Surface-mount Fuses Fundamentals

Transcription

1 Surface-mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from.5a up to 20A. TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-089, TIA-968-A (formerly FCC Part 68), and UL rd edition. Surface-mount Fuses Fundamentals Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc. Figure Glass/Ceramic Substrate Multiple Fuse Elements Substrate Material Single Fuse Element Glass Coating Figure compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach. Figure 2 Multi-layer Design Fault Zones Single-layer Glass Coated Design Figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure. Multi-layer Design Single-layer Glass Coated Design Wire-In-Air Design for 240SFV Fuses The 240(625) is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications. Figure 3 compared our straight wire element design 240SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability. Introduced PCB assembly technology into 240SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse. Figure 3 Glass fiber enforced epoxy body Straight wire element Copper terminal plated with Ni and Tin Ceramic body Corrugate wire element End cap plated with Tin 75

2 Temperature Derating A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime. Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure 4. Use it to determine the derating percentage based on operating temperature and apply it to the derated system current. Figure 4 % of Carrying Capacity 206/0603/0402 Series Themal Derating Curve 240 Series Temperature Effect On Rating % Maximum Operating Temperature ( C) Maximum Operating Temperature ( C) % De-rating Pulse Cycle Derating Once the I 2 t value for the application waveform has been determined, it must be derated based on the number of cycles expected over the system lifetime. Since the stress induced by the current pulse is mechanical in nature, the number of times the stress is applied has significant bearing on how much derating must be applied to the fuse rating. Figure 5 presents the current pulse derating curve for our surface-mount chip fuses up to,000 cycles. Figure 5 % of Minimum I 2 t % Surface-mount Fuse Pulse Derating Curve 0% Number of Pulses Selecting Surface-mount Fuses Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system operating current. Unfortunately, it s not that simple. There are derating considerations for operating current and application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as knowing the nominal current drawn by the system. Fuse Selection Flowchart However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart will help you select a fuse best suited for your application conditions. Figure 6 Step Determine Steady State Fuse Rating Apply Standard Steady State Derating (75%) [I fuse I sys /0.75] Apply Temperature Derating [I fuse I sys /0.75/K temp ] Steady State Fuse Rating Step 2 Determine Pulse Waveform by Calculating I 2 t Step 3 Apply Pulse Cycle Derating Step 4 Apply Pulse Temperature Derating Step 5 Apply Derating for Variance in the Circuit Step 6 Select Fuse Rating for Pulse Environment Step 7 Select Fuse Rating (use higher value between Step and Step 6) Step 8 Check Voltage Rating 76

3 Surface-mount Fuses Pulse Tolerant Chip Fuses Pulse Tolerant chip fuses has high inrush current withstand capability and provide overcurrent protection on DC power systems. Silver fusing element, monolithic and multilayer design provides strong arc suppression characteristics. These RoHS-compliant surface-mount devices facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. NEW Surface-mount Fuses Pulse Tolerant Chip Fuses Benefits High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating Excellent temperature stability Strong arc suppression characteristics Features Lead free materials and RoHS compliant Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 500ppm) Monolithic, multilayer design High-temperature performance -55 C to +25 C operating temperature range Applications Laptops Digital cameras Cell phones Printers DVD players Portable electronics Game systems LCD monitors Scanners 77

4 Table FP Clear Time Characteristics for Pulse Tolerant Chip Fuses % of rated current Clear time at 25 C % 4 hours (min.) 200% seconds (min.) 60 seconds (max.) 0% second (min.) 0.02 seconds (max.) Table FP2 Typical Electrical Characteristics and Dimensions for Pulse Tolerant Chip Fuses 0603 (608 mm) Pulse Tolerant Chip Fuses Typical Electrical Characteristics Max. Interrupt Ratings Shape and Dimensions mm (Inch) A B C D Min Max Min Max Min Max Min Max mm in (0.057) (0.069) (0.026) (0.037) (0.008) (0.020) (0.026) (0.037) D C A B Part Number Rated Cold DCR (Ω)* I 2 t (A 2 sec) Voltage (V DC ) 0603SFPF/ SFP50F/ SFP200F/ SFP250F/ SFP300F/ SFP350F/ SFP400F/ SFP450F/ SFP500F/ (326 mm) Pulse Tolerant Chip Fuses Shape and Dimensions mm (Inch) D A B C D Min Max Min Max Min Max Min Max mm in (0.8) (0.34) (0.030) (0.046) (0.00) (0.030) (0.055) (0.07) C A B Part Number Typical Electrical Characteristics Rated Cold DCR (Ω)* I 2 t (A 2 sec) 206SFPF/ SFP50F/ SFP200F/ SFP250F/ SFP300F/ SFP350F/ SFP400F/ SFP450F/ SFP500F/ * Measured at 0% of rated current and 25 C ambient temperature. Melting I 2 t at 0.00 sec clear time. Max. Interrupt Ratings Voltage (V DC ) 78 RoHS Compliant, ELV Compliant HF Halogen Free

5 Figure FP-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Figure FP ClearTime (s) A.5A 0603SFP Average Time Curves 2.0A 2.5A 3.0A 3.5A 4.0A 4.5A 5.0A Surface-mount Fuses Pulse Tolerant Chip Fuses Figure FP2 0, SFP I 2 T vs. t Curves 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A.5A.0A I 2 t (A 2 s) Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 79

6 Figure FP-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Cont d Figure FP3 206SFP Average Time Curves.0A.5A 2.0A 2.5A 3.0A 3.5A 4.0A 4.5A 5.0A 0,000 ClearTime (s) Figure FP4 206SFP I 2 T vs. t Curves 0, A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A.5A.0A I 2 t (A 2 s) ,000 Time (s) Note: Curves are nominal Please go to page 97 for more information for Pulse Tolerant Chip Fuses. 80 RoHS Compliant, ELV Compliant HF Halogen Free

7 Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses Very Fast-acting chip fuses help provide overcurrent protection on systems using DC power sources up to 63V DC. The fuse s monolithic, multilayer design provides the highest hold current in the smallest footprint, reduces diffusion-related aging, improves product reliability and resilience, and enhances high-temperature performance in a wide range of circuit designs. These RoHS-compliant surface-mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. NEW Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses Benefits Very fast acting at 200% and 300% overloads Excellent inrush current withstanding capability at high overloads Thin body for space limiting applications Glass ceramic monolithic structure Silver fusing element and silver termination with nickel and tin plating RoHS compliant and lead-free materials Symmetrical design with marking on both sides (optional) Features Lead free materials and RoHS compliant Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 500ppm) Monolithic, multilayer design High-temperature performance -55 C to +25 C operating temperature range Applications Laptops Digital cameras Cell phones Printers DVD players Portable electronics Game systems LCD monitors Scanners 8

8 Table FV Clear Time Characteristics for Very Fast-Acting Chip Fuses % of rated current Clear time at 25 C % 4 hours (min.) 200% 0.0 second (min.) 5 seconds (max.) 300% 0.00 second (min.) 0.2 seconds (max.) Table FV2 Typical Electrical Characteristics and Dimensions for Very Fast-Acting Chip Fuses 0603 (608 mm) Very Fast-Acting Chip Fuses Shape and Dimensions mm (Inch) A B C D Min Max Min Max Min Max Min Max mm in (0.057) (0.069) (0.009) (0.09) (0.008) (0.020) (0.025) (0.037) D C A B Part Number Rated 0603SFV050F/ SFV075F/ SFVF/ SFV25F/ SFV50F/ SFV75F/ SFV200F/ SFV250F/ SFV300F/ SFV350F/ SFV400F/ SFV450F/ SFV500F/ * Measured at 0% of rated current and 25 C Typical Electrical Characteristics Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) Figure FV-FV2 Family Performance Curves for Very Fast-Acting Chip Fuses Figure FV Figure FV A 0.75A.00A.25A 0603SFV Average Time Curves.75A 2.00A.50A 2.50A 3.00A 3.50A 4.00A 4.50A 5.00A SFV I²t vs. t Curves 5.00A 4.50A 4.00A 3.50A 3.00A 2.50A 2.00A.75A.50A.25A.00A 0.75A 0.05A ClearTime (s) 0. I²t (A²s) Note: Curves are nominal Time (s) Please go to page 97 for more information for Very Fast-Acting Chip Fuses. 82 RoHS Compliant, ELV Compliant HF Halogen Free

9 Fast-acting chip fuses help provide overcurrent protection on systems using DC power sources up to 63V DC. The fuse s monolithic, multilayer design provides the highest hold current in the smallest footprint, reduces diffusionrelated aging, improves product reliability and resilience, and enhances high-temperature performance in a wide range of circuit designs. Surface-mount Fuses Fast-Acting Chip Fuses These RoHS-compliant surface-mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics. Surface-mount Fuses Fast-Acting Chip Fuses Benefits Small size with high-current ratings Excellent temperature stability High reliability and resilience Strong arc suppression characteristics Features Lead free materials and RoHS compliant Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 500ppm) Monolithic, multilayer design High-temperature performance -55 C to +25 C operating temperature range Applications Laptops Digital cameras Cell phones Printers DVD players Portable electronics Game systems LCD monitors Scanners 83

10 Table FF Clear Time Characteristics for Fast-Acting Chip Fuses % of rated current Clear time at 25 C % 4 hours min. 250% 5 seconds max. 400% 0.05 seconds max. Table FF2 Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for Fast-Acting Chip Fuses 0402 (5mm) Fast-Acting Chip Fuses Shape and Dimensions Inch (mm) Recommended Pad Layout Inch (mm) 0.020±0.004 (0.5±0.0) (0.60) 0.00±0.004 (0.25±0.0) (.60) 0.06 (0.40) 0.039±0.004 (.00±0.0) 0.020±0.004 (0.5±0.0) (0.70) Part Number Typical Electrical Characteristics Rated Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) 0402SFF050F/ SFF075F/ SFFF/ SFF50F/ SFF200F/ SFF300F/ SFF400F/ (608mm) Fast-Acting Chip Fuses Shape and Dimensions Inch (mm) 0.03±0.006 (0.80±0.5) 0.063±0.006 (.60±0.5) Part Number Typical Electrical Characteristics Rated Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) 0.03±0.006 (0.80±0.5) 0603SFF050F/ SFF075F/ ±0.006 (0.36±0.5) 0603SFFF/ SFF50F/ Recommended Pad Layout Inch (mm) 0.0 (2.80) (0.60) (.00) 0603SFF200F/ SFF250F/ SFF300F/ SFF350F/ SFF400F/ (.09) 0603SFF500F/ SFF600F/ (326mm) Fast-Acting Chip Fuses Typical Electrical Characteristics Max. Interrupt Ratings Shape and Dimensions Inch (mm) 0.063±0.008 (.60±0.20) 0.26±0.008 (3.20±0.20) Part Number Rated Cold DCR (Ω)* I 2 t (A 2 sec) Voltage (V DC ) 206SFF050F/ SFF075F/ SFFF/ ±0.008 (.0±0.20) 206SFF50F/ SFF75F/ SFF200F/ SFF250F/ Recommended Pad Layout Inch (mm) 0.020±0.00 (0.5±0.25) 0.73 (4.40) (.50) 206SFF300F/ SFF400F/ SFF500F/ SFF600F/ SFF700F/ (.45) 0.07 (.80) 206SFF800F/ SFF600F/ SFF700F/ SFF800F/ * Measured at 0% of rated current and 25 C ambient temperature. Melting I 2 t at 0.00 sec clear time. 84 RoHS Compliant, ELV Compliant HF Halogen Free

11 Figure FF-FF6 Family Performance Curves for Fast-Acting Chip Fuses Figure FF Clear-Time (s) SFF Average Time Curves 0.5A.0A.5A 0.75A 2.0A 3.0A 4.0A Figure FF2 I²t (A²s) SFF I²t vs. t Curves 4.0A 3.0A 2.0A.5A.0A 0.75A 0.5A Surface-mount Fuses Fast-Acting Chip Fuses Note: Curves are nominal Time (s) Figure FF3 Figure FF4 0603SFF Average Time Curves 0.5A.0A.5A 2.0A 2.5A 3.0A 3.5A 4.0A 5.0A 6.0A 0.75A 0603SFF I²t vs. t Curves Clear-Time (s) 0 0. I²t (A²s) A 5.0A 4.0A 3.5A 3.0A 2.5A 2.0A.5A.0A 0.75A 0.5A Note: Curves are nominal Time (s) RoHS Compliant, ELV Compliant HF Halogen Free 85

12 Figure FF-FF6 Family Performance Curves for Fast-Acting Chip Fuses Cont d Figure FF5 Figure FF6 0.5A 0.75A.0A.5A.75A 2.0A 2.5A 3.0A 4.0A 5.0A 6.0A 7.0A 8.0A 206SFF Average Time Curves 206SFF I²t vs. t Curves A 7.0A 6.0A 5.0A 4.0A 3.0A 2.5A 2.0A.75A.5A.0A 0.75A Clear-Time (s) 0. I²t (A²s) 0 0.5A Time (s) Note: Curves are nominal Please go to page 97 for more information for Fast-Acting Chip Fuses. 86 RoHS Compliant, ELV Compliant HF Halogen Free

13 Surface-mount Fuses High--Rated Chip Fuses The monolithic multilayer design of the TE Circuit Protection high-current-rated chip fuses helps to provide some of the highest current ratings available in the 206 size and enhances high-temperature performance in a wide range of circuit protection designs. The devices small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, servers, communications equipment, voltage regulator modules, and other high-current, small size applications. High- Rated Chip Fuses Benefits Glass ceramic monolithic structure provides stability in application cycling High-current rating in a small package allows more efficient use in system space Strong arc suppression in overcurrent conditions Features Lead free materials and RoHS compliant Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 500ppm) Monolithic multilayer design High-temperature performance -55 C to +25 C operating temperature range Applications Communications equipment Voltage regulator modules Power supplies Servers 87

14 Table FH Clear Time Characteristics for High--Rated Chip Fuses 206SFH Series % of rated current Clear time at 25 C % 4 hours (min.) 250% 5 seconds (max.) Table FH2 Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for High--Rated Chip Fuses 206 (326mm) High--Rated Chip Fuses Shape and Dimensions Inch (mm) 0.063±0.008 (.60±0.20) 0.26±0.008 (3.20±0.20) Part Number Rated Typical Electrical Characteristics Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) 206SFHF/ ±0.008 (0.97±0.20) 206SFH20F/ SFH50F/ SFH200F/ ±0.00 (0.5±0.25) * Measured at 0% of rated current and 25 C ambient temperature. Melting I 2 t at 0.00 sec clear time. Recommended Pad Layout Inch (mm) 0.73 (4.40) (.50) 0.07 (.80) (.45) Figure FH-FH2 Family Performance Curves for High--Rated Chip Fuses Figure FH Figure FH SFH Average Time Curves 0A 2A 5A 20A SFH I²t vs. t Curves 20A 5A 2A 0A 0 ClearTime (s) 0. I²t (A²s) Note: Curves are nominal Time (s) Please go to page 97 for more information for High--Rated Chip Fuses. 88 RoHS Compliant, ELV Compliant HF Halogen Free

15 Surface-mount Fuses Slow-Blow Chip Fuses Available in industry standard 206 and 0603 chip sizes, TE Circuit Protection s slow-blow chip fuses help provide overcurrent protection on systems that experience large and frequent current surges as part of their normal operation. The slow-blow chip fuse s monolithic, multilayer design helps provide some of the highest current ratings available in the 206 and 0603 footprints and enhances high-temperature performance in a wide range of circuit protection designs. The devices small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, capacitor filter banks, LCD (Liquid Crystal Display) backlight inverters, electric motors and portable electronics. Surface-mount Fuses Slow-Blow Chip Fuses Benefits Time-delayed design prevents nuisance openings in pulsed and high inrush current applications Small size with high-current ratings Strong arc suppression characteristics Features Lead free materials and RoHS compliant Halogen free (refers to: Br 900ppm, Cl 900ppm, Br+Cl 500ppm) Monolithic multilayer design High-temperature performance -55 C to +25 C operating temperature range Applications Small motors systems Portable electronics Input power ports Power over Ethernet (POE) Test equipment POL converter protection Computer drives Displays Printers 89

16 Table FS Clear Time Characteristics for Slow-Blow Chip Fuses 0603SFS Series % of rated current Clear time at 25 C % 4 hours (min.) 200% second (min.) 20 seconds (max.) 300% 0. second (min.) 3 seconds (max.) 800%(.0A-.5A) second (min.) 0.05 seconds (max.) 800%(2.0A-5.0A) 0.00 second (min.) 0.05 seconds (max.) 206SFS Series % of rated current Clear time at 25 C % 4 hours (min.) 200% second (min.) 20 seconds (max.) 300% 0. second (min.) 3 seconds (max.) 800%(.0A-.5A) second (min.) 0.05 seconds (max.) 800%(2.0A-8.0A) second (min.) 0.05 seconds (max.) Table FS2 Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for Slow-Blow Chip Fuses 0603 (608mm) Slow-Blow Chip Fuses Shape and Dimensions Inch (mm) Recommended Pad Layout Inch (mm) 0.03±0.006 (0.80±0.5) (.09) 0.04±0.006 (0.36±0.5) 0.0 (2.80) (0.60) 0.063±0.006 (.60±0.5) 0.03±0.006 (0.80±0.5) (.00) Part Number Rated Typical Electrical Characteristics Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) 0603SFSF/ SFS50F/ SFS200F/ SFS250F/ SFS300F/ SFS350F/ SFS400F/ SFS450F/ SFS500F/ (326mm) Slow-Blow Chip Fuses Shape and Dimensions Inch (mm) 0.063±0.008 (.60±0.20) 0.26±0.008 (3.20±0.20) Part Number Rated Typical Electrical Characteristics Cold DCR (Ω)* I 2 t (A 2 sec) Max. Interrupt Ratings Voltage (V DC ) 206SFSF/ SFS25F/ ±0.008 (0.97±0.20) 206SFS50F/ SFS200F/ SFS250F/ ±0.00 (0.5±0.25) 206SFS300F/ Recommended Pad Layout Inch (mm) 0.73 (4.40) (.50) 0.07 (.80) 206SFS350F/ SFS400F/ SFS450F/ SFS500F/ SFS550F/ (.45) 206SFS600F/ SFS700F/ SFS800F/ * Measured at 0% of rated current and 25 C ambient temperature. Melting I 2 t at 0.00 sec clear time. 90 RoHS Compliant, ELV Compliant HF Halogen Free

17 Figure FS-FS4 Family Performance Curves for Slow-Blow Chip Fuses Figure FS ClearTime (s) A.5A 0603SFS Average Time Curves 2.0A 2.5A 3.0A 3.5A 4.0A 4.5A 5.0A Surface-mount Fuses Slow-Blow Chip Fuses Figure FS2 0, SFS I²t vs. t Curves 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A.5A.0A I 2 t (A 2 s) Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 9

18 Figure FS-FS4 Family Performance Curves for Slow-Blow Chip Fuses Cont d Figure FS3 2.5A 3.0A 3.5A 4.0A 4.5A 5.0A 5.5A 6.0A 7.0A 8.0A 206SFS Average Time Curves.0A.25A.5A 2.0A 0 ClearTime (s) Figure FS4 206SFS I²t vs. t Curves A 7.0A 6.0A 5.5A 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A.5A.25A.0A I 2 t (A 2 s) Time (s) Note: Curves are nominal Please go to page 97 for more information for Slow-Blow Chip Fuses. 92 RoHS Compliant, ELV Compliant HF Halogen Free

19 Surface-mount Fuses 240 Very Fast-Acting Fuses The 240(625) is Wire-in Air SMD Fuse which is very suitable for secondary level overcurrent protection applications. These lead-free surface mount devices offer more reliability and have no end cap falling off risk. Straight wire element in air performs consistent fusing and cutting characteristics. NEW Surface-mount Fuses 240 Very Fast-Acting Fuses Benefits Very fast acting at 200% overload current level Excellent inrush current withstanding capability High reliability and resilience Strong arc suppression characteristics Copper terminal with nickel and tin plated Features Halogen free, RoHS compliant and % lead-free Copper or copper alloy composite fuse link Fiberglass enforced epoxy fuse body Wide range of current rating -55 C to +25 C operating temperature range (with de-rating) Applications Industrial equipment LCD/PDP TV Backlight inverter Power supplier Telecom system Networking Game systems White goods Automotive 93

20 Table SFV Clear Time Characteristics for 240 Very Fast-Acting Fuses % of rated current Clear time at 25 C % 4 hours (min.) 200% (0.5A-0.0A) 0.0 second (min.) 5 seconds (max.) 200% (2.0A-20.0A) 0.0 second (min.) 20 seconds (max.) Table SFV2 Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for 240 Very Fast-Acting Fuses 240 (625 mm) Very Fast-Acting Fuse Shape and Dimensions mm (Inch) D A B C A B C D Min Max Min Max Min Max Min Max mm in (0.234) (0.246) (0.077) (0.093) (0.038) (0.068) (0.092) (0.04) Recommended Pad Layout mm (Inch) 6.86 (0.270) 2.95 (0.6).96 (0.077) 3.5 (0.24) Part Number Marking Code Typical Electrical Characteristics Rated Cold DCR (Ω)* I 2 t (A 2 sec) Voltage (V AC ) (V DC ) 240SFV0.50FM/25-2 C Max. Interrupt Ratings 240SFV0.63FM/25-2 S SFV0.75FM/25-2 D SFV.00FM/25-2 E V AC 25V DC 32V DC 240SFV.25FM/25-2 F SFV.50FM/25-2 G SFV2.00FM/25-2 I SFV2.50FM/25-2 J SFV3.00FM/25-2 K SFV3.5FM/25-2 V SFV3.50FM/25-2 L SFV4.00FM/25-2 M V AC 25V DC 32V DC 240SFV5.00FM/25-2 N SFV6.30FM/25-2 O SFV7.00FM/25-2 P SFV8.00FM/25-2 R SFV0.0FM/25-2 Q V AC 25V DC 32V DC 240SFV2.0FM/065-2 X V AC 65V DC 240SFV5.0FM/065-2 Y V DC 240SFV20.0FM/065-2 Z * Measured at 0% of rated current and 25 C ambient temperature. 65V AC 65V DC 32V DC 94 RoHS Compliant, ELV Compliant HF Halogen Free

21 Figure SFV-SFV2 Family Performance Curves for 240 Very Fast-Acting Fuses Figure SFV ClearTime (s) A 0.75A.00A 0.63A 240SFV Average Time Curves.25A.50A 2.00A 2.50A 3.5A 3.50A 3.00A 4.00A 5.00A 6.30A 7.00A 8.00A 0.0A 2.0A 5.0A 20.0A Surface-mount Fuses 240 Very Fast-Acting Fuses Figure SFV2 I 2 t (A 2 s),000 0, SFV I 2 T vs. t Curves 20.0A 5.0A 2.0A 0.0A 8.00A 7.00A 6.30A 5.00A 4.00A 3.50A 3.5A 3.00A 2.50A 2.00A.50A.25A.00A 0.75A 0.63A 0.50A Time (s) Note: Curves are nominal Please go to page 97 for more information for 240 Fast-Acting Fuses. RoHS Compliant, ELV Compliant HF Halogen Free 95

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23 Specifications, Packaging Information, Agency Approvals and Part Numbering Systems for All Fuses Table F Environmental Specifications for All Fuses Operating temperature Mechanical vibration Mechanical shock Thermal shock Resistance to soldering heat Solderability Moisture resistance Salt spray Storage temperature Storage humidity Table F2 Material Specifications for All Fuses -55 C to +25 C Withstands Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202 Withstands 500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 23 of MIL-STD-202 Withstands cycles from -65 C to +25 C when evaluated per Method 07 of MIL-STD-202 Withstands 60 seconds at +260 C when evaluated per Method 20 of MIL-STD-202 Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202 Withstands 0 cycles when evaluated per Method 06 of MIL-STD-202 Withstands 48-hour exposure when evaluated per Method 0 of MIL-STD C/ 85% RH Per MIL-STD-202F, Method 06F Surface-mount Fuses - Specifications for All Fuses Construction body material Ceramic (206/0603/0402); Fiberglass/Epoxy (240) Termination material Silver, Nickel, Tin Fuse element Silver(206/0603/0402); Copper/Copper Alloy (240) Figure F Thermal Derating for All Fuses % De-rating 206/0603/0402 Series Temperature Effect on Rating % De-rating 240 Series Temperature Effect on Rating Maximum Operating Temperature ( C) Maximum Operating Temperature ( C) Table F3 Electrical Specifications for All Fuses Insulation resistance after opening 20,000Ω rated voltage. Fuse clearing under low voltage conditions may result in lower - post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide sufficient insulation resistance for circuit protection. carrying capacity Withstands % rated current at +25 C ambient for 4 hours when evaluated per MIL-PRF RoHS Compliant, ELV Compliant HF Halogen Free 97

24 Table F4 Packaging Information for All Fuses Size Reel Quantity (pcs) Reel Diameter Reel Width Carrier Tape Size TapeType Reels per Outside Shipment Box Outside Shipment Boxes per Overpack 0402(5) 0,000 78mm white plastic 9.0 ± 0.5mm 8.00 ± 0.0mm Paper 5 to (608) 4,000 78mm white plastic 9.0 ± 0.5mm 8.00 ± 0.0mm Paper 5 to SFV(608) 6,000 78mm white plastic 9.0 ± 0.5mm 8.00 ± 0.0mm Paper 5 to 0 206(326) 3,000 78mm white plastic 9.0 ± 0.5mm 8.00 ± 0.0mm Plastic 5 to 0 240(625) 2,000 78mm white plastic 3.4 ± 0.5mm 2.00 ± 0.0mm Plastic 4 to 0 Figure F2 Recommended Soldering Temperature Profile for All Fuses Tp Ramp up tp Critical Zone T L to Tp T L Ts MAX t L Temperature Ts MIN ts Preheat Ramp down 25 Reflow Profile t 25 C to Peak Time Classification Reflow Profiles Profile Feature 206/0603/ Average ramp up rate (Ts MAX to Tp) 3 C/second max. 3 C/second max. Preheat Temperature min. (Ts MIN ) 50 C 50 C Temperature max. (Ts MAX ) 200 C 200 C Time (ts MIN to ts MAX ) seconds 40- seconds Time maintained above: Temperature (T L ) 27 C 200 C Time (t L ) seconds seconds Peak/Classification temperature (Tp) 260 C max. 250 C max. Time within 5 C of actual peak temperature Time (tp) seconds seconds From 25 C to preheating (50 C) 8 minutes max. 40- seconds Ramp down rate 4 C/second max. Natural cooling Recommended conditions for hand soldering:. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended, do not directly contact the chip termination with the tip of soldering iron. 2. Preheating: 50 C, 60s (min). Appropriate temperature (max) of soldering iron tip/soldering time (max): 280 C /0s or 350 C / 3s. 98 RoHS Compliant, ELV Compliant HF Halogen Free

25 Table F5 Tape and Reel Specifications for All Fuses Dimension in inches (mm) Mark 0402 (5) 0603 (608) 206 (326) 0603SFV (608) 240 (625) E ± ± ± ± ± (.75 ± 0.0) (.75 ± 0.0) (.75 ± 0.0) (.75 ± 0.0) (.75 ± 0.0) F 0.38 ± ± ± ± ± (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) (5.50 ± 0.0) W 0.35 ± ± ± ± ± (8.00 ± 0.0) (8.00 ± 0.0) (8.00 ± 0.0) (8.00 ± 0.0) (2.00 ± 0.0) P ± ± ± ± ± (2.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) P ± ± ± ± ± (4.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) (4.00 ± 0.0) P ± ± ± ± ± (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.05) (2.00 ± 0.0) D ± ± ± ± ± ( /-0.00) ( /-0.00) ( /-0.00) ( /-0.00) ( /-0.00) D max 0.6 ± (.00 max) (.55 ± 0.0) t ± ± (0.23 ± 0.02) (0.25 ± 0.05) A ± ± ± ± ± (0.67 ± 0.0) (0.98 ± 0.0) (.80 ± 0.0) (0.98 ± 0.0) (2.85 ± 0.0) B ± ± ± ± ± (.7 ± 0.0) (.80 ± 0.0) (3.50 ± 0.0) (.80 ± 0.0) (6.40 ± 0.0) K ± ± ± ± ± (0.63 ± 0.0) (0.95 ± 0.08) (.27 ± 0.0) (0.60 ± 0.08) (2.35 ± 0.0) Surface-mount Fuses - Specifications for All Fuses Figure F3 Component Tape Dimensions for All Fuses D 0 Paper Carrier Tape Specifications P 0 P 2 E F W B 0 D P A 0 K 0 D 0 Plastic Carrier Tape Specifications P 0 P 2 t E F W B 0 D P A 0 K 0 RoHS Compliant, ELV Compliant HF Halogen Free 99

26 Figure F4 Reel Dimensions for All Fuses Dimension Dimension (mm) Description Mark 206/0603/ Hub outer diameter B Reel inside width W Reel outside width W Tape width 8 B W 2 W Agency Approvals for All Fuses UL File # E97536 Part Numbering System for Fast-Acting, Slow-Blow And 0603 Very Fast-Acting Chip Fuses 206 SF F 400 F / 24-2 Packaging -2 = Tape and Reel Voltage Rating 24 = 24V DC Special Code F = RoHS Compliant FM = RoHS Compliant + Marked Part Rated 050 = 0.50 Amps 400 = 4 Amps Fuse BlowType F = Fast Acting S = Slow Blow SF = Surface Mount Fuse Size (206, 0603, 0402) Part Numbering System for High--Rated Chip Fuses 206 SF H F / 24-2 Packaging -2 = Tape and Reel Voltage Rating 24 = 24V DC Special Code F = RoHS Compliant FM = RoHS Compliant + Marked Part Rated = 0 Amps Fuse BlowType H = High SF = Surface Mount Fuse Size (206) RoHS Compliant, ELV Compliant HF Halogen Free

27 Part Numbering System for 240 Very Fast-Acting Fuses 240 SF V 6.30 FM / 25-2 Packaging -2 = Tape and Reel Voltage Rating 25 = 25V DC Special Code F = RoHS Compliant M = Marked Part Rated 6.30= 6.30 Amps Fuse BlowType V = Very Fast Acting SF = Surface Mount Fuse Size (0.24*0.0 inch) Surface-mount Fuses - Specifications for All Fuses Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies ( TE ) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.te s only obligations are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. RoHS Compliant, ELV Compliant HF Halogen Free 0

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