Rework Technic pc. MARTIN Expert 09.6 Rework Set for all SMD Components REWORK TECHNIC PC.

Similar documents
MS9000SAN Rework Station

Solder Reflow Guide for Surface Mount Devices

Reballing Rework Bright New Future

Rack C. 25 slots (maximum 50 components) Maximum placement area mm. Standard placement area mm. Rack A

ROBOTIC PRINTED CIRCUIT BOARD ASSEMBLY LINE

Advanced Technologies and Equipment for 3D-Packaging

Market trends

Assembly of LPCC Packages AN-0001

How To Clean A Copper Board With A Socket On It (Ios)

HIGH-QUALITY EQUIPMENT FOR FLEXIBLE ELECTRONICS PRODUCTION

Rework stations: Meeting the challenges of lead-free solders

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.

MACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society

Auditing Contract Manufacturing Processes

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations

PCB Quality Inspection. Student Manual

Optilia Instruments. Empowering Your Vision!

SMD Rework Station TABLE OF CONTENTS

A and M Electronics Contract Manufacturing Circuit Board Assembly Avenue Kearny Valencia, Ca (661) or (800)

Designing with High-Density BGA Packages for Altera Devices

pb tec solutions GmbH, Max-Planck-Str. 11, Alzenau (Germany) Tel.: Fax:


Multilevel Socket Technologies

CATALOGO MARTIN GmbH 2014 PCB TECHNOLOGIES ITALIA. ARTICOLO DESCRIZIONE PZ 1. REWORK Technique 1.1 EXPERT 10.6 Systems

What is surface mount?

RE-8500 BGA Rework Station

Electronics Manufacturing Services, Since 1986

A universal forensic solution to read memory chips developed by the Netherlands Forensic Institute. The NFI Memory Toolkit II

CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC

DVD-111C Advanced Hand Soldering Techniques

Int863 INSTRUCTION MANUAL. IR Preheating System BASIC TROUBLESHOOTING GUIDE

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien

Bob Willis leadfreesoldering.com

HOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology

Fractus Compact Reach Xtend

Selective Soldering Defects and How to Prevent Them

30 GHz 5-Bit Phase Shifter TGP2100

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

The Three Heat Transfer Modes in Reflow Soldering

Good Boards = Results

Automated Contact Resistance Tester CR-2601

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

Complete. PCB Design Using. NI Multisim, NI Ultiboard, LPKF CircuitCAM and BoardMaster. pg. 1. Wei Siang Pee

January 1999, ver. 3 Application Note Burn-in sockets are zero-insertion-force (ZIF) sockets that do not deform a device s leads.

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

SMD Terminal Blocks with Push-Buttons

AE Series Convection Reflow Ovens

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages

TN0991 Technical note

ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING

ECP Embedded Component Packaging Technology

MP-1919 XNOVA Cube TM SMD LED

Edition Published by Infineon Technologies AG Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.

Adapters - Overview. Quick-Turn Solutions for IC Supply Issues

Webinar HDI Microvia Technology Cost Aspects

SMD Soldering Guide by Infidigm

Ultraprint 2000 HiE. Ultraprint 2000 HiE Features MODULAR DESIGN ENSURES SUPERIOR ADAPTABILITY

PRELIMINARY. J-Series High PDE and Timing Resolution, TSV Package. High-Density Fill Factor Silicon Photomultipliers. Overview

SHENZHEN ZHUOMAO TECHNOLOGY CO., LTD. 深 圳 市 卓 茂 科 技 有 限 公 司

TAGARNO AS Sandøvej Horsens Denmark Tel: Mail: mail@tagarno.com

Electronic Board Assembly

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Ball Grid Array (BGA) Technology

PIN IN PASTE APPLICATION NOTE.

Surface Mount LEDs - Applications Application Note

Antenna Part Number: FR05-S1-R-0-105

HSMtec. Intelligent Printed Circuit Boards for innovative LED products. Copyright, Häusermann GmbH, 2012

PCB inspection is more important today than ever before!

ADVANCED DIRECT IMAGING. by ALTIX

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

How do you create a RoHS Compliancy-Lead-free Roadmap?

touchbga.com TOUCHBGA BGA Rework Station IR-PRO-SC v6 User Manual

Be careful not to scratch or hit front edge of the side viewing micro prisms onto hard objects!

VECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION

Polyimide labels for Printed Circuit Boards

SLLP G PRODUCT DATASHEET. RoHS Compliant

PCB Board Design. PCB boards. What is a PCB board

APPLICATION NOTE. Basler racer Migration Guide. Mechanics. Flexible Mount Concept. Housing

Recommended Soldering Techniques for ATC 500 Series Capacitors

Report. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D Peiting. Your Order-No.

User Guide Reflow Toaster Oven Controller

WSD130 SOLDERING STATION

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC level General description. 1.2 Features. 1.

PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages

G8 GALILEO. Innovation with Integrity. High-End Melt-extraction Analyzer. Inert Gas Method

VTSDIR. Main station front panel. Main station rear panel. Figure Velleman nv

Customer Service Note Lead Frame Package User Guidelines

Fraunhofer ISIT, Itzehoe 14. Juni Fraunhofer Institut Siliziumtechnologie (ISIT)

Optimizing Insertion Extraction Force in a Pin-Socket Interconnect

Leaded Surface Mount Technology (SMT) 7

0.45mm Height 0402 Package Pure Green Chip LED Technical Data Sheet. Part No.: LL-S160PGC-G5-1B

Machine Vision Optimizing Electronics Production

Series. X-ray Inspection.

Solder joint inspection and analysis

What's causing all these issues?

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices

PRODUCT SPECIFICATION

Transcription:

Rework Technic pc MARTIN Expert 09.6 Rework Set for all SMD Components REWORK TECHNIC PC www.martin-smt.de

Rework for Winners Clear and functional: Standards set by MARTIN. With the intuitive and precise functions of the new Expert 09.6 even demanding processes become easily executable tasks. You too can trust "Made by MARTIN". Reliable solder connections of reworked components are our best advertisement. Well Proven More Efficient REWORK TECHNIC PC You can rely on patented Martin Technology. Extensive know-how and eminent precision has been proven thousands of times by our customers around the world for more than 25 years. Just profit from the speed of the new MARTIN Expert 09.6. Quick and reliable processes as well as very attractive pricing provide maximum advantage.

Precision control unit High resolution camera Equipment for residual solder removal and dispensing Patented Hot Air soldering nozzle IR underheater Placement nozzle with automatic 4-axes control Service and support around the globe. Wherever you are, MARTIN is very close. The distinctive features of our technology are rightly also expected from our service and support: competence, reliability and quick reaction times. In addition, we also provide support through practical seminars at our training centre. By this, we offer well proven know-how with use of the most up to date MARTIN equipment. More Flexible Equip yourself for the demands of tomorrow. Just as its famous predecessors, the new MARTIN Expert 09.6 is future proof and compatible with the smallest SMDs as well as large processor sockets.

Your Plus in Placement The new MARTIN Expert 09.6 offers absolute certainty and leading edge speed with its patented placement system. The crystal clear, flawless camera checks and controls the automatic placement process, from the first moment to the final error free result.

Automatic and camera controlled Exact capturing of the pad array with only three mouse clicks. Generation of SMD coordinates. Controlled and automatic placement of the SMD onto the pad array. Auto Vision Technology Automated SMD placement is simplicity itself for operators: The pads shown on the screen are marked and all coordinates of the component are established with three final mouse clicks. Placement is then controlled in every detail by the camera and carried out automatically by the machine. There is no quicker, more certain or more accurate way of positioning SMDs.

Your Advantage in Soldering The new Expert 09.6 employs the highest standards of thermodynamics. PCBs are provided with the required basic heat rapidly, yet carefully from below. At the same time the solder joints are heated precisely for the reflow process. This combination guaranties the best soldering results. Rapid Profile Based on Rapid Technology, this innovative profile guarantees a clear and effective process. The result is a time saving up to 30%. Diagramm Profile This module duplicates production reflow oven profiles. Thermal values are simply transferred from a datasheet into the Easy Solder program.

Optional Extras Precision Hot Air MARTIN s Precision Hot Air technology ensures that the required soldering temperature is reached without exceeding any maximum value specified for the SMD within a tolerance of only +/- 1%. Micro SMD Set For the processing of miniature components. Report software Allows access to all stored data of individual solder processes. Rapid Technology The patented Rapid Technology fully utilises the permitted thermal limits of the PCB. IR underheater and hot air heat at the maximum permitted rate, and after that, maintain temperatures at the recommended level. Soldering nozzles Sets for all BGAs, CSPs und SOs. Reballing Tools Facilitates the trouble free re use of removed components. Expert 07.6 This low-cost alternative can later be upgraded to Expert 09.6. Classic Profile Easy Solder software produces a proven 10 phase multi zone profile from just 3 data sets.

MARTIN Expert 09.6 Konzept und Realisierung: Sternwerfer Design The set comes complete with Solder station DBL 05 with soldering pen, tool magazine, reballing holder, 2 soldering nozzles (4.0, 7.0 mm) Dis module with dispensing pen, 2 aluminium nozzles (0.3 mm), cleaning set Vac module with vacuum pen, 4 placement nozzles (0.7, 1.5, 6.3, 8.5 mm), 2 solder sucker nozzles (1.0, 1.4 mm), cleaner Measurement module with ultra fine sensors, 2 channels Underheater IRF 04 (2400 W) PCB table Smart Fix 06 with hand rest, illumination, cooling, 4 PCB holders and 8 PCB supports Auto Vision Placer with 5 automatic axes, camera, 2 lenses and 4 placement nozzles Second soldering pen for residual solder removal Foot switch, solder paste, solder balls, flux pen, flux cream CSP/BGA transfer tool, SMD hook Set with 7 soldering nozzles for all PLCCs, QFPs Box with consumables Rework ABC (handbook) MARTIN Rework software Easy Solder 06 (WIN 2000/XP/Vista) Technical Details Max. PCB width 390 mm Max. PCB length 500 mm Footprint 700 x 900 mm Hot Air 2-35 I/min ± 1 I/min 50-400 C ± 1,0 % (repeatability) Underheater 400-2400 Watt 250 x 280 mm WIN software Easy Solder 06 Travel 75 mm / 75 mm / 23 mm / ±10 Resolution of axes 0,001 mm Resolution of camera 1944 x 2595 pixel Image size 14 x 18 mm (Flip Chip)* 28 x 37 mm (CSP) 37 x 50 mm (BGA/QFP) 65 x 85 mm (Maxi BGA)* Placement accuracy ± 0,015 mm (Flip Chip)* ± 0,03 mm (CSP) ± 0,04 mm (BGA/QFP) ± 0,07 mm (Maxi BGA)* MARTIN Expert 09.6H Specific equipment Instead of underheater IRF 04: IRH radiaton element (110 W) Instead of 7 soldering nozzles for QFPs: Set with 4 soldering nozzles for all CSPs 2 soldering nozzles for SOs (10 x 15 mm, 15 x 25 mm) 2 placement nozzles for chips (0.25, 0.5 mm) Specific technical data Footprint 700 x 800 mm Underheater 20-110 Watt 65 x 80 mm MARTIN Expert 09.6XL Specific equipment Auto Vision Placer extended by 50 mm Instead of underheater IRF 04: IRF 07 (4800 W) Specific technical data Max. PCB width 490 mm Max. PCB length 600 mm Footprint 840 x 1050 mm Underheater 900-4800 Watt 370 x 385 mm Image size 75 x 95 mm (Maxi-BGA)* * Optional extra 11/2007 Martin GmbH, Argelsrieder Feld 1b, D-82234 Wessling Fon +49-(0)8153-9329-32, Fax +49-(0)8153-9329-39 info@martin-smt.de, www.martin-smt.de