Selection Guide. Thermal Solutions

Transcription

1 Selection Guide Thermal Solutions

2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad Thermally Conductive Insulators More than 20 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad. Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet critical needs of a rapidly changing electronics industry. The Sil-Pad family of elastomeric thermal interface materials encompasses dozens of products, each with its own unique construction, properties and performance. Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Sil-Pad 900S Thermal impedance: 0.61 C-in2/W (@50 psi) Electrically isolating Low mounting pressures Smooth and highly compliant surface General-purpose thermal interface material solution Power supplies Thickness: (0.229mm) (Vac): 5500 Thermal Conductivity: 1.6 W/m-K Sil-Pad 1100ST Thermal impedance: 0.66 C-in2/W (@50 psi) Inherent tack on both sides Pad is re-positionable Excellent thermal performance at low pressures Electrically isolating Auto-placement Auto-dispensable Power supplies Thickness: (0.305mm) (Vac): 5000 Thermal Conductivity: 1.1 W/m-K Sil-Pad C-in2/W (@50 psi) Exceptional thermal performance at lower application pressures Smooth and non-tacky on both sides Superior breakdown voltage and surface wet out values Designed for applications where electrical isolation is critical Excellent cut-through resistance Power supplies Audio amplifiers Discrete devices Thickness: ( mm) (Vac): 6000 Thermal Conductivity: 1.8 W/m-K Sil-Pad provides: Excellent thermal performance Eliminates the mess of grease More durable than mica Efficient total applied cost that compares favorably with other alternatives Sil-Pad K-10 Sil-Pad A1500 Q-Pad 3 Sil-Pad 1500ST (soft tack) high performance thermal interface material is designed specifically for use in highvolume auto-dispensing and auto-placement applications. Thermal impedance: 0.41 C-in2/W (@50 psi) Tough dielectric barrier against cut-through High performance film Designed to replace ceramic insulators Power supplies CAGE Number U.L. File Number E59150 Thickness: (0.152mm) (Vac): 6000 Thermal Conductivity: 1.3 W/m-K Construction: Silicone/Film 0.42 C-in2/W (@50 psi) Elastomeric compound coated on both sides Power supplies Thickness: (0.254mm) (Vac): 6000 Thermal Conductivity: 2.0 W/m-K 0.35 C-in2/W (@50 psi) Eliminates grease processing constraints Electrically isolating and easy to handle Conforms to surface textures Installation prior to soldering and cleaning Between a transistor and a heat sink Between two large surfaces such as an L-bracket and the chassis of an assembly Between a heat sink and a chassis Under electrically isolated power modules or devices such as resistors or transformers U.L. File Number E59150 Thickness: (0.127mm) (Vac): N/A Thermal Conductivity: 2.0 W/m-K

3 Gap Pad Thermally Conductive Gap Filling Materials The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry s growing need for interface materials with greater conformability, higher thermal performance and easier application. The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement. Gap Pad provides: Elimination of air gaps to reduce thermal resistance High conformability to reduce interfacial resistance Low-stress application assembly Gap Pad VO Ultra Soft Highly conformable, low hardness Gel-like modulus Designed for low-stress applications Puncture, shear and tear resistant Power conversion Between heat-generating semiconductors or magnetic components and a heat sink Area where heat needs to be transferred to a frame, chassis or other type of heat spreader Thickness: ( mm) Hardness, Bulk Rubber (Shore 00): 5 (Vac): >6000 Thermal Conductivity: 1.0W/m-K Gap Pad 1500R Fiberglass reinforced for puncture, shear and tear resistance Easy release construction Electrically isolating Power conversion RDRAM memory modules / chip scale packages Area where heat needs to be transferred to a frame, chassis or other type of heat spreader Thickness: ( mm) Hardness, Bulk Rubber (Shore 00): 40 (Vac): >6000 Thermal Conductivity: 1.5W/m-K Gap Pad 5000S35 Highly conformable, S-Class softness Natural inherent tack reduces interfacial thermal resistance Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads Fiberglass reinforced for puncture, shear and tear resistance Excellent thermal performance at low pressures CD ROM / DVD ROM Voltage Regulator Modules (VRMs) and POLs Thermally-enhanced BGAs Memory packages / modules PC Board to chassis ASICs and DSPs Thickness: ( mm) Hardness, Bulk Rubber (Shore 00): 35 (Vac): >5000 Thermal Conductivity: 5.0W/m-K Gap Filler 1000 (Two-Part) Gap Filler 1500 (Two-Part) Gap Filler 3500S35 (Two-Part) Bergquist Gap Filling materials deliver superior thermal conductivity and are the ideal solution for liquid dispensed applications. As form-in-place elastomers, their ultra-conforming properties provide infinite-thickness coverage for uneven board topography. They are ideal for fragile and low-stress applications such as power electronics and discrete devices. As cured, these products are dry to the touch, with no cure by-products, for a cleaner assembly. Bergquist Gap Filler offerings include a range of rheological characteristics and can be tailored to meet customer specific flow requirements. Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure schedules 100% solids - no cure by-products Excellent low and high temperature mechanical and chemical stability Between any heat-generating semiconductor and a heat sink Density (g/cc): 1.6 Hardness (Shore 00): 30 Dielectric Strength (V/mil): 500 Thermal Conductivity: 1.0W/m-K Optimized shear thinning* Stays in place, highly slump resistant Ultra-conforming, designed for fragile and low stress applications No cure by-products Between any heat -generating semiconductor and a heat sink Density (g/cc): 2.7 Hardness (Shore 00): 50 Dielectric Strength ( V/mil): 400 Thermal Conductivity: 1.8W/m-K * Optimized Shear Thinning - Maximizes dispensing capacity. Two-part formulation for easy storage Thixotropic nature makes it easy to dispense Ultra-conforming, designed for fragile and low-stress applications Ambient or accelerated cure schedules Discrete components to housing PCBA to housing Fiber optic telecommunications equipment Density (g/cc): 3.0 Hardness (Shore 00): 35 Dielectric Strength (V/mil): 275 Thermal Conductivity: 3.6W/m-K

4 Hi-Flow Phase Change Interface Materials Hi-Flow 565UT Hi-Flow 225F-AC Hi-Flow 650P Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure total wet-out of the interface without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle C-in2/W (@25 psi) Used where electrical isolation is not required Low volatility - less than 1% Easy to handle in the manufacturing environment Spring or clip mount applications where thermal grease is used Microprocessors mounted on a heat sink Power conversion modules Thickness: 0.005, (0.127mm, 0.254mm) Reinforcement Carrier: None Continuous Use Temp: 125 C Thermal Conductivity: 3.0 W/m-K 0.10 C-in2/W (@25 psi) Can be manually or automatically applied to the surfaces of a roomtemperature heat sink Foil reinforced, adhesive-coated Soft, thermally conductive 55 C phase change compound Power conversion High performance computer processors Power modules Thickness: (0.102mm) Reinforcement Carrier: Aluminum Continuous Use Temp: 120 C Thermal Conductivity: 1.0 W/m-K 0.20 C-in2/W (@25 psi) Field-proven polyimide film Excellent dielectric performance Excellent cut-through resistance Spring / clip-mounted Discrete power semiconductors and modules Thickness: ( mm) Reinforcement Carrier: Polyimide Continuous Use Temp: 150 C Thermal Conductivity: 1.5W/m-K Thermally Conductive Adhesives Bond-Ply 100 Bond-Ply 660P Liqui-Bond SA 1800 The above application photo depicts TO-251 components fully bonded to a heat sink utilizing Bond-Ply LMS 500P lamination. Bergquist Liquid Adhesives provide mechanical attachment of the component to the heat sink with thermal transfer properties without the need for added fasteners. The thixotropic characteristics make these materials an ideal fit automated or manual dispensing. High bond strength to a variety of surfaces Double-sided, pressure-sensitive adhesive tape High performance, thermally conductive acrylic adhesive Can be used instead of heat-cure adhesive, screw mounting or clip mounting Mount heat sink onto BGA graphic processor or drive processor Mount heat spreader onto power converter PCB or onto motor control PCB Thickness: 0.005/0.008/0.011 (0.127/0.203/0.279mm) Reinforcement Carrier: Fiberglass (Vac): 3000/6000/8500 Thermal Conductivity: 0.8W/m-K Designed to replace mechanical fasteners or screws For applications that require electrical isolation Double-sided pressure sensitive adhesive tape Heat sink onto BGA processor Heat sink onto drive processor Heat spreader onto power converter PCB Heat spreader onto motor control PCB Thickness: (0.203mm) Reinforcement Carrier: Film (Vac): 6000 Thermal Conductivity: 0.4W/m-K Eliminates the need for mechanical fasteners One-part formulation for easy dispensing Mechanical and chemical stability Maintains structural bond in severe-environment applications Heat cure PCBA to housing Discrete component to heat spreader Density (g/cc): 2.8 Hardness (Shore A): 80 Dielectric Strength (V/mil): 250 Thermal Conductivity: 1.8W/m-K

5 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Thermal Clad Insulated Metal Substrates Thermal Clad is a versatile substrate allowing circuit boards to be configured for shapes, bends and multiple thicknesses. In this motor control application, the dielectric has been selectively removed and the metal formed with three-dimensional features. IMS Circuit Boards Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards (PWB s). These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications. Additional Thermal Clad benefits: Increased power density Extend the life of dies Improved product thermal and mechanical performance Better use of surface mount technology Panels Thermal Clad substrates are available in panel form. Material selection should be based on thermal, dielectric and mechanical application requirements. Circuit layer oz-10 oz Dielectric layer - HT, HPL or MP Base plate copper or aluminum ( mm) Panels 18 x 24 (457.2 x 609.6mm), 18 x 25 (457.2 x 635mm) and 20 x 24 (508 x 609.6mm) IsoEdge Ideal for use in DC/DC converter applications, IsoEdge high thermal performance technology replaces older flat-based heat sinks and insulators used in combination to meet safety agency criteria. IsoEdge s thin powder dielectric coating provides excellent heat transfer with inherent 3-D dielectric safety while minimizing time-consuming assembly and safety approval times. Circuit Layer 0.50 oz to 10 oz Base Layer Copper or Aluminum Dielectric Layer ( HT, HPL, MP ) HT Anatomy of a Thermal Clad Board PRODUCT FAMILY THERMAL PERFORMANCE DIELECTRIC PERFORMANCE OTHER Part Number HT HT HT (1) Thickness (10-3in/10-6m) 3/76 6/152 9/229 (2) Impedance (ºC/W) (3) Conductivity (W/m-K) (4) Breakdown (kvac) (5) Glass Transition ( C) HPL HPL / MP MP / Method Description: 1-ASTM D374 2-Internal TO-220 test RD Extended ASTM ASTM D149 5-Internal MDSC test RD UL File QMTS2-E (Temperature Index) Power Conversion Heat-Rail and Forming Panels Motor Drives Due to the size constraints and watt-density requirements in DC/ DC conversion, Thermal Clad has become the favored choice. Thermal Clad offers a variety of thermal performances, is compatible with mechanical fasteners and is highly reliable. It can be used in almost every form-factor and fabricated in a wide variety of substrate metals, thicknesses and copper foil weights. The use of Thermal Clad in heat-rail applications has grown significantly and is currently used in automotive, audio, motor control and power conversion applications. Utilizing the many advantages of surface mount assembly, attachment capabilities and high thermal performance, Thermal Clad offers a cost effective solution for heat management. When using Thermal Clad as the metal base substrate, the assembly process can be fully automated, thus eliminating the high labor cost of hand assembly. T-Clad also allows for unique shape requirements as it can be custom formed. In high-brightness LED applications, light output and long life are directly attributable to how well the LEDs are managed thermally. Thermal Clad is an excellent solution for designers. Because T-Clad is a metal based material, it can be configured for custom shapes and thicknesses thus allowing the designer to put high-brightness LEDs in virtually any application. Mounting highbrightness LEDs on T-Clad assures the lowest possible operating temperatures and maximum brightness, color and life. Compact high reliability motor drives built on Thermal Clad have set the benchmark for watt-density. Dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements. With the ability to fabricate in a wide variety of formfactors, the implementation into either compact or integrated motors drives is realized. The availability of Thermal Clad HT makes high temperature operation possible.

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