3535HP UV LED Outline : 3.5*3.5*2.0mm 3.5*3.5*2.9mm High efficiency Good thermal dissipation & optical uniformity Table of contents Features--------------------------------------------------1 Product code method---------------------------------2 Product list ----------------------------------------------3 Maximum rating----------------------------------------4 Intensity binning----------------------------------------5 Forward voltage binning------------------------------5 Wavelength binning-----------------------------------6 Relative spectral power distribution---------------7 Electronic-optical characteristics ------------------7 Typical spatial distribution---------------------------8 Thermal design for de-rating------------------------8 Dimensions----------------------------------------------9 Suggest Stencil Pattern-----------------------------10 Packing--------------------------------------------------11 Reflow profile------------------------------------------13 Precautions--------------------------------------------14 Test items and results of reliability---------------17 Features RoHS and REACH-compliant MSL2 qualified according to J-STD 020 ESD 8KV (HBM : MIL-STD-883 Class 3B) Applications UV Curing Medical applications Industrial facility applications Ver. A2 SPEC-0010 1 / 17
Product code method 1 - Z - HP35 - A Q24B - H - Z - 1 - Z G 1 - Z - HP35 - B Q24B - H - Z - 1 - Z G 1 - Z - HP35 - A Q34B - H - Z - 1 - Z G 1 - Z - HP35 - B Q34B - H - Z - 1 - Z G 1 - Z - HP35 - A Q54B - H - Z - 1 - Z G 1 - Z - HP35 - B Q54B - H - Z - 1 - Z G 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 Process type Category Specification Lens code Dice wavelength & Luminous rank 1: Normal process Z: SMD LED HP35: Ceramic 3535 A: 120 B: 60 Qxxx: UV product 6 7 8 9 10 Support code Zener & High CRI Cap color code Module& Lens code Current code H: HTCC Z: Zener 1: Series No. Z: Molding G: 500mA Ver. A2 SPEC-0010 2 / 17
Product list Forward Voltage (V) Radiant Power (mw) Peak @500mA Color Wavelength Group 500mA 700mA Min. Min. (nm) Min. Max. U062 620 824 U066 660 877 U070 700 931 UV U074 740 984 U078 780 1037 380-390 3.4 4.0 U082 820 1090 U086 860 1144 U090 900 1197 U062 620 824 U066 660 877 U070 700 931 UV U074 740 984 U078 780 1037 390-410 3.4 4.0 U082 820 1090 U086 860 1144 U090 900 1197 U062 620 824 U066 660 877 U070 700 931 UV U074 740 984 U078 780 1037 410-430 3.4 4.0 U082 820 1090 U086 860 1144 U090 900 1197 Notes: 1. Forward voltage (VF ) ±0.05V, Radiant power (PO) ±7% 2. IS standard testing. 3. Viewing angle(2θ1/2) ±10 Viewing Angle Part Number 120 1ZHP35AQ24BHZ1ZG 60 1ZHP35BQ24BHZ1ZG 120 1ZHP35AQ34BHZ1ZG 60 1ZHP35BQ34BHZ1ZG 120 1ZHP35AQ54BHZ1ZG 60 1ZHP35BQ54BHZ1ZG Ver. A2 SPEC-0010 3 / 17
Maximum Rating (Ta : 25 ) Characteristics Symbol Min. Typical Max. Unit DC Forward Current 1 IF 500 700 ma Reverse Voltage VR -5 V Reverse Current (-5V) IR 10 μa Junction Temperature 2 Tj 125 Storage Temperature Range Tstg -40 100 Soldering Temperature Tsol 260 Notes: 1. For other ambient, limited setting of current will depend on de-rating curves. 2. When drive on maximum current, Tj must be kept below 150 Ver. A2 SPEC-0010 4 / 17
Intensity binning Bin code (500mA) Min. Po (mw) Max. Po (mw) U062 620 660 U066 660 700 U070 700 740 U074 740 780 U078 780 820 U082 820 860 U086 860 900 U090 900 940 Forward voltage binning Bin code (500mA) Min. VF (V) Max. VF (V) V3436 3.4 3.6 V3638 3.6 3.8 V3840 3.8 4.0 Ver. A2 SPEC-0010 5 / 17
Wavelength binning Bin code (500mA) Min. Wp (nm) Max. Wp (nm) Q380 380 385 Q385 385 390 Q390 390 395 Q395 395 400 Q400 400 405 Q405 405 410 Q410 410 415 Q415 415 420 Q420 420 425 Q425 425 430 Ver. A2 SPEC-0010 6 / 17
Relative spectral power distribution Electronic-optical characteristics Forward Current vs. Forward Voltage (Ta=25 ) Relative Radiant Power vs. Forward Current (T a=25 ) Ver. A2 SPEC-0010 7 / 17
Maximum Current (ma) Typical Spatial Distribution 120 60 Thermal Design for De-rating The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 1000 900 800 700 600 500 400 300 200 100 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Ambient Temperature ( ) Rj-a = 10 /W Rj-a = 15 /W Rj-a =20 /W Rj-a =25 /W Ver. A2 SPEC-0010 8 / 17
Dimensions 120 60 All dimensions are in millimeters. Tolerance is ±0.13mm unless other specified. Ver. A2 SPEC-0010 9 / 17
Suggest Stencil Pattern (Recommendations for reference) Suggest stencil t =0.12 mm Ver. A2 SPEC-0010 10 / 17
Packing - + Trailer 160(min) of empty pockets sealed with tape Loaded Pockets (1000 pcs) Leader 400mm (min) of empty pockets sealed with tape Ver. A2 SPEC-0010 11 / 17
Label Label Label Notes: 1. Each reel (minimum number of pieces is 100 and maximum is 1000 for 120 degree product / 500 for 60 degree product) is packed in a moisture-proof bag along with 2 packs of desiccant and a humidity indicator card; 2. A maximum of 5 moisture-proof bags are packed in an inner box (size: 240mm x 200mm x 105mm ±5mm) 3. A maximum of 4 inner boxes are put in an outer box (size: 410mm x 255mm x 230mm ±5mm) 4. Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and the cardboard box. Ver. A2 SPEC-0010 12 / 17
temperature Reflow Profile IR reflow soldering Profile Lead Free solder 300 250 200 150 100 Lead solder 1-5 /sec 240 max Pre heating 150-180 210 max 2-5 /sec 120sec.Max 10sec. max 2-5 /sec 50sec.max 50 0 25 0 50 100 150 200 250 300 Time sec Notes: 1. The recommended reflow temperature is 240 (±5 ). The maximum soldering temperature should be limited to 260. 2. Do not stress the silicone resin while it is exposed to high temperature. 3. The reflow process should not exceed 3 times. Ver. A2 SPEC-0010 13 / 17
Precautions 1. Recommendation for using LEDs 1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may cause a drastic decrease in the luminosity. 1.2 Avoid mechanical stress on LED lens. 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens damage. 1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel packaging 2. Pick & place nozzle The pickup tool was recommended and shown as below 3. Lens handling Please follow the guideline to pick LEDs. 3.1 Use tweezers to pick LEDs. 3.2 Do not touch the lens by using tweezers. 3.3 Do not touch lens with fingers. 3.4 Do not apply more than 4N (400gw) directly onto the lens. Ver. A2 SPEC-0010 14 / 17
Correct ( ) Wrong ( X ) 1. Lens cleaning In the case which a small amount of dirt and dust particles remain on the lens surface, a suitable cleaning solution can be applied. 1.1 Try a gentle wiping with dust-free cloth. 1.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface. 1.3 Do not use other solvents as they may directly react with the LED assembly. 1.4 Do not use ultrasonic cleaning which will damage the LEDs. 2. Carrier tape handling The following items are recommended when handling the carrier tape of LEDs. 2.1 Do not twist the carrier tape. 2.2 The inward bending diameter should not be smaller than 6cm for each carrier tape. 2.3 Do not bend the tape outward. Ver. A2 SPEC-0010 15 / 17
3. Storage 3.1 The moisture-proof bag is sealed: The LEDs should be stored at 30 C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. 3.2 The moisture-proof bag is opened: The LEDs should be stored at 30 C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within 168hrs. If the humidity indicator card shows the pink color in 10% even higher or exceed the storage limiting time since opened, that we recommended to baking LEDs at 60 C at least 24hrs. To seal the remainder LEDs return to the moisture-proof bag, it s recommended to be with workable desiccants. Ver. A2 SPEC-0010 16 / 17
Test Items and Results of Reliability Test Item Test Conditions Duration/ Cycle Number of Damage Reference Thermal Shock High Temperature Storage Humidity Heat Storage Low Temperature Storage Life Test High Humidity Heat Operation High Temperature Operation 40 30min 5min 125 30min 100 cycles 0/22 AECQ101 Ta=100 1000 hrs 0/22 EIAJ ED-4701 200 201 Ta=85 EIAJ ED-4701 1000 hrs 0/22 RH=85% 100 103 Ta=-40 1000 hrs 0/22 EIAJ ED-4701 200 202 Ta=25 If=500mA 1000 hrs 0/22 85 RH=85% If=500mA 1000 hrs 0/22 Ta=85 If=500mA 1000 hrs 0/22 ESD(HBM) 8KV at 1.5kΩ;100pf 3 Times 0/22 MIL-STD-883 Criteria for Judging the Damage Item Symbol Condition Criteria for Judgment Min Max Forward Voltage VF If=500mA _ USL 1 1.1 Reverse Current IR VR =5V _ 100μA Luminous Intensity Iv If=500mA LSL 2 0.7 _ Notes: 1. USL: Upper specification level 2. LSL: Lower specification level Ver. A2 SPEC-0010 17 / 17