PS/PF PRESSURE SENSOR

Transcription

1 High precision pressure sensor (without amp.) PS (ADP)/PF (ADP) PS/PF PRESSURE SENSOR PS pressure sensor PF pressure sensor FEATURES. Ultra-miniature size (for PS pressure sensor). High-level precision and linearity. Impressive line-up of models Taking their place alongside the standard kω bridge resistance models are those with a.kω resistance which is optimally suited to V drive circuits. Economy model (no glass base) gives outstanding value for consumer appliances kpa (. kgf/cm ) and 9 kpa (. kgf/ cm ) units are also available. TYPICAL APPLICATIONS (Please evaluate under actual conditions before using.) Industrial use (pressure switches and pneumatic devices, etc.) Medical use (blood pressure monitors, compressed air pressure measurement, air beds, etc.) Other pneumatically operated pressure devices RoHS compliant ORDERING INFORMATION <Product name> : PF pressure sensor : PS pressure sensor ADP <Terminal profile and > : DIP terminal (Direction opposite the pressure inlet ) : DIP terminal (Pressure inlet ) <Rated pressure> :.9 kpa :. kpa : 9. kpa : 98. kpa : 9. kpa :. kpa 7: 9. kpa 8: 8. kpa 9: 98.7 kpa A:. kpa <Type> : Standard type (With glass base) : Economy type (Without glass base) <Bridge resistance> Nil: : : PF kω PS kω.kω Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types. ASCTB8E 7-T

2 PS (ADP)/PF (ADP) TYPES. DIP terminal Part No. Brige resistance PS pressure sensor PF pressure sensor kω.kω kω.kω Terminal Pressure Direction opposite the pressure inlet Pressure inlet Direction opposite the pressure inlet Pressure inlet Direction opposite the pressure inlet Pressure inlet Direction opposite the pressure inlet Pressure inlet.9kpa ADP ADP ADP ADP.kPa ADP ADP ADP ADP 9.kPa ADP ADP ADP ADP Standard type 98.kPa ADP ADP ADP ADP ADP ADP (with glass 9.kPa ADP ADP ADP ADP base).kpa ADP ADP ADP ADP 9.kPa ADP7 ADP7 ADP7 ADP7 8.kPa ADP8 ADP8 ADP8 ADP8 98.7kPa ADP9 ADP9 ADP9 ADP9 ADP9 ADP9 Economy type (without glass.kpa ADPA ADPA ADPA ADPA base) Standard packing: Carton: pcs.; Case:, pcs. RATING Type Standard type (With glass base) Economy type (Without glass base) Type of pressure Gauge pressure Pressure medium Air* Rated pressure Unit: kpa.9. to * 98.7*. Max. applied pressure Twice the rated pressure. times the rated pressure Twice the rated pressure Notes: *. Unless otherwise specified, measurements were taken with a drive current of ±. ma and humidity ranging from % to 8%. *. Please consult us if a pressure medium other than air is to be used. *. For PS pressure sensor only *. This is the regulation which applies within the compensation temperature range. *. Please consult us if the intended use involves a negative pressure.. times the rated pressure Twice the rated pressure Bridge resistance ±Ω ±7Ω ±Ω Ambient temperature to C to F (no freezing or condensation) to + C + to + F Storage temperature to C to 8 F (no freezing or condensation) to +7 C to +8 F Standard temperature C 77 F C 8 F C 77 F Temperature compensation range Drive current (constant current) to C to F to C to F to C to F. ma DC. ma DC. ma DC Output span voltage ± mv ± mv ± mv.±. mv Offset voltage ± mv ± mv Linearity ±.7%FS ±.%FS ±.%FS ±.%FS ±.%FS ±.%FS Pressure hysteresis ±.%FS ±.%FS ±.%FS ±.%FS ±.7%FS Offset voltage-temperature * ±%FS ±.%FS ±.%FS ±%FS Sensitivity-temperature * ±%FS ±.%FS ±.%FS ASCTB8E 7-T

3 REFERENCE DATA [PS pressure sensor]. Characteristics data.-() Output ADP9 Drive current:. ma; temperature: C 8 F Output voltage (mv) 98.7/ 98.7 Pressure, kpa.-() Offset voltage temperature ADP9 Drive current:. ma; rating ±.%FS Offset voltage temperature (%FS) Temperature, C F PS (ADP)/PF (ADP).-() Sensitivity temperature ADP9 Drive current:. ma; rating ±.%FS Sensitivity temperature (%FS) Temperature, C F. Pressure cycle range ( to rated pressure) Tested sample: ADP9, temperature: C F, No. of cycle: Offset voltage range Output span voltage range Offset voltage range (%FS) Output span voltage range (%FS) Even after testing for million times, the variations in the offset voltage and output span voltage are minimal. Pressure cycle, cycle Pressure cycle, cycle [PF pressure sensor]. Characteristics data -() Output ADP Drive current:. ma; temperature: C 77 F Output voltage (mv) Pressure, kpa -() Offset voltage temperature ADP Drive current:. ma; rating ±%FS Offset voltage temperature (%FS) 7 Temperature, C F -() Sensitivity temperature ADP Drive current:. ma; rating ±.%FS Sensitivity temperature (%FS) 7 Temperature, C F ASCTB8E 7-T

4 PS (ADP)/PF (ADP). Pressure cycle range ( to rated pressure) Tested sample: ADP, temperature: C 77 F Offset voltage range Output span voltage range Offset voltage range (%FS) Output span voltage range (%FS) Even after testing for million times, the variations in the offset voltage and output span voltage are minimal. Pressure cycle, cycle Pressure cycle, cycle Evaluation test Classification Tested item Tested condition Result Storage at high temperature Temperature: Left in a C 8 F constant temperature bath Time:, hrs. Environmental Endurance Mechanical Soldering resistance Storage at low temperature Humidity Temperature cycle High temperature/high humidity operation Vibration resistance Dropping resistance Terminal strength Soldered in DIP soldering bath Temperature Note: For details other than listed above, please consult us. Temperature: Left in a C F constant temperature bath Time:, hrs. Temperature/humidity: Left at C F, 9% RH Time:, hrs. Temperature: C to C F to 8 F cycle: Min. Times of cycle: Temperature/humidity: C F, 9% RH Operation times:, rated voltage applied Double amplitude:. mm.9 inch Vibration: to Hz Applied vibration : X, Y, Z s Times: hrs each Dropping height: 7 cm 9.8 inch Times: times Pulling strength: 9.8 N { kgf}, sec. Bending strength:.9 N {. kgf}, left and right 9 time Temperature: C F Time: sec. Temperature: C F Time: sec. ASCTB8E 7-T

5 DIMENSIONS (mm inch) [PS pressure sensor]. Terminal : DIP terminal Direction opposite the pressure inlet ADP CAD Data 7..8 PS (ADP)/PF (ADP) The CAD data of the products with a CAD Data mark can be downloaded from: Recommended PC board pattern (BOTTOM VIEW) -.9 dia. -. dia. Pressure inlet hole. dia.. dia dia..7 dia.. dia..98 dia Atmospheric pressure inlet hole JAPAN R. R.8 8. Max.. Max General tolerance: ±. ± Terminal connection diagram +Output R R +Input Input R R is no connection Output Terminal No. Name Power supply (+) Output (+) Power supply ( ) Power supply ( ) Output ( ) No connection Note: Leave terminal unconnected.. Terminal : DIP terminal Pressure inlet ADP CAD Data 7..8 Recommended PC board pattern (BOTTOM VIEW) -.9 dia. -. dia. Pressure inlet hole. dia.. dia Atmospheric pressure inlet hole JAPAN dia..7 dia dia dia Max.. Max. R. R.8 General tolerance: ±. ±. dia..97 dia Terminal connection diagram +Input R R Terminal No. +Output R R Output Input is no connection Name Power supply (+) Output (+) Power supply ( ) Power supply ( ) Output ( ) No connection Note: Leave terminal unconnected. ASCTB8E 7-T

6 PS (ADP)/PF (ADP) [PF pressure sensor]. Terminal : Direction opposite the pressure inlet derection ADP ( ) CAD Data Recommended PC board pattern (BOTTOM VIEW) Atmospheric pressure inlet hole.9 Pressure inlet hole.8 dia.. dia. -.9 dia. -. dia dia..8 dia... C. C R. R. to Tolerance: ±. ±. Terminal connection diagram +Input R R +Output Output R R Input JAPAN General tolerance: ±. ±. Terminal No. Name Output ( ) Power supply (+) Output (+) No connection Power supply ( ) Output ( ) Note: Leave terminal unconnected.. Terminal : Pressure inlet ADP ( ) CAD Data Recommended PC board pattern (BOTTOM VIEW) Atmospheric pressure inlet hole.9 Pressure inlet hole.8 dia.. dia. -.9 dia. -. dia dia.. dia R.. dia..8 dia. C.. to Tolerance: ±. ±. Terminal connection diagram +Input Output R R Output R R JAPAN General tolerance: ±. ±. Input Terminal No. Name Output ( ) Power supply (+) Output (+) No connection Power supply ( ) Output ( ) Note: Leave terminal unconnected. ASCTB8E 7-T

7 NOTES. Mounting Use lands on the PC boards to which the sensor can be securely fixed.. Soldering Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. ) Manual soldering Set the soldering tip from to C to 7 F (W), and solder for no more than seconds. Please note that output may change if the pressure is applied on the terminals when the soldering. Thoroughly clean the soldering iron. ) DIP soldering (DIP terminal type) Please keep the DIP solder bath temperature no higher than C F. When soldering, heat should be applied no longer than five seconds. When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. ) Solder reworking Finish reworking in one operation. For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. ) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. ) Please control warping of the PCB within. mm of the sensor width. ) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder.. Cleaning ) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. ) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.. Environment ) Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. ) Since this pressure sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. ) Avoid using the pressure sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. ) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. ) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. PS (ADP)/PF (ADP). Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance.. Other handling precautions ) That using the wrong pressure range or mounting method may result in accidents. ) The only direct pressure medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. ) The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked. ) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. ) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. () When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. () When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. ) Based on the pressure involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. ASCTB8E 7-T

8 PS (ADP)/PF (ADP) APPLICATION CIRCUIT DIAGRAM (EXAMPLE) The pressure sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the pressure sensor is used. Amplifier circuit unit Constant current circuit unit Pressure sensor OP AMP OP AMP OP AMP MOUNTING METHOD The general method for transmitting air pressures differs depending on whether the pressure is low or high. Checkpoints for use () Select a pressure inlet pipe which is sturdy enough to prevent pressure leaks. () Fix the pressure inlet pipe securely so as to prevent pressure leaks. () Do not block the pressure inlet pipe. Methods of transmitting air pressures When the pressure When the pressure is low is high (.9 to 98. kpa) (9. to 98.7 kpa) PC board Tube PC board O-ring Pressure inlet pipe If a tube is used as the pressure inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings. ASCTB8E 7-T