RAPID PCB PROTOTYPING PRODUCT CATALOG 02/03

Transcription

1 RAPID PCB PROTOTYPING PRODUCT CATALOG 02/03

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3 Contents 1 Contents The Corporation In-house Rapid PCB Prototyping Utilization of LPKF Systems in the Conventional PCB Process Applications Software Package LPKF CircuitCAM LPKF BoardMaster LPKF Circuit Board Plotter Quality Features LPKF ProtoMat C-Series LPKF ProtoMat M/L-Series LPKF ProtoMat H-Series (Fully Automatic) LPKF ProtoMat X-Series LPKF ProtoLaser Accessories/Options LPKF Through-Hole Plating Technology Rivets (LPKF EasyContac) Conductive Paste (LPKF AutoContac) Electro Plating (LPKF Contac III, MiniContac III & MiniContac III/HF)...29 LPKF Multilayer Technology Multilayer Press (LPKF MultiPress II) Technology LPKF Solder Mask (LPKF EasySolder) Tools (Mill and Drill Bits) Consumables Surface Mount Technology (SMT) Solder Paste Printing (LPKF ZelPrint) Quick-Release Stencil Frames (LPKF ZelFlex) Assembly (LPKF ZelPlace & BGA Placer) Reflow Oven (LPKF ZelFlow) Other LPKF Product Lines Imprint Contact Forms Index

4 2 The Company The Company Tradition and innovation Founded in the seventies, LPKF quickly established a reputation for innovation by launching new chemical free methods for producing prototype circuit boards. The CAD-supported milling technique established itself with electronic design engineers worldwide as a clean, efficient and environmentally friendly alternative to chemical etching. Revolutionary when first introduced, it is now an industry standard method throughout the world. Success led to expansion and the opening of branch offices worldwide at an early stage. LPKF gained customers in all sectors from one-man operations to major international corporations. With a broad spectrum of products and services, LPKF covers all aspects of the in-house prototyping chain. In the beginning of the nineties, the range of products and services was significantly expanded with the development of laser systems for making ultra-fine circuit boards followed by, the now well known, stencil laser for making SMD paste stencils. The company is now the world market leader for in-house Rapid PCB Prototyping and StencilLasers. This status is attributable to the company s future-oriented product policy, large investment in R&D and the highest quality standards. Proactively shaping markets Specialists in a wide range of fields continuously analyze the printed circuit board market to identify trends and set new industry standards for accuracy and performance. This is highlighted by the major commitment to research and development resulting in the large number of patents registered in recent years. In addition, the continuous exchange of information between clients and LPKF s R&D departments emphasizes the innovative power of the company and the focus on user-oriented solutions. The aim is, by using LPKF products, to optimize important commercial factors for its clients such as time-to-market, reduction of outside service cost and flexibility through independence.

5 The Company 3 Package solutions LPKF is far more than a supplier of high-end solutions: clients around the world in a wide spectrum of industry sectors also benefit from the company s broad expertise in all aspects of printed circuit boards. LPKF supplies individually tailored solution packages enabling its clients to profit from rapid, flexible and independent production processes. In addition to the machines themselves, this is accomplished with LPKF s comprehensive consulting services and supply of superior tools and consumables for every day jobs. The complete range of products in the LPKF Rapid PCB Prototyping segment includes circuit board plotters, through-hole plating systems, SMD solder paste printers, component placement systems, reflow ovens and a wide range of accessories. The global service network keeps LPKF close to its customers and shows the commitment to excellent customer service. Over 26 years experience in printed circuit board technology LPKF milling technology: An efficient alternative to chemical etching Complete in-house Rapid PCB Prototyping Identifying trends, setting new standards Precision based on quality Finer and finer structures and high density packaging are only feasible with the highest levels of precision. This requires machines for PCB prototyping and production alike to be extremely precise to meet these demands. LPKF develops and manufactures almost every Certified by component in its machines and systems. The result is a perfect synthesis of quality and high-tech: this applies to the materials used as well as the manufacturing process. LPKF s quality management has been certified to ISO 9001:2000. Innovation through exchange of ideas with customers Individually tailored solution packages for future-oriented customers Global service network Perfect synthesis of quality and high-tech to DIN EN ISO 9001 ISO 9001:2000 certified supplier

6 4 In-house Rapid PCB Prototyping In-house Rapid PCB Prototyping LPKF ss/ds without through-hole plating LPKF ss/ds with mechanical through-hole plating LPKF ss/ds with conductive paste through-hole plating LPKF ss/ds with galvanic through-hole plating LPKF Multilayer CAM (CircuitCAM/BoardMaster) LPKF PCB Prototyping Milling Technology CAM (CircuitCAM/BoardMaster) Structuring the internal layers Bonding the layers Drilling Drilling Galvanic through-hole plating Structuring Structuring of outer layers Contour routing Contour routing Conductive paste plating Mechanical through-hole plating Prototype printed circuit board Solder mask Tin plating Optional ss single-sided circuit board ds double-sided circuit board pth plated through hole npth non-plated through hole

7 Use in conventional series production 5 Use in conventional PCB production ss/ds with through-hole plating (photo resist) ss/ds with through-hole plating (Pb/Sn) (metal etching resist) ss/ds with through-hole plating (metal etching resist) ss/ds with through-hole plating (tenting technology) ss/ds without through-hole plating Multilayer CAM (CircuitCAM/BoardMaster) Creating negative artwork film Exposing photo resist Use of LPKF systems in conventional PCB production Developing photo resist Rinsing circuit board Drilling pth Drilling npth Deburring Cleaning Galvanic through-hole plating Laminating Resist stripping Differential etching, rinsing, cleaning, drying Creating negative artwork film Exposing photo resist Developing photo resist Etching, rinsing, cleaning, drying Bonding the layers Rinsing circuit board Pb/Sn Drilling pth Resist stripping Deburring Etching, rinsing, cleaning, drying Cleaning Pb/Sn resist Desmearing etch-back Drilling npth Contour routing Solder mask Galvanic through-hole plating Laminating Creating negative artwork film Tin plating Exposing photo resist De-panelling Developing photo resist Solder paste printing Rinsing circuit board Assembling (SMD, BGA) Etching, rinsing, cleaning, drying Reflow soldering Resist stripping

8 6 Applications Applications Use of circuit board plotters for Rapid PCB Prototyping Prototype circuit boards with up to 8 layers LPKF ProtoMats have a broad range of applications: an enormous spectrum of rigid and flexible materials, as well as soft substrates for RF and microwave technology, can easily be machined to produce prototype boards of production quality. 100 µm (4 mil) track and gap 150 µm (6 mil) hole diameters The electrical characteristics of the prototype can be accurately produced from the design data. This is guaranteed by the precise reproduction of the geometrical properties by the LPKF circuit board plotters. The capability to create 100 µm (4 mil) tracks and gaps as well as 150 µm (6 mil) holes enables the production of state-of-the-art circuits including BGA and fine-pitch SMD components. Through-hole plating An essential part of most prototype boards are through-hole connections. LPKF offers alternative methods including: Rivets (LPKF EasyContac), conductive paste (LPKF AutoContac) and galvanic through-hole plating (LPKF MiniContac III and Contac III). Through-hole plating with rivets The LPKF EasyContac system is a simple, low cost method for through-hole plating on less complex circuit boards. The process uses rivets, manually inserted with a special tool and then soldered. This through-hole plating method is suitable for low-density circuit boards with up to 50 via holes. Through-hole plating with conductive paste A dispenser mounted on the head of the LPKF circuit board plotter automatically injects a special conductive paste into the holes of the board and then vacuums out the excess paste leaving an open hole. The paste is cured in a convection oven and creates a plated through-hole that is solderable and can be populated with wired components. LPKF AutoContac is suitable for low-density circuit boards with up to 300 via holes with diameters of 0.5 mm mm (20 mil - 55 mil). Electroplating LPKF offers two different sized electroplating systems LPKF Contac III and MiniContac III. These galvanic through-hole plating systems were specially developed to provide in-house plating solutions without compromising layout density or limiting design rules. The process takes min and produces production quality through-hole plating. Holes as small as 0.2 mm (8 mil) are easily plated and there is no limit to the number of holes.

9 Applications 7 Reverse pulse plating The introduction of reverse pulse plating (RPP) in 2003 has considerably improved the quality of through-hole plating. This method guarantees uniform plating thickness in the entire hole and allows plating of more difficult aspect ratios. The bone effect (thicker plating at the top and bottom of the hole) is now a thing of the past. This technology is based on accurately timed reverse pulsing (anodic polarisation of the circuit board) which precisely ablates excess material to give smoother plating. Production of multilayer circuit boards Multilayer circuit boards can easily be produced in house using LPKF solutions. Today the production of 8-layer multilayers in ultra-fine technology is becoming a standard requirement as much as simple double sided boards. In the production of multilayer circuit boards in particular, electroplating systems (Contac III or MiniContac III) combined with the LPKF MultiPress II, are the backbone of the cost and time saving production of such complex prototype circuit boards. Routing slots, cut outs and board profile The routing of slots, cut-outs and board contours or larger openings or routing of circuit board contour to depanelize it from sheet material is no problem even with complex shapes. Solder mask Solder masks are used in PCB mass production to increase soldering precision and protect the boards from environmental influences. With LPKF EasySolder, LPKF has developed an easy, inexpensive method of producing instant solder masks for prototype boards using the LPKF circuit board plotter. The mask is simply cut into an adhesive polymer material and then bonded to the finished board. RF and microwave circuits Designers of RF and microwave circuits often require a substantial number of different prototype boards during a development project, all made with superior accuracy. Only some PCB manufacturers are set up to produce boards on special RF substrates and some of the chemical methods used are unable to provide the precise geometries required. The LPKF ProtoMat C100/HF was developed specifically for the RF and microwave market. It mostly uses custom designed precision tools to guarantee straight sidewalls and minimum penetration into the substrate. Prototypes can be quickly produced for testing as soon as the design is complete, then small batches can also be economically made with this machine. The LPKF ProtoMat C100/HF easily handles all common RF substrates including PTFE and ceramic filled substrates (RO 4000).

10 8 Applications Special Applications Flexible circuit boards With LPKF s patented non-contact air bearing it is possible to process a wide range of flexible circuit materials. The crucial factor in this application is the ratio of flexible material thickness to the copper layer thickness but many flexible circuits have been prototyped on an LPKF circuit board plotter equipped with this device. Rigid-flex circuit boards LPKF circuit board plotters have a proven track record in the production of rigid-flex circuit boards. In small batch production as well as prototyping, the LPKF circuit board plotters with non-contact air bearing (LPKF ProtoMat C100/HF, H100, 95s/II and X60) highlight the benefits of defined depth milling. Prototyping of rigid-flex circuit boards is completed quickly and easily with these machines. Front panels and sign production LPKF circuit board plotters can also be used for engraving and routing front panels and signs. These high-precision systems open up numerous options for the very fine machining of various materials, e.g.: Plastic Plexiglass Aluminum Brass, and many more. Housings The multi-functional character of LPKF circuit board plotters in electronics development is also highlighted by their ability to machine other parts such as housings. This involves the use of different tools to suit the materials used. Dispensing With the LPKF AutoContac system fitted onto an LPKF circuit board plotter it is possible to dispense media of various kinds including solder paste, adhesive, conductive paste and sealing compounds.

11 Applications 9 Use of circuit board plotters in PCB production Reworking assembled/unassembled circuit boards LPKF circuit board plotters can be used in numerous positions of PCB production lines and easily integrated. LPKF ProtoMat systems are ideal and cost-effective additions to congested production lines particularly for the de-panelling of circuits (LPKF ProtoMat X60), or the subsequent creation of holes and openings after board manufacture. Other uses include configuring or coding, e.g. by removing a plated hole or by severing one or more tracks. LPKF systems can also be used to rework circuit boards, which have been produced by etching. Milling and engraving of special films and instant solder masks LPKF circuit board plotters can be used to produce precision artwork for the mass production of circuit boards. This saves the expense of buying and running a photoplotter or the cost of using an outside service. The ability to cut very precisely defined openings in special films opens up other areas of application for LPKF circuit board plotters including the production of: Instant solder mask Prototype SMD stencils for the application of solder paste on prototype printed circuit boards using the printing machine LPKF ZelPrint LT300 Drilling circuit boards or test adapters LPKF circuit board plotters can be used as CNC drilling machines. The software supplied with each circuit board plotter system can read in drilling co-ordinates from circuit boards if no data is available by using a camera (LPKF CircuitView) in conjunction with the teach-in method. Test adapters for the pinhole bed of automatic circuit board testers can be drilled or milled in materials such as plexiglass, Pertinax and antistatic fiberglass reinforced epoxy often used for vacuum test adapters. Solder frames and inspection templates A crucial aspect in the production of solder frames and inspection templates is precise machining of the carrier materials to ensure a perfect fit with the mass production circuit boards. This is another ideal area of application for LPKF circuit board plotters.! Perhaps you have come up with a new idea, or want to machine other new materials. Maybe you have a special application but have not yet found a solution, simply give us a call! Our application engineers are happy to perform tests and help you find the solutions to your problems any time.

12 10 Software package (LPKF CircuitCAM & BoardMaster) Software package (LPKF CircuitCAM & BoardMaster) Plug & Play for a fast start Each LPKF circuit board plotter is delivered complete with a comprehensive software package for the import of data from any PCB layout CAD package and control of the machine itself. The development of the software focused on three key aspects: simple operation, perfect match to the hardware, and compatibility with all standard CAD programs. This ensures an easy to learn, easy to use and compatible package. LPKF CircuitCAM The software interface to your CAD/EDA system LPKF CircuitCAM is one of the few user friendly programs offering powerful editing options for data modification. Its core is the intelligent insulation process used to produce the milling paths for the LPKF circuit board plotter. Simple integration LPKF CircuitCAM processes the same data, which would be sent to the PCB manufacturer. The usual data flow does not need to be changed. Automatic importing of the aperture tables and tool lists is followed by reading in of the Gerber and NC drilling files, which are then graphically displayed on screen. LPKF CircuitCAM provides numerous editing options for data modification (versiondependent): Data input: Gerber, GerberX, HP-GL, Excellon, Sieb & Meier, DXF, Barco, ODB Data output: Gerber, GerberX, HP-GL, LMD, Excellon formats Intelligent insulation: This process guarantees removal of copper using various automatic and individually adjustable insulation options, which optimize milling time and tool life, with up to four different tools per insulation strategy and freely definable rub-outs including polygons Design rule check: Automatic checking of track/gap spaces Auto contour routing: Automatic generation of routing path with definable breakout tabs Auto ground plane: automatic generation of ground planes Direct drawing input: Drawing of simple front panels or PCB s Editing: e.g. modifying line-widths, changing hole diameters, shifting holes, add copper areas, etc. The WIZARD: Integrated program assistant to guide the user and cut the learning curve. True type fonts: (TTF) in CircuitCAM text function Auto assign: Automatic assignment of production phases/tools for BoardMaster Machining order control: Modification of cutting direction and sequence Simple and functional LPKF CircuitCAM is very easy to operate via the Windows interface thanks to its intelligent structure. Particularly fast and effective operation through programmable tool bars and input instructions. A program assistant (Wizard) guides the user through the program sequence step by step: from importing data, through generation of milling/routing paths, to the export of production data. Even unskilled users can rapidly learn this software and successfully generate the data for the circuit board plotter. Compatible with every standard CAD/EDA CircuitCAM supports all standard data formats CAD data accepted GERBER Extended GERBER (RS 274 X) DPF (BARCO ) EXCELLON SIEB & MEIER DXF HP-GL CircuitCAM for Windows CAD data importing and editing Milling data and routing path generation BoardMaster for Windows Controlling the LPKF circuit board plotter Tool library Process control ODB

13 Software package (LPKF CircuitCAM & BoardMaster) 11 High performance CAM station With LPKF CircuitCAM PCB software, the user also has access to an independent CAM station. This opens up a wide range of options: production data control, editing, modification, step and repeat, different design rule checks, generation of ground planes or text in true type fonts as well as contour routing paths. LPKF CircuitCAM PCB is also a very high-performance data converter, e.g. for the conversion of AutoCAD DXF data into Gerber files. Upgrading LPKF CircuitCAM LITE to PCB is possible any time for a single flat fee. Special applications with LPKF CircuitCAM software Defined insulation at the push of a button The diverse insulation parameters and options of LPKF CircuitCAM can be individually adjusted and easily executed. The use of several tools guarantees optimal, reliable removal of the copper around the conductor lines. RF- and microwave layouts Because of its special functions, it is particularly easy to use LPKF CircuitCAM to process RF and microwave layouts from any original data. The intelligent polygon-fill function for instance makes the processing of DXF data really easy. Contour routing path generator LPKF CircuitCAM also has the option to generate routing paths automatically. This includes the creation of cutting paths for internal slots or openings as well as the outer contour of the circuit board. Defined breakout tabs are created at the same time to hold the circuit board in the material. Specifications Import formats LPKF CircuitCAM LITE Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill (version 1 and 2), Sieb & Meier NC Drill, HP-GL LPKF CircuitCAM PCB Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill (version 1 and 2), Sieb & Meier NC Drill, HP-GL, Barco DPF, AutoCAD DXF, ODB Supported shapes Circle, square, rectangle (also rounded or angled), octagon, oval, marker, IEC 1182 ( ) including thermal reliefs, fiducials, etc., special (arbitrary Export formats definable). LPKF BoardMaster (LMD) LPKF BoardMaster (LMD), Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill, HP-GL Editing functions Original modification, relocating, duplicating, rotating, mirroring, erasing, extending/severing lines, line/path extension/shortening, line path/segment parallel shifting, line path/object polygon conversion (Fill), curve linking/closing Special functions Contour routing path generator with breakout tabs Contour routing path generator with breakout tabs, volume operations, joining/separating objects, step & repeat (multiple PCB), polygon cut-out, ground plane generation with defined clearance, batch functions Display functions Zoom window (freely definable), zoom in/out, overview, redraw, individual layers selectable/visible, panning (keyboard), layer in solid/outline/center line display, 16 pre-set colors (up to 16 million freely available), different colors for tracks and pads of the same layer, different colors for insulation tools Marker functions Single element, total layer, all layers, pad groups, selection and limiting to specific layers possible for lines/polygons/circles/rectangles/pads/holes (multiple choice and restriction to specific layers possible) Graphic functions Control functions Lines (open/closed), circle, polygon, rectangle, pad, hole, text (TTF) Measuring Measuring, design rule check Insulation methods Single insulation method, additional multiple insulation of pads, removal of residual copper spikes (spike option), milling out of large insulation areas (rub-out), concentric or in serpentines maintaining minimum insulation spaces, zone insulation (only PCB version) Insulation tools Languages 1-2 tools English, German, French, Spanish, Japanese and Chinese 1-4 tools Hardware and software Microsoft Windows 95/98/NT/2000/XP, 700 MHz processor or better, min. 128 MB RAM (256 MB recommended), screen resolution min. 1024x768 pixels specifications Supplied with LPKF ProtoMat C20, C40, M30/S LPKF ProtoMat C60, C100/HF, M60, 95s/II, H100, X60, L60, Upgrade from LITE available

14 12 Software package (LPKF CircuitCAM & BoardMaster) LPKF BoardMaster The powerful and comfortable control software This intelligent control software for LPKF circuit board plotters combines a high degree of user-friendliness with perfect process control. The graphic user interface can handle milling and drilling data created by CircuitCAM as well as HP-GL files from various design software packages. User-friendly operating interface The WYSIWYG (What-You-See-Is-What-You-Get) user interface shows all milling and drilling data as well as the size of the base material. Through a simple click of a mouse various different layouts and step-and-repeat copies can be placed on one sheet of material. The actual machining status is constantly displayed. Intelligent tool management All tool parameters such as feed rate and rpm are controlled by LPKF BoardMaster and managed in the tool library. The life of the bits is constantly monitored and the user is prompted to change tools when the maximum tool life is reached. The tool change process is optimized to reduce the number of changes necessary. The tool changing on the LPKF ProtoMat 95s and H100 is fully automatic and requires no user interaction. Simultaneous processing of several projects Automatic data transmission All of the processing phases and associated tools are automatically output by CircuitCAM straight into BoardMaster. The production of the circuit board can start immediately the cutting data is processed without any program change. Tool library LPKF BoardMaster in use Selection of separate elements Technical data LPKF BoardMaster Import formats Control Display function LPKF-Mill-Drill (*.LMD), HP-GL All ProtoMat plotters and LPKF 101 LC, LPKF LC/VS, LPKF HI-P, LPKF AutoMill, LPKF 91, LPKF 91s and LPKF 92s WYSIWYG display of machining data, zoom in/out/working area/projects, previous view, all viewing methods available at all times, even during the machining process Placement functions Selection methods Tool management Tool Library Programming the material size Languages Other Hard and software requirements Copy, move, step and repeat, handles multiple artworks and placements simultaneously Total production phase, specific tools, individual drill holes/lines/segments, selection from/up to a specific hole/line segment RPM and head down time, registering and saving actual tool life, initiating the tool change procedure if tool lifetime is exceeded Unlimited, individual library for different material types, individual customizable parameters Positioning with corner coordinates, with the mouse, coordinates input via keyboard, option of saving frequently used material sizes English, German, Spanish, Japanese, French, Chinese Acoustic signal at end of production phase and display of production time remaining, estimated production time is displayed before start Microsoft Windows 95/98/NT/2000/XP, 400 MHz processor or better, min. 64 MB RAM (recommended 128 MB), screen resolution min. 800 x 600 pixels, serial port

15 LPKF ProtoMat Quality features 13 LPKF ProtoMat Quality features High precision and long life State-of-the-art technology and materials of the highest quality ensure that LPKF circuit board plotters comply with the most stringent specifications for precision. This applies to the machines themselves as well as to the boards produced by them. These systems have an extremely long and useful operational life. Each and every LPKF ProtoMat plotter is built to be the best of its class with thousands of installed systems to prove it. Rigid cast aluminium table Integrated dust extraction system U U U System Design Precision linear shafts Anti-backlash lead screws Solid, high-precision cast machine table Variable high-speed spindle motors up to 100,000 rpm Increased tool lifetimes Automatic, software-supported, smart warm-up phase doubles motor lifetimes Software-supported registration hole system Enclosed LPKF dust extraction with electronic control and absolute filter to prevent micro dust particles from becoming airborne Quick-release tool collet For standard and special tools with 1/8 shaft Coaxial milling depth limiter Either mechanical foot or noncontact air bearing Scans the material surface and compensates for irregularities This allows the defined Coaxial milling depth penetration of the tool limiter and the production of ultra-fine structures even on soft microwave substrates The shape of the depth limiter provides efficient dust extraction of the entire cutting area. O CircuitCAM U Software solutions CAM software package (CircuitCAM, BoardMaster) For circuit boards and front panel applications: included (Windows 95/98/2000/NT and XP compatible) CircuitCAM: conversion and editing software with intelligent insulation process BoardMaster: circuit board plotter control, process control; intelligent tool management guarantees optimal use of LPKF high-precision tools. Both standard bits and special tools for RF circuits do not require any liquid cooling. O O BoardMaster U Important Parameters Step resolution as small as 1 µm (0.004 mil) with a repeatability of ± 1 µm (0.004 mil) Circuit structures Minimum 80 µm (3.1 mil) tracks partially with 100 µm (4 mil) spacing Drill holes 150 µm (6 mil) and bigger Machining of various materials FR3, FR4, G10, other glass fiber reinforced epoxies PTFE, filled substrates (e.g. RT/duroid, TLX, etc.) ceramic filled substrates (e.g. Rogers RO and TMM) brass and aluminum plastic materials Upgrading Options The software already includes options such as dispensing and conductive paste through-hole plating. Teach-in-camera (LPKF CircuitView) Accessories and additional equipment options allow the adaptation of the systems to an enormous range of tasks Customer Service (Free advice/support) Germany Slovenia China Spain France UK/Ireland Japan North America (8 am - 5 pm PST)

16 14 LPKF ProtoMat C-series LPKF ProtoMat C-series 200 x 340 (7.8 x 14.4) Applications 375 x 540 (14.8 x 21.3) C-Series M-Series Working area in mm (inch) 530 x 650 (20.9 x 25.6) 1 and 2-sided circuit boards FR3, FR4, FR5, G10 Flexible substrates RF & microwave substrates Front panels/sign engraving Machining cut outs in front panels Contour routing of circuit boards Multilayer PCBs up to 4 layers* Multilayer PCBs up to 8 layers* Test adapter drilling Milling film artworks SMD solder stencil cutting Rigid-flex circuit milling Depanelization and reworking of bare and populated boards Solder frames for circuit board assembly Housing production X-Series! Training for LPKF ProtoMat C, M, and X-series All LPKF products are supplied with comprehensive operating instructions, with easy to understand manuals to make installation and commissioning quick and simple for the user. Additional software assistant and multimedia training CD allow complete self-conducted training at the user s convenience. We also provide private installation and training classes, both on-site or at one of LPKF s worldwide service facilities. LPKF ProtoMat C20 Suitable for application * combined with MultiPress II and Contac III/MiniContac III C40 C60 C100/HF LPKF ProtoMat C20 Simple and affordable 2-sided PCBs This circuit board plotter is an ideal entry-level system for users that demand precision prototypes on an affordable budget. This model is particularly popular in schools, colleges, and universities. The ProtoMat C20 is ideal for single and double sided boards using analog and digital technology with medium layout density. LPKF ProtoMat C40 Robust basic model with quick tool change Instant prototypes right out of the lab at a higher level The ProtoMat C40 is setting a new standard in the industry combining the capability to create precision single and double sided PCBs with the operating comfort of a quick-release tool collet and the high performance of 40,000 rpm programmable motor speed. This makes this entry-level circuit board plotter the perfect fit for users from small businesses to corporate engineering. LPKF ProtoMat C60 For tight specs and diverse applications The 60,000 rpm programmable speed motor allows the use of an extended range of tools, including small rectangular profiled endmills with diameters as small as 0.25 mm (10 mil). These tools have superior characteristics for RF and microwave applications and allow maximum precision with minimum penetration into the substrate. The high-speed motor also allows the production of dense digital designs with track/gap geometries of 100 µm (4 mil) and 0.2 mm (8 mil) drill holes as well as multilayer applications. LPKF ProtoMat C100/HF Ideal for RF substrates and flex This system, especially designed for RF and microwave PWBs, takes prototyping to extremes. A motor speed of 100,000 rpm allows the widest range of tools including 0.15 mm (6 mil) endmills for high performance designs. In addition the ProtoMat C100/HF is extremely versatile. A contact-less air bearing depth limiter is ideal for use on flexible or gold plated circuits. Micrometer depth adjustment can be used to mill precise pockets into brass or aluminum backed circuits or to route beryllium copper sheets. The ProtoMat C100/HF is fully compatible with multilayer applications and all common materials including FR4, Rogers RO 4000 and TMM, as well as PTFE substrates such as RT/duroid, UltraLAM, TLX, TLY and many others.

17 LPKF ProtoMat C-series 15 Simple and affordable Robust basic model with quick Multifunctional for tight specs Ideal for RF substrates 2-sided PCBs tool change and diverse applications and flex Specifications LPKF ProtoMat C20 LPKF ProtoMat C40 Part number Minimum track width Minimum gap Minimum hole diameter Working area Resolution Repeatability Front-to-back registration accuracy Milling motor mm (8 mil) 0.2 mm (8 mil) 0.5 mm (20 mil) 340 mm x 200 mm (13.4 x 7.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) DC, 20,000 rpm mm (4 mil) 0.2 mm (8 mil) 0.3 mm (12 mil) 340 mm x 200 mm (13.4 x 7.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) EC (brushless), 10,000-40,000 rpm, programmable Tool change Collet Drilling capacity Positioning speed (max.) Depth adjustment Semi-automatic 1/8 collet 78 holes/min 35 mm/sec (1.38 /sec) Mechanical scanning, coaxial foot Semi-automatic 1/8 quick-release collet 78 holes/min 35 mm/sec (1.38 /sec) Mechanical scanning, coaxial foot X/Y positioning system stepper motors, precision lead stepper motors, precision LPKF ProtoMat C mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 340 mm x 200 mm (13.4 x 7.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) 3-phase motor, 10,000-60,000 rpm, programmable Semi-automatic 1/8 quick-release collet 90 holes/min 35 mm/sec (1.38 /sec) Mechanical scanning, coaxial foot stepper motors, precision LPKF ProtoMat C100/HF mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 340 mm x 200 mm (13.4 x 7.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) 3-phase motor, 10, ,000 rpm, programmable Semi-automatic 1/8 quick-release collet 120 holes/min 35 mm/sec (1.38 /sec) Non-contact air bearing stepper motors, precision screws ActiveCAM lead screws ActiveCAM lead screws ActiveCAM lead screws ActiveCAM anti-backlash Supernuts anti-backlash Supernuts anti-backlash Supernuts anti-backlash Supernuts Z drive electromagnetic with hydraulic electromagnetic with electromagnetic with pneumatic, 14 mm (0.55 ) damper hydraulic damper hydraulic damper movement Machine table base 75mm (3 ) cast aluminum 75mm (3 ) cast aluminum 75mm (3 ) cast aluminum 75mm (3 ) cast aluminum X/Y linear system precision linear bushings and precision linear bushings precision linear bushings precision linear bushings dual shafts and dual shafts and dual shafts and dual shafts Dimensions (W/H/D) 16.5 x x ) 16.5 x x ) 16.5 x 13.4 x ) 16.5 x 13.0 x ) Weight 24 kg (53 lb) 24 kg (53 lb) 24 kg (53 lb) 25 kg (55 lb) Power supply 120/240V, Hz/150VA 120/240V, Hz/150VA 120/240V, Hz/200VA 120/240V, Hz/200VA Compressed air supply bar (87 psi), 50 l/min (1.7 cfm) Options/accessories Software package CircuitCAM LITE Software package CircuitCAM PCB Dust extraction unit Dust extraction AutoSwitch Tooling starter kit (board material/tools etc.) Measuring microscope Mobile sound enclosure Head illumination CircuitView camera system Micrometer depth adjustment 3-phase motor, 10,000 to 100,000 rpm 3-phase motor, 10,000 to 60,000 rpm EC motor, 10,000 to 40,000 rpm DC motor, 20,000 rpm Pneumatic Z-stroke Pneumatic non-contact air bearing Raising Z-axis by 30 mm (1.2 ) standard equipment optional (can be retrofitted) recommended basic equipment Dimensions (W/H/D) 1) 420 mm x 350 mm x 565 mm optional (needs to be factory mounted) 2) 420 mm x 340 mm x 565 mm not available 3) 420 mm x 330 mm x 565 mm

18 16 LPKF ProtoMat M/L-series LPKF ProtoMat M/L-series 200 x 340 (7.8 x 14.4) 375 x 540 (14.8 x 21.3) C-Series M-Series Working area in mm (inch) 530 x 650 (20.9 x 25.6) X-Series LPKF ProtoMat M30/s Robust basic model with quick-release collet for 2-sided PCBs, large panels The large table size makes the ProtoMat M30 very valuable for large analog and digital boards with medium population density as well as production of multiple copies of the same or different layouts. For increased operating comfort, this system provides programmable spindle speed and quick-release tool collet. LPKF ProtoMat M60 For precise large and multilayer boards The ProtoMat M60 is truly a multi-talented system. Its large table size allows the production of large circuit boards. This is especially helpful when producing multilayer boards as this plotter can handle multiple layers simultaneous. A 60,000 rpm motor guarantees perfect drill hole quality, which is essential for proper interconnection on multilayer boards, and produces dense circuitry from DC to RF. It is also able to engrave and route inspection templates, aluminum panels and other two-dimensional mechanical items. Applications 1 and 2-sided circuit boards LPKF ProtoMat M30/s M60 L60 LPKF ProtoMat L60 For extremely long circuit boards, antennas and front panels This circuit board plotter provides a long working area that accommodates extra large circuits including antennae and front panels. It is equipped with a 60,000 rpm motor capable of handling small endmills for RF and microwave circuitry and a pneumatic Z-axis with extra clearance for thick substrates. FR3, FR4, FR5, G10 Flexible substrates RF & microwave substrates Front panels/sign engraving Machining cut outs in front panels Contour routing of circuit boards Multilayer PCBs up to 4 layers* Multilayer PCBs up to 8 layers* Test adapter drilling Milling film artworks SMD solder stencil cutting Rigid-flex circuit milling Depanelization and reworking of bare and populated boards Solder frames for circuit board assembly Housing production Suitable for application * combined with MultiPress II and Contac III/MiniContac III

19 LPKF ProtoMat M/L-series 17 Robust basic model with quick-release collet for 2-sided PCBs, large panels Multifunctional system for precise large and multilayer boards For extremely long circuit boards, antennas and front panels Specifications LPKF ProtoMat M30/s LPKF ProtoMat M60 Part number Minimum track width Minimum gap Minimum hole diameter Working area Resolution Repeatability Front-to-back registration accuracy Milling motor mm (4 mil) 0.2 mm (8 mil) 0.3 mm (12 mil) 540 mm x 375 mm (21.3 x 14.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) EC (brushless), 10,000-30,000 rpm, programmable mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 540 mm x 375 mm (21.3 x 14.8 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) 3-phase motor, 10,000-60,000 rpm, programmable Tool change Collet Drilling capacity Positioning speed (max.) Depth adjustment Semi-automatic 1/8 collet 78 holes/min 35 mm/sec (1.38 /sec) Mechanical scanning, coaxial foot Semi-automatic 1/8 collet 90 holes/min 35 mm/sec (1.38 /sec) Mechanical scanning, coaxial foot LPKF ProtoMat L mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 375 mm x 1,250 mm (14.75 x 49.2 ) µm (0.312 mil) / mm (0.2 mil) / mm (0.8 mil) 3-phase motor, 10,000-60,000 rpm, programmable Semi-automatic 1/8 collet 120 holes/min 35 mm/sec (1.38 /sec) Non-contact air bearing X/Y positioning system stepper motors, precision lead screws stepper motors, precision lead screws stepper motors, precision lead screw ActiveCAM anti-backlash Supernuts ActiveCAM anti-backlash Supernuts assemblies with internal ball recirculating system Z drive electromagnetic with hydraulic damper electromagnetic with hydraulic damper pneumatic, 14 mm (0.55 ) movement Machine table base 75mm (3 ) cast aluminum 75mm (3 ) cast aluminum precision milled aluminum bed X/Y linear system precision linear bushings and dual shafts precision linear bushings and dual shafts precision linear bushings and dual shafts Dimensions (W/H/D) 620 x 420 x 760 mm (24.4 x 16.5 x 29.9 ) 620 x 420 x 760 mm (24.4 x 16.5 x 29.9 ) 620 x 420 x 1,543 mm (24.4 x 16.5 x 60.7 ) Weight 43 kg (94.6 lb) 43 kg (94.6 lb) 110 kg (242 lb) Power supply 120/240V, Hz/150VA 120/240V, Hz/200VA 120/240V, Hz/200VA Compressed air supply bar (87 psi), 100 l/min (3.528 cfm) Options/accessories Software package CircuitCAM LITE Software package CircuitCAM PCB Dust extraction unit Dust extraction AutoSwitch Tooling starter kit (board material/tools etc.) Measuring microscope Mobile sound enclosure Head illumination CircuitView camera system Micrometer depth adjustment 3-phase motor, 10,000 to 100,000 rpm 3-phase motor, 10,000 to 60,000 rpm EC motor, 10,000 to 40,000 rpm Pneumatic Z-stroke Pneumatic non-contact air bearing Raising Z-axis by 30 mm (1.2 ) standard equipment optional (can be retrofitted) recommended basic equipment optional (needs to be factory mounted) not available

20 18 LPKF ProtoMat H-series LPKF ProtoMat H-series 380 x 420 (14.9 x 16.5) 95s/II, H100 LPKF ProtoMat 95s/II Precision system with automatic tool change The LPKF ProtoMat 95s offers high-speed and precision combined with the convenience of a 30-station fully automatic tool change. A contact-less air bearing depth limiter is ideal for use on flexible or gold plated circuits. This circuit board plotter is designed for PCB labs with a high volume of prototypes in any technology including analog, digital, power supplies, flex boards as well as RF and microwave circuits. The high production speed is also a substantial advantage for the in-house fabrication of quick turn multilayer circuit boards and small batch production. Working area in mm (inch)! Installation and training for LPKF ProtoMat 95s/II and H100 These systems are offered with installation and training packages to support users in their correct operation for the many applications that the high end LPKF ProtoMat 95s/II and ProtoMat H100 can perform. Applications 1 and 2-sided circuit boards FR3, FR4, FR5, G10 Flexible substrates RF & microwave substrates Front panels/sign engraving Machining cut outs in front panels Contour routing of circuit boards Multilayer PCBs up to 4 layers* Multilayer PCBs up to 8 layers* Test adapter drilling Milling film artworks SMD solder stencil cutting Rigid-flex circuit milling Depanelization and reworking of bare and populated boards Solder frames for circuit board assembly Housing production LPKF ProtoMat 95s/II H100 LPKF ProtoMat H100 The fastest prototyping system yet This system allows significant reduction in the production time of prototype PCBs. The maximum milling speed is now almost doubled compared to prior top-of-the-range systems and the integrated smart following-vector path generation allows the system to maintain a higher average speed. The combination of both of these features pushes the performance factor of this machine 2-3 times. Now prototype production of multilayer boards is accomplished in-house comfortably. The resolution has been increased five fold to 1 µm, which combined with 100,000 rpm milling motor allows this plotter to partially create 80 µm (3.1 mil) tracks with 100 µm (4 mil) spacing which accommodates all state of the art packages including BGA and µbga. Along with the increased performance, the H100 also includes many new features derived from high volume production systems, which up to now have been unknown in this class of prototyping equipment. These features include automatic tool change, automatic tool adjustment by scanning sensor, and a camera system for automatic fiducial recognition. This eliminates user interaction and simplifies the board alignment process. The H100 system also includes an integrated vacuum tabletop allowing proper mounting of thin and flexible substrates on the plotter. Suitable for application * combined with MultiPress II and Contac III/MiniContac III

21 LPKF ProtoMat H-series 19 Precision system with automatic tool change The fastest prototyping system yet! Specifications Part number Minimum track width Minimum gap Minimum hole diameter Working area Resolution Repeatability Front-to-back registration accuracy Milling motor LPKF ProtoMat 95s/II mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 420 mm x 380 mm (16.5 x 14.9 ) 5 µm (0.2 mil) ± mm (0.2 mil) ± 0.02 mm (0.8 mil) 3-phase motor, 10,000-60,000 rpm, programmable LPKF ProtoMat H mm (4 mil); 0.08 mm (3.1 mil) partially 0.1 mm (4 mil) 0.15 mm (6 mil) 420 mm x 380 mm (16.5 x 14.9 ) 1 µm (0.04 mil) ± mm (0.04 mil) ± 0.02 mm (0.8 mil) 3-phase motor, 10, ,000 rpm, programmable Tool change Collet Drilling capacity Positioning speed (max.) Depth adjustment Automatic, 30 positions 1/8 pneumatic-release collet 90 holes/min 60 mm/sec (2.36 /sec) Non-contact air bearing Automatic, 30 positions 1/8 pneumatic-release collet 120 holes/min 100 mm/sec (3.94 /sec) Non-contact air bearing: automatic setting X/Y positioning system stepper motors, precision ball screw assemblies with internal ball recirculating system stepper motors, precision ball screw assemblies with internal ball recirculating system Z drive pneumatic, 14 mm (0.55 ) movement pneumatic, 14 mm (0.55 ) movement Machine table base X/Y linear system 75 mm (3 ) cast aluminum precision linear bushings and dual shafts 75 mm (3 ) cast aluminum precision linear bushings and dual shafts Dimensions (W/H/D) Weight Power supply Compressed air supply Options/accessories Software package CircuitCAM LITE Software package CircuitCAM PCB Dust extraction unit Dust extraction AutoSwitch Tooling starter kit (board material/tools etc.) Measuring microscope Mobile sound enclosure Head illumination CircuitView camera system Micrometer depth adjustment 3-phase motor, 10,000 to 100,000 rpm 3-phase motor, 10,000 to 60,000 rpm EC motor, 10,000 to 40,000 rpm Pneumatic Z-stroke Pneumatic non-contact air bearing Raising Z-axis by 30 mm (1.2 ) 650 mm x 430 mm x 750 mm (25.6 x 16.9 x 29.5 ) 50 kg (110 lb) (without acoustic cabinet) 120/240V, Hz/240VA 6 bar (90 psi), 100 l/min (2.4 cfm) 650 mm x 430 mm x 750 mm (25.6 x 16.9 x 29.5 ) 50 kg (110 lb) (without acoustic cabinet) 120/240V, Hz/240VA 6 bar (87 psi), 100 l/min (3.528 cfm) standard equipment optional (can be retrofitted) optional (needs to be factory mounted) not available recommended basic equipment

22 20 LPKF ProtoMat X-series LPKF ProtoMat X-series 375 x 540 (14.8 x 21.3) 530 x 650 (20.9 x 25.6) Model for use in series production. Working area matches standard PCB production panels 200 x 340 (7.8 x 14.4) C-Series M-Series Working area in mm (inch) X-Series LPKF ProtoMat X60 Drilling, Routing & Depaneling The ProtoMat X60 is placed between two worlds rapid PCB prototyping plotter on one hand and versatile production drilling and routing system on the other. The large table holds panel sizes of 650 mm x 530 mm (26 x 21 ). The X60 is equipped with pneumatic z-stroke and non-contact air bearing depth limiter. The extended Z-axis range enables depaneling and milling of deep trenches for rigid and rigid-flex boards. The ProtoMat X60 is also ideal for producing antistatic inspection templates for circuit boards. Applications 1 and 2-sided circuit boards FR3, FR4, FR5, G10 Flexible substrates RF & microwave substrates Front panels/sign engraving Machining cut outs in front panels Contour routing of circuit boards Multilayer PCBs up to 4 layers* Multilayer PCBs up to 8 layers* Test adapter drilling Milling film artworks SMD solder stencil cutting Rigid-flex circuit milling Depanelization and reworking of bare and populated boards Solder frames for circuit board assembly Machining of enclosures Suitable for application * combined with MultiPress II and Contac III/MiniContac III LPKF ProtoMat X60 Specifications Part number Minimum track width Minimum gap Minimum hole diameter Working area Resolution Repeatability Front-to-back registration accuracy Milling motor Tool change Collet Drilling capacity Positioning speed (max.) Depth adjustment X/Y positioning system Z drive Machine table base X/Y linear system Dimensions (W/H/D) Weight Power supply Compressed air supply Options/accessories Software package CircuitCAM LITE Software package CircuitCAM PCB Dust extraction unit Dust extraction AutoSwitch Tooling starter kit (board material/tools etc.) Measuring microscope Mobile sound enclosure Head illumination CircuitView camera system Micrometer depth adjustment 3-phase motor, 10,000 to 100,000 rpm 3-phase motor, 10,000 to 60,000 rpm EC motor, 10,000 to 40,000 rpm Pneumatic Z-stroke Pneumatic non-contact air bearing Raising Z-axis by 30 mm (1.2 ) standard equipment optional (can be retrofitted) optional (needs to be factory mounted) not available LPKF ProtoMat X mm (4 mil) 0.1 mm (4 mil) 0.2 mm (8 mil) 650 mm x 530 mm (25.6 x 20.9 ) 1 µm (0.04 mil) ± mm (0.04 mil) ± 0.02 mm (0.8 mil) 3-phase motor, 10,000-60,000 rpm, programmable Semi-automatic 1/8 collet 120 strokes/min 50 mm/sec (1.97 /sec) Non-contact air bearing stepper motors, precision ball screw assemblies with internal ball recirculating system pneumatic, 14 mm (0.55 ) movement 75mm (3 ) cast aluminum precision linear bushings and dual shafts 750 mm x 420 mm x 900 mm (29.5 x 16.5 x 35.4 ) 69 kg (151.8 lb) 120/240V, Hz/240VA 6 bar (87 psi), 100 l/min (3.528 cfm) recommended basic equipment

23 LPKF ProtoLaser 21 LPKF ProtoLaser LPKF ProtoLaser for Rapid PCB Prototyping Product features 60 µm (2.4 mil) track with 40 µm (1.6 mil) gaps Capable of drilling and skiving Alumina and other ceramic substrates Fine marking and engraving of components and front panels Extremely simple operation Powerful software with intuitive user interface Laser Safety Class 1 Ultra fine geometries with laser To be able to prototype HDI circuitry the LPKF ProtoLaser combines the best of both worlds. This circuit board plotter features a mechanical milling head with fully automatic tool change for milling, drilling and routing as well as a laser beam to create circuit geometries as small as 40 µm (1.6 mil) with 100 µm (4 mil) pitch. The laser is also capable of drilling and skiving ceramic substrates. This system is designed to meet the needs of engineers pushing the envelope with top-level designs without compromising the turnaround time for prototypes. Laser cutting head High-end versatility HDI circuit structuring The LPKF ProtoLaser uses a hybrid cutting head consisting of both a mechanical tool and a laser beam that can be used alternatively. The laser beam creates the critical fine structures, whereas the mechanical milling bit removes larger copper areas, drills holes or routes the board s contour. A completely integrated software tool management automatically handles all tool parameters as well as the interaction between laser and mechanical machining. If particularly high specifications are demanded an optional cleaning process can be applied subsequently. Substrate cutting Another application of the LPKF ProtoLaser is the cutting of various substrates including aluminium oxide, silicon nitride, polycrystalline silica and others. Micro coil Laser-cut ceramics

24 22 LPKF ProtoLaser High-performance CAM software The LPKF ProtoLaser uses the LPKF CircuitCAM/BoardMaster software package. LPKF CircuitCAM imports the artwork (Gerber Standard [RS-274-D], Gerber Extended [RS-274-X], DBF [Barco], Excellon NC Drill [versions 1 and 2], Sieb & Meier NC Drill, DXF, HP-GL, ODB), provides the extensive functionality of a CAM package, calculates the cutting paths for the laser and the milling tools, and transfers the production data to the ProtoLaser control software (LPKF BoardMaster). In addition to numerous control functions, this also incorporates comprehensive tool management and a comfortable WYSIWYG user interface which permanently informs about the current status of the production process. Data preparation with CircuitCAM 60/40 µm (2.4/1.6 mil) ultra fine circuit Micro coil 50 µm (2 mil) Sensor Circuit with 40 µm (1.6 mil) geometries If you have any questions, or inquiries about your special applications, please contact our LPKF application engineers at any time.

25 LPKF ProtoLaser 23 Specifications: Laser Part number Wavelength Output Frequency Beam diameter Minimum track and gap Copper thickness ,064 nm 70 W multi-mode system 0-50 khz (regulated by cutting speed) 40 µm (1.6 mil) 60 µm/40 µm (2.4 mil/1.6 mil) < 35 µm (1 oz.) Specifications: milling/drilling head Milling motor Tool change Collet Drilling capacity Positioning speed (max.) Depth adjustment Minimum track and gap Minimum hole diameter 3-phase motor, programmable 10,000-60,000 rpm Automatic, 23 positions 1/8 pneumatic-release collet 120 strokes/min 60 mm/sec (2.4 /sec) Non-contact air bearing 0.1 mm/0.1 mm (4 mil/4 mil)) 0.2 mm (8 mil) General specifications Working area Resolution Repeatibility X/Y positioning system Z drive Dimensions (W/H/D) Machine table unit Laser control unit Unit separation Weight Machine table unit Laser control unit Power supply Machine table unit Laser control unit 420 x 380 mm (16.5 x 15 ) for laser applications: 415 mm x 320 mm (16.3 x 12.6 ) 5 µm (0.2 mil) mm (0.2 mil) stepper motors, precision ball screw assemblies with internal ball recirculating system pneumatic, 14 mm / 0.55 movement 730 mm x 1,340 mm x 850 mm (28.7 x 52.8 x 33.5 ) with housing 570 mm x 1100 mm x 750 m (22.4 x 43.3 x 29.5 ) 215 mm (8.5 ) 110 kg (242 lbs) (with cover) 180 kg (396 lbs) 230 V, 50/60 Hz, 240 VA; 6 bar (87 psi) compressed air, min. 100 l/min (3.5 cfm) 3-phase, 3 x 400 V, 50 Hz, 4 kva, 10 bar (145 psi) comp. air, min. 120 l/min (4.2 cfm), cooling water 10 l /min (0.35 cfm), 2-6 bar (29-87 psi), max. 20 C (68 F) Applications HDI circuits Compatible with all common circuit substrates Engraving of components, front panels, etc. Machining and circuit structuring of ceramic substrates (max. thickness 635 µm [25 mil])

26 24 Accessories/options Accessories/options The LPKF accessories/options are practical additions to the machines and systems. A very high degree of functionality is guaranteed by the perfect match between each component. High quality materials and precise finishing ensures products with long lifetime. LPKF acoustic cabinets The acoustic cabinets reduce noise and dust emissions to ensure comfortable operations in electronic design labs or CAD offices. Storage shelves for tools and basic materials, as well as a space for the integrated dust extraction, simplify routine work. LPKF acoustic cabinets are optionally available for all circuit board plotters but are supplied standard with the LPKF ProtoMat 95s/II and the H100 for safety purposes due to the automatic tool change. The protective cover is mobile to ensure easy travel to various locations. Size cabinets Small cabinet Large cabinet 95s/II cabinet Front and rear view of the cabinet with Part number Machine W/H/D approx. (mm)* Noise reduction C series 650/1,320/700 Approx. 8 db M series 730/1,320/950 Approx. 8 db Standard 95s/II, H /1,320/850 Approx. 8 db optional accessories * Dimensions W/H/D (inch) 25.6 /52 / /52 / /52 /33.5 Measuring microscope The measuring microscope magnifies 50 times and has a metric scale for the precise setting of insulation gap widths and quality control. Part number Dust extraction Milling and drilling dust must be removed from the machining head to ensure the proper operation of the milling depth limiter. The dust extraction system guarantees reliable removal of the dust generated by machining. Technical data Part number Vacuum pressure Air flow rate Power consumption Filter surface Dim. W/H/D mm (inch) Acoustic pressure Absolute filter Filter material Surface filter cartridge Filter efficiency Max. 20,000 Pascal 40 l/sec (1.411 cfm) 800 W (230 V) 1,200 cm 2 ( ) (cotton wool) 300/360/400 (11.8/14.2/15.7) 50 db(a) HEPA filter Glass fiber 4,300 cm 2 (169.3 sq. in) Particle size µm ( mil) 100 % LPKF AutoSwitch AutoSwitch is a useful addition to the dust extraction system. When fitted, the dust extraction system is switched on and off automatically. This ensures safety, increases the lifetime of the dust extraction system and reduces noise when the machine is not running. Part number

27 Accessories/options 25 Hot air oven The hot air oven has an integrated timer and precise temperature controller, creating optimal conditions for hardening paste plated-holes and for laminating solder-resist films. Technical data Part number Feature Power External dim. W/H/D mm (inch) Internal dim. W/H/D mm (inch) Timer, temperature controller 1,800 W 580/290/350 (22.8/11.4/13.8) 440/210/290 (17.3/8.3/11.4) Compressor Some LPKF systems (e.g. ProtoMat C100/HF, H100, 95s/II, MultiPress II, Auto- Contac) require compressed air. The compressors supplied by LPKF guarantee clean, dry and reliable compressed air supplies. Technical data Part number Tank size in liters Max. pressure bar (psi) Output l/min (cfm) External dim. W/H/D mm (inch) Weight kg (lb) Acoustic noise level db(a) At a distance of 4 m (L PA4 ) For LPKF system Compressor type Small (116) 33 (1.1) 360/430/360 (14.2/16.9/14.2) 21 (46.2) 33 AutoContac, MultiPress Large (145) 165 (5.8) 1,000/770/390 (39.4/30.3/15.4) 56 (123.2) 67 C100/HF, 95s/II, X60, H100 LPKF precision ring setter The LPKF ring setter includes a tool ring press, adjusting unit, and a measuring microscope. The precise adjustment of spacing rings allows different tools to be used without readjusting the milling depth settings. Available for All LPKF ProtoMat LPKF ProtoMat 95s/II, H100 Part number Standard LPKF CircuitView The LPKF CircuitView provides a camera option for the visual positioning of the milling head. This system is particularly suitable for the reworking of circuit boards, as well as the coding, and teach-in functions. CircuitView contains a monochrome camera and a frame grabber card. This option is available for all LPKF circuit board plotters. Available for LPKF ProtoMat C & M series LPKF ProtoMat 95s/II, H100 Part number LPKF StatusLight LPKF acoustic cabinets for the LPKF circuit board plotters can also be equipped with a multi-colored indicator light. The StatusLight, which is visible from a long distance, indicates the operating status of the machine. Part number

28 26 Accessories/options Optional accessories are typically factory mounted to the circuit board plotter and are standard on some systems, however the user can retrofit some options. Integrated head illumination The high-performance LED ring surrounds the tool holding fixture and guarantees shadowfree illumination of the immediate machining area. This makes direct quality control of drilling and milling faster and easier. The head illumination is available for all LPKF ProtoMat circuit board plotters. for mechanical depth limiter: part number for non-contact air bearing depth limiter: part number (retrofitting upon request) (retrofitting upon request) Micrometer screw The micrometer screw is for the infinite adjustment of the milling depth when operating on materials without a milling depth limiter. Available for all LPKF circuit board plotters this device works off of a backstop to control milling depth. Part number Pneumatic Z-stroke The pneumatic Z-stroke makes it possible to machine thicker materials (up to a maximum of 14 mm [0.55 ]). It also gives a 15 mm (0.59 ) z-movement (standard: 5 mm [0.2 ]), and can use tools with much smaller diameters thanks to the adjustable lowering pressure. Part number is available upon request LPKF ProtoMat C20 C40 C60 C100/HF M30/s M60 L60 95s/II* H100* X60 Option Standard * without Z-extension Non-contact air bearing depth limiter The pneumatic depth limiter has an air cushion which makes it possible to machine sensitive materials without coming into direct contact. Part number is available upon request LPKF ProtoMat C20 C40 C60 C100/HF M30/s M60 L60 95s/II H100 X60 Option Standard Increased Z-axis height (to max. 30 mm [1.18 ]) Setting the Z-axis higher enables the surface machining of thicker material. The system is also suitable for reworking assembled circuit boards. The stroke remains unchanged at 5 mm (0.2 ) (15 mm [0.59 ] in the case of pneumatic stroke). This option is available for all LPKF circuit board plotters with the exception of LPKF ProtoMat 95s/II, H100 and ProtoLaser. Part number is available upon request 100,000 rpm motor This motor is capable of using very small endmills (0.15 mm [6 mil]) for RF/microwave applications and drilling very small holes. The higher speed provides longer tool life and also allows higher travel speeds. Part number is available upon request LPKF ProtoMat C20 C40 C60 C100/HF M30/s M60 L60 95s/II H100 X60 Option Standard

29 LPKF EasyContac 27 LPKF EasyContac Manual system for through-hole plating LPKF EasyContac delivers a simple and easy-to-operate system for the through-hole plating of circuit board holes. The minor effort involved and low costs are the major benefits of this manual solution. LPKF EasyContac is particularly suitable where twosided soldering is not possible, e.g. beneath components. The set contains all of the necessary tools and materials with the exception of a soldering iron. LPKF EasyContac was developed for prototype circuit boards and PCB repairs with up to 50 through-plated holes per circuit board. All the necessary parts are conveniently packed in a handy box so that it can also be used by service engineers. The key components of the LPKF EasyContac are through-hole plating rivets made of a special copper alloy. These rivets are available with external diameters of 0.8 mm (32 mil), 1.0 mm (40 mil), 1.2 mm (48 mil) and 1.4 mm (56 mil). The internal diameter is 0.2 mm (8 mil) or 0.4 mm (16 mil) smaller than the desired external diameter. They are manually placed in the hole and riveted with a stamping tool. A component lead can still be fed through the hole if necessary. The rivet is then simply soldered. Technical data Part number Max. base material size Number of through-plated holes per circuit board Number of layers Material costs/through-hole plating Max. resistance Environmental compatibility Through-plated holes/min Process reliability Base material types No limit < 50 2 Approx Euro 0.35 (US$ 0.35) 10 m Ω 2-3 Any substrate with 1.5 mm (59 mil) thickness The set contains the following: 1 automatic punch tool with stamp tip A for 0.6 (24 mil) and 0.8 mm (32 mil) (inner diameter) rivets 1 stamp tip B for 1.0 (40 mil) and 1.2 mm (48 mil) (inner diameter) rivets 1 pair of tweezers 1 anvil plate 1,000 rivets per size Available through-hole plating rivets, approx. dimensions in mm (mil) Part Internal External Collar Length Hole diameter number diameter diameter diameter (24) 0.8 (32) 1.3 (52) 2.2 (88) 0.9 (36) (32) 1.0 (40) 1.6 (64) 2.2 (88) 1.1 (44) (40) 1.4 (56) 2.2 (88) 2.5 (100) 1.5 (60) (48) 1.6 (64) 2.6 (104) 2.6 (104) 1.7 (68)

30 28 LPKF AutoContac LPKF AutoContac Conductive paste through-hole plating with the LPKF circuit board plotter Product features Conductive epoxy paste through-hole plating Easily integrated on any existing LPKF circuit board plotters Suitable for boards with up to 300 holes Option for the dispensing of various pastes (solder paste, adhesive, conductive paste and sealants) The patented LPKF AutoContac system is ideal for fast environmentally friendly in-house through-hole plating without chemicals. A special conductive paste produces plated holes suitable for component insertion and soldering in double-sided circuit boards directly using the LPKF circuit board plotter. This simple and easy-to-learn technique, along with the minor investment required, makes independent Rapid PCB Prototyping practical for even the smallest enterprise. Dispenser LPKF ProtoMat C60 with LPKF AutoContac Procedure LPKF AutoContac is suitable for circuit boards with max. 300 holes and hole diameters of mm (20-55 mil). A special conductive paste is automatically injected into the hole by a dispenser mounted to the head of the LPKF circuit board plotter. The second step involves the vacuum extraction of the excess paste. The subsequent hardening in a hot-air oven creates a permanent through-plated hole suitable for component assembly. The complete through-hole plating process is precisely and automatically controlled by the LPKF BoardMaster circuit board plotting software. The parameters for a specific drill hole diameter are stored in the tool library of the software. This tried-and-tested technique combined with the individual definition of dispenser parameters is also used for the application of solder paste, adhesives, and sealants. 1 2 Vacuum removal 3 Solder paste Dispensing needle Copper pad Circuit board Backing material Cross section Thermal curing Specifications Part number Max. base material size Varies depending on the circuit board plotter Hole diameter 0.5 mm mm (20-55 mil) Number of through-plated holes < 300 Number of layers Material costs/through-plated hole Max. resistance Environmental compatibility Through-plated holes/min 2 Approx. 2 Cents 150 m Ω 15 Through-plated hole: view from top Through-plated hole: view from bottom Through-plated hole: with soldered component lead; view from top Process reliability Process duration ~ 45 min* Base material types FR4, RO 3000, RO 4000, TMM Power supply Connected to LPKF circuit board plotter Compressed air supply 6 bar (87 psi) * Average value dependent on circuit board size

31 LPKF Contac III, MiniContac III & MiniContac III/HF 29 LPKF Contac III, MiniContac III & MiniContac III/HF In house professional quality through-hole plating Product features No development work hold-ups No chemical expertise or analysis required Only four tanks No chemical pre-coppering Reverse pulse plating 8-layer circuit board 6-layer circuit board 4-layer circuit board The LPKF through-hole plating systems were specially developed for the professional production of prototype and small batch production printed circuit boards to be used in combination with an LPKF circuit board plotter. These systems enable production quality boards to be produced independently without the need for outside suppliers. The through-plated holes comply with the highest specifications and can be made quickly in house to avoid day long hold-ups in the design process. This system is particularly suitable for complex circuit boards with any number of holes. The LPKF Contac III can be optionally equipped for tin plating. Reverse Pulse Plating To ensure that tomorrow s demands are fully satisfied, the LPKF MiniContac III and Contac III systems use reverse pulse plating technology, providing uniform copper plating that allows plating of more difficult aspect ratios and smaller holes. It avoids the boneeffect (thicker copper growth at hole entrance) that can clog up small via holes entirely before they are completely plated. This option is also very useful for small holes on high density PCBs and improves production reliability during soldering. Reverse pulse plating is achieved using control electronics that monitors the whole through-hole plating process and removes excess material by the precise setting of reverse pulses (anodic polarisation of the workpiece). LPKF Contac III LPKF MiniContac III Conventional throughhole plating method (bone effect) Reverse Pulse Plating

32 30 LPKF Contac III, MiniContac III & MiniContac III/HF LPKF through-hole plating technologies Standard technology: Carbon-based through-hole plating (black hole method) Special technology: Palladium-based through-hole plating, especially for PTFE based microwave substrates! We will be happy to provide you with a list of applicable base materials upon request! Methods for both technologies Optimal through-hole plating requires a very high standard hole quality. The through-hole plating process starts with the pre-treatment of the circuit boards in three tanks for approx. 30 minutes all together. This process involves degreasing, pre-treatment and activation. The circuit boards are then copper-coated in a galvanic bath. This takes minutes depending upon the specified thickness of the copper coating. The equipment is very environmentally friendly because it is a closed system: all of the chemicals remain in the tank during use. The only external connection required is a cold water supply for the rinsing tank. One set of chemicals lasts approximately one year. No technical expertise is required to operate or look after the tanks. LPKF Contac III in use Chemical tinning option For the Contac III, LPKF offers the additional option of a heated tank to provide chemical tin plating for optimal soldering of through-hole plated circuit boards and oxidation protection. Part number Tin-plated circuit boards Specifications LPKF Contac III LPKF MiniContac III LPKF MiniContac III/HF Part number Activator Carbon Carbon Palladium Max. base material size 360 mm x 420 mm (14.2 x 16.5 ) 220 mm x 340 mm (8.7 x 13.4 ) 210 mm x 340 mm (8.3 x 13.4 ) Max. board size * 270 mm x 330 mm (10.6 x 13.0 ) 130 mm x 250 mm (5.1 x 9.8 ) 130 mm x 250 mm (5.1 x 9.8 ) LPKF ProtoMat 95s/II: 254 mm x 305 mm ( 10.0 x 12.0 ) LPKF ProtoMat 95s/II: 110 mm x 230 mm (4.3 x 9.1 ) LPKF ProtoMat 95s/II: 110 mm x 230 mm (4.3 x 9.1 ) Hole diameter 0.2 mm (8 mil) 0.2 mm (8 mil) 0,2 mm (8 mil) Number of plated holes Unlimited Unlimited Unlimited Max. number of layers Max. resistance < 10 m Ω < 10 m Ω < 10 m Ω Environmental compatibility Good Good Good Processing reliability Very good Very good Very good Process duration 90 minutes 90 minutes 90 minutes Base material types FR4, RO 3000, RO 4000, TMM ** FR4, RO 3000, RO 4000, TMM ** Various special materials Power supply 120***/240 V, Hz, max. 2,000 VA 120/240 V, Hz, 600 VA 120/240 V, Hz, 600 VA Ambient temperature C ( F) C ( F) C ( F) Dimensions( W/H/D) 1,150 mm x 1,110 mm x 715 mm ( 45.3 x 43.7 x 28.1 ) 870 mm x 640 mm x 570 mm ( 34.2 x 25.2 x 22.4 ) 870 mm x 640 mm x 570 mm ( 34.2 x 25.2 x 22.4 ) Optional chemical tinning Yes No No * Smaller board size applicable if milled with air-foot circuit board plotter (C100/HF, 95s II, H100) ** Other materials upon request *** upon request

33 LPKF MultiPress II 31 LPKF MultiPress II LPKF MultiPress II time and cost saving in-house production of prototype multilayer circuit boards. Product features Up to eight layers Multilayer boards to 305 mm x 254 mm (12 x 10 ) Microprocessor controlled Small footprint The MultiPress II stores various time, temperature and pressure profiles for processing different materials. Combined with an LPKF circuit board plotter and an electroplating system, this equipment is all that is required for complete in-house multilayer prototyping. 8-layer circuit board Specifications Part number Max. press area (gross) Max. circuit board size (recommended) Max. pressure Max. temperature Compressed air supply Compressed air volume per minute Max. number of layers Pressing time Dimensions (W/H/D) Weight Power supply Microprocessor controlled Base materials Options Mobile stand mm x 360 mm (16.5 x 14.1 ) 305 mm x 254 mm (12 x 10 ) 150 kn (15 t) 210 C (410 F) Max. 10 bar, min. 6 bar (max. 145 psi, min. 87 psi) Approx. 30 l/min (1 cfm) 8 After pre-heating, approx. 90 min. plus hardening time prior to drilling * 530 mm x 600 mm x 480 mm (20.9 x 23.6 x 18.9 ) ** Approx. 210 kg (463 lb) 240 V/50-60 Hz, 2000 VA 4 pressure/temperature/time profiles FR4, others upon request Part no * depending upon Prepreg and selected through-hole plating process ** desk-top model

34 32 Technology Technology Different LPKF technologies for the production of multilayers Applications 4, 6 and 8-layer multilayer boards with a maximum net size of 305 mm x 254 mm (12 x 10 ) Laminating prototype solder mask (LPKF EasySolder) 1. Sequential build-up method for multilayer production Example: 4-layer multilayer 1. Insulation engraving of both inner layers (layer 2 & 3) of the circuit board with the LPKF circuit board plotter. 2. Bonding of outer layers (layer 1 & 4) with LPKF multilayer press. 3. Drilling multilayer through-holes with the LPKF circuit board plotter. 4. Electroplating of the through-holes with LPKF MiniContac III or Contact III (connecting the inner layers) Insulation engraving of the outer layers (layer 1 & 4) of the circuit board 6. Surface finish: mechanical cleaning, tin plating, flux or conformal coating, prototype solder mask (LPKF EasySolder)

35 Technologie Registration pin method for multilayer production Example: 8-layer multilayer 1. Creating layer 2 layer 3 Layer 3 Drilling the registration pin holes Insulation milling Layer 2 Insulation milling 2. Creating layer 4 layer 5 Layer 5 Drilling the registration pin holes for the MultiPress II setting pins Insulation milling Layer 4 Insulation milling 5. Drilling and through-hole plating Drilling of the plated through-holes Electroplating with LPKF MiniContac III or Contac III Drilling of the non-plated holes 6. Creating layer 1 layer 8 Insulation milling 7. Contour Routing the internal/external contours 8. Surface finish Mechanical cleaning, tin plating, flux or conformal coating, prototype solder mask (LPKF EasySolder) 3. Creating layer 6 layer 7 Layer 7 Drilling the registration pin holes for the MultiPress II setting pins Insulation milling Layer 6 Insulation milling 4. Bonding material According to the layer construction (see figure above), the layers are pinned in the pressing package and bonded in the MultiPress II. Registration pin locations

36 34 LPKF EasySolder LPKF EasySolder Instant solder mask for prototype circuit boards Fast, precise, flexible: mechanically made prototype solder masks can be produced extremely quickly using LPKF EasySolder. The solder mask is made out of high-quality, temperature-resistant and dimensionally stable polyimide film. A solder mask increases soldering reliability and protects the circuit board from environmental influences. This process requires no screen printing and no photographic technology or chemical-etching. System accessories for applying the solder mask Part number Process description LPKF CircuitCAM software uses the soldermask CAD data to create the cutting paths for the circuit board plotter to mechanically produce the solder mask. Structuring is done by cutting the pads out of the polyamide material using the LPKF circuit board plotter. The solder-resist mask is then bonded to the circuit board using a pressing tool. The subsequent lamination process takes place in a hot-air oven at a temperature of 180 C (356 F) and takes about 60 minutes. The bonding pressure is individually adjusted to the size of the circuit board to ensure optimal results. LPKF EasySolder masks are suitable for all standard soldering processes such as wave and reflow soldering, as well as manual soldering. It is temperature resistant to 288 C (550 F), compliant with IPC standards. LPKF EasySolder is supplied complete with accessories and consumables. A hot air oven for laminating the solder mask on the circuit board is also available from LPKF as an optional accessory. Hot air oven Part number Solder mask lamination with LPKF MultiPress II The LPKF MultiPress II can also be used to laminate prototype solder masks. The advantages are a shorter process time and the ability to handle larger circuit boards. The complete laminating process is fully automatic and press parameters are conveniently pre-programmed. LPKF MultiPress II Part number Specifications Max. circuit board size Pressure setup Laminating time LPKF EasySolder 180 mm x 120 mm (7 x 5 ) net Manual w/ torque wrench 60 minutes plus pre-heating LPKF EasySolder withlpkf MultiPress II 300 mm x 250 mm (12 x 10 ) net Automatic, programmable 60 minutes, automatic pre-heating Cool off period Approx min A few minutes Accessory set Part number Solder mask film Tools and accessories Pressure compensation mat Press sheet (stainless steel) Cut backing material Press cushion LPKF EasySolder LPKF EasySolder for LPKF MultiPress II s. consumables s. consumables 210 mm x 297 mm (8.3 x 11.7 ), temp. resistant to 255 C (491 F) for 5 min. (IPC compliant), adhesive: modified epoxy resin, 10 per pack (custom sizes available). LPKF micro plotter (1/8 shaft) Metal scalpel, glue stick and adhesive tape Rubber, reusable up to 50 times 210 mm x 160 mm (8.3 x 6.3 ) 210 mm x 297 mm (8.3 x 11.7 ) 210 mm x 160 mm (8.3 x 6.3 ) 210 mm x 297 mm (8.3 x 11.7 ) 210 mm x 160 mm (8.3 x 6.3 ) 210 mm x 297 mm (8.3 x 11.7 )

37 Tools 35 Tools Quality and precision LPKF tools LPKF s development to satisfy the extreme precision and performance requirements of current state of the art circuit boards has produced a large range of high performance precision cutting tools. These tools are custom designed for LPKF and made of 100 % top quality carbide resulting in significantly longer tool life, precise cuts, and diminished drill flux. The proprietary designs are accomplished with extensive testing and design reconfiguration until the highest quality results are met. LPKF s leading commitment is an ongoing research and development process to continually suit the user demands and approaching technologies. For ease of use and to minimize the set-up time, LPKF tools come in two different lengths: 36 mm (1.42 ) for tools working on the surface (milling bits and endmills) and 38 mm (1.5 ) for tools that work through the material (drill and router bits). 38 mm (1.50 ) 36 mm (1.42 ) Microcutter (1) A Surface machining tools (l = 36 mm/1.42 ) A.1 Conical tools A.2 Cylindrical tools Universal cutter (2) RF Endmill (3) Tools (1/8 -Shaft) Endmill (4) B Penetrating tools (l = 38 mm/1.5 ) Drills (5) Contout router (6) Endmill (long) (7)

38 36 Tools A - Engraving tools (36 mm [1.42 ] length) A.1 Conical Tools 1 Micro cutter For copper thickness up to 18 µm (1/2 oz.) Minimum insulation space: 100 µm (4 mil) (min. 60,000 rpm required) 100 µm (4 mil) Copper layer Base material 2 Universal cutter For milling insulation on any type of base material Minimum insulation space: 200 µm (8 mil) 200 µm (8 mil) A.2 Cylindrical tools 3 Endmill (RF) For RF circuit outlines: 150 µm (6 mil), 250 µm (10 mil) or 400 µm (15.7 mil) diameter (min. 60,000 rpm required) Minimal substrate removal Straight side walls 150 µm (6 mil) 4 Endmill For rub-outs and wide insulations Engraving of aluminum front panels 0.8 mm (31 mil), 1 mm (39 mil), 2 mm (79 mil), 3 mm (118 mil) diameter mm ( mil) Ø insulations mm ( mil) Ø engraving Aluminum

39 Tools 37 B - Drilling /routing tools (38 mm [1.5 ] length) 5 Spiral drill To drill circuit boards and other materials 0.15 mm (6 mil) to 3 mm (118 mil) Diameters bigger than 2.4 mm (96 mil) are automatically routed 2.95 mm (116 mil) and 3 mm (118 mil) to drill registration pin holes max. 2.4 mm (95 mil) Ø min mm (6 mil) Ø 6 Contour router Routes inner and outer board contours Routes large holes without size limitation 1 mm (39 mil), 2 mm (79 mil), 3 mm (118 mil) diameter 1-3 mm ( mil) Routing 7 Endmill (long) For cutting out aluminum front panels and to mill clean contours in soft RF substrates Also to mill pockets in brass and aluminum backed substrates and to mill enclosures 1 mm - 2 mm (39 mil - 79 mil) diameter 1-2 mm (39-79 mil) Ø 1-2 mm (39-79 mil) Ø Aluminum dielectric material

40 38 Consumables Consumables Start sets for LPKF circuit board plotters For all LPKF circuit board plotters, LPKF has comprehensive start and accessory sets available with high-quality tools and consumables to ensure the highest levels of quality and precision. All of these components can also be ordered separately. Product/accessory set Accessory set for LPKF ProtoMat C20, C40 C60 M30/S, M40 M60, 95s/II, X60, H100 C100/HF Part number Drill underlay material panel A Drill underlay material panel A FR4, A4 1, 1-sided, 35 µm (1 oz.) FR4, A4 1, 2-sided, 35 µm (1 oz.) FR4, A4 1, 2-sided, 18 µm (1/2 oz.) FR4, A3 2, 1-sided, 35 µm (1 oz.) 5 5 FR4, A3 2, 2-sided, 35 µm (1 oz.) 5 5 Tool set 1/8 shaft Micro cutter 1/8, l = 36 mm, mm (4-6 mil) Endmill (RF) 1/8, l = 36 mm, d = 0.25 mm (10 mil) Adhesive tape Circuit board cleaning pad RF and microwave tool set 1 Rogers data sheet set mm x 297 mm (8 x 12 ) mm x 420 mm (12 x 16 ) Tool set 1/8 shaft 5 Spiral drills 1/8, l = 38 mm (1.5 ), d = 0.6 mm (24 mil) 5 Spiral drills 1/8, l = 38 mm (1.5 ), d = 0.7 mm (28 mil) 5 Spiral drills 1/8, l = 38 mm (1.5 ), d = 0.8 mm (31.5 mil) 5 Spiral drills 1/8, l = 38 mm (1.5 ), d = 0.9 mm (35.4 mil) 5 Spiral drills 1/8, l = 38 mm (1.5 ), d = 1.0 mm (39 mil) 2 Spiral drills 1/8, l = 38 mm (1.5 ), d = 1.1 mm (43.3 mil) 2 Spiral drills 1/8, l = 38 mm (1.5 ), d = 1.3 mm (51.2 mil) 2 Spiral drills 1/8, l = 38 mm (1.5 ), d = 1.5 mm (59 mil) 2 Spiral drills 1/8, l = 38 mm (1.5 ), d = 3.0 mm (118 mil) 1 Contour Router 1/8, l = 38 mm (1.5 ), d = 1.0 mm (39 mil) 1 Contour Router 1/8, l = 38 mm (1.5 ), d = 2.0 mm (79 mil) 2 Endmill 1/8, l = 36 mm (1.42 ), d = 1.0 mm (39 mil) 1 Endmill 1/8, l = 36 mm (1.42 ), d = 2.0 mm (79 mil) 2 Endmills (RF) 1/8, l = 36 mm (1.42 ), d = 0.4 mm (15.7 mil) 10 Universal cutters 1/8, l = 36 mm (1.42 ), mm (8-20 mil) Part number RF and microwave tool set 1 RO4003, 0.8 mm (32 mil) thick, 230 x 305 mm (9 x 12 ) 5 Endmills (RF) 1/8, l = 36 mm (1.42 ), d = 0.25 mm (10 mil) 3 Endmills (RF) 1/8, l = 36 mm (1.42 ), d = 0.4 mm (15.7 mil) 5 Endmills 1/8, l = 36 mm (1.42 ), d = 1.0 mm (39 mil) 2 Endmills 1/8, l = 36 mm (1.42 ), d = 2.0 mm (79 mil) 2 Endmills 1/8, l = 38 mm (1.42 ), d = 2.0 mm (79 mil) 3 Endmills (RF) 1/8, l = 36 mm (1.42 ), d = 0.15 mm (6 mil) Part number Explanation Every LPKF circuit board plotter has a registration set pin hole system to ensure the precise positioning of double-sided base materials in particular. This location hole system consists of set pin holes (1) positioned exactly on the center axis of the machine in permanent set pin hole strips (3). A special adhesive tape (2) leaves no residue and is used to mount the base material. It also ensures that warped objects are held down flat on the machines tabletop. The PCB cleaning pad removes minor burrs and residues from the mechanical milling process and gives the base material surface a great finish

41 Consumables 39 Base materials Circuit board specifications are becoming ever more complex: higher packaging densities, finer structures, tighter spaces and smaller holes all require first-class base materials. This is the only way of guaranteeing high-quality results to match the increasing demands for RF and microwave technology and multilayer production. Usual base material types for prototyping* Name FR2 FR3 FR4/FR5 (G10) Flex PTFE Resin Phenol resin Epoxy resin Epoxy resin Polyimide resin RT/duroid etc. Reinforcement Paper Paper Glass fiber None Polytetrafluorethylene (PTFE) Dielectric constant ε R LPKF standard article * Other materials upon request, e.g. RO4000 (Non PTFE) Copper layer Resin Reinforcement (glass fiber) Copper layer Base material Nominal thickness of the base material For single or double-sided circuit boards Nominal thickness = copper layer insulation layer Example: The nominal thickness is calculated as follows: mm 2 x mm = 1.5 mm mil 2 x 0.71 mil = 59 mil For internal layers of multilayers Nominal thickness = insulation layer Example: The nominal thickness is calculated as follows: 1.5 mm - 2 x mm = mm 59 mil - 2 x 0.71 mil = mil Nominal thickness Copper layer Fiberglass reinforced epoxy resin (insulation layer) Copper layer Nominal thickness Copper layer Fiberglass reinforced epoxy resin (Insulation layer) Copper layer

42 40 Consumables LPKF multilayer start set The selection of the proper material is particularly crucial for the production of multilayer circuit boards. The carefully selected components in LPKF material sets include all the necessary materials of tried-and-tested quality to ensure the best results and smooth production of multilayer prototypes. The following material sets are available depending on the number of layers to be produced: LPKF 4-layer multilayer set Floating method for ten panels with 254 mm x 304 mm (10 x 12 ) net size Part number Contents: 20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5 x 14.2 ) 40 x Prepeg, size 380 mm x 320 mm (15 x 12.6 ) 20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5 x 14.2 ) 10 x double sided FR4 laminate, 35 µm (1 oz.) Cu clad, thickness 1 mm (39 mil), size 420 mm x 360 mm (16.5 x 14.2 ) 4 x drill underlay material, size 420 mm x 360 mm (16.5 x 14.2 ) 4-layer multilayer LPKF 6-layer multilayer set Floating method for ten panels for 254 mm x 304 mm (10 x 12 ) net size Part number Contents: 20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5 x 14.2 ) 20 x laminate multi-layer 18 µm (1/2 oz.) copper base, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.2 x 14.5 ) 80 x Prepreg, size 380 mm x 320 mm (15 x 12.6 ) 40 x pressing cardboard cushion, size 420 mm x 360 mm (16.5 x 14.2 ) 10 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.46 mm (18.1 mil), size 420 mm x 360 mm (16.5 x 14.2 ) 4 x drill underlay material, size 420 mm x 360 mm (16.5 x 14.2 ) 6-layer multilayer LPKF 8-layer multilayer set Method with pinned layers* for ten panels with 254 mm x 304 mm (10 x 12 ) net size Part number Contents: 30 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5 x 14.2 ) 20 x laminate multi-layer 5 µm (1/8 oz.) copper base, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.2 x 14.5 ) 60 x Prepreg, size 380 mm x 320 mm (15 x 12.6 ) 20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5 x 14.2 ) 6 x drill underlay material, size 420 mm x 360 mm (16.5 x 14.2 ) 8-layer multilayer * This requires the accessories for MultiPress II to produce multilayers with pinned layers: 1 x pressing frame with positioning pins 2 x pressing sheet for 400 mm x 360 mm (15.7 x 14 ) Part number

43 Consumables 41 Chemicals LPKF has put together different chemical sets for use with LPKF Contac III and MiniContac III through-hole plating systems as well as for circuit board surface finish. The set contains high-quality perfectly matched components specially selected for each system to ensure the production of first class through-hole plated contacts. LPKF Contac III chemical set For through-hole plating, complete set with approx. one year s supply Part number Contents: 4 x 13 liters (3.435 gal.) Cleaner x 10 liters (2.642 gal.) Cleaner x 10 liters (2.642 gal.) Activator x 10 liters (2.642 gal.) Copper Plater x 0.5 liters (0.132 gal.) Shine 400 Chemical set LPKF MiniContac III For through-hole plating, complete set with approx. one year s supply Part number Contents: 4 x 6 liters (1.585 gal.) Cleaner x 5 liters (1.321 gal.) Cleaner x 5 liters (1.321 gal.) Activator x 5 liters (1.321 gal.) Copper Plater 400 and 2 x 1 liters ( gal.) Copper Plater x 0.25 liters (0.066 gal.) Shine 400 Chemical set for LPKF MiniContac III/HF For through-hole plating, complete set with approx. one year s supply Part number Contents: 4 x 6 liters (1.585 gal.) Cleaner x 5 liters (1.321 gal.) Cleaner x Activator 310 4,740 ml ( gal.) Catalyst A 265 ml ( gal.) Catalyst B 100 ml ( gal.) Replenisher 2 x 5 liters (1.321 gal.) Copper Plater 400 and 2 x 1 liters ( gal.) Copper Plater x 0.25 liters (0.066 gal.) Shine 400 Tin plating for Contac III Tin-plates prototype circuit boards. Protects against oxidation and provides excellent solderability. Part number Filled in Contac III tin plating tank 13 liters (3.5 gal.) Good for over 500 boards 100 x 160 mm (4 x 6 ) Shipped in powder form 1,170 gr. (39 oz.), distilled water required for setup Tin plated circuit board

44 42 Consumables Accessories for LPKF AutoContac and LPKF EasySolder Accessories for LPKF AutoContac For rapid and environmentally-friendly in-house through-hole plating without chemicals, LPKF AutoContac is the ideal solution. The special conductive paste is applied by the LPKF circuit board plotter to ensure optimal through-hole plating. LPKF AutoContac paste set Two pre-filled cartridges with 25 gr. (0.83 oz.) paste, and one empty cartridge. Part number Polypropylene refill fitting (luer) To connect two cartridges with one another for mixing. Part number Accessories for LPKF EasySolder The following accessory sets are specially prepared for the LPKF EasySolder method. These sets ensure the production of high-quality solder masks to simplify the assembly of SMT components. Each set contains the right amount of material to produce at least ten solder masks. LPKF EasySolder accessory set for LPKF MiniPress (manual system) Part number Contents: 10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87 x ) 10 x pressing cardboard cushion 210 mm x 297 mm (8.27 x 11.7 ) 4 x drill underlay material 210 mm x 297 mm (8.27 x 11.7 ) 2 x pressing sheets (stainless steel) 210 mm x 160 mm (8.27 x 6.3 ) 2 x press compensation mat 210 mm x 297 mm (8.27 x 11.7 ) 3 x micro cutter 1 x scalpel 1 x glue stick and adhesive tape Accessory set for LPKF EasySolder for LPKF MultiPress II Part number Contents: 10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87 x ) 10 x pressing cardboard cushion 210 mm x 297 mm (8.27 x 11.7 ) 4 x drill underlay material 210 mm x 297 mm (8.27 x 11.7 ) 2 x pressing sheet (stainless steel) 210 mm x 297 mm (8.27 x 11.7 ) 2 x press compensation mat 210 mm x 297 mm (8.27 x 11.7 ) 3 x micro cutter 1 x scalpel 1 x glue stick and adhesive tape

45 LPKF ZelPrint 43 LPKF ZelPrint LPKF provides two professional stencil printers for prototypes and small batches. Both LPKF ZelPrint models have extremely high levels of precision and efficiency: Manual or semi-automatic: the sophisticated technology guarantees easy operation and perfect printing results. LPKF ZelPrint LT300 Manual tabletop stencil printer Product description LPKF ZelPrint LT300 is a precision manual stencil printer. This tabletop model can be utilized for both prototypes and small batches of fine pitch SMT boards. Precise vertical separation between stencil and circuit board is guaranteed to meet the specifications of contact printing. This unique solution allows printing of 0.3 mm (12 mil) pitch (ultra-fine-pitch area). High positioning accuracy, simple operation and the ability to use milled polymer stencils (limited to 0.65 mm [26 mil] pitch) reduces costs and increases efficiency in the production of circuit board prototypes. This printer is shipped with a ZelFlex quick-release stretching frame for stencils but is also compatible with various other frames. The precise threedimensional adjustment of the stencil with micrometer screws (X, Y, theta and clearance) is vital for superior printing results. The ZelPrint LT300 has freely adjustable, high clearance PCB nesting pins that allow printing of boards that are already populated on the other side. Product features Manual stencil printer Parallel stencil separation Quick-release stencil frame included (ZelFlex ZR) Precision stencil adjustment with micrometer screws Compatible with various stencil frames Test print screen included Printing of two side populated boards LPKF ZelPrint with test screen, rubber squeegee and metal stencil, clamped into a ZelFlex ZR quick-release frame (can also be used for polymer stencils). LPKF ZelPrint PTC 350 Semi-automatic tabletop stencil printer Product description This semi-automatic fine-pitch SMD stencil printer is designed for prototype circuit board production as well as for the production of small to medium quantity batches. The powered squeegee is speed and pressure controlled and guarantees highly reproducible printing results. The fast and simple circuit board clamping, and the automatically switched vacuum table, allows up to 100 printing cycles per hour. Straightforward settings and simple operation of four operating modes including single and dual pass printing and print-flood/flood-print cycles. The printing process can be started automatically just by closing the printer, or be initiated manually at the push of a button. The stencil/pcb alignment is precisely done in X/Y/Z and theta and a test print screen overlay allows quick setup. Stencil frames are held in place with pneumatic latches and can be exchanged quickly through slide rails. Smaller frames are held in frame adapters. The PTC 350 s rigid construction ensures the highest level of precision and efficiency. Product features Semi-automatic stencil printer Printing of rigid and flex boards Vacuum table Precision stencil adjust with micrometer screws 4 printing modes Compatible with various stencil frames, including quick release Test print screen included LPKF ZelPrint PTC 350

46 44 LPKF ZelPrint Specifications LPKF ZelPrint LT300 LPKF ZelPrint PTC350 Part number Frame dimensions Maximum printing area Squeegee action Print table adjustment Max. height of printing items Squeegee speed Squeegee pressure Squeegee type Accuracy (machine) Accuracy (printing) Double side printing Dimensions (W/H/D) Height with optional stand Weight Power Compressed air Vacuum requirements Vacuum connection Ambient conditions width up to 430 mm (16.92 ); length adjustable from 420 mm mm (16.54 x ), height adjustable from mm ( 0.78 x 1.57 ) 300 x 300 mm (11.8 x 11.8 ) manual X and Y ±10 mm (0.4 /400 mil); υ ± 5 5 mm (0.2 ), optionally more - - rubber ± mm (± 0.98 mil) ± 0.04 mm (1.57 mil) max. height of components 15 mm (0.59 ) 740 mm x 180 mm x 530 mm (29.1 x 7.1 x 20.9 ) - 30 kg (66 lb) Temperature: 5-35 C (41-95 F) Humidity: 30-95% x 584mm (18 x 23 ), height adjustable from mm ( ) 350 x 350 mm (13.8 x 13.8 ) power sweep X and Y ±10 mm (0.4 /400 mil); υ ± 5 20 mm (0.8 ) 10 to 120 mm/s ( /s) adjustable 0-6 bar (0-87 psi) downstop dual squeegee, rubber or metal* ± mm (± 0.98 mil) 0.04 mm (1.57 mil) max. height of components 10 mm (0.39 ) 600 mm x 380 mm x 800 mm ( 23.6 x 14.9 x 31.5 ) 1200 mm (47.4 ) 80 kg (176 lb), with base 122 kg (268.4 lb) 220V-240V/50 Hz or 100V-120V/60 Hz, 300 VA 6 bar, 10 l/min (87 psi, cfm) approx. 40 m 3 /h 40mm (1.6 ) hose Temperature: C (68-86 F) Humidity: 30-95% *Option Accessories Floor-standing base for semiautomatic stencil printer PTC350 Vacuum pump, built-in floor-standing base Vacuum pump (external) Compressor Dual rubber squeegee 250 mm (9.85 ) Dual metal squeegee 350 mm (13.77 ) Manual quick release frame ZR 457 x 580 mm (18 x 23 ); Inner area 407 x 470 mm (16 x 18.5 ) Pneumatic quick release frame Z4P 457x584 Adapter for smaller frames Test screen overlay Squeegee height setting with two measuring gauges Rubber blade for squeegee Metal blade for squeegee ZelFlex ZR 362 x 480 mm (14.25 x ) ZelFlex ZR 406 x 508 mm (16 x 20 ) Rubber squeegee 260 mm (10.23 ) Rubber squeegee 150 mm (5.9 ) Rubber/metal squeegee custom width standard optional not available LPKF ZelPrint LT300 PTC350 recommended basic equipment

47 LPKF ZelFlex 45 LPKF ZelFlex LPKF ZelFlex quick-release stencil frames Available for virtually every stencil printer LPKF offers two different quick-release stencil frame systems, one with mechanical and the other with pneumatic stretching mechanism. For ease of use the ZelFlex Z4P maintains tension without air being constantly connected to it. Both versions allow the stencil to be directly mounted in the frame using a perforation system. The simple perforation pattern is royalty free and shipped as a Gerber file with every frame. Product features Available for virtually any stencil printer Fast and simple changeover of stencils Reduces storage space for archiving stencils Uniform tension over the whole surface ZelFlex Z4P maintains tension without air being connected Environmentally friendly: no adhesives, lacquers and cleaning solvents required 1. LPKF ZelFlex ZR Mechanically stretched two-sided quick-release stencil frame for both metal and polymer stencils 2. LPKF ZelFlex Z4P Professional quick-release stencil frame with pneumatic 4-side action: Ideal for high volume environment. Frame maintains tension after air is disconnected. LPKF ZelFlex Z4P LPKF ZelFlex ZR frame with metal and polymer stencil LPKF ZelFlex Z4P with compressed air hose

48 46 LPKF ZelFlex Product description LPKF ZelFlex ZR LPKF ZelFlex mechanical quick-release frames are manufactured from rigid, high-quality aluminum profiles and enable the direct mounting of stencils in the frames. Equal tension of the stencil is achieved with patented tensioning regulators, that protect the stencil from damage through over-tensioning. Smaller stencils can also be fitted in these frames without any problems. The tension of the stencil can be adjusted or changed even if the frame is already installed in the printer. LPKF ZelFlex ZR Specifications Part number Outer dimensions (W/D)* Max. inner dimensions (W/D) ** Max. printing area (W/D)*** Max. squeegee width Weight ZelPrint type LPKF ZelFlex ZR 362 x 480 LPKF ZelFlex ZR 406 x mm x 480 mm 406 mm x 508 mm (14.2 x 18.9 ) (16 x 20 ) 312 mm x 370 mm 356 mm x 398 mm (12.28 x ) (14.01 x ) 250 mm x 320 mm 300 mm x 350 mm (9.87 x ) (11.81 x ) 260 mm (10.23 ) 300 mm (11.81 ) 2.8 kg (6.16 lb) 3.1 kg (6.82 lb) LPKF ZelPrint LT300 LPKF ZelPrint LT300 LPKF ZelFlex ZR 457 x mm x 584 mm (18 x 23 ) 407 mm x 474 mm (16.02 x ) 350 mm x 420 mm (13.77 x ) 350 mm (13.77 ) 3.5 kg (7.70 lb) LPKF ZelPrint PTC350 * External dimensions without tension screws ** Rear clamping bar can be moved to reduce stencil length *** Depending on the position of rear bar and stencil size Product description LPKF ZelFlex Z4P 4-sided quick-release stencil frame is a flexible, cost and space saving alternative for professional stencil print operations. The patented stencil perforation pattern guarantees simple, fast and repeatable stencil changeover. The stretching mechanism uses compressed air to create a uniform tension over the whole working area. Once charged, the frame maintains the tension and can be used for more than 24 hours without being re-connected to an air supply. This feature allows simplified operation and easy integration into the printer. LPKF ZelFlex Z4P Specifications Part number External dimensions (W/H/D) Max. inner dimensions (W/D) Max. printing area (W/D) Max. squeegee width Compressed air supply Air refill Height of frame Weight Ambient conditions mm x 33 mm x 584 mm (18 x 1.30 x 22 ) 357 mm x 484 mm (14 x ) 337 mm x 464 mm (13.26 x ) 340 mm (13.38 ) Dependant on the stencil thickness Max. 6 bar (87 psi) (6 x 10 Pa) for stencils > 150 µm (6 mil) Max. 4 bar (58 psi) (6 x 10 Pa) for stencils µm (4-6 mil) Every 48 hours min. 33 mm (1.29 ) without adapters 5 to 10 kg (11-22 lb) Temperature: 5-35 C (41-95 F) Humidity: %! IMPORTANT NOTE All LPKF ZelFlex frames are produced in many different dimensions and with different adapters to fit most available screen printers. A Gerber file of the royalty-free perforation pattern is supplied with every frame.

49 LPKF ZelPlace & BGA Placer 47 LPKF ZelPlace & BGA Placer LPKF ZelPlace 110, 220, 330, 340 Manual Pick and Place systems for prototype circuit boards and small batches General product description LPKF ZelPlace is a manual Pick & Place system for professional SMD assembly of prototype PCBs and small production batches. The basic unit of all LPKF ZelPlace machines is a multi-function dispenser for applying various media, and a vacuum pick-up nozzle to place the components. All LPKF ZelPlace models are based on the same platform. Upgrading to a more sophisticated system is possible at any time. Each ZelPlace system comes with a multifunctional dispenser unit that features both manual and automatic dispensing mode. Product features Fine-pitch assembly Vacuum pick-up nozzle and precision manipulator Modular system design Dispenser Various feeders Upgradable at any time LPKF ZelPlace 110 The LPKF ZelPlace 110 system is the ideal solution for the assembly of SMD components (surface mounted devices) with a pitch between 1 mm (39 mil) and 1.27 mm (50 mil), such as SOIC, SOT, PLCC and passive components 1206 and The components are picked with a vacuum pick-up nozzle and placed on the PCB with the help of a guided hand support. Feeders and turntables can be mounted to LPKF ZelPlace 110 on three sides. The multi-function LPKF ZelDisp dispenser for solder paste or adhesives is part of the Pick & Place system. LPKF ZelPlace 110 with component turntable LPKF ZelPlace 220 LPKF ZelPlace 220 has a guided manipulator head and integrated illumination. This allows precise and vibration-free placement of a component in the desired position. When placing the component the vacuum is controlled by the LPKF ZelDisp multifunction dispenser unit and turned on and off automatically. In addition to classic areas of application, this system is capable of dispensing adhesives and solder paste. Turntables (for bulk components) and feeders can be conveniently placed on all three sides. LPKF ZelPlace 220 enables the assembly of digital SMDs with a large number and high density of leads. Components such as SSOP with 0.65 mm (26 mil) pitch, TSOP with 0.5 mm (20 mil) pitch, QFP with 0.65 mm (26 mil) pitch and 160 leads, or 0402 passive components, can be precisely placed with this system. LPKF ZelPlace 220 with component turntable, tape and stick feeder

50 48 LPKF ZelPlace & BGA Placer LPKF ZelPlace 330/340 LPKF ZelPlace 330 and 340 are the most advanced LPKF ZelPlace systems. Both systems allow the placing of fine-pitch components such as QFP with 0.5 mm ( 20 mil) and 0.4 mm (16 mil) pitch with up to 300 pins, as well as 0402 components. The edge centring of BGA components up to 1.27 mm (50 mil) pitch is also no problem for LPKF ZelPlace 330/340. The X-Y-guided manipulator can be locked in x and y direction with fine adjustment using micrometer screws. This allows high levels of placement accuracy for SMD components. The vacuum of the pick-up nozzle is automatically turned on and off when placing the component. A swiveling micro camera can be mounted directly on the manipulator to ease placement of large components. Other options include a stereo microscope with or without a CCD camera, and a monitor, so ZelPlace 330 or 340 can also be used as an inspection unit. A turntable for bulk components and a range of different feeders can be placed ergonomically on all three sides (ZelPlace 330). LPKF ZelPlace 340 contains an additional reworking station for selective soldering of SMD components. In this case, the feeders can be placed on the left side with the turntable sitting in the back. Instead of a feeder rail a second turntable can be placed on the left side of the system. LPKF ZelPlace 330 with component turntable, feeder carrier and feeder LPKF ZelPlace 330/340 with optional stereo microscope and CCD camera

51 LPKF ZelPlace & BGA Placer 49 LPKF ZelPlace BGA Semi-automatic placement of new generation components to assemble highly integrated circuit boards. LPKF ZelPlace BGA with monitor BGA component Product description The placing of components with pins hidden from the top and sides requires reliable and precise alignment to avoid expensive and difficult rework. LPKF ZelPlace BGA Placer is designed for the accurate placing of different types of BGA, CSP and flip chip components, as well as fine-pitch and ultra-fine-pitch components. The system is suitable for R&D labs as well as production facilities focusing on custom designs and small batches. Special optics and adjustable two-colour illumination help to simultaneously view and align the PCB leads and the component pins. Coarse and fine adjustment is achieved using an air-bearing table with micrometer screw adjustment. As soon as the component is aligned, it is automatically placed at a single push of a button. Product features Semi-automatic placement of BGA and QFQ components from 5mmx5 mm (0.2 x 0.2 ) up to 45 mm x 45 mm (1.77 x 1.77 ) Granite base plate Air-bearing positioning table Optical placement verification Specifications LPKF ZelPlace BGA Max. PCB size Max. size of components Min. size of components Pitch Placement accuracy Power supply Compressed air Dimensions (W/H/D) Weight 220 mm x 300 mm (8.6 x 11.8 ) 45 mm x 45 mm (1.8 x 1.8 ) 5 mm x 5 mm (0.2 x 0.2 ) 0.3 mm (12 mil) ± 50 µm (± 2 mil) 230 V/50 Hz oder 115 V/60 Hz, 20 VA 6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free 600 mm x 430 mm x 435 mm (23.6 x 17 x 17.1 ) 35 kg (77 lb) Placing components with CCD camera and monitor

52 50 LPKF ZelPlace & BGA Placer Specifications Entry level Professional system High-end system High-end / repair system LPKF ZelPlace LPKF ZelPlace 110 LPKF ZelPlace 220 LPKF ZelPlace 330 LPKF ZelPlace 340 Part number Max. PCB size 370 x 290 mm 370 mm x 340 mm 370 mm x 340 mm 370 mm x 340 mm (14.56 x ) (14.56 x ) (14.56 x ) (14.56 x ) Max. placement area 220 x 300 mm 370 mm x 300 mm 370 mm x 300 mm 370 mm x 300 mm (8.66 x ) (14.56 x ) (14.56 x ) (14.56 x ) Operating air pressure bar ( psi) bar ( psi) bar ( psi) bar ( psi) Vacuum bar ( psi) bar ( psi) bar ( psi) bar ( psi) Pulse/Pause ratio 0.1-2s / 0.1-5s 0.1-2s / 0.1-5s 0.1-2s / 0.1-5s 0.1-2s / 0.1-5s Number of dispensing points up to 300 /min up to 300/min up to 300/min up to 300/min Dispensing quantity minimum 0.2 mm 3 minimum 0.2 mm 3 minimum 0.2 mm 3 minimum 0.2 mm 3 Turntable location left/right/back left/right/back left/right/back left/back Feeder location left/right left/right left/right left Power supply 120V or 230V, 50/60Hz. 7VA 120V or 230V, 50/60Hz. 7VA 120V or 230V, 50/60Hz. 7VA 230V, 50/60Hz, 780VA Air supply 6 bar (87 psi), 10 l/min (0.35 cfm)* 6 bar (87 psi), 10 l/min (0.35 cfm)* 6 bar (87 psi), 10 l/min (0.35 cfm)* 6 bar (87 psi), 10 l/min (0.53 cfm)* Max. device dimensions 1,000 mm x 500 mm x 900 mm 1,000 mm x 500 mm x 900 mm 1,000 mm x 500 mm x 900 mm 1,000 mm x 500 mm x 900 mm (W/H/D) (40 x 20 x 35 ) (40 x 20 x 35 ) (40 x 20 x 35 ) (40 x 20 x 35 ) Weight kg (33-88 lb) kg (33-88 lb) kg (33-88 lb) kg (33-88 lb) Ambient conditions Temperature: 5-35 C (41-95 F) Temperature: 5-35 C (41-95 F) Temperature: 5-35 C (41-95 F) Temperature: 5-35 C (41-95 F) Humidity: 30-95% Humidity: 30-95% Humidity: 30-95% Humidity: 30-95% * clean, dry, oil-free LPKF ZelPlace accessories Part number LPKF LPKF LPKF LPKF ZelPlace 110 ZelPlace 220 ZelPlace 330 ZelPlace 340 ZelDisp dispenser Bridge-guided unit for stereo-microscope and CCD camera Zoom stereo-microscope unit SM CCD Camera Color monitor Ball socket turntable 150 mm ( 5.90 ) Turntable set with 45 antistatic component bins Turntable set with 90 antistatic component bins Feeder-carrier Tape feeder 8 mm (0.31 ) Tape feeder 12 mm (0.47 ) Tape feeder 16 mm (0.63 ) Stick feeder SO8 - SO28, SO8L - SO28L Stick feeder PLCC28 - PLCC Stick feeder PLCC52 - PLCC Monochrome micro camera (swiveling) Upgrade kit for LPKF ZelPlace 110 to 220 Upon request Upgrade kit for LPKF ZelPlace 110 to 330 Upon request Upgrade kit for LPKF ZelPlace 220 to 330 Upon request Upgrade kit for LPKF ZelPlace 330 to 340 Upon request Set of consumables K1 Set of consumables K2 Stand for 2 cartridges* Vacuum gripping device* Vacuum switch* Foot switch with 2 m (6 ft.) cable Set of 10 dispensing and vacuum needles* * items are included in set K1 delivered with LPKF ZelPlace standard equipment accessories not available optimal configuration IMPORTANT NOTE LPKF ZelPlace 110, 220 and 330 can be upgraded to LPKF ZelPlace system!340.

53 LPKF ZelPlace & BGA Placer 51 Accessories for LPKF ZelPlace 110, 220, 330 and 340 Tape and stick feeder Up to 13 feeders can be mounted on the feeder carrier for fast changeover of components. They can be conveniently mounted on both sides of the system. Feeder carrier with feeders Turntable for bulk components The turntable with either 45 or 90 ESD safe components bins can be located on both sides of the system as well as in the back. ESD safe turntable for bulk components LPKF ZelDisp Each LPKF ZelPlace comes with a ZelDisp dispenser unit. This multi-function dispenser with an integrated non-drop function is also designed for the dispensing of low viscosity fluids like adhesives. The dispensing pressure, time and repetition rate between the pulses can be set as required. The dispensing cycle is started by activating the foot switch (LPKF ZelPlace 110) or pressing down the manipulator head (all other LPKF ZelPlace versions). The Pick & Place vacuum is also generated and controlled by the LPKF ZelDisp unit. LPKF ZelDisp Consumables set K1 This set contains the following parts: foot switch with 2 m (6 ft.) cable, vacuum pick-up nozzle with vacuum valve, silicon hoses, cartridge adapter 10 ccm (4 inch 2 ), two 10 ccm cartridges with caps and pistons and plungers, set of ten dispensing and vacuum needles, two vacuum caps, stand for two cartridges. LPKF consumables set K2 One cartridge adapter 5 ccm, two 5 ccm cartridges with caps and pistons and plungers, set of ten dispensing and vacuum needles, two vacuum caps.

54 52 LPKF ZelPlace & BGA Placer Overview of typical SMD components and recommended assembly configurations Entry level Professional system High-end systems LPKF ZelPlace BGA LPKF ZelPlace 110 LPKF ZelPlace 220 LPKF ZelPlace 330 & 340 Passive components in Inch / mm 1206 (3216) 0805 (2012) 0603 (1608) 0402 (1005) 0201 (0603) IC packages SOT23 SOT323 SC90-TR SOIC 1.27 mm (0.05 ) PLCC 1.27 mm (0.05 ) SSOP 0.65 mm (0.025 ) - 64 leads TSOP 0.5 mm (0.019 ) - 48 leads QFP 0.8 mm (0.031 ) leads QFP 0.65 mm (0.025 ) leads QFP 0.65 mm (0.025 ) leads QFP 0.5 mm (0.019 ) leads QFP 0.4 mm (0.015 ) leads LQFP 0.3 mm (0.011 ) leads BGA 1.5/1.27 mm (0.06 /0.05 ) Edge Centring BGA 1 mm (0.039 ) Edge Centring µbga 0.75 mm (0.029 ) µbga 0.5 mm (0.019 ) Compatible Limited compatibility (requires skilled user or is time consuming) additional tools may be required

55 LPKF ZelFlow 53 LPKF ZelFlow LPKF ZelFlow RO4, RO4/N2 Reflow Ovens Product description The LPKF ZelFlow RO4 combined hot-air/quartz reflow oven is the ideal tool for rapid SMD prototyping and small batch production. Compact and versatile, the oven has a large working area and micro-processor controlled temperature-time profiles. It is capable of SMD Reflow soldering, curing of adhesives and conductive pastes, and other thermal treatments. The process temperature and time can be easily programmed by the user. All parameters such as pre-heating/reflow temperatures and times can be saved as user profiles for later use. It is also suitable for longer treatments such as temperature stabilisation of electronic components for up to 24 hours. The start and end of all processes is indicated visually and acoustically. The timers can be set to display count-up or count-down to the end of the process. The circuit boards are automatically cooled at the end of the process. Its dual access design features both drawer and a clamshell opening with safety interlocks. The ZelFlow RO4/N2 features optional nitrogen inerting. Product features Forced air (convection) and IR (quartz lamp) Microprocessor controlled Large working area Automatic cooling Programmable time/temperature profiles Simplified user interface N 2 inerting option available (ZelFlow RO4/N2) LPKF RO4/N2 closed LPKF ZelFlow RO4/N2 open Specifications Part number Maximum circuit board size Preheating temperature/time Reflow temperature/time Long thermal treatments temperature/time LPKF ZelFlow RO4 LPKF ZelFlow RO4/N mm x 350 mm (11.02 x ) C ( F), s C ( F), s C ( F), min The LPKF ZelFlow RO4 working area is specially designed to match the specifications for LPKF AutoContac and LPKF EasySolder. Temperature stabilisation time Cooling Power connection Power consumption max. Nitrogen gas consumption (N2 model only) Dimensions (W/H/D) Weight Ambient conditions 5 min variable speed fans, processor controlled V/50-60 Hz single phase 3,500 VA 0.28 m 3 /h (10 SCFH)* 500 mm x 370 mm x 450 mm (19.7 x 14.6 x 17.7 ) 24 kg (52.8 lb) Temperature: C (68-86 F) Humidity: % * Standard Cubic Feet per Hour No special accessories available.

56 54 Other LPKF products Other LPKF products Description Application LPKF system Laser systems for the production of metal and polymer stencils for solderpaste printing. Polymer stencil Metal stencil LPKF StencilLaser SL 600 Polymer LPKF StencilLaser SL 800 Laser system for drilling micro-vias, direct circuit board structuring, skiving and contour cutting of flex and rigid circuit boards. Microvia Cutting LPKF MicroLine Drill 600 Structuring Rigid-flex circuit board Laser system for the production of 3D molded interconnect devices (MIDs). High-density circuit structures are created directly on three-dimensional plastic components. (Laser based 3D-MID technology, additive/subtractive) Production steps LPKF MicroLine 3D Assembled MID

57 Other LPKF products 55 Description Application LPKF system Laser system for the high-resolution structuring of thin metal and polymer films using a mask projection. Available for panels and reel-to-reel. 50 µm lines and spaces created by laser structuring Etching resist structuring (ATOTECH) for ultrafine circuit boards. Photos courtesy of Philips High-precision sensors e.g. for temperature measurement. Sensor and sensor elements made out of flexible substrates, e.g. for medical technology. LPKF MicroLine Laser Laser system for micro-machining metallic, organic and ceramic materials. Cutting, drilling and engraving ceramics LPKF MultifunctionLaser MF 100 UV Interior glass structuring Services LPKF Laser Center, North America Telephone LPKF Laser Center, Germany Telephone D-MID Application Center, Germany Telephone

58 56 Imprint Imprint This catalogue was prepared with enormous attention to details. LPKF reserves the right to change specifications and other product information without notice. Price lists The price lists in the catalogue or attached to the catalogue are not part of the catalogue. All of the prices contained in the list apply ex works, excluding packaging and local taxes. All prices are subject to changes. Only the latest price list is valid. We will be happy to provide you with an individual quotation containing detailed specifications based on the latest price list. General terms and conditions We also draw your attention to our general terms and conditions and terms of delivery and payment which apply to all transactions and which we will be glad to send you upon request together with the requested quotation. Special agreements must be made in writing. Privacy protection All of the personal data provided by customers are only saved for our own commercial purposes and in compliance with local privacy protection law. Trademarks & patents 2003 LPKF Laser & Electronics AG, Garbsen, Germany. Systems and products offered by LPKF and its subsidiaries are covered by issued and pending German and foreign patents. Products mentioned are for identification purposes only and may be trademarks or registered trademarks of their respective companies. LPKF, the LPKF logo and LPKF ProtoMat are registered trademarks of LPKF Laser & Electronics AG. Product catalogue number Publisher LPKF Laser & Electronics AG Osteriede Garbsen Telephone 49 (0) 51 31/ Fax 49 (0) 51 31/ [email protected] web info Concept, design and layout AD HOME Hauptstraße Langenhagen Telephone 49 (0)5 11/ Fax 49 (0)5 11/ [email protected]

59 Information order form 57 LPKF information order form PLEASE DETACH AT PERFORATION AND FAX BACK TO YOUR DISTRIBUTOR LPKF has far more products and services available than are listed in this catalogue. To ensure you get the best solution for your area of application, we will be very happy to send you detailed information on other LPKF products. Fax-No. Germany China France Japan Slovenia Spain UK/Ireland North America Company Contact Department, Building, Mail Stop Telephone Fax Address City, State Country Please select from the following options for Rapid PCB Prototyping: Personal consultation Demo CD Sample Board Information on other product categories LPKF MicroLine Laser Sensor technology Chip interposers Flexible circuits Micro-structuring of thin layers (< 1 µm) LPKF MicroLine 3D 3D-MIDs (additive/subtractive) Material processing Glass interior structuring LPKF MultifunctionLaser UV Ceramic cutting Ceramic drilling Ceramic engraving Glass interior structuring LPKF HybridLaser Structuring LPKF MicroLine Drill 600 Structuring Micro-via drilling Cutting Solder-resist ablation LPKF StencilLaser SMD metal stencils SMD polymer stencils LPKF MultifunctionLaser IR Circuit board structuring Cutting very thin sheets Trimming resistances LPKF stencil service SMD solder stencils Micro-cutting service Quick-release frames Precision shaped parts Gobos See imprint LPKF product catalogue for details.

60 58

61 Technical questionnaire 59 Technical questionnaire: Solutions for your specific requirements PLEASE DETACH AT PERFORATION, COPY AND FAX BACK TO YOUR DISTRIBUTOR Please fill out the following questionnaire to help us better provide you with accurate information to meet your needs. Your business is very important to us! Fax-No. Germany China France Japan Slovenia Spain UK/Ireland North America Company Contact Department, Building, Mail Stop Address City, State Telephone Fax Country Area of Application Digital Analog RF/Microwave Power Supplies Base material FR3 FR4 RF substrates Polyimide (rigid) Polyimide (flexible) Ceramic substrate Others: Max. board size less than 200 x 340 mm (8 x13 ) bigger than 200 x 340 mm (8 x13 ) Circuit board technology Single-layer Double-layer Flex Multilayer Rigid-flex Multilayer Number of layers (min - max) Blind Vias Yes Buried Vias Yes Interior layer thickness (min - max) No No Separation between interior layers (min - max) Through-hole plating No Yes Max. holes per circuit board Approx > 300 Min. hole diameter mm/mil PLEASE TURN OVER See imprint LPKF product catalogue for details.

62 60 Technical questionnaire Circuit board properties Circuit board (min - max) mm/inch Cu clad µm/oz. Circuit geometries Track widths (min) µm/mil ( < 200 µm [8 mil]) Gaps (min) µm/mil ( < 200 µm [8 mil]) Remaining ring of the pad (min) µm/mil ( < 200 µm [8 mil]) Prototype circuit board assembly Conventional SMD Mixed assembly Manual assembly Semi-automatic Automatic Others Soldering methods for prototype production Manual soldering Convection Wave soldering Vapor phase Reflow soldering Do you produce front panels? No Yes Aluminum Engraving Milling Plastic Engraving Milling max. thickness mm/inch max. thickness mm/inch Fully automatic tool change required? No Yes PCB Layout Software Name Version Export file formats Gerber Standard (RS-274-D) Gerber Extended (RS-274-X) Excellon NC Drill Sieb & Meyer NC Drill DXF HP-GL Others: Development projects per year No. of designs per project No. of boards per design How do you currently produce prototypes? In-house Etching Milling Wirewrap (wiring technique) External, by service companies Etching Milling Are you happy with the situation? Yes No Why? See imprint LPKF product catalogue for details.

63 Index 61 Index 4-layer multilayer 6-layer multilayer 8-layer multilayer Accessories Aluminum Applications AutoContac Automatic tool change AutoSwitch Base materials BGA Placer BoardMaster Brass Build-up method (sequential) CAD (please use also EDA) CAM Station Chemical sets Circuit board plotter CircuitCAM Compressed air Compressor Conductive paste Consumables Contac Contact printing Contour generator Convection oven Custom drill bits Custom tools Customer service line Data conversion Data export Data formats Data import Depanelization Dispensing Distribution network Double sided printing Drill bit Drill data Drilling machine Dust extraction EasyContac EasySolder Editing capabilities Endmill Engraving Fine-pitch printing Flex boards Flexible circuits Flex-rigid boards Foil engraving Front panels Fully automatic Galvanic Gerber Head lighting Housing Installation Insulation process Laser 31, 32, 33, 40 31, 32, 33, 40 31, 32, 33, 40 24, 42 8, 14, 16, 20 6, 14, 16, 18, 20, 21 6, , , , , 8, , 27 34, , , , ff , 54 Layout Measurement microscope Micro cutter Micrometer screw Microwave circuits Microwave layout Microwave prototype Milling bit MiniContac Multilayer boards MultiPress Paste PCB drilling PCB milling PCB post processing PCB prototype Plastic / composite Plastic engraving Pneumatic Z-axis Post processing of: populated boards bare boards Printing Program wizard ProtoLaser ProtoMat ProtoMat 95s/II ProtoMat C100/HF ProtoMat C20 ProtoMat C40 ProtoMat C60 ProtoMat H100 ProtoMat L60 ProtoMat M30s ProtoMat M60 ProtoMat X60 Prototypes Quality features Quick release collet Quick release frame Reflow oven Registration pin method Reverse pulse plating RF circuits RF layouts RF prototypes RF-Endmill Rivets Routing SatusLight Screen-printing Service Set pin system Sign engraving SMD assembly SMD fine pitch printing SMD metal stencils SMD polymer stencils SMD solder paste stencils Software upgrade Solder mask , , , 41 7, 31, 32, 33, 39, 40 31, , 14, 26 9, 20 9, ff , , , 29 7, , 14 36, 38 6, 27 7, , , , 11 7, 28 Solder paste printing Sound enclosur Special applications Spindle Starter packs Stencil printer Stencil printing Tech support Test adapter Through hole plating Tinning Tool library Tool management Tool ring set Tools Training Training Universal cutter Vacuum table (H100) Working depth limiter WYSIWYG ZelFlex ZelFlow ZelPlace ZelPrint , 27 ff 30, , ,

64 LPKF distribution network LPKF Headquarters LPKF Distribution and production facilities LPKF Distributors Germany (Headquarters) LPKF Laser & Electronics AG Osteriede Garbsen GERMANY Phone Fax [email protected] web info Slowenien LPKF Laser & Elektronika d.o.o. Planina Kranj SLOVENIA Phone Fax [email protected] web info UK/Ireland LPKF Laser & Electronics Ltd. Coppid Beech Lane, Wokingham Berkshire-RG40 1PD GREAT BRITAIN Phone Fax [email protected] web info China LPKF Tianjin Co., Ltd. No. 1 Building, Xing Nan Cun, Ke Yan Xi Road, Nan Kai District, Tianjin, PEOPLE'S REPUBLIC OF CHINA Phone Fax [email protected] Frankreich LPKF France S.A.R.L. Z.A. de l Églantier 21 Rue des Cerisiers (C.E Lisses) Evry Cedex FRANCE Phone Fax [email protected] Spain LPKF Laser & Electronics Spain, S.L. Apartado Nr Soto del Real (Madrid) Madrid/SPAIN Phone Fax [email protected] web info North America LPKF Laser & Electronics SW Boberg Rd. P.O. Box 3858 Wilsonville, OR USA Phone Fax [email protected] web info Japan LPKF Japan Co., Ltd. Yoyogi Shibuya-ku Tokyo JAPAN Phone Fax [email protected] web info Customer Service (Free advice/support) Germany Slovenia China Spain France UK/Ireland Japan North America (8 am - 5 pm PST) Your LPKF-Distributor Catalog number AD HOME