Thematic Unit of Excellence on Computational Materials Science Solid State and Structural Chemistry Unit, Indian Institute of Science

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1 Thematic Unit of Excellence on Computational Materials Science Solid State and Structural Chemistry Unit, Indian Institute of Science Call for Expression of Interest (EOI) for the Supply, Installation and Commissioning of High Performance Computing Cluster The Thematic Unit of excellence on Computational Materials Science (TUE-CMS) at SSCU, IISc has been established with the support of the Nano Mission Council, Department of Science and Technology. The TUE unit invites EoI from established Original Equipment Manufacturers (OEM) for the supply, installation, testing, commissioning and hand-over of a high performance computer as well as for cooling solution and other works within data center such as electrical, networking and civil. UPS and diesel generator supply will be provided by SSCU. In the following, OEM is defined to be the entity which manufactures compute and master nodes. Section A1: Outline of Intended HPC Platform & Environment: 1. It should be an x86 CPU-based cluster. The cluster can additionally consist of GPU/accelerator (one GPU/accelerator per CPU), but the aggregate contribution from such nodes (theoretical, or peak performance for double precision floating point arithmetic) to the total theoretical FLOPS rating should not exceed 50%. The GPU/accelerator should be capable of carrying out double precision floating point arithmetic operations. 10% of the non-gpu nodes should have higher RAM per node. (see below). The GPU/accelerator cards should be on PCI-gen3 slots. 2. Operating system, Job scheduler, resource management can be based on open Source. The OS should be based on one of the flavours of Linux or Unix. 3. The computing platform as per (1) above is expected to deliver a peak rating of 100 TFLOPS. 4. The computing part (compute nodes) of the HPC equipment should fit within three standard 42U racks (depth upto 1200 mm) and should consume less than 30 kw/rack for all the racks. The interconnect switch, storage, and other allied equipments can occupy additional space/racks. 5. A single-rack storage environment of 400 TB usable capacity in a parallel file system with hardware RAID 6 (WRITE performance IOR benchmark of 10 GB/s) is required. A tape backup solution of 50 TB usable, uncompressed capacity based on LTO6 with robotic arm and at least two drives is also required. A minimum of 15% of the total space should come from SAS at rpm. There should be no single-point failure at all levels. 6. In the configuration of the cluster, the RAM per node can be taken to be 128 GB 90% of the nodes. Remaining 5% of the (non-gpu) nodes will have higher RAM of 384GB per node and another 5% 768GB per node. 7. Interconnect should be Infiniband FDR (56 Gbps) non-blocking architecture (or equivalent or better in terms of specifications) established through a single switch or multiple switches. Please provide both options. 8. The entire solution is expected to possess fail-safe, redundant features for operational reliability of computers and of data safety. Redundancy in interconnect is not essential. Two Master nodes is required for redundancy. We also require for the 1

2 purposes of redundancy 3% excess 128 GB CPU-only compute nodes to be always available. 9. The cooling solution and the design of the various aspects of the data center such as civil, electrical and networking will also need to be executed by the supplier (see section A2). 10. After satisfying (i) of Section A1 above, provide additionally, four Intel Xeon phi(mic) accelerators located on two additional nodes of the low RAM compute nodes. 11. Benchmark programs in the area of molecular dynamics and quantum chemistry will be given at the next stage along with tender/rfp. Section A2: Outline of Data Center requirements (UPS and diesel generator sets along with external chiller (if required) will be provided by SSCU, IISc). 1. Cooling solution details within the data center should be provided by OEM or his authorized bidder. Outdoor chiller unit required/not required has to be mentioned along with its capacity. The solution should support at least upto 30 kw/rack. 2. Civil works of the data center (588 sq.ft) : anti-static tiles, painting, windows, false flooring/ceiling, ramp, etc should be provided by the OEM/AP. 3. Electrical work within the data center and power cables from distribution board to data center. PDUs should be done by the bidder. 4. Network cables and other accessories within the data center should be provided. 5. PUE (power usage efficiency) of the offered solution for the parts within data center and also for the total solution (including the outdoor units) should be stated. 6. Fire, BMS, rodent protection and water leak detection (in case water enters data center) should be optional. 7. Total power requirement and wiring diagram and also requirement for cooling (in terms of TR) should be stated. Section B: Terms and Conditions 1. The OEM should have had five(5) or more installations in the TOP500 Supercomputer list ( in the Novermber 2013 list. 2. The Authorized Partner (AP) should have had at least one entry in either Dec 2012, June 2013 or Dec 2013 Top Supercomputers-India list( The Authorized Partner (AP) of the OEM should have installed and managed at least one supercomputer of 8 TFLOPS (peak) or more capability (all contribution from CPU) in India. This should have had Infiniband (or equivalent or better) interconnect, along with PFS. Evidence for these installations must be provided either as a letter from the customer (with contact details) or from the list of Top Supercomputers-India. In case your installation is higher than 8 Tflops but is not listed in the website then you can submit the certificates/evidence for the same from the customer. 3. The proposal can be submitted either by OEM themselves or through an Authorised Partner. In the latter, a certificate of authorisation by the OEM needs to be provided. OEM alone can also bid without Authorized Partner in which case B2 above will not apply. One OEM should submit only one proposal. 4. The OEM should undertake to install, commission and provide periodic, comprehensive service and support throughout the life period (five years from the 2

3 date of installation) of the computer. This could be either by themselves or through their Authorised Partner but the responsbility will of the OEM. Application installation and optimization support from OEM periodically once in two months is required. They must demonstrate in the EoI, the establishment and availability of procedures/facilities to replace any faulty hardware items within a period of 48 hours of logging of complaint from TUE-IISc. This is in addition to the 3% redundant compute nodes. 5. The timely and satisfactory installation of the HPC Cluster and the associated Data Center works either by themselves or through their Authorised Partner will be the responsibility of the OEM. 6. The EoI proposals will be evaluated broadly based on Tflops, power consumption, I/O throughput, storage, etc and only those OEMs who are short-listed will receive the tender documents. TUE-IISc reserves the right to come up with a tender document which can have desirable elements from any EoI proposal. 7. Decision of the TUE-IISc committee in this regard will be final and binding on all parties. 8. Two different options/solutions can be proposed by a given OEM. 9. Multiple cooling solutions can be provided as options. 10. The data center works mentioned in points in section A2 may or may not be part of the final tender. Decision of TUE-IISc committee will be final in this regard and binding on all parties. At this stage, provide (a) Itemized documentation(s) in support of your Interest, as expected from criteria listed in Section B (Items 1-4) listed above (b) a brief description of your solution Node Processor Model Number Number of Sockets per node Number of Cores per socket Number of PCI slots GPU/accelerator Model Number Number of GPU/accelerator units per node & Total Number of such nodes having GPU/accelerator Number of nodes per RU Number of Master Nodes & Number of Compute Nodes Other Floor footprint of rack Model number of the master and compute nodes Number of Master nodes required & Form Factor Number of compute nodes required & 3

4 Form Factor Cooling Solution Name Technology details Power consumption of the cooling solution for 100 kw of IT load Data Center (comprising about 588 sq.ft.) False floor/ceiling details Electrical (number of sockets, wall, hanging, underground, etc) Network Civil i. Provide arithmetic calculations to demonstrate that the proposed solution meets our TFLOPS requirement. ii. of software (operating system, compilers, numerical libraries, scheduler, resource manager, parallel file system). iii. Detailed network diagram showing the IB interconnect, and how it serves the storage as well. Also, show the Gigabit network diagram etc. iv. Detailed description of PFS based storage (including number and product details of different kinds of servers, storage boxes, disk characteristics (SATA/SAS/..; RPM), capacities specifications etc.). v. Provide arithmetic calculations to demonstrate the I/O throughput. (c) Provide a list of Indian HPC customers with a brief description of what was supplied to them by the OEM and system integrator/indian Partner. Provide a certificate from at least two of them to certify your competence in the installation of Parallel File System (PFS) and Infiniband (or equivalent or better) interconnect (See Annexure-A for format). Certificates from both SI and OEM is required. EoI proposals in a sealed envelope superscribed Expression of Interest for HPC+data center for TUE-CMS should be submitted on or before Mar 4th, 2014, 4 p.m., addressed to: Chairman, Solid State and Structural Chemistry Unit, Indian Institute of Science, Bangalore (Kind Attn : Prof. S. Yashonath, TUE-CMS), should be handed over to Ms. Bavitha Reddy in room 209, SSCU, IISc. If you have any queries they can be sent by to: Any changes in the EoI will be intimated on our website, Annexure-A 4

5 Certificate from the HPC Customer This certificate is intended for the evaluation of a HPC purchase for the Thematic Unit of Excellence in Computational Materials Science, Indian Institute of Science, Bangalore (End Customer: Prof. S. Yashonath, ; Phone: ) Name of the Vendor: Contact person for further information: Rpeak & Rmax in TFLOPS: Storage capacity (in TB): What kind of PFS used & Throughput: Interconnect Used: Whether completed in time: Yes No Remarks on post installation service: How do you grade their installation: Excellent Good Satisfactory Not satisfactory How do you grade their Hardware support: Excellent Good Satisfactory Not satisfactory How do you grade their Software support: Excellent Good Satisfactory Not satisfactory (Signature) Name of the signatory, Organization with Seal and contact details (Telephone no. & id) Check List If any of the points under Section A or Section B is not complied either partially or fully, then please, provide the details of the same. 5

6 Please use the table below to confirm compliance to all requirements as per this EoI. In addition to information in below Table, please feel free to provide any additional information if you wish in support of technical compliance as an additional row at the end. Description Document in support of compliance to specified requirement. Page Numbers SNo. Compliance for Compliance Yes/No 1 Job Scheduler Descriptions 2 Certificate of Authorization from the OEM of compute nodes (if EoI is submitted by authorized partner) 3 Arithmetic calculations to demonstrate that the proposed solution meets our TFLOPS requirements 4 Arithmetic calculations to demonstrate that the proposed solution meets the storage throughput (based on disk RPM, number of disks, etc..) 5 of software (operating system, compilers, numerical libraries, scheduler, resource manager, parallel file system) 6 Detailed network diagram showing the IB interconnect and how it serves the storage as well. Also, show the Gigabit network diagram etc. 7 Detailed description of PFS based storage (including number and product details of different kinds of servers, storage boxes, disk capacities, specifications etc.). 8 Have you provided a list of Indian HPC customers with a brief description of what was supplied to them by the OEM 9 Attached Annexure-A (Certificate from HPC TWO Customers) From To 6

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