Precision manufacturing methods of inserts for injection molding of microfluidic systems.
|
|
|
- Fay Stanley
- 9 years ago
- Views:
Transcription
1 Precision manufacturing methods of inserts for injection molding of microfluidic systems. Giuliano Bissacco, Hans N. Hansen, Peter T. Tang & Jimmy Fugl Department of Manufacturing Engineering and Management Technical University of Denmark Produktionstorvet, Kgs Lyngby, Denmark Abstract Manufacturing of tools for micro injection molding and hot embossing of microfluidic systems can be realized by several different process sequences, mainly based on combinations of photolithography, etching and electrodeposition. The paper presents a classification of the available process sequence alternatives and proposes a new solution based on generation of the pattern by mechanical or thermal material removal operations. An experimental investigation is carried out for the verification of the accuracy achievable with the proposed method. Experimental results are compared to literature data concerning the other fabrication alternatives. Although mechanical and thermal material removal operations are inferior to conventional methods regarding accuracy and minimum feature size, they allow the integration of real 3D features into the design of polymer microfluidic systems to be produced in large volumes. Introduction Manufacturing of polymer microfluidic components is a key technology for the implementation of microfluidic devices in consumer products. If fluidic chips can be produced in an effective, accurate and economical way, a whole range of new applications will emerge and the applications already existing will attract much more attention. Low cost mass-production of polymer microfluidic components can be achieved using either injection molding or hot embossing. Both techniques require a tool to transfer the microstructures to the polymer material. A key issue is therefore the manufacturing of the tool. Depending on the number of replications specified and required accuracy, a number of very different processes can be utilized to obtain the tool (or tool insert in case of injection molding). Currently, production methods are mainly based on combinations of photolithography, etching and electrodeposition, and are therefore characterized by the limitations of such processes. Particularly the obtainable geometries are limited to 2½D microstructures. A viable alternative is constituted by the introduction of mechanical and thermal processes based on material removal in the process chain for insert fabrication. Such processes allow manufacturing of complex 3D shapes with high aspect ratios. Basic tool fabrication schemes The currently known methods for fabrication of tools for hot embossing and injection molding can be grouped in four basic manufacturing schemes. Some of the schemes include variants so the total number of fabrication schemes amounts to eight. Of the four main fabrication schemes two use silicon substrates and two use other materials as the substrate (polymers or metals). Two schemes utilize subtractive micromachining (reactive ion etching, mechanical micromachining or laser micromachining) and two schemes involve additive micromachining (UV-lithography combined with electroforming). The four schemes are briefly presented in the following. Fabrication scheme 1 A thick photoresist is applied to a flat metal disc by spin coating. The photoresist (such as SU-8) is exposed through a mask and developed. The metal substrate is then chemically or electrochemically activated to remove residues of photoresist and oxide layers. The disc is then moved to the electroplating bath and a nickel layer is built having a thickness just below that of the photoresist. The
2 photoresist is stripped and the tool insert is complete. The process sequence is described in [1] and shown in Fig. 1a. This process looks a little like UV-LIGA, except that the tool insert is fabricated directly and thus becomes a negative as compared to UV-LIGA. Fabrication scheme 2 This scheme is similar to what is sometimes referred to as UV-LIGA because the hard X-ray radiation used in traditional LIGA [2] is replaced with cheap and relatively long wavelength UV-light. The substrate is a clean, oxidized silicon wafer with a plating base consisting of 50/500 Å of Ti/Au (or Cr/Au) deposited by sputtering or evaporation of the metals in a vacuum chamber (PVD). A thick photoresist (such as SU-8) is applied to the disc by spin coating, exposed through a mask and developed. Photoresist residues are then removed by exposing the entire wafer to low energy oxygen plasma. At this point the fabrication scheme can move in two directions, Fig. 1b: Scheme 2a: The disc is moved to the electroplating bath and a nickel layer is built having a thickness just below that of the photoresist. In order to make the photoresist conducting on the top, the disc is returned to the vacuum chamber and a layer of for instance chromium/gold is sputtered onto the entire surface. The electroplating is then continued until a thickness of 2-3 mm is reached. Finally the nickel insert machined to the desired size and flatness, the silicon wafer dissolved in KOH (potassium hydroxide) and the photoresist removed. Scheme 2b: The wafer is electroplated with several millimeters of nickel - the nickel structures are simply allowed to grow together eventually covering the entire wafer. This is followed by machining of the back of the wafer and selective etching of silicon, plating base and photoresist. The basic difference between schemes 2a and 2b consists in the introduction of a conductive layer in order to uniform the growth of the nickel on the back of the insert. Fabrication scheme 3 Differently from the previous schemes, this one is based on subtractive micromachining by means of Reactive Ion Etching (RIE), also called Advanced Silicon Etching (AES). The pattern is obtained by UV-lithography of a thin photoresist (such as Hoechst AZ5214E) and subsequent etching of a mask material (typically silicon oxide or silicon nitride). Depending on whether, after the etching, the silicon wafer is to be used directly as a tool, or indirectly as a master, a positive or a negative mask is used respectively, leading to the following variants, Fig. 1c: Scheme 3a: A thin layer of titanium and gold is sputtered onto the entire surface (including the sidewalls). The wafer is then moved to the electroplating bath, and a metal layer of 2-3 mm is deposited. The tool insert is machined to the desired size and the silicon wafer is dissolved in KOH. The metal tool insert can be used for both hot-embossing and injection molding. The fabrication method is sometimes called DEEMO after Elders, Jansen and Elwenspoek [3]. Scheme 3b: The silicon wafer is glued or bonded onto a thick substrate with a similar thermal expansion coefficient (such as glass). This tool is used directly for hot-embossing. Fabrication scheme 4 The required pattern is generated into a substrate by means of mechanical or thermal processes as for instance micromilling, microedm or laser ablation. Depending on the chosen substrate and machining process, once the pattern has been machined, the fabrication scheme can move in one of three directions, Fig. 1d: Scheme 4a: The machined substrate, made of a polymer (such as ABS) or a soft-metal, is used as a master (positive) for electroforming of a tool insert (negative). If the substrate is made of polymer, chemical activation or coating by sputtering or evaporation is necessary prior to electroforming. The electroformed tool insert will typically consist of a thin activation layer (in case of a non-conducting polymer substrate), and a thick and wear resistant layer (nickel or nickel alloys). After electroforming and machining of the back of the insert, the substrate or master is dissolved. Scheme 4b: Here the substrate is machined and used as it is, perhaps with a little post-processing such as cleaning or mechanical polishing. If the substrate is a high performance polymer (e.g. PEEK), or a soft metal, the mould can be used for hot embossing [4]. If instead hardened tool steel is used for the substrate, the insert can be used for injection molding for very large volume production.
3 Scheme 4c: The substrate, made of polymer or soft-metal, is machined as in 4b and cleaned. To improve the wear and corrosion resistance it is then activated and electroplated with thin layers of copper, nickel or hard chromium. This scheme requires that metallization of the polymer or soft-metal is possible with good adhesion. a) Fabrication sequence for a tool insert based on a metal substrate, lithography and electroforming. b) Fabrication scheme based on silicon substrates, lithography and electroforming. c) Fabrication schemes utilizing reactive ion etching of silicon, either indirectly (3A) or directly (3B) for the fabrication of tool inserts for hot-embossing and injection molding. d) Fabrications schemes based on subtractive micromachining of non-silicon substrates. Fig. 1 Basic schemes for fabrication of hot embossing molds and injection molding mold inserts.
4 While the first three fabrication schemes are basically limited as concerns the obtainable shapes to 2½D structures, the fourth one allows the generation of real 3D features on the inserts. Moreover, the manufacturing time is typically much shorter, as no photoresist needs to be applied, exposed, developed and removed and only one electroforming step is included (or none in case of direct machining on tool steel). On the other hand scheme 4 presents limitations concerning the minimum feature size and the overall achievable accuracy because of the inherent limitations of mechanical and thermal processes relative to UV-lithography. In the following, the results from an experimental investigation, based on the application of scheme 4a and 4b to the fabrication of injection molding mold inserts with 2½D and real 3D micro features, are presented. Experimental investigation on tool fabrication by mechanical material removal According to the fabrication scheme 4, the mold insert can be obtained by mechanical or thermal material removal operations, either directly on the substrate or on a master for subsequent electroforming. These two alternatives have been considered for an experimental investigation of the achievable accuracy of injection molding inserts. The selected process for material removal was micromilling. Micromilling is a suitable technique for manufacturing of microstructures characterized by high aspect ratios and complex geometries, allowing the realization of nearly any shape. The size of the features of the insert must comply with the minimum tool diameter. As a consequence, at present the minimum size of concave features is limited to approximately 100 microns. Convex features do not present the same limitation, but must be able to withstand to the cutting forces without excessive elastic deformation. Due to the low structural stiffness of the micro end mills, cutting forces produce not negligible deflections of the tool and thereby variations of the dimensions of the machined features relative to the nominal values. Finally, differently from etching processes where the material removal takes place at atomic level, in micromilling the minimum material removal unit is in the order of a few tens of µm 3. This implies limitations on the resolution as well as problems related to material deformation, as for instance formation of burrs on the machined microstructures. The microfluidic system chosen for this investigation was not designed for a specific application, but as a test for the process capabilities. The insert design, which contains 2½D and 3D features with a minimum size of 200 microns, was chosen in such a way as to take advantage of the flexibility of the micromilling process, making it virtually impossible to produce it by silicon micromachining. The design incorporates four main chambers provided with micro features for fluid mixing and a series of channels connecting the chambers with each other and with the areas where the fluids are injected. The design of the plastic part is symmetric, as can be noticed from Fig. 2. The four chambers are 5 mm long, 1.5 mm wide and maximum depth is 1.5 mm. Two different types of protrusions characterize the four chambers. A series of three prismatic protrusions is present on the two right chambers in Fig. 2. Such protrusions are characterized by different heights, 1.2 mm, 0.9 mm and 0.6 mm. Similarly, three pyramidal protrusions (3D features) are present in each of the two left chambers, having heights of 1.2 mm, 0.9 mm and 0.6 mm. The channels are 0.2 mm both in width and depth. 12 complementary 3D pyramidal chambers for fluid injection are present. Following scheme 4a, a 2½D prismatic master was realized in aluminum, its shape corresponding to the shape of the positive of the plastic part, while, according to scheme 4b, a mould insert, whose shape corresponds to the negative of the plastic part, was machined in prehardened tool steel (35 HRC). The machine tool used for the manufacturing of both the aluminum master and the tool steel insert was Fig. 2 3D model of the test microfluidic system. a 3 axis CNC vertical milling
5 machine and high accuracy machining was achieved by means of a special machining procedure as described in [5]. The machining sequences required tools with diameters ranging from 6 mm to 200 µm. A detailed description of the machining sequences is reported in [6]. As regards the accuracy of the machined parts, dimensional verification was carried out on selected features [7]. The measured parameters were the width of the channels, measured with an optical CMM and the slope of the pyramids and height of prismatic protrusions in the main chambers, measured with a confocal microscope. The results are summarized in Tab. 1. Al channel 1 [µm] channel 2 [µm] inter-channel [µm] pyramid slope [deg] prism. protrus. height [µm] Nominal Measured Deviation Measured Deviation Tab. 1 Measurement results on selected features. As for the channel area, Fig. 3, all the machined grooves, which correspond to the two channels for the metal masters and to the distance between the channels for the steel insert, are smaller than the nominal dimensions. This is due to the deviation of the tool diameter from the nominal value and to the development of tool wear. The protruding features Aluminum instead, which correspond to the two Fig. 3 SEM images of the channel area. channels for the steel insert and to the distance between the channels for the metal master, are larger than the nominal dimensions in both cases. For the metal master, this is the direct consequence of the reduced size of the two grooves. For the steel insert an additional effect due to the tool deflection during the side milling of the two channels, is present, which increases the observed deviations. Aluminum Concerning the slope of the pyramids, Fig. 4 3D pyramidal protrusion/cavity area. deviations of 0.3 from the nominal slope were observed on the steel insert, while larger deviations of 3.4 were observed on the aluminum master. SEM images of the pyramids are shown in Fig. 4. Particularly accurate is the height of the prismatic protrusion on the steel insert, with deviations of 1 to 2 microns, Fig. 5. As a general observation on the accuracy of the micromilled features, grooves with nominal dimension equal to the nominal Aluminum tool diameter show an overall good Fig. 5 Prismatic protrusion/cavity area. dimensional accuracy, while for the vertical walls whose distance from the next feature is larger than the tool diameter, the accuracy in the plane orthogonal to the spindle axis is governed primarily by tool deflections and larger deviations are
6 measured. For these features the deflection of the tool is allowed as there is no material to prevent it. In this respect, the tool steel insert is affected by higher tool deflections because of the higher hardness of the work material and because of a higher tool wear, which increase the cutting forces. Besides the dimensional and geometrical accuracy of the produced parts, a main issue was the presence of burrs. Higher burrs were observed on the aluminum master, while on the steel insert burrs were very high in some critical points, but lower than in the metal master elsewhere. A visual comparison of the burr type and height is given by the SEM images reported in figures from 3 to 5. Reduction of the burrs on the aluminum master was obtained by chemical etching with sodium hydroxide, while for the steel insert, manual mechanical removal was necessary. The remaining burrs on the aluminum master were replicated on the insert during electroforming (negative shape) and reproduced on the molded plastic part. This is visible in Fig. 6 showing the channel area of a molded plastic part, with the replicated burrs on the right side of the channel. The presence of these undesired features on the replicated microfluidic systems constitutes a limitation of the capabilities of the insert manufacturing method, which are Left side of the channel Right side of the channel attributed solely to the chosen material Fig. 6 Borders of a channel on the replicated plastic part obtained using the electroformed insert from the aluminum master. On the right side of the channel the replicated burrs are clearly visible. removal technology. However, if a more convenient method, as for instance microedm, is used no burrs would be produced and the replicated part would in principle be flawless. Comparison of manufacturing accuracy provided by the different schemes A comparison of the capabilities of the four fabrication schemes is shown in Tab. 2. The table is not complete. Despite the high accuracy provided by the first three schemes, regarding both position and dimensions of the features, which is in the order of 1 µm, they show a strong limitation regarding the type of shapes obtainable, with only 2½D features, perhaps stacked in not more than three layers. As Substrate material Metal Silicon Metal or polymer Method Photoresist ASE milling or laser Fabrication scheme 1 2a 2b 3a 3b 4a 4b 4c Geometry 2½D 2½D 2½D 2½D 2½D 3D 3D 3D Number of layers that can be stacked Features XY (µm) * 1-20* 1-10* accuracy & alignment Z (µm) Min. channel width (µm) Max. channel depth (µm) ** ** ** Max. aspect ratio Side angle Range ( ) accuracy ( ) Surface roughness Sq Rms (nm) *For micromilling this value strongly depends on the type of material and feature (concave or convex). ** For micromilling this value depends on the tool diameter. Tab. 2 Comparison of the capabilities of the 4 basic fabrication schemes. Values refer to the average capabilities of the single schemes.
7 demonstrated instead by the investigation above, pyramids, which can be regarded as an infinite number of 2D stacked patterns, can be easily generated by micromilling. Therefore, following the fabrication scheme 4, any 3D feature can be integrated in microfluidic systems designs. On the other hand, as shown in Tab. 2, this fabrication scheme is inferior to the others as concerns the dimensional accuracy of the machined features and the minimum feature size. On the horizontal plane, a lower accuracy is obtained when scheme 4b is used, as the workpiece material is harder, implying larger tool deflections. Moreover, the presence of burrs is highly undesirable. Most of the limitations of the scheme 4 are to be attributed to the material removal technology used. If microedm is used for the generation of the patterns on either the metal master or on the steel insert, the minimum feature size would be reduced to approximately 10 µm, and the accuracy of the machined features would be in the order of 1-2 µm, regardless of whether they are concave or convex. Finally, burrs would not form at all. However, if a very high accuracy is not necessary for the functionality and a limited miniaturization is allowed, the solution investigated in this paper, involving the use of micromilling for material removal, allows the integration of a new class of features in the design of plastic microfluidic systems to be produced in large volumes. Conclusions Manufacturing of tools for micro injection molding and hot embossing of microfluidic systems can be realized by several different process sequences. When classified according to the substrate material and whether the pattern is obtained by means of additive or subtractive processes, four main fabrication schemes are identified. Three are based on combinations of photolithography, etching and electrodeposition and the fourth uses thermal or mechanical processes for material removal. The performance of this last fabrication scheme, based on micromilling as material removal technique, was verified in two variants: direct machining in hardened tool steel and machining of a substrate for subsequent electroforming. The overall accuracy as well as the obtainable shapes provided by the investigated method were compared to those provided by the other schemes. When micromilling is used for the patterning of the substrate, tool deflections limit the accuracy on the horizontal plane and burrs formation occurs, which requires further processing and cannot be completely eliminated. On the other hand, real 3D features can be generated, removing the main limitation of the other manufacturing schemes. This investigation shows that, if limited miniaturization is allowed, the proposed process chains involving micromilling permit the integration of a new class of features in plastic microfluidic systems to be produced in large volumes. References [1] R. Trichur, S. Kim, S.H. Lee, Y.A. Abdelaziez, D.E. Starkey, H.B.Halsall, W.R. Heineman & C.H. Ahn, "A New Plastic CE Chip with Wide Optical Clarity Using Cyclic Olefin Copolymers (COC)", Procedings of Micro Total Analysis Systems 2002, Vol. 1, pp , Nara (Japan), November 3-7 (2002) [2] E.W. Becker, W.Ehrfeld & D. Münchmeyer, Microelectron Eng., Vol. 4., No.35 (1986) [3] J. Elders, H.V. Hansen & M. Elwenspoek, DEEMO: A New Technology for the Fabrication of Microstructures, Proceedings of MEMS 95, pp , Amsterdam (1995) [4] M.F. Jensen, J.E. McCormack, B. Helbo, L.H. Christensen, T.R. Christensen, N.J. Mikkelsen, P.T. Tang, "Rapid prototyping of polymeric microstructures with IR and UV lasers", CIRP seminar on Micro and Nano Technology, Lyngby, November (2003) [5] G. Bissacco, H. N. Hansen, L. De Chiffre, 2004, Improving axial depth of cut accuracy in micromilling, Proc. of the 4th Euspen Int. Conf., Glasgow, Scotland (UK), pp [6] G. Bissacco 2004 Surface Generation and Optimization in Micromilling, Ph.D. Thesis Technical University of Denmark, IPL [7] J. Fugl, 2004, Tooling technologies for micro injection molding, M.Sc. thesis (IPL ), Dept. Manuf. Eng. & Mgn, Technical University of Denmark (in Danish).
Injection moulding and modelling on a micro scale
Injection moulding and modelling on a micro scale Technology Update Injection moulding and welding of plastics 11 November 2014 Research Projects (National / European) Micro/Nano/Multimaterial Manufacturing
T.M.M. TEKNIKER MICROMACHINING
T.M.M. TEKNIKER MICROMACHINING Micro and Nanotechnology Dapartment FUNDACION TEKNIKER Avda. Otaola. 20 Tel. +34 943 206744 Fax. +34 943 202757 20600 Eibar http://www.tekniker.es TMM FACILITIES -Clean Room
How compact discs are made
How compact discs are made Explained by a layman for the laymen By Kevin McCormick For Science project at the Mountain View Los Altos High School Abstract As the major media for music distribution for
Coating Technology: Evaporation Vs Sputtering
Satisloh Italy S.r.l. Coating Technology: Evaporation Vs Sputtering Gianni Monaco, PhD R&D project manager, Satisloh Italy 04.04.2016 V1 The aim of this document is to provide basic technical information
Masters for micro- and nanostructure replication by
Masters for micro- and nanostructure replication by Diplomvej 381 DK-2800 Kongens Lyngby Denmark www.nilt.com CVR: DK 29310203 Contact: Phone: +45 3111 1797 Email: [email protected] Background More than
Fabrication of Complex Circuit Using Electrochemical Micromachining on Printed Circuit Board (PCB)
5 th International & 26 th All India Manufacturing Technology, Design and Research Conference (AIMTDR 2014) December 12 th 14 th, 2014, IIT Guwahati, Assam, India Fabrication of Complex Circuit Using Electrochemical
Rapid Prototyping and Development of Microfluidic and BioMEMS Devices
Rapid Prototyping and Development of Microfluidic and BioMEMS Devices J. Sasserath and D. Fries Intelligent Micro Patterning System Solutions, LLC St. Petersburg, Florida (T) 727-522-0334 (F) 727-522-3896
Supporting Information. Rapid Prototyping of Microchannels with Surface Patterns for Fabrication of Polymer Fibers
Electronic Supplementary Material (ESI) for RSC Advances. This journal is The Royal Society of Chemistry 2015 Supporting Information Rapid Prototyping of Microchannels with Surface Patterns for Fabrication
Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.
CMOS Processing Technology Silicon: a semiconductor with resistance between that of conductor and an insulator. Conductivity of silicon can be changed several orders of magnitude by introducing impurity
Projet ConProMi : convergence Microtechnologie / Plasturgie dans la fabrication des outillages et l intégration des capteurs
Projet ConProMi : convergence Microtechnologie / Plasturgie dans la fabrication des outillages et l intégration des capteurs The ConProMi project : converging Microtechnology / Polymer technologies for
8.1 HPC for improved efficiency on standard machine tools by using new fluid-driven spindles
8.1 HPC for improved efficiency on standard machine tools by using new fluid-driven spindles A. Schubert 1, O. Harpaz 2, B. Books 2, U. Eckert 1, R. Wertheim 1 1 Fraunhofer IWU, Reichenhainer Str. 88,
Physics 441/2: Transmission Electron Microscope
Physics 441/2: Transmission Electron Microscope Introduction In this experiment we will explore the use of transmission electron microscopy (TEM) to take us into the world of ultrasmall structures. This
Silicon-On-Glass MEMS. Design. Handbook
Silicon-On-Glass MEMS Design Handbook A Process Module for a Multi-User Service Program A Michigan Nanofabrication Facility process at the University of Michigan March 2007 TABLE OF CONTENTS Chapter 1...
MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications
Technical Data Sheet MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications Regional Product Availability Description Advantages North America Europe, Middle East and Africa Latin
THE INFLUENCE OF STEEL GRADE AND STEEL HARDNESS ON TOOL LIFE WHEN MILLING IN HARDENED TOOL STEEL
THE INFLUENCE OF STEEL GRADE AND STEEL HARDNESS ON TOOL LIFE WHEN MILLING IN HARDENED TOOL STEEL S. Gunnarsson, B. Högman and L. G. Nordh Uddeholm Tooling AB Research and Development 683 85 Hagfors Sweden
FLEXIBLE CIRCUITS MANUFACTURING
IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available
Introduction to VLSI Fabrication Technologies. Emanuele Baravelli
Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation
Biaxial tripod MEMS mirror and omnidirectional lens for a low cost wide angle laser range sensor
Biaxial tripod MEMS mirror and omnidirectional lens for a low cost wide angle laser range sensor U. Hofmann, Fraunhofer ISIT Itzehoe M. Aikio, VTT Finland Abstract Low cost laser scanners for environment
Good Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
Electroplating with Photoresist Masks
Electroplating with Photoresist Masks Revised: 2014-01-17 Source: www.microchemicals.com/downloads/application_notes.html Electroplating - Basic Requirements on the Photoresist Electroplating with photoresist
Lapping and Polishing Basics
Lapping and Polishing Basics Applications Laboratory Report 54 Lapping and Polishing 1.0: Introduction Lapping and polishing is a process by which material is precisely removed from a workpiece (or specimen)
Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process
Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process Lynne Michaelson, Krystal Munoz, Jonathan C. Wang, Y.A. Xi*, Tom Tyson, Anthony Gallegos Technic Inc.,
Removing chips is a method for producing plastic threads of small diameters and high batches, which cause frequent failures of thread punches.
Plastic Threads Technical University of Gabrovo Yordanka Atanasova Threads in plastic products can be produced in three ways: a) by direct moulding with thread punch or die; b) by placing a threaded metal
RAPID PROTOTYPING. Learning Objectives: By the end of the lecture the student should be able to: Explain the fundamentals of Rapid Prototyping
RAPID PROTOTYPING Learning Objectives: By the end of the lecture the student should be able to: Explain the fundamentals of Rapid Prototyping Outline and explain differences of Rapid Prototyping Technologies
Le nanotecnologie: dal Laboratorio al Mercato. Fabrizio Pirri Politecnico di Torino Istituto Italiano di Tecnologia
Le nanotecnologie: dal Laboratorio al Mercato Fabrizio Pirri Politecnico di Torino Istituto Italiano di Tecnologia Materials & Processes for micro nanotechnologies Laboratory http://www.polito.it/micronanotech
Ion Beam Sputtering: Practical Applications to Electron Microscopy
Ion Beam Sputtering: Practical Applications to Electron Microscopy Applications Laboratory Report Introduction Electron microscope specimens, both scanning (SEM) and transmission (TEM), often require a
For Touch Panel and LCD Sputtering/PECVD/ Wet Processing
production Systems For Touch Panel and LCD Sputtering/PECVD/ Wet Processing Pilot and Production Systems Process Solutions with over 20 Years of Know-how Process Technology at a Glance for Touch Panel,
OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS
OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS Vojtěch SVATOŠ 1, Jana DRBOHLAVOVÁ 1, Marian MÁRIK 1, Jan PEKÁREK 1, Jana CHOMOCKÁ 1,
Modeling, Simulation and Calibration of Silicon Wet Etching
Modeling, Simulation and Calibration of Silicon Wet Etching Paper Andrzej Kociubiński, Mariusz Duk, Tomasz Bieniek, and Paweł Janus Abstract The methods of parameter optimization in Etch3D TM simulator
Material data sheet. EOS StainlessSteel GP1 for EOSINT M 270. Description, application
EOS StainlessSteel GP1 for EOSINT M 270 A number of different materials are available for use with EOSINT M systems, offering a broad range of e-manufacturing applications. EOS StainlessSteel GP1 is a
Through-mask Electro-etching for Fabrication of Metal Bipolar Plate Gas Flow Field Channels
991 Downloaded 23 Dec 21 to 24.16.113.125. Redistribution subject to ECS license or copyright; see http://www.ecsdl.org/terms_use.jsp ECS Transactions, 33 (1) 991-16 (21) 1.1149/1.3484593 The Electrochemical
Verification Experiment on Cooling and Deformation Effects of Automatically Designed Cooling Channels for Block Laminated Molds
International Journal of Engineering and Advanced Technology (IJEAT ISSN: 2249 8958 Volume-4 Issue-5 June 2015 Verification Experiment on Cooling and Deformation Effects of Automatically Designed Cooling
Effective Cooling Method for Spin Casting Process
Effective Cooling Method for Spin Casting Process Yong-Ak Song, Sehyung Park, Yongsin Kwon Korea Institute of Science and Technology KIST, CAD/CAM Research Center P.O. Box 131, Cheongryang, Seoul, Korea
Design for Microfluidic Device Manufacture Guidelines
Design for Microfluidic Device Manufacture Guidelines Editors: Henne van Heeren (enablingmnt), Peter Hewkin (facilitator of the Microfluidics Consortium) With contributions from the following members of
III. Wet and Dry Etching
III. Wet and Dry Etching Method Environment and Equipment Advantage Disadvantage Directionality Wet Chemical Solutions Atmosphere, Bath 1) Low cost, easy to implement 2) High etching rate 3) Good selectivity
Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
A Fuzzy System Approach of Feed Rate Determination for CNC Milling
A Fuzzy System Approach of Determination for CNC Milling Zhibin Miao Department of Mechanical and Electrical Engineering Heilongjiang Institute of Technology Harbin, China e-mail:[email protected]
Choosing a Stencil. By William E. Coleman, Ph.D. and Michael R. Burgess
Choosing a Stencil Is a stencil a commodity or a precision tool? A commodity is something that can be purchased from many suppliers, with the expectation that the performance will be the same. A precision
GEOMETRY OF SINGLE POINT TURNING TOOLS
GEOMETRY OF SINGLE POINT TURNING TOOLS LEARNING OBJECTIVES Introduction to Features of single point cutting tool. Concept of rake and clearance angle and its importance System of description of Tool geometry
Flex Circuit Design and Manufacture.
Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 [email protected] www.merlincircuit.co.uk Flex Circuit
Analysis of Blind Microvias Forming Process in Multilayer Printed Circuit Boards
POLAND XXXII International Conference of IMAPS - CPMT IEEE Poland Pułtusk - 4 September 008 Analysis of Blind Microvias Forming Process in Multilayer Printed Circuit Boards Janusz Borecki ), Jan Felba
Metrology for Characterization of Wafer Thickness Uniformity During 3D-IC Processing
Metrology for Characterization of Wafer Thickness Uniformity During 3D-IC Processing Authors: Tom Dunn, Chris Lee, Mark Tronolone, Aric Shorey Corning Incorporated Corning, New York 14831 [email protected]
Concepts and principles of optical lithography
1/56 2/56 Concepts and principles of optical lithography Francesc Pérez-Murano Institut de Microelectrònica de Barcelona (CNM-IMB, CSIC) [email protected] 10 cm mà blia 1 cm Gra de sorra Xip 1 mm 100
Results Overview Wafer Edge Film Removal using Laser
Results Overview Wafer Edge Film Removal using Laser LEC- 300: Laser Edge Cleaning Process Apex Beam Top Beam Exhaust Flow Top Beam Scanning Top & Top Bevel Apex Beam Scanning Top Bevel, Apex, & Bo+om
How to Build a Printed Circuit Board. Advanced Circuits Inc 2004
How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production
Nanotribology of Hard Thin Film Coatings: A Case Study Using the G200 Nanoindenter
Nanotribology of Hard Thin Film Coatings: A Case Study Using the G200 Nanoindenter Application Note Introduction Thin film coatings are extensively used in various applications, such as microelectronics,
NANO INDENTERS FROM MICRO STAR TECHNOLOGIES
NANO INDENTERS FROM MICRO STAR TECHNOLOGIES Micro Star makes a variety of nano indenters following defined standards or custom requested geometries and dimensions. Micro Star calibration laboratory complies
CIRP Encyclopedia of Production Engineering
The International Academy for Production Engineering Luc Laperriere Gunther Reinhart Editors CIRP Encyclopedia of Production Engineering Volume 1 A-H With 1145 Figures and 85 Tables ^ Springer Reference
Tableting Punch Performance Can Be Improved With Precision Coatings
Tableting Punch Performance Can Be Improved With Precision Coatings by Arnold H. Deutchman, Ph. D. Director of Research and Development (614) 873-4529 X 114 [email protected] Mr. Dale C. Natoli
MICRO DROPLET GENERATION TECHNOLOGY
MICRO DROPLET GENERATION TECHNOLOGY Micro-droplet Generation Technology Micro-droplet Generation System Semiconductor Wafer Cleaning Precision Coating Emulsion Twin-Fluid Nozzle System www.hshi-tech.co.kr
Rapid Prototyping Technologies. May, 2016
Rapid Prototyping Technologies May, 2016 WE HAVE ALL THE NECESSARY TOOLS TO ENSURE THE FINAL SUCCESS OF YOUR PROTOTYPE. Andaltec can help you in all the steps, from the design to fully finished prototype
* This work is an official contribution of the National Institute of Standards and Technology and
Variability in the Geometric Accuracy of Additively Manufactured Test Parts A.L. Cooke and J.A. Soons National Institute of Standards and Technology * Gaithersburg, MD, USA Abstract This paper describes
3D laser removal and texturing in a new dimension
www.dmgmori.com LASERTEC 45 Shape 3D material removal by laser Laser texturing LASERTEC 45 Shape 3D laser removal and texturing in a new dimension LASERTEC LASERTEC 45 Shape: High-precision 3D laser removal
Supporting Online Material for
www.sciencemag.org/cgi/content/full/1162193/dc1 Supporting Online Material for Polymer Pen Lithography Fengwei Huo, Zijian Zheng, Gengfeng Zheng, Louise R. Giam, Hua Zhang, Chad A. Mirkin* *To whom correspondence
3D FUSION NANO POWDER DIRECT METAL SINTERING SYSTEMS SPECIFICATION
FONON CORPORATION 3D FUSION NANO POWDER DIRECT METAL SINTERING SYSTEMS SPECIFICATION About Fonon Additive Manufacturing Technologies encompass 3D FUSION TECHNOLOGY or 3D Laser Metal Sintering (Commonly
COATED CARBIDE. TiN. Al 2 O 3
COATED CARBIDE GENERAL INFORMATION CVD = Chemical Vapour Deposition coated grades GC2015, GC2025, GC2135, GC235, GC3005, GC3015, GC3020, GC3025, GC3115, GC4015, GC4025, GC4035, S05F, and CD1810. PVD =
Phenomenological aspects of a modified fragmentation of the ground material
Phenomenological aspects of a modified fragmentation of the ground material Lucjan Dabrowski, Mieczyslaw Marciniak Warsaw University of Technology, Warsaw, Poland Summary: The main point of this paper
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using
High power picosecond lasers enable higher efficiency solar cells.
White Paper High power picosecond lasers enable higher efficiency solar cells. The combination of high peak power and short wavelength of the latest industrial grade Talisker laser enables higher efficiency
Milling & Machining Centers
Training Objective After watching the program and reviewing this printed material, the viewer will gain knowledge and understanding of basic milling theories and procedures. In addition, the viewer will
Damage-free, All-dry Via Etch Resist and Residue Removal Processes
Damage-free, All-dry Via Etch Resist and Residue Removal Processes Nirmal Chaudhary Siemens Components East Fishkill, 1580 Route 52, Bldg. 630-1, Hopewell Junction, NY 12533 Tel: (914)892-9053, Fax: (914)892-9068
Lecture 9. Surface Treatment, Coating, Cleaning
1 Lecture 9. Surface Treatment, Coating, Cleaning These processes are sometimes referred to as post-processing. They play a very important role in the appearance, function and life of the product. Broadly,
Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography
Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography Wen-Di Li*, Wei Wu** and R. Stanley Williams Hewlett-Packard Labs *Current address: University
RAMAX S Prehardened stainless holder steel
T O O L S T E E L F A C T S RAMAX S Prehardened stainless holder steel Wherever tools are made Wherever tools are used This information is based on our present state of knowledge and is intended to provide
Reflection and Refraction
Equipment Reflection and Refraction Acrylic block set, plane-concave-convex universal mirror, cork board, cork board stand, pins, flashlight, protractor, ruler, mirror worksheet, rectangular block worksheet,
Manufacturability of Turbine Blade Die from Composite Material Using Rapid Tooling Techniques
Manufacturability of Turbine Blade Die from Composite Material Using Rapid Tooling Techniques D. Safaeian 1, M. Shakeri 2 and A.L. Darvish 2 Faculty of Engineering, Mazandaran University, Shariati Ave.
High speed machining and conventional die and mould machining
High speed machining and conventional die and mould machining Reprint from HSM - High Speed Machining There are a lot of questions about HSM today and many different, more or less complicated, definitions
Development of High-Speed High-Precision Cooling Plate
Hironori Akiba Satoshi Fukuhara Ken-ichi Bandou Hidetoshi Fukuda As the thinning of semiconductor device progresses more remarkably than before, uniformity within silicon wafer comes to be strongly required
Dry Etching and Reactive Ion Etching (RIE)
Dry Etching and Reactive Ion Etching (RIE) MEMS 5611 Feb 19 th 2013 Shengkui Gao Contents refer slides from UC Berkeley, Georgia Tech., KU, etc. (see reference) 1 Contents Etching and its terminologies
Ningbo Yinzhou Keao Prototyping & Mould Factory Services include : CNC machining prototypes,
Ningbo Yinzhou Keao Prototyping & Mould Factory Services include : CNC machining prototypes, STEREOLITHOGRAPHY (SLA) Selective Laser Sintering (SLS) RTV MOLDING AND CAST URETHANE PROTOTYPES Tel : +86 574
Mounting Instructions for SP4 Power Modules
Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the
Photolithography. Class: Figure 12.1. Various ways in which dust particles can interfere with photomask patterns.
Photolithography Figure 12.1. Various ways in which dust particles can interfere with photomask patterns. 19/11/2003 Ettore Vittone- Fisica dei Semiconduttori - Lectio XIII 16 Figure 12.2. Particle-size
PRELIMINARY BROCHURE. Uddeholm Ramax HH
PRELIMINARY BROCHURE Uddeholm Ramax HH Uddeholm Ramax HH Uddeholm Ramax HH provides several benefits: The product offers uniform hardness in all dimensions combined with excellent indentation resistance.
Section 4: NiResist Iron
Section 4: NiResist Iron Section 4 Ni-Resist Description of Grades...4-2 201 (Type 1) Ni-Resist...4-3 202 (Type 2) Ni-Resist...4-6 Stock Listings...4-8 4-1 Ni-Resist Description of Grades Ni-Resist Dura-Bar
Application Note #503 Comparing 3D Optical Microscopy Techniques for Metrology Applications
Screw thread image generated by WLI Steep PSS angles WLI color imaging Application Note #503 Comparing 3D Optical Microscopy Techniques for Metrology Applications 3D optical microscopy is a mainstay metrology
FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU HYBRID MACHINING PROCESSES IN CUTTING TECHNOLOGY
FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU HYBRID MACHINING PROCESSES IN CUTTING TECHNOLOGY VIBRATION-SUPERIMPOSED MACHINING Hybrid Machining Processes Principle Process Variants
TechCut 4 Precision Low Speed Saw
Product Brochure TechCut 4 Precision Low Speed Saw 3" - 6" Blade Range Digital Speed Display 1-Micron Sample Indexing Spring-Loaded Dressing Stick Attachment All Aluminum & Stainless Steel Construction
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing. PCB Background Information (courtesy of Wikipedia)
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing Introduction As you saw on the video (http://www.youtube.com/watch?v=9x3lh1zfggm), photolithography is a way to nanomanufacture
ENS 07 Paris, France, 3-4 December 2007
ENS 7 Paris, France, 3-4 December 7 FRICTION DRIVE SIMULATION OF A SURFACE ACOUSTIC WAVE MOTOR BY NANO VIBRATION Minoru Kuribayashi Kurosawa, Takashi Shigematsu Tokyou Institute of Technology, Yokohama
GLOSSARY OF TERMS Casting. Classic hologram Demetallisation. Diffraction Dot matrix. e-beam
GLOSSARY OF TERMS Casting. A method of embossing whereby a film of soft resin is applied to a nickel shim then exposed to ultraviolet light causing the resin to harden by cross linking. The resin film
Choosing optimal rapid manufacturing process for thin-walled products using expert algorithm
Choosing optimal rapid manufacturing process for thin-walled products using expert algorithm Filip Górski, Wiesław Kuczko, Radosław Wichniarek, Adam Dudziak, Maciej Kowalski, Przemysław Zawadzki Poznan
Process Improvements for Ultra-Thick Photoresist Using a Broadband Stepper
Process Improvements for Ultra-Thick Photoresist Using a Broadband Stepper Warren W. Flack, Ha-Ai Nguyen Ultratech Stepper, Inc. San Jose, CA 95134 Elliott Capsuto ShinEtsuMicroSi, Inc. San Jose, CA 95112
Group. The precision company SURFACE TECHNOLOGIES INTERNATIONAL. Hard chrome. Surface solutions by STI Group. English
Group SURFACE TECHNOLOGIES INTERNATIONAL The precision company Hard chrome English Surface solutions by STI Group Trust the Market Leader Thanks to its technological competence, its modern infrastructure,
Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications
Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications Janet E. Semmens Sonoscan, Inc. 2149 E. Pratt Boulevard Elk Grove Village, IL 60007 USA Phone: (847)
Engine Bearing Materials
Engine Bearing Materials Dr. Dmitri Kopeliovich (Research & Development Manager) The durable operation of an engine bearing is achieved if its materials combine high strength (load capacity, wear resistance,
A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators
A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators Dr Peter Hockley and Professor Mike Thwaites, Plasma Quest Limited
3D TOPOGRAPHY & IMAGE OVERLAY OF PRINTED CIRCUIT BOARD ASSEMBLY
3D TOPOGRAPHY & IMAGE OVERLAY OF PRINTED CIRCUIT BOARD ASSEMBLY Prepared by Duanjie Li, PhD & Andrea Novitsky 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard
Unit 6: EXTRUSION. Difficult to form metals like stainless steels, nickel based alloys and high temperature metals can also be extruded.
1 Unit 6: EXTRUSION Introduction: Extrusion is a metal working process in which cross section of metal is reduced by forcing the metal through a die orifice under high pressure. It is used to produce cylindrical
EXPERIMENTAL AND NUMERICAL ANALYSIS OF THE COLLAR PRODUCTION ON THE PIERCED FLAT SHEET METAL USING LASER FORMING PROCESS
JOURNAL OF CURRENT RESEARCH IN SCIENCE (ISSN 2322-5009) CODEN (USA): JCRSDJ 2014, Vol. 2, No. 2, pp:277-284 Available at www.jcrs010.com ORIGINAL ARTICLE EXPERIMENTAL AND NUMERICAL ANALYSIS OF THE COLLAR
Fatigue Analysis of an Inline Skate Axel
FATIGUE ANALYSIS OF AN INLINE SKATE AXEL 57 Fatigue Analysis of an Inline Skate Axel Authors: Faculty Sponsor: Department: Garrett Hansen, Mike Woizeschke Dr. Shanzhong (Shawn) Duan Mechanical Engineering
Advanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
Production of Wind Tunnel Testing Models with use of Rapid Prototyping Methods
Production of Wind Tunnel Testing Models with use of Rapid Prototyping Methods R. ADELNIA 1, S. DANESHMAND 2, S. AGHANAJAFI 3 Mechanical Group, Majlesi Azad University Isfahan IRAN Abstract: In a time
Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE 6450 - Dr. Alan Doolittle
Lecture 12 Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12 Evaporation and Sputtering (Metalization) Evaporation For all devices, there is a need to go from semiconductor to metal.
Chalmers Publication Library
Chalmers Publication Library Contactless pin-flange adapter for high-frequency measurements This document has been downloaded from Chalmers Publication Library (CPL). It is the author s version of a work
Brush Plating of Nickel-Tungsten Alloy for Engineering Application
Brush Plating of Nickel-Tungsten Alloy for Engineering Application Zhimin Zhong & Sid Clouser ASETS Defense 12 1 Engineering (functional) applications Hardness, wear resistance, & corrosion protection
3D Sputtering System Fully automated
3D Sputtering System Fully automated S8+ Sputtering Technology by Tapematic Built on the ability to draw on the best that the world has to offer, and to develop innovative products with anticipation of
SELECTRON Oberflächentechnik
1. General Process Description The Selectron process has been proved to be most useful in most branches of the industries: Applications in the tool manufacture industries, applications in mechanical engineering
Welding of Plastics. Amit Mukund Joshi. (B.E Mechanical, A.M.I.Prod.E)
Welding of Plastics Amit Mukund Joshi (B.E Mechanical, A.M.I.Prod.E) Introduction Mechanical fasteners, adhesives, and welding processes can all be employed to form joints between engineering plastics.
3D Printed Injection Molding Tool ("PIMT") Guide. Objet Ltd.
3D Printed Injection Molding Tool ("PIMT") Guide Objet Ltd. 2 Injection molding is a high speed, automated and versatile process that can produce high precision complex three dimensional parts from a fraction
