NEWS FROM SACLAY ATLAS MMM CERN 24/25 JUNE

Transcription

1 NEWS FROM SACLAY F Bauer, D Desforges, E Ferrer-Ribas, W Gamache, A Giganon, PF Giraud, P Graffin, S Herlant, S Hervé, F Jeanneau, H Le Provost, O Meunier, A Peyaud, P Ponsot, Ph Schune PAGE203 ATLAS MMM CERN 24/25 JUNE

2 OUTLINE New tools and material Vacuum bag glueing tests Planarity and stiffness measurements Operational ML Alignment issues PAGE 2

3 NEW TOOLS AND MATERIAL 3D-Optic head Marble table, 3x2 m2, planarity ~ 5 µm In a next future: laminar flow PAGE 3

4 GLUEING TESTS: VACUUM BAG # Steps Frame Honeycomb Skin Al bars Nomex, 5 mm FR4 2 2 Al bars Nomex, 5 mm FR4 3 G0, good precision Nomex, 5 mm FR4+Cu 4 Al, extruded Al, 5 mm, µ-holes FR4 5 Al, extruded, drilled Al, 5 mm, µ-holes FR4+Cu 6 No Al, 5 mm, µ-holes FR4+Cu Skins: Al frame: Glue: Pressure: Curing: 000 x 600 x 06 mm3 no particular mech precision Araldite 20, applied by hand -900/000 mbar ~24hrs PAGE 4

5 PLANARITY MEASUREMENTS Horizontal and vertical measurements Planarity Parallelism (in progress) 72 points (with and wo frame) PAGE 5

6 PLANARITY: PROFILES 0# 0,05# 0,05# 0# 0# 0# 50# )0,05# 50# 200# 50# )0,# 350# 250# )0,5# 650# 450# 800# 550# 50# )0,05)0# 50# )0,2# 950# 982# 590# (0,05# 200# 50# )0,))0,05# 350# 250# )0,5))0,# 500# 350# 0)0,05# )0,2))0,5# 500# 350# )0,25))0,2# (0,# (0,5# 650# 450# 800# )0,25# 0(0,05# (0,05(0# (0,((0,05# (0,5((0,# (0,2((0,5# (0,2# 950# 550# [ [ Face including frame Face no frame 0,05(0,06# 0,04(0,05# 0,4# 0,3# 0,2# 0,# 0# 0# 50# 0# 50# 50# 0,3)0,4# 0,2)0,3# 0,)0,2# 0)0,# 0,03(0,04# 50# 0,02(0,03# 50# 200# 350# 650# 550# 800# 950# 590# 982# Face 2 including frame G0, good precision 800# (0,02# (0,04((0,03# (0,05((0,04# (0,04# (0,05# 650# 550# 950# [ -075 (0,03((0,02# (0,03# 500# 500# 450# (0,02((0,0# 50# (0,0# 450# (0,0(0# 0,02# 0,0# 0# 350# 350# 350# 0(0,0# 0,03# 250# 200# 250# 0,0(0,02# 0,05# 0,04# )0,)0# )0,# 0,06# [ Face 2 no frame Nomex, 5 mm FR4+Cu Face on the table PAGE 6

7 Vertical measurements Horizontal measurements PLANARITY: RESULTS Material (frame, stiffener) F frame (mm) F no frame (mm) F2 frame (mm) F2 no frame (mm) Al, Nomex Al, Nomex G0, Nomex Al, Al Al, Al No frame, Al Material (frame, stiffener) F frame (mm) F no frame (mm) F2 frame (mm) F2 no frame (mm) Al, Nomex Al, Nomex G0, Nomex Al, Al Al, Al No frame, Al PAGE 7

8 STIFFNESS MEASUREMENTS Geometry Dimensions: 000 x 600 x 2 mm3 2 FR4 plates (e= 06 mm) Frame: rectangular section (20 x 0 x mm3) Honeycomb (e=0 mm) Boundary conditions Support: cylindrical tubes (960 mm spacing) Load: 220 N (Lead bricks, area: 200 x 00 mm2) Load in the center PAGE 8

9 STIFFNESS: RESULTS The structure is 30% stiffer than in the model PAGE 9

10 OPERATIONAL MULTI-LAYER Layout: PCB dimensions à 000 x 600 mm2 to fit the 3D measurements device (Mitutoyo) Active surface (~685 x 400 mm2) XY strips resistive layer Floating mesh Several alignment possibilities (optical with rasmasks or targets mechanical with insert and holes) Wide Al frame with holes for the rasmasks alignment P O N M K L I J H C D E F G 6 A B 6 Coupe C-C Echelle : 000 2: * Dimension des inserts pour information , ,8 685,8 25* * 4 3 4x 7 dans le PCB Détail A 2 2: 7 Mire , ,05 57,2 7,6 400,05 200, , , ,5 225, ,025 Echelle : ,35* * 4 252, ,5 252,5 282,5 9 A C C ,5 B , , , ,9 367, Détail B , Rasmaks 20x20 détachables 4 392,9 2,5 2: P A Origine Réf approb ou modif St Ind Date Matière /Material : Trait th /Heat treatments : Casser les angles vifs Protection /Shielding : Break all sharp edges Ss-Ens /Sub Assy: Tolérances Générales Séparateur Ss-Traitant 3,2 Separator Supplier IRG 0, ISO mk Quantité /Quantity: 4 Echelle /Scale : : ,5 3 2,5 R,25 25 Echelle : GAMACHE Dess Vérif 4 3 PROVISOIRE Masse / Mass : Plan dessiné avec le système CAO CATIA V5 Ne peut être modifié que par le même système CATIA V5 CAD drawing Do not make manual revisions or alterations Réf CAO : PA_PCBCATDrawing Upgrade Atlas - NSW 3,5,5 7 Operational prototypes 2mx06m Irfu quadruplet PCB R0,75 R2 Ref ext : Contrat : Il n'est permis d'utiliser ce dessin qu'avec licence spéciale ou autorisation expresse (loi du mars 957) This drawing may not be used without special license Planche /Sheet : /2 7 IABA DM PA P O N M L K J G F E D C A0 89 x 84 Dessin exécuté selon les Normes ISO Drawing created with ISO norms PAGE 0 2 Le 7/06/203 à 5:43:04 2,5

11 MOUNTING PROCESS AND TOOLING Tooling is designed both for mechanical and operational prototypes 3D optical device insert glue mask Glueing of high precision metallic insert with regards to the masks (optical alignment) 2 Alignment of 2 boards and glueing of a doublet using a high precision expansive pin (different versions for vacuum bag or stiff back glueing) and high precision tool on the marble 3 Optical or mechanical alignment of quadruplet (next slides) PCB Expansive pins (for mounting process): not amagnetic nor radiation hard (oil) insert 2 Positioning tool precision ~3 µm masks Marble PAGE

12 ALIGNMENT MASKS STUDY Readout planes in one doublet are mounted back-to-back During assembly of doublets then quadruplets, we may need to see alignment masks from both sides (direct and through FR4 view) Goals of this study: - Effect of the substrate thickness on the measurement precision - How to illuminate the mask for measurement optimization - How to calibrate a final MM doublet/quadruplet - Consequences on Operational Multi-Layer (OML) CMM head or calibration tool camera Direct view Sample from Rui (0,5mm thick) with copper lines View through FR4 Direct view View through FR4 few cms PAGE 2

13 ~40 mm PICTURES Machining is clearly visible ~700 microns Zoom on the edge of the thinner area of the PCB with back lightening : Thinner PCB area: ~022 to 03mm thick Normal PCB area: ~056mm thick PAGE 3

14 RESULTS (unit: micron) Strip # width Strip #3 width Strip #4 width Distance between strip # and strip #4 Distance between strip # and last visible strip Measurement looking to copper side Measurement through FR4 (lightening through the PCB) Delta eg: points used to fit strip edge Precision: ~5 to 0 microns Depends on software of Mitutotyo optical machine (number of points to fit a straight lines): it measures white-black transition region Zoom on strip edge PAGE 4

15 CONSEQUENCES FOR OML - To control the positioning of a doublet after glueing - To perform the alignment of a quadruplet Alignment masks are etched on thin, removable parts of the PCB Thin to see mask from top or bottom Removable to have access to other PCB masks CONCLUSION: We think we have a solution to optically control the PCB assembly on doublets or quadruplets (after gluing) The final error could be ~20 microns or below? To be tested with the OML using a CMM equipped with an optical head In practice, lightening during the measurements will not be so simple PAGE 5

16 OTHER ACTIONS Glueing process: test of the stiff-back procedure with an optical table modified for vacuum The intermediate mechanical prototype (doublet) is in progress (manufacturing of the mechanical components) Goal: measurement of the bending transmission with and wo spacers in the drift gap (ceramic pillars) to define the in-plane alignment system PAGE 6

17 CONCLUSION Basic material and tools: we are almost ready Vacuum bag glueing test: High precision manufacturing needed for the frame Big difference between the 2 faces Best results with no frame but poor stiffness and mechanically not strong à stiffback method Stiffness 30% larger than in the model (stress on the screws pres of P Ponsot) MLO: layout almost terminated M4 in progress: deformation prototype almost ready Alignment (before and after glueing) is designed in parallel for the 2 prototypes PAGE 7