SOCKETS FOR SD MEMORY CARD (SUPPORTS SDIO)

Transcription

1 (AXA) UPPER/LOWER METAL SHELL CONSTRUCTION FOR SUPERIOR DURABILITY AND EVEN BETTER ABILITY TO WITHSTAND STATIC ELECTRICITY SOCKETS FOR SD MEMORY CARD (SUPPORTS SDIO) Standard mounting type SDIO grand tab contact supported (supports SDIO) Metal shell Metal shell PCB cut-off type Horseshoe shaped slider Reverse mounting type Double spring Triple contact structure Compliance with RoHS Directive ORDERING INFORMATION FEATURES. Triple contact construction for improved prevention of minute circuit cutoff from dropping. The terminals in the power supply section have been made with triple contacts. This construction means that there will be no circuit cutoff over 0. µs even if the device is dropped.. Robustness and resistance to ESD and EMI have been fortified using upper and lower metal shells. The socket is effective against EDS and EMI, since both the front and back of the card are covered with metal when mounted. Also, since a more robust design is possible compared to singlesided plastic molding, the influence of reflow heat is reduced.. Constructed with double spring and horseshoe shaped slider Since the entire bottom of the card pushes the slider, the right-to-left balance is good, which allows smooth insertion and removal.. Porosity treatment achieves a high contact reliability. 5. Thinnest socket in its class at.7 mm Thickness of standoff type is. mm (including.5 mm standoff). 6. Simple card lock (prevents card from falling out) 7. Compliance with RoHS Directive Environmentally friendly, the connectors comply with Europe s RoHS Directive. Cadmium, lead, mercury, hexavalent, chromium, PBB and PBDE are not used. Porosity treatment This treatment consists in coating the surface with a very thin film to seal pinholes in the gold plating. We have developed this porosity treatment technology, which ensures contact reliability for thin gold plating comparable to that of thick gold plating. Porosity treatment membrane Pin hole Gold plating Nickel plating Base material Ambient gas Improved insertion and removal reliability Improved resistance to corrosion Improved contact reliability for digital signals APPLICATIONS Starting with products in the IT field that use s such as digital cameras, PDAs and IC recorders, you can also use this socket in the automotive and household appliances fields in such products as car navigation systems and microwave ovens. : Sockets for (supports SDIO) <Board mounting direction> 6: Reverse type (outside terminal) 7: Standard type (outside terminal) <Eject type> : Push-push type <Stand off height> 0: 0 mm 7: 0.7 mm :.5 mm :.6 mm 5:.8 mm <Function> : Without card jump-out prevention function With card presence SW With write protect SW </Positioning boss> : SMD terminal/with positioning boss <Packing> T: 5 pcs. tray package 0 trays P: 50 pcs. embossed tape and paper reel package reels AXA 6: With card jump-out prevention function With card presence SW With write protect SW

2 PRODUCT TYPES Product name Sockets for (Supports SDIO) Eject type Push-push type Available jump-out prevention function Not available Available SPECIFICATIONS Characteristics Item Specifications Condition Rated Current 0.5 A/ terminal Electrical characteristics Mechanical characteristics Lifetime characteristics Environmental characteristics Contact resistance Note: Please consult us for card falling out prevention mechanism. Mounting type On board mounting standard type On board mounting reverse type PCB cut-off standard type On board mounting standard type On board mounting reverse type PCB cut-off standard type Signal contact portion: Max. 00mΩ Detection contact portion: Max. 0mΩ Standoff height (mm) 0 AXA70.5 AXA7 0 AXA60.5 AXA6.6 AXA6.8 AXA AXA77 0 AXA706.5 AXA76 0 AXA606.5 AXA66.6 AXA66.8 AXA AXA776 Inner carton Asterisk mark on end of ; P: 50 pieces ( reel) (Embossed tape package) T: 5 pieces ( tray) (Tray package) Packing quantity (AXA) Outer carton Asterisk mark on end of ; P: 700 pieces ( reels) (Embossed tape package) T: 700 pieces (0 trays) (Tray package) Measured with the HP8B, except for the resistance of the cable. Insulation resistance Min.,000MΩ (Initial) Using 500V DC megger (applied for min.) Breakdown voltage 500V AC for min. Rated voltage is applied for one minute and check for short circuit or damage with a current of ma. Frequency: 0 to 55 Hz Vibration resistance Acceleration: 0.0 m/s No current interruption for more than 0. µs insertion force Max. 0N Insertion and removal life of card Insertion and removal life: 0,000 times Contact resistance after testing: Signal contact portion: Max. 00mΩ Detection contact portion: Max. 0mΩ Insertion and removal speed are at a rate of 00 times/hour or less. Ambient temperature 5 C to +90 C No freezing or condensation in low temperatures Storage temperature 0 C to +90 C (The allowable storage temperature is 0 C to +50 C if unopened from original packaging) No freezing or condensation in low temperatures Resistance to soldering heat Humidity tolerance (mated ) Applicable memory card Unit weight.95g Reflow soldering: peak temperature 50 C or less Hand soldering: Soldering iron temperature 00 C, 5 sec. or less Contact resistance: Signal contact portion: Max. 00mΩ Detection contact portion: Max. 0mΩ Insulation resistance: Min. 00 MΩ SDIO card, /Multi-media card Sockets (shell) surface temperature for using infrared reflow soldering machine MIL-STD-A, METHOD 00 Temperature: 0± C, Humidity: 90 to 95%RH, Test time: 500 hours. Material and surface treatment Portion Material Surface Earth shell Lock pin Stainless steel Coil spring Body Slider Heat resistant resin (UL9V-0) Signal contact Contact portion: Ni plating on base, Au plating on surface Soldering portion: Ni plating on base, Au plating on surface Detection contact Copper alloy Contact/Soldering portion: Ni plating on base, Au plating on surface Retention solder tab (with earth shell) Soldering portion: Cu plating on base, Sn plating on surface AXA77 soldering part: Au and partial Pd plating over Ni

3 (AXA) DIMENSIONS (Unit: mm). On board mounting standard type (outside terminals) AXA70 AXA706 (with card jump-out prevention function) No. No. No. No. Lot No (9.80) 8.0 (.0) (5.0) (.0) center (.0).65±0..50±0. (Contact pitch) ±0. Detailed internal view Pin No. Pin No. : Recommended pattern forbidden area (entire inside) : Pattern forbidden area 0.65± ± ±0.05 ±0.05 ± ±0.05 (Pitch) (5.0) (0.0) ± ±0.05.0± ± ± ± ±0.05.0±0.05.5± ±0.0.0±0.05.5±0.05 ±0.0.0±0.05 : Pattern forbidden area. (Because part of the contact is close to the substrate, avoid the pattern arrangement.) Relation of es to attachment attachment protect not Open Closed Closed number : Recommended pattern forbidden area. (Because part of the earth shell are close to the substrate, we recommend that you avoid the pattern arrangement.)

4 . On board mounting standard type with standoff (.5 mm) (outside terminals) AXA7 AXA76 (with card jump-out prevention function) (AXA) (.0) 0.80 No. No. No. No. (Stand-off dimensions).50 (.0) (5.0) (9.80) 8.0 Lot No..95 (.0).65± center.0.95 (.0).50±0. (Contact pitch) ± Detailed internal view ±0.05 ±0.05 ± ± ± ±0.05 (Pitch) Pin No. Pin No. Rib to prevent card ejection : Pattern forbidden area.0.60 : Pattern forbidden area ± ± ±0.05.0±0.05.5± ±0.05 ±0.05.0±0.05.5±0.05.0±0.05 : Pattern forbidden area. (Because part of the contact is close to the substrate, avoid the pattern arrangement.) Relation of es to attachment attachment protect not Open Closed Closed number

5 (AXA). On board mounting reverse type (outside terminals) AXA60 AXA606 (with card jump-out prevention function) No. No. No. No (.0) (5.0) (9.80) 8.0 A direction (.0) center (.0).80 (Contact pitch).50±0..65± ±0. Internal view on arrow from A direction.675± ±0.05 (Pitch) ±0.05 ±0.05 ± ±0.05 Pin No. Pin No. : Recommended attern forbidden area (whole surface) (5.0) (0.0).60± ± ±0.05.0±0.05.5±0.05.0±0.05.0± ±0.05.5±0.05 ±0.05 : Recommended pattern forbidden area. (Because part of the earth shell are close to the substrate, we recommend that you avoid the pattern arrangement.) Relation of es to attachment attachment protect not Open Closed Closed number

6 . On board mounting reverse type with standoff (.5 mm) (outside terminals) AXA6 AXA66 (with card jump-out prevention function) (AXA) (.0) No. No. No. No. A direction (.0) (5.0) (9.5) (.0) center (.0).80.0 (Contact pitch).50±0..65± (0.7) 0.65±0..50 (Stand-off dimensions) Internal view on arrow from A direction Pin No. Pin No..675± ±0.05 (pitch) ±0.05 ±0.05 ± ± ±0.05.0±0.05.0±0.05 (0.0).5± ±0.05.0±0.05.0±0.05 ±0.05.5±0.05 Relation of es to attachment attachment protect not Open Closed Closed number

7 (AXA) 5. On board mounting reverse type with standoff (.6 mm) (outside terminals) AXA6 AXA66 (with card jump-out prevention function) (.0) No. No. No. No. (9.5) A direction (.0) (5.0) (.0) center (.0).80 (Contact pitch).50± ± ±0..60 (Stand-off dimensions) Internal view on arrow from A direction Pin No. Pin No. ± ±0.05 ±0.05 ± ±0.05 (pitch) 0.65±0.05.0± ±0.05.0±0.05 (0.0).5± ±0.05.0±0.05.0±0.05 ±0.05.5±0.05 Relation of es to attachment attachment protect not Open Closed Closed number

8 6. On board mounting reverse type with standoff (.8 mm) (outside terminals) AXA65 AXA656 (with card jump-out prevention function) (AXA) (.50) No. No. No. No. A direction (.0) (5.0) (9.5) (.0) (.0).80 (Contact pitch).50± ±0. center.65±0..80± (Stand-off dimensions) 0.0 (0.7) Internal view on arrow from A direction Pin No. Pin No. ± ±0.05 ±0.05 ± ±0.05 (pitch) 0.65±0.05.0± ±0.05.0±0.05 (0.0).5± ±0.05.0±0.05.0±0.05 ±0.05.5±0.05 Relation of es to attachment attachment protect not Open Closed Closed number

9 (AXA) 7. PCB cut-off standard type (outside terminals) AXA77 AXA776 (with card jump-out prevention function) No. No. No. No. (.0) (5.0) (0.80) Lot No (5.0) center.0 (0.80).65± ±0. (Contact pitch) 0.80± Detailed internal view Pin No. Pin No..00±0.05 ±0.05 ± ± ± ± ± ±0.05 Rib to prevent card ejection (.0).00±0.05.0± ± ±0.05 (8.90) Relation of es to attachment attachment protect not Open Closed Closed number.0±0.05 Substrate edge (.0) 5.0± ±0.05 (9.0).80±0.05 R0.0

10 EMBOSSED TAPE AND REEL Tape dimensions Reel dimensions (AXA) mm Emboss carrier tape Top cover tape P E T Socket for + (. 0 ) Taping reel Top cover tape Tape 65 to 80 Pocket pitch= dia. (.00) (.00) (0.0) (.75) (0.0) (.00±0.) Pull-out direction 70 dia. Emboss carrier tape Cavity Label NOTES. Regarding the design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas.. Regarding the socket mounting ) When reflow soldering when the slider is locked, heat will cause the slider to deform and not work. Therefore, please confirm that the slider lock is released before mounting if you have inserted and removed a card before soldering. ) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations.. Soldering ) Reflow soldering Screen-printing method is recommended for cream solder printing. Use the recommended foot pattern for cream solder printing (screen thickness: mm). Use the recommended reflow temperature profile s shown on the right for infrared reflow soldering. Temperature 50 C max. 55 to 65 C Preheating 60 to 0 sec. Peak temperature 80 to 00 C Within 0 sec. Time Measure the temperature at the connector surface. ) Hand soldering Set the soldering tip to 00 C, and solder for no more than 5 seconds.. Cleaning after soldering Inside the socket there is a slider section and card contact/write protection mechanism. If anything such as flux remains inside after washing, insertion and removal will be hampered and contact will be faulty. Therefore, do not use methods that involve submersion when cleaning. (Partial cleaning of the PCB and soldered terminals is possible.) 5. After PC board mounting ) Warping of the PC board should be no more than 0.0 mm for the entire connector length. ) When assembling PCBs or storing them in block assemblies, make sure that undue weight is not exerted on a stacked connector. ) Be sure not to allow external pressure to act on connectors when assembling PCBs or moving in block assemblies. 6. Handling single components ) Make sure not to drop or allow parts to fall from work bench ) Be cautious when handling because excessive force applied to the terminals will cause deformation and loss of terminal. ) Repeated bending of the terminals may break them. 7. fitting ) These products are made for the design of compact and lightweight devices and therefore the molded part is very thin. For this reason, design the device to prevent undue wrenching forces from being applied to the product during use. ) The sockets are constructed to prevent reverse card insertion. Caution is required because repeated, mistaken reverse insertion may damage the socket and card. ) When not soldered, be careful not to insert and remove the socket's card. Doing so will cause a decrease in anchoring ability of the mated part and loss of. ) Forcibly removing a fitted card may degrade the card removal prevention lock. To remove a card, be sure to push the card in the insertion direction to release the slider lock before pulling out the card. 8. Device design ) Contact failure may result if dust or dirt enters the contact section. Please take appropriate measures when designing the device to prevent this from happening, for example by adding a cover. ) To ensure smooth insertion and removal of cards, please design the chassis so that no force is applied to the metal shell on top of the socket. If a force is present that pushes down on the metal shell, the card will be pressed, which might prevent ejection. ) Please provide a guide or similar to keep the socket from having force applied to it when inserting and removing. 9. Others If you coat the PCB after soldering for insulation and to prevent wear, make sure that the coating does not adhere to the socket. Regarding general notes, please refer to page. For other details, please verify with the product specification sheets.