FRAUNHOFER IIS DESIGN AUTOMATION DIVISION EAS

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1 FRAUNHOFER IIS DESIGN AUTOMATION DIVISION EAS Manfred Dietrich Head of Department Microelectronic Systems Fraunhofer IIS/EAS

2 The Fraunhofer-Gesellschaft n Application-oriented research is the central mission of Fraunhofer n The Fraunhofer-Gesellschaft undertakes applied research of direct utility to private and public enterprises and of wide benefit to society n 1.66 billion annual research budget n More than 70 percent of this research revenue from contracts with industry and from publicly financed research projects n Just 30 percent basic funding by the German federal and state governments n Institutes work as profit centers 2

3 Die Fraunhofer-Gesellschaft Locations in Germany Itzehoe Lübeck Rostock n More than employees n More than 80 research institutions, including 60 Fraunhofer institutes n International representative offices Institutes and facilities Other locations Bremerhaven Oldenburg Hamburg Bremen Hannover Berlin Potsdam Teltow Braunschweig Magdeburg Cottbus Oberhausen Paderborn Halle Dortmund Schkopau Leipzig Duisburg Kassel Leuna Schmallenberg Dresden St. Augustin Erfurt Jena Aachen Freiberg Euskirchen Gießen Chemnitz Wachtberg Ilmenau Darmstadt Würzburg Bayreuth Erlangen Bronnbach St. Ingbert Kaiserslautern Fürth Nürnberg Saarbrücken Karlsruhe Pfinztal Ettlingen Stuttgart Straubing Freising Freiburg Augsburg Garching München Oberpfaffenhofen Kandern Prien Efringen- Holzkirchen Kirchen 3

4 Fraunhofer-Institut for Integrated Circuits IIS Founded 1985 Locations Erlangen, Nuremberg, Fuerth, Dresden (1992) Employees 730 Budget 90 Mio. 20% basic governmental funding 80% project financed Management Prof. Albert Heuberger 4

5 Fraunhofer IIS Business Areas and Competences n Audio and multimedia n Digital broadcasting n Integrated circuits and sensor systems n Localization and navigation n Embedded communication systems n Image processing systems n X-ray technology n Medical n Logistics 5

6 Fraunhofer IIS Design Automation Division EAS Founded 1992 Location Dresden Employees 83 Budget 7 Mio. 20% basic governmental funding 80% project financed Management Dr. Peter Schneider 6

7 Fraunhofer IIS Design Automation Division EAS Profile n One of the largest research institutions in the field of design automation in Europe n Microelectronics and heterogeneous systems n Focus on all aspects of functional design Challenges n Mastering the growing complexity of electronic systems n Closing the gap between manufacturing and system design n Comprehensive consideration of different physical domains 7

8 Business Areas Microelectronic Systems Sensor Systems and Actuators Automation Systems Communications & Assistance Systems 8

9 Business Areas Microelectronic Systems n Behavioral modeling of electronic systems and components n Methods for n Model generation, simulation and optimization n Debugging, analysis, formal verification n Test generation, fault simulation, diagnosis n Design for Manufacturability n Parasitics and tolerance optimization n Nano electronics and innovative packaging incl. 3D integration 9

10 Analog circuit design methodology ¾ Current analog circuit design ¾ Mainly hand-crafted ¾ Hard to meet/verify all specifications ¾ Less reuse / no analog IP ¾ Our vision ¾ Library of configurable analog IP, independent from a dedicated process technology ¾ Concerning all design rules and constraints ¾ Concept ¾ Generators provide all necessary design views in a consistent way concerning the design rules ¾ Optimization is used to fit to target specifications 10

11 Working areas Analyse of the influence of nonideal features n Modeling and simulation of paramter variations n Variation of the manufatory n Degradation of parameters during lifetime n Test and Diagnose by analoge fault simulation n Calculation of parasitics and their correlation n Methods for the generation of behaviour modells n Characterization by simualtion 11 11

12 Fraunhofer SystemC / SystemC-AMS based Technologies SystemC model SystemC library C++ compiler and linker Executable code (simulator) C++ debugger Waveform viewer 12 12

13 Working areas Robust Digital Systems Methods, tools for the design of robust systems robust System design of communication and assist systems High-Level- Validation TLM-Debugging Digital test SystemVerilog HW-Verification Modelling of nonfuctional parametersichtfunkt. Aspekte energy Design effiziency realibility Satellite ranging Signal correlation Simulation Prototyping Smart Textiles AAL textile network safety HW/SW-Co- Verification Gesture monitoring Sensorik 13

14 Business Areas Sensor Systems and Actuators n Modeling and simulation methods for sensor systems n High speed, supersensitive image sensors with integrated signal processing and their integration into modern measurement system n Position measurement systems based on magnetic field sensors n Systems for condition monitoring, error detection and failure prediction n Robust wireless sensor networks for distributed data acquisition and process control n Measurement systems based on virtual sensors 14

15 Business Areas Automation Systems n Virtual representation of machines and processes Modeling for virtual production n Methods for verification of control systems n Model predictive control n Design support and solutions for wired and wireless communication n Application-oriented design of automation systems including optimization 15

16 Business Areas Communication and Assistance Systems n Methods and tools for efficient, application specific design from specification to prototype n Technologies for the design under constraints, such as energy efficiency, testability, robustness, reusability n Analysis, synthesis, verification and debugging, testing and diagnosis of complex digital systems n Ambient Assisted Living and Smart Textiles applications n Digital Broadcasting DAB, DVB 16

17 EXAMPLES from Business Areas 17 Fraunhofer IIS/EAS

18 SystemC AMS Development Environment SystemC / SystemC AMS SystemC Language for description of complex digital hardware systems on different abstraction levels SystemC AMS Extension of SystemC for modeling analog and mixed signal behavior Advantages n Combination of analog and mixed signal circuit models n Modeling different abstraction levels n High simulation performance n Ability to integrate other EDA tools Application areas n Automotive (TIER 1, TIER 2, OEMs) n Building automation n Production systems n n Communication technology Chip industry 18

19 Technology Oriented Modeling Modeling, Analysis, Verification device characteristics digital n + n + Substrat ( p) parasitics System analog Source: SINTEF interconnects / packaging technology.... VHDL-AMS, Verilog-AMS, SystemC-AMS, thermal behavior G(2πf) MEMS freqency (Hz) Frequency response original, dim=27225 reduced, dim=72 sensor characteristics thickness of mounting bracket (µm) Design, Optimization, Constraints 19

20 Reliability of Interconnect Structures n Interconnect aging due to electro and stress migration Hillock e - Void n Impact increases n Smaller feature size n Higher current density n Higher temperatures n Complex packaging variants => 3D Acm Metallisierung A 2mA µ m 2 n Model based approach to derive guidelines for designers n Constraint driven design Source: BOSCH 20

21 Device Aging n Investigation of reasons for device aging n Hot Carrier Injection (HCI) n Negative Bias Temperature Instability (NBTI) n Modeling of parameter drift due to aging n Analytical model description n Parameters derived by measurements n Simulation and analysis of aging n Stress estimation for devices n Impact on system behavior n Extraction of design constraints n Consideration of aging by design rules S G -I G n+ n+ -I D P-well I B D Impact ionization HCI NBTI 21

22 Robust and Fail-safe Systems Prevent faults Tap the full potential of manufacturing processes and reduce the probability of device and component failures Reduce parameter variation, drift effects, design methods Accept faults Reduce the impact of failures and ensure the availability of system functionality Redundancy, Intelligent operation strategies, à High-end technology Manufacturing complexity à Robust design Design complexity à Fault tolerance System complexity Comprehensive consideration of reliability and functional aspects allows to find optimal system solutions 22

23 Smart System Integration (SiP / 3D) n Detailed simulation of effects in chip-package systems and 3D stacks n Thermal management and characterization n Electrical characterization n Thermo-mechanical analysis n Behavioral modeling and design flow integration n Modeling methodology n Multi-level, multi-physics modeling n Approaches for model simplification (MOR) n Customer-specific design environments and flow integration n Place & route, floor planning n Design space exploration n Test methods for 3D 23

24 Functional Digital Mockup n Integration of behavior models and CAD models à Extension of classic DMU n Interactive analysis of complex mechatronics n Coupling of domain specific simulators and visualization components FDMUservices Interactive visualization User Master simulator Visualization data Control, stimuli Simulation data Simulator 3 close coupling Wrapper Simulator 1 Wrapper Simulator 2 Wrapper Simulator n 24

25 Model-based Control Design Inverse Pendulum n Sensor system concept n Model-based dimensioning (range, singular positions, driving torque) n Control design (observer, coordinate transformations, dynamic correction) n Proof of stability Pendulum rod Base Universal joint Arms Rotational joints 25

26 Application of Charge-based Image Sensor n Characteristics n Highly parallel charge-based image sequence processing n On-chip data compression and feature extraction n High dynamics with linear and logarithmic characteristics (120dB) n ADC configurable for conversion rate and resolution n Application areas n Industrial measurement n Safety engineering n Building automation Rear side of a 2 Cent coin Image with test chip 100x100 pixel 26

27 Magnetic Sensor Systems Application development n Feasibility studies n Comparison of technologies n Construction studies and prototype development n Design optimization Sensor IC modeling Modeling of magnets n Analog/digital IC models n Various magnetic sensor technologies n Customer specific models 27

28 Condition Monitoring n Challenges n Choice of measured quantities, sensor positions n Analysis of aging effects, failure modes etc. n Elaboration of signal processing n Model-based approach n Partial replacement of measurements n Application of statistical methods n Support of feature extraction n Design of application-specific condition monitoring systems n Determination of measurement quantities and selection of sensors n Simulation studies for sensor positioning and system optimization 28

29 Robust Wireless Sensor Networks (WSN) Complex WSN applications cannot be developed by»traditional«prototyping and debugging New technologies are necessary to support the design of secure, reliable, and robust WSN applications efficiently. SuSAN n Provide tools and methods for development of complex WSN systems, n Guarantee robustness and security already during the design phase n Improve interoperability and scalability 29

30 Verification of Industrial Control Systems Specification Requirements/technical specification, standards Model development Overall system model, material and machine parameters, characteristics Code generation Verification Model checking SPS co-simulation System simulation Real-timesimulation Verified IEC Code 30

31 Design of Energy-aware Building Management Systems System simulation Formal verification Optimization Building models (controlled system) Automation models (control unit) Operation scenarios Measurement data based model adaption Room monitoring Water installation Lightening Energy storage Multimedia Electric installation Ventilation, sunblind^, heating Energy sources Generation of control programs Virtual commissioning Simulation based prediction of control system behavior Communication network Sensors/Actuators Control 31

32 Planning and Virtual Commissioning of Intralogistic Systems Material flow simulation Properties: n Input: Load scenarios, operation parameters n Results: Identification of deadlocks and bottlenecks, throughput, processing time, functional correctness n 3D - Visualization of the material flow through the process n Logging and analysis of material handling events n Development and test of routing strategies; Test and validation of various layout options Applications: n Warehouse scenarios n Logistic systems within a production line n Airport cargo systems 32

33 Smart Textiles Applications Research topics n n Conductive textile structures (integration of elektronics) n n n n Analysis of electrical characteristics Conductivity and communication behavior Variation of electrical characteristics at environmental influence Power supply Network structures (specific for textiles) n Internal/external structures Current focus n Networks: Enhancement of network technologies, adoption for applications, motion detection n Software modules: Low-power programming, embedded operating systems with dynamic configuration, verification of safety critical embedded software 33

34 DARTS Receiver for Satellite Ranging Digital Advanced Ranging with Transport-Stream Signals Dual Ranging Receiver: n Complex DSP board n Control and correlation algorithms in real-time n max. 20 measurements n Accuracy of positioning +/- 0,5 meters 34

35 Our Range of Services n System solutions Sensor and measurement systems, communication systems, components for assistance systems, etc. n Design tools and methods SystemC AMS development environment, statistical power simulation and analysis, modeling und code generation, etc. n Development services Complex mixed-signal circuits, software, boards and devices including embedded software n Studies, tutorials and training courses 35

36 Our Customers and Industrial Partners 36

37 Thank you for your attention Fraunhofer Institute for Integrated Circuits IIS Design Automation Division EAS Zeunerstraße Dresden, Germany Fraunhofer IIS/EAS