Helixeon High CRI Series
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1 Helixeon High CRI Series Helixeon high CRI series provide efficiency luminous flux output with high color rendering index performance for the decorative, artistic and general lighting applications. With typical Ra of 80 or 90, customers can reproduce the colors of objects much more faithfully in comparison with conventional emitters. Also, it is capable of standard lead free solder reflow process and compatible to RoHS certification. Features High color rendering index Silicone molding lens Standard lead free solder reflow process-jedec 020c RoHS certification Application Decorative and artistic lighting Torch lighting Up and down lighting Par lamp General lighting 1
2 Product Nomenclature HM HP - E 1 H V 9 X1 X2 X3 X4 X5 X6 X7 X1 X2 X3 X4 Item Mode Heat sink Power Code Type Code Type Code Type Code Type HM Molding HP High Power E Emitter 1 1W X5 X6 X7 Pattern Color CRI Code Type Code Type Code Type H Lambertian II V Warm White 9 Ra = 90 S Neutral White 8 Ra = 80 Circuit Diagram of HELIXEON High CRI Series Emitter Radiation Pattern Part number Circuit diagram Lambertian II Lambertian II Lambertian II HMHP-E1HV9 HMHP-E1HV8 HMHP-E1HS8 2
3 Package Dimensions Lead Form Note: 1. The anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required. The slug of the device is no electrically neutral. 3. Drawings are not to scale. 4. All dimensions are all in millimeter. 5. All dimensions without tolerance are for reference only. 6. Specifications are subject to change without notice. 3
4 Characteristics for Helixeon high CRI series HMHP-E1HV9 Characteristics at I F = 350mA (Ta=25 ): Value Unit Parameter Symbol Min Typical Max Luminous flux (1) (2) Φ v lm CRI Ra View angle 2Θ 1/ degree Correlated color temperature (3) CCT K Forward voltage (4) V F V Power dissipation P D W HMHP-E1HV8 Characteristics at I F = 350mA (Ta=25 ): Value Unit Parameter Symbol Min Typical Max Luminous flux (1) (2) Φ v lm CRI Ra View angle 2Θ 1/ degree Correlated color temperature (3) CCT K Forward voltage (4) V F V Power dissipation P D W 4
5 HMHP-E1HS8 Characteristics at I F = 350mA (Ta=25 ): Parameter Symbol Luminous flux (1) Φ v (2) Value Unit Min Typical Max lm CRI Ra View angle 2Θ 1/ degree Correlated color temperature (3) CCT K Forward voltage (4) V F V Power dissipation P D W Note: 1. The typical luminous flux of Helixeon will be upgraded per season. 2. Ф v, minimum luminous flux performance guaranteed within published operating conditions. HELIO maintains a tolerance of ±10% luminous flux measurements. 3. The correlated color temperature of Helixeon is divided into three main bins. In case of customized CCT, this detail information will be discussed in meeting. The tester tolerance of CCT is ±5%. 4. HELIO maintains a tolerance of±0.06v on forward voltage measurements. 5
6 Absolute Maximum Ratings Parameter 1W Peak Forward Current (1/10 Duty Cycle at 1KHz) 700mA Continuous Forward Current 500mA LED Junction Temperature 120 Operation Temperature -40 ~+105 Storage Temperature -40 ~+120 ESD Sensitivity (1) > 8,000V Human Body Model (HBM) Class 2 JESD22-A114-B Reverse Voltage (V) not designed for reverse operation Note: 1. It is included the zener chip to protect the product from ESD. 6
7 White ANSI Bin Structure 7
8 Product Binning Doc. No.: DS Helixeon emitters are labeled using 6-digit alphanumeric bin code. The formats are explained as follows: AB CD EF Where: AB - designates Photometric Luminous Flux bin. CD - designates Correlated color temperature bin. EF - designates forward voltage bin. Photometric Luminous Flux binning information (AB) Color Bin Code Min. Max. Unit HMHP-E1HV9 R S lm S HMHP-E1HV8 T lm U HMHP-E1HS8 T U lm Correlated color temperature binning information (CD) Clolor Bin Code Min. Max Unit HMHP-E1HV9 8A,8B,8C,8D HMHP-E1HV8 7A,7B,7C,7D HMHP-E1HS8 5A,5B,5C,5D K Forward voltage binning information (EF) Bin Code Min. Max. Unit J K L V M N
9 Forward Current (ma) Relative Luminous Flux (%) Relative Spectral Power Distribution (%) Forward Voltage (V) Doc. No.: DS Optical & Electrical characteristics Emission spectrum Forward Voltage vs Forward Current HMHP-E1HV9 HMHP-E1HV8 HMHP-E1HS Wavelength (nm) Forward Current (ma) Operating Current & Ambient Temperature Typical Light Output Characteristics over Forward Current Rj-a= 30 /W Rj-a= 40 /W Rj-a= 50 /W Ambient Temperature ( ) Forward Current (ma) 9
10 Relative Intensity(%) Doc. No.: DS Typical Polar Radiation Pattern % 60 80% % 40% 20%
11 Storage Do not open the moisture proof bag before the devices are ready to use. Before the package is opened, LEDs should be stored at temperatures less than 30 and humidity less than 50%. After the package is opened, LEDs should be stored at temperatures less than 30 and humidity less than 30%. LEDs should be used within 168 hours (7 days) after the package is opened. Before using LEDs, baking treatment should be implemented based on the following conditions: pre-curing at 60±5 for 24 hours. 11
12 Handling Precaution The softness and dust affinity of silicone molding lens constrain the handling of LED. Thus, some handling indications of HELIXEON emitters are presented for possible damage prevention and excellent reliability. Avoid leaving fingerprints or scratches (by sharp tools) on the silicone resin parts. Do not force over 2000g impact or pressure on the silicone molding lens. The LEDs should only be picked up by making contact with the sides of the LED body. In case of pick-and-place nozzle for surface mount assembly, avoid directly contacting the lens with nozzle. The pickup tool was recommended and shown as below. Units:mm 12
13 Temperature Doc. No.: DS Solder Reflow Process Parameters Reflow soldering of Helixeon emitters requires effective control of heating and cooling. Both the rate of heating and cooling and the absolute temperatures reached are critical in assuring the formation of a reliable solder joint while avoiding damage to the emitter during the reflow process. The following reflow soldering profiles are provided for reference. It is recommended that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. t P T P T L t s Preheat Area 25 o C Time Profile Feature Ramp-Up Rate Lead Free Assembly 2-3 ºC/s Preheat Temperature ºC Preheat Time (t s ) s Liquid Temperature (T L ) 217 ºC Time maintained above T L s Peak Temperature (T p ) 235±5 ºC Peak Time (t p ) Ramp-Down Rate Max 20 s Max 6 ºC/s 13
14 Reliability Test List Test Item Resistance to soldering heat (reflow soldering) Standard Test Method JEITA ED Test Conditions Note Number of Damaged Ta=260, 10sec. (Pre treatment 25,70%,168hrs.) 2 times 0/10 Solderability (reflow soldering) JEITA ED Tsld=245±5, 3sec. (Lead Solder) 1 time over 95% 0/10 Steady state operating life Ta=25, I F = 350mA Tested with Helio standard circuit board 1000 hrs. 0/10 Steady state operating life of high humidity heat 60, RH=90%, I F = 350mA Tested with Helio standard circuit board 1000 hrs. 0/10 Temperature cycle JEITA ED ~ 25 ~ 100 ~ 25 30min. 5min. 30min. 5min. 100 cycles 0/10 Thermal shock JEITA ED ~ sec. 15sec. 20 cycles 0/10 High temperature storage Low temperature storage JEITA ED JEITA ED Ta= hrs. 0/10 Ta= hrs. 0/10 Vibration 2000 Hz, 2directions 60min. 0/10 Failure Criteria: Forward Voltage shift :> 200 mv Luminous Flux degradation :> 30 % Forward or Reverse Leakage:>10μA 14
15 Tube Package Specifications TUBE DIMENSIONS UNIT:mm W1 W2 H1 H2 L 16.5 ± ± ± ± ±1.0 15
16 Packaging INNER BOX: DIMENSIONS (mm) L W H Note: 1. There are 50pcs emitters in a tube. 2. There are 20 tubes in an inner carton. 16
17 Tape-and-Reel Package Specifications CARRIER TAPE DIMENSIONS (2 PINS) UNIT:mm W P E F P2 D D1 P0 A0 B0 K0 T 24.0 ± ± ± ± ± ± ± ± ± ± ±
18 REEL DIMENSIONS UNIT:mm M N W W1 H K S ψ ψ ±1.0 ±0.5 ±0.5 ±0.5 ±0.5 ψ380.0 ± ±0.5 Leader/Trailer and Orientation(2 PINS) 18
19 Packaging INNER BOX: DIMENSIONS (mm) L W H
20 Label Label for Tape-and-Reel XXXX-XXXX Reel-XXXX-XXXX 1000 XXXXX (1) XXXX XXXX-XX-XX Note: 1. HELIO internal code. Label for Tube & Tray XXXX-XXXX XXXXXX 20
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