American Opto Opto Plus Plus LED LED American A561X-5 G/W Opto G/W Plus LED American A561X-5 Opto G/W Plus LED 0.56 0.56 Single Single Digit Digit Seven Seven Segment Segment Display Display specifications 0.56 Single A561X-5 Digit Seven G/W Segment Display Package Package Dimensions 0.56 Single Digit Seven Segment Display Package Dimensions package dimensions Package Dimensions 0.56inch 0.56inch (14.22 (14.22 mm) mm) height height 1 Low Low power power consumption consumption 0.56inch (14.22 mm) height rohs rohs Compliance Compliance Low 0.56inch power (14.22 consumption mm) height Case Case mold mold type type Case rohs mold Compliance type rohs Compliance CDSX56F series CDSA56F SERIES CDSC56F SERIES Notes: Notes: 1. Label 1. Label Notes: Notes: A: Part A: Part Number Number B: Date B: Date C: Bin C: Bin Code Code 2. All 2. dimensions All dimensions are in are millimeters in millimeters (inches) (inches) Notes: 1. Label Notes: A: Part Number B: Date C: Bin Code Notes: 3. Tolerance 3. Tolerance is ± is 0.25mm ± 0.25mm (0.01 ) (0.01 ) unless unless otherwise otherwise specified specified 1. All dimensions are in millimeters Notes: 2. 1. All Label (inches). dimensions Notes: A: are Part in Number millimeters B: (inches) Date C: Bin Code 2. Tolerance is ± 0.25mm (0.01 ) unless otherwised noted. 3. Specifications Feb. Feb. 2005 2005 are Rev. subject Rev. 1.0 1.03. Tolerance is ± 0.25mm (0.01 ) unless otherwise specified to change 2. All dimensions without notice. are in millimeters (inches) 3. Tolerance is ± 0.25mm (0.01 ) unless otherwise specified Feb. 2005 Rev. 1.0 Feb. 2005 Rev. 1.0
2 Part number description Part Number Chip Material Color of Emission Lens Type Description CDSA56R1WF GaAsP Red White Segment Common Anode CDSC56R1WF GaAsP Red White Segment Common Cathode CDSA56RR1WF AlGaAs Super Red White Segment Common Anode CDSC56RR1WF AlGaAs Super Red White Segment Common Cathode CDSA56Y1WF GaAsP Yellow White Segment Common Anode CDSC56Y1WF GaAsP Yellow White Segment Common Cathode CDSA56G1WF GaP Green White Segment Common Anode CDSC56G1WF GaP Green White Segment Common Cathode CDSA56B1WF GaN Blue White Segment Common Anode CDSC56B1WF GaN Blue White Segment Common Cathode OPTICAL-ELECTRICAL CHARACTERISTICS (Ta=25 C) Part Number Wavelength (nm) Absolute Maximum Electro-Optical Characteristics Δλ Pd Iaf Ipf Vf (V) If Iv (mcd) nm mw ma (Peak) Min Typ Max (Rec) Min Typ CDSA56R1WF 625 45 75 30 100 1.7 1.85 2.5 10 3 8 CDSC56R1WF 625 45 75 30 100 1.7 1.85 2.5 10 3 8 CDSA56RR1WF 640 20 72 20 100 1.6 1.75 2.4 10 5 18 CDSC56RR1WF 640 20 72 20 100 1.6 1.75 2.4 10 5 18 CDSA56Y1WF 588 35 75 30 100 1.7 2.1 2.8 10 1.9 4.7 CDSC56Y1WF 588 35 75 30 100 1.7 2.1 2.8 10 1.9 4.7 CDSA56G1WF 568 30 65 30 100 1.7 2.1 2.8 10 3 10.5 CDSC56G1WF 568 30 65 30 100 1.7 2.1 2.8 10 3 10.5 CDSA56B1WF 470 30 120 30 100 3.0 3.5 4.0 10 1.9 8.5 CDSC56B1WF 470 30 120 30 100 3.0 3.5 4.0 10 1.9 8.5
3 ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Reverse Voltage 5V Spectral Line half-width (λ) nm Reverse Current (Vr = 5V) 100μA Power Dissipation (Pd) mw Operating Temperature -40 C~+85 C Peak Forward Current (Duty 1/10, @ KHz) ma Storage Temperature -40 C~+85 C Recommended Operation Current (If Rec) ma Soldering Temperature 250C~260C for 3 sec. Average Luminous Intensity (If=10) μa
American American Opto Opto Plus Plus LED LED C/A284CX G/W C/A284CX G/W optical characteristic curves - red 4 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: ORANGE-RED (E) TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: ORANGE-RED (E) Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current
American Opto Plus LED American C/A284CX Opto G/W Plus LED 0.28 C/A284CX Four Digit Clock G/W Display optical characteristic 0.28 Four curves Digit Clock - Super Display red TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: SUPER RED (SR) 5 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: SUPER RED (SR) Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current
American Opto Plus LED American C/A284CX Opto Plus G/W LED C/A284CX G/W optical characteristic curves - Yellow 0.28inch Low power (7.102 consumption mm) height Low RoHS power Compliance consumption RoHS Case Compliance mold type 6 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: YELLOW (Y) TYPICAL Forward ELECTRO-OPTICAL Current vs. Forward Voltage CHARACTERISTIC Relative CURVES: Intensity YELLOW vs. Forward (Y) Current
American Opto Plus LED American C/A284CX Opto Plus G/W LED C/A284CX G/W optical characteristic curves - Green 7 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES GREEN (G) Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES GREEN (G)
American Opto Opto Plus Plus LED LED C/A2570X G/W G/W 0.7 5 x 7 DOT MATRIX DISPLAY optical characteristic 0.7 5 x 7 DOT curves MATRIX - blue DISPLAY 0.70inch (17.8 mm) height 0.70inch (17.8 mm) height 8 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: BLUE (LB) TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: BLUE (LB) Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current
9 4 SOLDERIng soldering COnDITIOnS conditions - LAmP display TYPE LED * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommended. * Recommended soldering conditions Pre-Heat Pre-Heat Time Solder Bath Temperature Dippng Time Dipping Position Dip Soldering 100 C Max 60 Second Max 260 C Max 5 Second Max No lower than 3mm from the base of the epoxy Temperature Soldering Time Position Hand Soldering 3mm Series 300 C Max 3 Second Max No closer than 3mm from the base of the epoxy Others 350 C Max 3 Second Max No closer than 3mm from the base of the epoxy * Do not apply any stress to the lead. Particularly when heated. * The LED must not be repositioned after soldering. * After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. * Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused by the PC board warping or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may be mounted in this fashion, but, the user will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. * When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. * Cut the LED leadframes at room temperature. Cutting the leadframes at high temperature may cause LED failure. ChromeLED order to supply Corp. the reserves best product the right possible. to make The changes most current at any time version in order of this to document supply the will best always product be available possible. at: The www.chromeled.com most current version 17800 Castleton Street, #388 City of Industry, CA 91748 T: 626-964-9040 F: 626-964-9072 www.chromeled.com