th ISSE International. Seminar in Electronics. Spring. Technology (ISSE 2014) Dresden, Germany May 2014 ISBN:

Transcription

1 th ISSE International Spring Technology Seminar in Electronics (ISSE 2014) Dresden, Germany 7-11 May 2014 IEEE Catalog Number: CFP14509-POD ISBN:

2 Table of Contents Autors Title Pages Paul Gierth, Lars Rebenklau Michal Jurcisin, Stanislav Slosarcik, Slavomfr Kardos Wettability of Rapid Thermal Firing Silver-Pastes Heat Dissipation Based on LTCC - HTCC Heterostructure Andrea Marie, Nelu Blaz, Goran Radosavljevic, Sasa Toskov, Ljiljana Zivanov Affect of Peak Sintering Temperature Variation on LTCC Ferrite Tape Complex Permeability Marco Steinhauser, Gerhard Eckart, Gudrun Lange Electron Beam Brazing of Copper and Aluminium Sasa Toskov, Nenad Krcic, Goran Radosavljevic LTCC Lamination Process Using PMMA Fugitive Material Dirk Seehase, Heiko Huth, Arne Neiser, Mathias Nowottnick Attila Geczy, Laszlo Gal, Istvan Hajdu, Balint Kovacs, Daniel Nagy, Miklos Ruszinko Peter Lukacs, Alena Pietrikova, Lubomir Livovsky Reactive Paste for Reflow Soldering of Large Components Optimizing Solder Joints on Biodegradable PCBs with Vapour Phase Soldering Analysis of Mechanical Properties of LTCC Substrates Stoyan Stoyanov, Alexander Dabek, Chris Bailey Hot Nitrogen Deballing of Ball Grid Arrays A. G. Staat, T. Hohlfeld, T. Standau, 1. Weimann, R. Bauer, K. Harre Substrates Based on Renewable Resources for Printed Circuit Boards Alexandra Fodor, Rajmond Jano, Dan Pitica Thermal Influences on IC Packages During Manual Soldering Process iii 37th Int. Spring Seminar on Electronics Technology

3 P. Fulmek, G. Langer, F.-P. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, J. Nicolics Direct Junction Temperature Measurement in High-Power LEDs Przemystew Krystian Matkowski Comparative Thermal Analysis of Commercial and Novel Hybrid Thermal Greases Bartosz Ptetek, Tomasz Fafat, Jan Felba Ciprian lonescu, Detlef Bonfert, Mihai Branzei Michal Stekovic, Josef Sandera Ryszard Kisiel, Bartosz Platek, Marcin Mysliwiec Paul Svasta, Andrei Marghescu, Traian Neacsa Cryptographic Evaluation of the Interfacial Resistance Between Carbon Nanotube and Silicon by Using Molecular Dynamics Simulations Investigation on Thermal Properties of Substrates for Printed Electronics Fabrication of Electrochemical Sensor in Low Temperature Co-Fired Ceramics Thermal Properties of Ag Sintered Layer Used as Interconnect Material in Microelectronics Packaging Coprocessor for Data Integrity Algorithms Karel Hromadka, Jiri Stulik, Jan Reboun Martin Klima, Jakub Somer, Lucie Blahova, Michal Prochazka, Ivan Szendiuch Thick Printed Copper Conductors on Alumina Substrates Usage of Low-Temperature Co-Fired Ceramic in Hermetic Packaging Jerzy Szatepak, Aleksander Gados, Konrad Kietbasihski, Anna Mbzniak, Jakub Krzemihski, Marian Teodorczyk, Tomasz Kowaluk, Malgorzata Jakubowska Nanosilver Sintered Joints on Elastic Substrates 104 Pavel Mach, David Busek Oliver Krammer Study of Thermomechanical Properties of One- and Two-Component Conductive Adhesives Correcting Factor of Solder Paste Volume Calculation for Pin-in-Paste Technology iv 37^ Int. Spring Seminar on Electronics Technology

4 Agility Kornel Ruman, Alena Pietrikova, Igor Vehec, Tibor Rovensky, Pavol Galajda Integration of Microstrip LP and BP Filters to Multilayer Structure Based on Various LTCC Katharina Schulz, Daniel Ernst, Siegfried Menzel, Thomas Gemming, Juergen Eckert, Klaus-Juergen Wolter Thermosonic Platinum Wire Bonding on Platinum Daniel Ernst, Michael Melzer, Denys Makarov, Falk Bahr, Wilfried Hofmann, Oliver G. Schmidt, Thomas Zerna Packaging Technologies for (Ultra-)Thin Sensor Applications in Active Magnetic Bearings Lukas Lorenz, Sebastian Sohr, Ralf Rieske, Krzysztof Nieweglowski, Thomas Zerna, Klaus-Jurgen Wolter Development of a Wafer-Level Integration Technology for Photonic Transceivers Based on Planar Lightwave Circuits Paul Gierth, Michael Zieschank, Lars Rebenklau Evaluation of Long Time Stability of Solder Joints on Ag Thick Film Conductors on AI2O Tomas Blecha Screen Printed Chipless RFID Tags Martin Hirman, Karel Rendl, Frantisek Steiner, Vaclav Wirth Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu Balazs Hies, Barbara Horvath Martin Molhanec, Ivana Beshajova-Pelikanova Tin Whisker Growth from Low Ag Content Micro-Alloyed SAC Solders Employing Model Based Failure Mode and Effect Analysis for Screen Printing Martin Molhanec, Rajmond Jano, Alexandra Fodor Extreme - Manufacturing to Greater Productivity and Quality Soldering Profile Optimization for Through-Hole and Surface Mounted Ceramic Capacitors V 37 Int. Spring Seminar on Electronics Technology

5 Damian Nowak, Andrzej Dziedzic Reliability of Fine-Line Thick-Film and LTCC Conductors at High-Temperature Operation Arne Neiser, Dirk Seehase, Andreas Fink, Kevin Lehnzen, Helmut Beikirch Thermoelectric Generator for Stand- Alone Electronic Device Operation in Temperature Test Cabinets Karel Dusek, Martin Placek, David Busek, Klara Dvofakova, Alexandra. Rudajevova Study of Influence of Thermal Capacity and Flux Activity on the Solderability Karel Dusek, Ivana Beshajova Pelikanova, David Busek, Marek Zeidler Measurements of Solder Paste Viscosity During Its Tempering and Aging Martin Placek, Karel Dusek, Jan Urbanek A. Otahal, M. Adamek, 1. Szendiuch A. Pietrikova, J. Durisin, M. Bazu, V. Mian Whiskers Growth on Thick Tin Layers and Various Types of Surfaces Impact of Solder Paste Drying on the Solderability Influence of Different Methods of Ageing on Microstructure of Solder Joints Adrian Tulbure, Emilian Ceuca, Dirk Turschner Arduino Based Power Semiconductors Tester for Urban Traction Systems Pavel Mach, Martin Horak Ageing of Self-Healing Polypropylene Film Capacitors by Non-Sinusoidal Voltage Attila Geczy, Marta Fejos, Laszlo Tersztyanszky, Andras Kemler, Andras Szabo Tibor Rovensky, Alena Pietrikova, Kornel Ruman, Igor Vehec Dan-Sebastian Filip, Dorin Petreus loan Plotog, Marian Vladescu Investigating Printed Circuit Board Shrinkage During Reflow Soldering Stability of LTCC Substrates in High Frequency Area After Accelerated Aging Tests Wireless Energy Transfer Using Resonant Induction Working Temperatures Influence Over the Solder Joints Properties vi 37 Int. Spring Seminar on Electronics Technology

6 Goran Miskovic, Luka Vuckovic, Javier Fernandez, Heinz Homolka, Michael Unger, Goran Radosavljevic Investigation on physical and electrical behaviour of LTCC dielectric tapes Przemystaw Krystian Matkowski, Tomasz Fatat, Zbigniew Zaluk, Jan Felba, Andrzej Moscicki Structure of the Thermal Interface Connection Made of Sintered Nano Silver Krzysztof Jerzy Urbahski, Tomasz Fatet, Przemystaw Matkowski, Marcin Szczerba, Jan Felba, Andrzej Moscicki Investigation of Electrical Properties of Contacts Made of Materials Based on Sintered Nano-Ag Particles Mihai Branzei, Bogdan Mihailescu, Ion Pencea Balint Medgyes, Istvan Hajdu, Richard Berenyi, Laszlo Gal, Miklos Ruszinko, Gabor Harsanyi Lead / Lead-Free Solder Alloys Shear Tests Correlations with Structure at Different Temperatures Electrochemical Migration of Silver on Conventional and Biodegradable Substrates in Microelectronics Anna Andonova, George Angelov, Peter Chernev Diagnostics of Packaged ICs By Infrared Thermography Anna Andonova, Ivaylo Zhivkov, Yavor Georgiev, George Angelov, Jana Honova, Martin Weiter Thermographic Control of Organic Solar Cells Krystian Jankowski, Artur Wymystowski Acceleration of Life Prediction of Solder Joints Using Multi-Failure Criteria Elitsa Gieva, Rostislav Rusev, George Angelov, Rossen Radonov, Marin Hristov Microelectronic Circuits Analogous to Hydrogen Bonding Networks in Michaelis Complex of Beta-Lactamase Protein vii 37th Int. Spring Seminar on Electronics Technology

7 Radu Gabriel Bozomitu, Vlad Cehan, Robert Gabriel Lupu A New CMOS Differential Input FM Quadrature Demodulator Boleslav Psota, Alexandr Otahal, Ivan Szendiuch Mechanical Testing of PCB Using Computer Simulations Robert Gabriel Lupu, Radu Gabriel Bozomitu, Vlad Cehan Jan Simota, Jin Tupa Snezhana Pleshkova- Bekyarska, Aleksandar Bekyarski S. G. Pleshkova, K. Peeva, A. Bekyarski Detection of Gaze Direction by Using Improved Eye-Tracking Technique Implementation of SPC Methodology to Service Processes Multicore DSPs Thermal Image for Real Time Sequence Processing Motion Detection in Thermal Surveillance System Received Thermal Images Quality Estimation in Thermo Vision Communication Systems David Kurzmanowski, Jurgen Wilde Using Layout Data for Predicting Effects on Production Processes in PCB- Manufacturing E. Ceuca, A. Tulbure Modeling and Practical Strategy for PWM 1. M. Costea, C. 1. Dumitrescu, N. Dumitru, B. Soare Control in Heating Applications Biomedical Signals Analysis Techniques Using the Signal Processor TMS320C6211B M. Costea, P. A. Tanasa, 1. Barbu, 1. Cojocaru, N. Dumitru Automatic Traffic Monitoring System Aurelian Botau, Detlef Bonfert, Catalin Negrea Electrical and Thermal Behavior for DC and Pulsed Stress on Chip Resistors Martin Bursik, Vladimir Sitko, Michal Rezmcek, Ivan Szendiuch, Jaroslav Jankovsky Analytic Method for Monitoring of Cleaning Process Efficiency Dorin Petreus, Toma Patarau, Radu. Etz, Tiberiu Frentiu Portable System for Heavy Metals Detection Based on Spectral Analysis viii 37th Int. Spring Seminaron Electronics Technology

8 Manuela Franz, Ivan Szendiuch Grzegorz Wroblewski, Marcin Stoma, Daniel Janczak, Anna Mtozniak, Mafgorzata Jakubowska Distribution of Free-Field Photovoltaic Plants in Europe and Exemplarily in South Moravia, Czech Republic Electroluminescent Structures With Nanomaterials for Direct Printing of Interactive Packages and Labels Alexandr Knapek, Filip Mika, Jan Prasek, Petra Majzlfkova SEM Characterization of Carbon Nanotubes Based Active Layers of Chemical Sensors Tomasz Falat, Przemyslaw Matkowski, Zbigniew Zaluk, Jan Felba, Andrzej Moscicki Mechanical Strength of Joints Based on nano-ag Sintering Phenomena Attila Bonyar, Balazs Wimmer, Istvan Csarnovics Irina Y. Uvarova, Roman M. Rudenko, Elena A. Voitsihovska, Ivan 1. Yaskovets, Boris A. Danilchenko Eugen Coca, Vlad Cehan Development of a Localised Surface Plasmon Resonance Sensor Based on Gold Nanoparticles Accumulation and Recovery of Radiation- Induced Damages in Single-Walled Carbon Nanotube Bundles Laboratory Study of Electromagnetic Waves Reflectivity of Certain Materials C. A. Tamas, N. D. Codreanu, C. Grecu, 1. Marghescu Dan Tudor Vuza, Marian Vladescu Arkadiusz P. Dabrowski, Leszek J. Golonka Investigations on Silicon and PCB Ground System Design for New 1.2V DDR4 Power Sources Solving an EMC/EMI Problem Occurred Inside a Complex Programmable Logic Device LTCC/PZT Differential Pressure Sensor Utilizing Ultrasonic Wave Resonator Tamas Garami, Norbert Reti, Oliver Krammer Controlling the Cooling Rate of Soldering Processes with PIC Microcontroller Radek Soukup, Ales Hamacek, Lukas Mracek, Jan Reboun Textile Based Temperature and Humidity Sensor Elements for Healthcare Applications ix 37th Int. Spring Seminar on Electronics Technology

9 Hristo Ivanov, Marin Valkov Emil lontchev, Radostin Kenov, Rossen Miletiev, Ivaylo Simeonov, Yavor Isaev Milica G. Kisic, Nelu V. Blaz, Andrea M. Marie, Goran J. Radosavljevic, Ljiljana D. Zivanov, Mirjana S. Damnjanovic Application of Sensors and Control Microsystems to Improve Efficiency and Service Life Durability of LED Lighting Equipment Hardware Implementation of Quad Microelectromechanical Sensor Structure for Inertial Systems Influence of Coil Design on Sensing Performance of Pressure Sensor with Polyimide Membrane Oleksandr Bogdan, Anatolii Orlov, Gennady Pashkevich, Veronika Ulianova, Yurii Yakimenko, Andrii Zazerin Optimal Parameters Determination for Nanostructure-Enhanced Surface Acoustic Waves Sensor Nikolay Dodev, Nencho Nenov, Emil Dimitrov, Venelin Pavlov Electronic Measurement System of Flexi-Coil Suspension Springs Test Stand Nelu Blaz, Andrea Marie, Sasa Toskov, Goran Miskovic, Goran Radosavljevic, Ljiljana Zivanov Capacitive Sensor for Quantity Detection of Known Liquid Present in Distilled Water Norocel Codreanu, Gaudentiu Varzaru, Ciprian lonescu David Wagner, Bertram Schmidt, Markus Detert Roland Wuchrer, Georg Lautenschlager, Rene Metasch, Mike Rollig, Thomas Fleischer, Thomas Hartling Solar Powered Wireless Multi-Sensor Device for an Irrigation System Challenges to the Electronics Packaging Technologies for the Volume Integration of Components in Medical Tools and Instruments Filter-Based Interrogation of Fiber Bragg Grating Sensors X 37 Int. Spring Seminaron Electronics Technology

10 Ondrej Kainz, Slavomir Kardos, Stanislav Slosarclk, Michal Jurcisin, Pavol Cabuk Virtual Factory for PCB and Thick-Film Circuits Fabrication James Morris, Lisa Weasel, Peter Moeck, Juna Snow Nanotechnology Courses for General Education Florin Draghici, Mihaela Pantazica, Norocel Dragos Codreanu, Paul Svasta - Hands-On Project Key Issue in the Education of Future Electronic Engineers A. Ktossowicz, P. Winiarski, M. Zawierta, W. St plewski, A. Dziedzic Analysis oflong-term Stability of Capacitors Embedded in Printed Circuit Boards Jan Macioszczyk, Piotr Slobodzian, Leszek Golonka Improvement of the Frequency Bandwidth of LTCC Meander Antenna Yurii Yakimenko, Andrii Zazerin, Anatolii Orlov, Oleksandr Bogdan Film Bulk Acoustic Resonator Finite Element Model in Active Filter Design Timo Kordass, Jorg Franke Galvanic Plating for 3D-MID Applications xi 37 Int. Spring Seminar on Electronics Technology