheet.. Dimensions are in inches (mm).. Unless otherwise specifi ed, tolerance is ±.00 (0. mm). /. Add mω to the contact resistance shown in the datasheet. /. Add.0 oz. (0. g) to the weight of the relay assembly shown in the datasheet. /. Add 0 mω to the contact resistance shown in the datasheet. /. Add 0.0 oz (0. g) to the weight of the relay assembly shown in the datasheet. /. M pad to be used only when the relay has a center pin (e.g. ERM-A, XM-.).0 [0.] (REF) 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

54 APPENDIX: Ground Pin Positions Ø.00 [Ø.0] "Z" POSITION "X" POSITION "Z" POSITION Ø.00 [Ø.0] ± "Y" POSITION ± "Y" POSITION TO- Relays: ERT, ER, ERT, ER0, ER, ER, ERT, ER, ERT,, TN, 00H, 00K, 00V, RF00, RF0, RF, RF, RF0, RF, RF0, RF TO- Relays: ER, ER, RF, RF.00 [.] "Y" POSITION "W" POSITION.00 [.] "Y" POSITION.00 [.] "Z" POSITION "Z" POSITION.00 [.] "X" POSITION.00 [.].00 [.] "U" POSITION (ERC and ERC only).00 [.] Centigrid Relays: RF0, ERC, C, ERC Centigrid Relays: RF00, RF0, ER, ER, Indicates ground pin position Indicates glass insulated lead position Indicates ground pin or lead position depending on relay type NOTES. Terminal views shown. Dimensions are in inches (mm). Tolerances: ±.00 (±.) unless otherwise specifi ed. Ground pin positions are within.0 (0.) dia. of true position. Ground pin head dia., 0.0 (0.) ref: height 0.00 (0.) ref.. Lead dia. 0.0 (0.) nom. Page (00) (0) 0 TELEDYNE RELAYS

55 ISSR Guide0 v00.indd //00 :: AM APPENDIX: Teledyne Relays T R Program Teledyne Relays program was developed to provide the JAN relay user an alternate means of specifying and procuring established reliability relays. The form, fit and function of a relay is the same as that of its JAN counterpart. program requirements differ in certain regimens/tests found in both MIL-PRF- and MIL-PRF-0 that add cost but no value to the relay. This program parallels the military specifi cations in most aspects. The components that make up such a program are intricate and varied. Furthermore, there are additional options of high value for design, manufacturability and operation of high reliability assemblies. The following page presents a table that compares the 00% screening performed on JAN relays and relays prior to shipment. Other signifi cant highlights of the program include: Two unique screening levels The ability to define lead finish Spacer pad options which may not be available in military specifi cations Ground pin options which may not be available in military specifi cations Reduced lead time Reduced cost The program is fully defined for both general product requirements and detailed product requirements in the following Teledyne Relays specifi cations: TR-R- TR-STD- TR-STD- TR-ERL- TR-R-/XXX TR Supplement Copies of these documents are available from Teledyne Relays. We suggest that users check with Teledyne Relays from time to time to assure that they have the latest issue. Can t Find What You Need? Check out our full line of relays and switches. Order literature online at 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

56 APPENDIX: Teledyne Relays T R Program INSPECTION A Level.%/0K Cycles Screening Levels B Level.%/0K Cycles JAN L Level %/0K Cycles JAN M Level %/0K Cycles Subgroup Screening, Internal Moisture AQL Vibration (Sinusoidal) AQL Vibration (Sinusoidal) 00% Screening, Burn-In (Hybrids only) Screening, Run-In (Room Temperature) Screening, Run-In (+ C and C) Subgroup Coil or Coil Current Insulation Dielectric Withstanding Static Contact Pickup and Dropout or Set and Reset Operate and Release or Set and Reset Time Hold Turn-On and Turn-Off Time (Hybrids only) Contact Bounce Time Contact Stabilization Time Turn-On Current (T Hybrids only) Turn-On (C Hybrids only) Turn-Off (Hybrids only) Coil Transient Suppression (D, DD and Hybrids only) Diode Blocking Integrity (DD only) Zener (C Hybrid only) Neutral Screen (Latching Relays only) Break Before Make Verifi cation Contact Simultaneity Subgroup Solderability Samples per Daily Solderability Inspection Lot Leak Test External Visual and Mechanical Inspection /Lot for Dimension and Weight Check AQL = Acceptable Quality Level Page (00) (0) 0 TELEDYNE RELAYS

57 Teledyne Relays HI-REL Program Teledyne Relays: Because in deep space there is no acceptable failure rate Teledyne Relays has a long history of supplying High Reliability relays for use in space bound vehicles. From the earliest deep space probes, such as Voyager I, now nearing billion miles out in space, to the next generation of probes scheduled for the future, Teledyne Relays continues to be the preeminent supplier of Hi-Reliability relays to the space market. Teledyne Relays Hi-Reliability Specification: TR-HIREL- Eliminates the need for customers to develop and maintain specifi cations. Manufacturing and Quality Assurance requirements are fully defi ned and documented. Meets the general requirements of both ESA/ SCC and NASA/GSFC documents. Offers options for 00% Group A screening Offers options for levels of Lot Acceptance Testing (LAT). Teledyne Screening Document 0-0- NASA approved screening regimen based on NASA/GSFC S--P. RELAY TYPES TO- Magnetic-Latching Relays TO- Non-Latching Relays TO- Magnetic-Latching, High-Shock Relays TO- Non-Latching, High-Shock Relays TO- Non-Latching, High-Vibration Relays HI-REL SCREENING CAPABILITIES 00% Open Electrical Inspection 00% Precap Inspection Fully Automated Small Particle Inspection (Millipore Clean) Asynchronous Miss Test Coil Continuity Sine Vibration Random Vibration High/Low Run In (Miss Test) C ± C Radiographic Inspection Mechanical Shock Test Thermal Shock Test Acceleration Radiographic Inspection (X-ray) Mechanical Shock Test Thermal Shock Test Acceleration Load Banks for a Variety of Life Test Load Serialized Printed Electrical Data Continuous Life Testing Environmental Testing Vertical Integration For information or answers to your questions, please visit our website. 0 TELEDYNE RELAYS SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Page

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