2. EXPERIMENTAL METHODS

Similar documents
Coating Technology: Evaporation Vs Sputtering

Electron Beam and Sputter Deposition Choosing Process Parameters

Vacuum Evaporation Recap

Types of Epitaxy. Homoepitaxy. Heteroepitaxy

Plasma Source. Atom Source, Ion Source and Atom/Ion Hybrid Source

3 - Atomic Absorption Spectroscopy

Chemical Sputtering. von Kohlenstoff durch Wasserstoff. W. Jacob

Vacuum Pumping of Large Vessels and Modelling of Extended UHV Systems

Noble Gases. Outline Nobel Gas Elements Radon and Health Chemistry Homework

High Rate Oxide Deposition onto Web by Reactive Sputtering from Rotatable Magnetrons

2. Deposition process

Dry Etching and Reactive Ion Etching (RIE)

Sputtering. Ion-Solid Interactions

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE Dr. Alan Doolittle

Plasma Cleaner: Physics of Plasma

MODERN ATOMIC THEORY AND THE PERIODIC TABLE

Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.

Feasibility study on polyparylene deposition in a PECVD reactor

A. Kinetic Molecular Theory (KMT) = the idea that particles of matter are always in motion and that this motion has consequences.

Electron Configurations, Isoelectronic Elements, & Ionization Reactions. Chemistry 11

Untitled Document. 1. Which of the following best describes an atom? 4. Which statement best describes the density of an atom s nucleus?

Chapter 5 TEST: The Periodic Table name

2B.1 Chilled-Water Return (and Supply) Temperature B.3 Cooling-Water Supply Temperature / Flow

LASER CUTTING OF STAINLESS STEEL

A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators

Lecture 2 - Semiconductor Physics (I) September 13, 2005

Ion Beam Sputtering: Practical Applications to Electron Microscopy

QGA Quantitative Gas Analyser

Sample Exercise 12.1 Calculating Packing Efficiency

Calculation of Liquefied Natural Gas (LNG) Burning Rates

STM, LEED and Mass spectrometry

******* KEY ******* Atomic Structure & Periodic Table Test Study Guide

Plasma diagnostics focused on new magnetron sputtering devices for thin film deposition

- thus, the total number of atoms per second that absorb a photon is

Direct Energy Influx Measurements. in Low Pressure Plasma Processes

Chapter 5 - Aircraft Welding

Chapter 8. Low energy ion scattering study of Fe 4 N on Cu(100)

Sputtering by Particle Bombardment I

Austin Peay State University Department of Chemistry CHEM Empirical Formula of a Compound

We will study the temperature-pressure diagram of nitrogen, in particular the triple point.

1. PECVD in ORGANOSILICON FED PLASMAS

Plasma Electronic is Partner of. Tailor-Made Surfaces by Plasma Technology

BB-18 Black Body High Vacuum System Technical Description

13- What is the maximum number of electrons that can occupy the subshell 3d? a) 1 b) 3 c) 5 d) 2

Welding of Plastics. Amit Mukund Joshi. (B.E Mechanical, A.M.I.Prod.E)

Surface activation of plastics by plasma for adhesion promotion

State of the art in reactive magnetron sputtering

Lab 6: Paper Chromatography. Pages Pre-lab page 151 No Post lab Chromatogram must be turned in attached to lab report

How MOCVD. Works Deposition Technology for Beginners

V K Raina. Reactor Group, BARC

IUCLID 5 COMPOSITION AND ANALYSIS GUIDANCE DOCUMENT: IRON ORES, AGGLOMERATES [EINECS NUMBER , CAS NUMBER ] IRON ORE PELLETS

Experimental Observation of the Quantum Anomalous Hall Effect in a Magnetic Topological Insulator

The study of deep-level emission center in ZnO films grown on c-al 2 O 3 substrates

How To Analyze Plasma With An Inductively Coupled Plasma Mass Spectrometer

13C NMR Spectroscopy

PARTICLE SIMULATION ON MULTIPLE DUST LAYERS OF COULOMB CLOUD IN CATHODE SHEATH EDGE

Deposition of Thin Metal Films " (on Polymer Substrates)!

Chapter 12 - Liquids and Solids

Modern approaches to determination of toxic metals in marine environmental objects. Atomic absorption and inductively coupled plasma, advantages and

Methods of plasma generation and plasma sources

Decorative vacuum coating technologies Certottica Longarone. Thin Film Plasma Coating Technologies

Design, Modelling and Simulation of Multiple Effect Evaporators

PHOTOELECTRIC EFFECT AND DUAL NATURE OF MATTER AND RADIATIONS

CVD SILICON CARBIDE. CVD SILICON CARBIDE s attributes include:

3. What would you predict for the intensity and binding energy for the 3p orbital for that of sulfur?

Silicon, the test mass substrate of tomorrow? Jerome Degallaix The Next Detectors for Gravitational Wave Astronomy Beijing

Desalination of Sea Water E7-1

Chapter 7 Periodic Properties of the Elements

New and improved slagging and corrosion control techniques for biomass firing. Martti Aho IV Liekkipäivä

Composition of the Atmosphere. Outline Atmospheric Composition Nitrogen and Oxygen Lightning Homework

105 Adopted:

Online Changing States of Matter Lab Solids What is a Solid? 1. How are solids different then a gas or a liquid?

Research on the Transport and Chemistry of Fission Products in Primary Circuit and Containment Conditions at VTT

THIN FILM MATERIALS TECHNOLOGY

Lecture 11. Etching Techniques Reading: Chapter 11. ECE Dr. Alan Doolittle

Chapter 2 Chemical and Physical Properties of Sulphur Dioxide and Sulphur Trioxide

Principles of Ion Implant

Chapter 2 Atoms, Ions, and the Periodic Table

Refrigerated Air Dryers. Catalogue

Electrospray Ion Trap Mass Spectrometry. Introduction

Site Planning Guide Aug 2011

Graphite Furnace AA, Page 1 DETERMINATION OF METALS IN FOOD SAMPLES BY GRAPHITE FURNACE ATOMIC ABSORPTION SPECTROSCOPY (VERSION 1.

Engine Heat Transfer. Engine Heat Transfer

Section 10.0: Electrode Erosion

h e l p s y o u C O N T R O L

Lectures about XRF (X-Ray Fluorescence)

Module 7 Wet and Dry Etching. Class Notes

Lecture 35: Atmosphere in Furnaces

Review - After School Matter Name: Review - After School Matter Tuesday, April 29, 2008

Introduction OLEDs OTFTs OPVC Summary. Organic Electronics. Felix Buth. Walter Schottky Institut, TU München. Joint Advanced Student School 2008

CH3 Stoichiometry. The violent chemical reaction of bromine and phosphorus. P.76

Chemical vapor deposition of novel carbon materials

Structure and properties of transparent conductive ZnO films grown by pulsed laser

B) atomic number C) both the solid and the liquid phase D) Au C) Sn, Si, C A) metal C) O, S, Se C) In D) tin D) methane D) bismuth B) Group 2 metal

Potassium-Argon (K-Ar) Dating

Lecture 9. Surface Treatment, Coating, Cleaning

How To Implant Anneal Ion Beam

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Modification of Pd-H 2 and Pd-D 2 thin films processed by He-Ne laser

CHEMISTRY 113 EXAM 4(A)

Transcription:

RF Solid Sources for Atomic Beam Epitaxy R. Clampitt 1 and M.B. Lee 2+ 1.Oxford Applied Research, Crawley Mill, Witney, Oxon, UK 2.Bexin Technologies Inc., Blauvelt, NY, 10913, USA + communicating author with e-mail: oarusa@optonline.net 1. INTRODUCTION The efficiency of film growth depends on both the sticking probability and the reactivity of the evaporants. Reactivity of some evaporants can often be enhanced by predissociation into a more reactive species prior to deposition onto the substrate. The word cracking - borrowed from Petrochemical Refinery terminology-has been adapted to describe this process. We report here the design of such a cracker which can enhance reactivities of solid charges in MBE growth. 2. EXPERIMENTAL METHODS To achieve this, the evaporant K-cell, in which solid is loaded, is coupled to a RF plasma section to facilitate electron-induced dissociation of evaporant. The plasma is first ignited using an inert gas and the K-cell subsequently heated to evaporate the source materials into the discharge. The utility of this technique has been reported earlier. 1 To obtain sharp multi-layer profiles we have incorporated a fast acting all-quartz valve. The general design features of such a valved cracker with 200 cc charge loading capacity are illustrated in Figure 1. For all polymeric materials except phosphorus, the transfer tube is maintained at reservoir temperature. In the case of phosphorus it is cooled in order to condense and utilize the white phosphorus resulting from the evaporation of the red phosphorus feedstock The valve characteristics (Figure 2a), measured with neon gas, demonstrate that rapid flux control can be achieved The all-quartz valve design makes the source compatible with corrosive material such as antimony. Figure 2b shows Sb vapour deposition data on a quartz crystal microbalance, confirming the rapid flux control. Mass spectrometry using a simple residual gas analyzer (RGA) can be employed to diagnose the efficiency of RF plasma cracking of polymeric evaporants.

3. RESULTS AND DISCUSSION A stable RF discharge in the absence of support gas has been achieved for many different solid charges, including As, Se and white P. Figure 3 show emission spectra of, respectively, Ar, Ar+As and pure As discharges. 1 A pure self-supporting white P discharge to achieve enhanced doping incorporation during growth of ZnSe has been previously reported. 2 A Selenium-cracked spectrum shows that the Se 2 dimer is less than 10-4 of Se monomer (Figure 4a.) The mass spectrum of a pure self-supporting Sulphur discharge (Figure 4b.) shows that the polymeric species are almost entirely cracked into S 1 and S 2 even at the low (40W) RF power used. Table 1. summarizes the ion current detected from the source. The tabulated data demonstrates that all charged particles are removed from the beam when a voltage of 500/1000 V is applied across the plates, the beam now comprising only neutral particles. Collector voltage (V) Deflector voltage (V) Collector Current (ua) 1 0 0-0.43 2 0 1000 0.03 3-10 0-0.13 4-10 1000 0.06 5 +9 0-0.43 6 +18 0-0.88 7-18 0 0.16 8-18 500 0.05 9-18 1000 0.05 Table 1: Summary of ion current detected by a 3x3 cm2 collector plate 150mm from the source. Collector bias and deflector voltage are listed in columns 1 and 2 respectively.

The instrument offers an interesting possibility of re-examining some challenging but technologically significant MBE growth processes, such as Mn doping of GaN, in which incorporation of unactivated Mn remains problematic. The source offers the unique prospect of delivering, simultaneously, both atomic nitrogen and atomic Mn, the latter potentially activated within the RF plasma to a metastable electronic state. 3 4. CONCLUSIONS In conclusion, we have shown that an all-quartz valve RF cracker can be used to dissociate polymeric materials to the atomic form without adding a prohibitive thermal load to an MBE system. This advancement points to a new variation in MBE, atomic beam epitaxy, in which highly reactive atomic species are utilized. References: 1. Waag, A., Lugauer, H.J. and Landwehr, G. VIII Eur.Workshop on MBE, Granada, 1995 (Abstracts) 2. Calhoun, L.E. and Park, R.M.,J. App.Phys. 85,490, 1999 3. The idea of using a nitrogen supported Mn discharge for growing Mn doped GaN was first suggested to us by Prof. G. Wicks of the University of Rochester during this conference.

FIGURES Figure 1: Illustration of all quartz valved RF cracker Figure 2a: Demonstration of rapid flux control by manual valve operation

Figure 2b: Deposition of atomic antimony vapour as a function of valve position. K-cell at 625 C; RF plasma power 250W; argon 1.2sccm Figure3: Emission spectrum of argon-supported and pure As discharges

Figure 4a: A mass spectrum of species from a pure Selenium discharge. Note that even the dimer intensity is negligible compared to atomic Se (3x10-5 A) Figure 4b: A mass spectrum of a 40W discharge in pure sulphur, showing the dominance of the monomer and dimer