Micron Product Guide. The memory. Experts



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Transcription:

Micron Product Guide The memory Experts 2014

Contents 4 Segment Directory DRAM 6 MT40 DDR4 SDRAM MT41 DDR3 SDRAM MT47 DDR2 SDRAM MT46 DDR SDRAM MT48 SDRAM 7 MT44 RLDRAM 3 Memory MT49 RLDRAM 2 Memory MT42 Mobile LPDDR2 MT46 Mobile LPDDR MT48 Mobile LPSDR 8 MT45 PSRAM CellularRAM Memory Modules 8 DDR3 SDRAM 240-pin UDIMM DDR3 SDRAM 240-pin ECC UDIMM DDR3 SDRAM 240-pin VLP ECC UDIMM DDR3 SDRAM 204-pin SODIMM DDR3 SDRAM 204-pin ECC SODIMM DDR3 SDRAM 200-pin SORDIMM 9 DDR3 SDRAM 240-pin RDIMM DDR3 SDRAM 240-pin VLP RDIMM DDR3 SDRAM 240-pin LRDIMM DDR3 SDRAM 244-pin Mini-UDIMM DDR3 SDRAM 244-pin Mini-RDIMM DDR3 SDRAM 244-pin Mini-UDIMM DDR3 SDRAM 244-pin VLP Mini-UDIMM DDR3 SDRAM 244-pin VLP Mini-RDIMM DDR2 SDRAM 240-pin UDIMM DDR2 SDRAM 240-pin ECC UDIMM 10 DDR2 SDRAM 200-pin SODIMM DDR2 SDRAM 200-pin SORDIMM DDR2 SDRAM 240-pin RDIMM DDR2 SDRAM 240-pin VLP RDIMM DDR2 SDRAM 240-pin FBDIMM DDR2 SDRAM 244-pin Mini-RDIMM 10 DDR2 SDRAM 244-pin VLP Mini-RDIMM DDR SDRAM 184-pin UDIMM 11 DDR SDRAM 184-pin ECC UDIMM DDR SDRAM 200-pin SODIMM DDR SDRAM 200-pin ECC SODIMM DDR SDRAM 184-pin RDIMM DDR SDRAM 184-pin VLP RDIMM SDRAM 168-pin UDIMM SDRAM 168-pin ECC UDIMM SDRAM 144-pin SODIMM SDRAM 168-pin RDIMM NAND Flash 12 MT29 SLC NAND Flash NAND Small Page (SP) Flash MT29 MLC NAND Flash 13 MT29 Serial NAND Flash Managed NAND 13 MTFC and N2M4 e MMC Memory for Embedded MTED and MTFD Embedded USBs MT29 Enhanced ClearNAND Flash Memory NOR Flash 14 M29AW Parallel NOR Flash Automotive M29DW Parallel NOR Flash Automotive M29F Parallel NOR Flash Automotive M29W Parallel NOR Flash Automotive 15 M58BW Parallel NOR Flash Automotive M58WR Parallel NOR Flash Automotive G18 Parallel NOR Flash Embedded J3 Parallel NOR Flash Embedded M28W Parallel NOR Flash Embedded 16 M29DW Parallel NOR Flash Embedded M29EW Parallel NOR Flash Embedded M29W Parallel NOR Flash Embedded

17 P30 Parallel NOR Flash Embedded P33 Parallel NOR Flash Embedded M58, PF48F, PC28F Parallel NOR Flash Mobile 18 M25P Serial NOR Flash Automotive M25PE Serial NOR Flash Automotive N25Q Serial NOR Flash Automotive M25PX Serial NOR Flash Automotive 19 M25P Serial NOR Flash Embedded M25PE Serial NOR Flash Embedded M25PX Serial NOR Flash Embedded 20 M45PE Serial NOR Flash Embedded N25Q Serial NOR Flash Embedded N25W Serial NOR Flash Mobile Solid State Drives (SSDs) 21 M500 Self-Encrypting Drive (SED) P400e SSD P400m SSD P300 SSD P410m SSD 22 P320h PCIe SSD P410m PCIe SSD Multichip Packages (MCPs) 23 MT29 NAND Flash-Based MCPs 23 Bare Die and Wafer-Level Products Hybrid Memory Cube (HMC) Part Numbering 25 DRAM Components 27 HMC Memory 28 MCP/PoP Memory 29 NOR MCP 30 e MMC Memory 31 e MMC 100-ball Stand-Alone 32 DDR4 Module 33 DDR3 Module 34 DDR2 Module 35 DDR and SDRAM Module 36 PSRAM CellularRAM Memory 37 NAND Flash 38 NAND Small Page Flash 39 N25Q Serial NOR Flash 40 M25/M45 Serial NOR Flash 41 M29W Parallel NOR Flash M29AW Automotive Uniform Block MLC Flash 42 M29DW Parallel NOR Flash M29EW Parallel NOR Flash 43 M29F Automotive Single-Bank 5V Flash 44 P30/P33 Parallel NOR Flash and P30/P33 Stacked 45 G18 Parallel NOR Flash J3 Parallel NOR Flash 46 M28W Parallel NOR Flash M58BW Parallel NOR Flash 47 M58WR Parallel NOR Flash 48 3xx and 4xx SSDs 49 4xx and 5xx SSDs Resources 50 Product Lifecycle Solutions 51 Web Tools 24 Hybrid Memory Cube

We have the right device for your design. Micron has one of the most comprehensive, cost-competitive memory product portfolios in the industry. We re committed to meeting our customers needs with a broad continuum of memory solutions, from legacy designs to long-term stability for current designs, new innovations, and emerging technologies. Automotive Solutions for the Road Building on our decades of experience in the memory business, we ve established a broad portfolio of products and technologies that maximize the functionality of today s sophisticated automotive electronics. Our engineers have the technical background to help you choose the best of our high-quality, rigorously tested automotive memory solutions to optimize your design. DRAM Components 6 PSRAM CellularRAM Memory 8 NAND Flash 12 NOR Flash 14 Mobile LPDRAM 7 e MMC Memory 13 IMM One Source for Industrial/Multi-Market Applications Our exacting quality standards, broad product portfolio, individualized category support, and commitment to supply stability set us apart as the memory provider that IMM customers can rely on to serve mission-critical application needs. Our memory solutions are the top choice for PC, network infrastructure, and communications equipment used in extreme environments empowering the newest technology developments in the fields of science, medicine, and manufacturing. DRAM Components 6 Mobile LPDRAM 7 NOR Flash 14 e MMC Memory 13 PSRAM CellularRAM 8 NAND Flash 12 Mobile Staying Connected in a Wireless World We ve developed some of the industry s highest-performance mobile memory solutions, but we deliver more than just great products. We strive to solve design challenges through better engineering raising the bar on features, functionality, and performance. We work with chipset vendors, OS designers, and other enablers to ensure our parts are optimized for your design. You get a comprehensive product portfolio of mobile memory solutions that maximize performance along with the technical experts to help you make it work for your applications. Mobile LPDRAM 7 NAND Flash 12 PSRAM CellularRAM Memory 8 NAND and NOR Flash-Based Multichip Packages (MCPs) 23 e MMC Memory 13

Computing Power and Efficiency From workstations to netbooks, from tablets to ultrathins, computing designs require a multitude of packages, densities, and speeds. Our products enable you to optimize performance in key areas like signaling speeds and bandwidth and to find the right combination of power, efficiency, and cost. From components to modules to SSDs, we manufacture our products from start to finish. We invest time up front, rigorously testing and validating that our products are right the first time. Plus, our experienced technical support will help you get your design to market faster, easier, and better. DRAM Modules 8 Solid State Drives (SSDs) 21 DDR3/DDR4 SDRAM Components 6 Hybrid Memory Cube (HMC) 24 Graphics and Consumer Balancing Cost and Performance The convergence of applications in the graphics and consumer segment is bringing TV, social media, home entertainment, and gaming to end consumers through one piece of equipment. Micron offers one of the industry s broadest portfolios of market-leading DRAM and nonvolatile memory devices to meet this very competitive segment s demands for highperformance, cost-efficient memory solutions. We ve got the memory you need for a broad range of designs, including digital TVs, Blu-ray Disc players, video game consoles, portable game systems, personal media players, PC graphics cards, media tablets, cameras, or printers. DRAM Components 6 NOR Flash 14 NAND Flash 12 Managed NAND 13 Multichip Packages (MCPs) 23 Hybrid Memory Cube (HMC) 24 Networking Enabling Applications Now and Into the Future The unique requirements of communications and networking applications demand high-performance, specialty memory with low latency, rigorous thermal specifications, pristine signal integrity, and ECC data protection. Choosing the right memory technology for your design is a critical decision you make on the initial board layout; so is choosing a memory supplier to provide it. Micron engineers and manufactures a broad portfolio of specific solutions to meet the needs of your mission-critical networking applications. DRAM and RLDRAM Components 6 DRAM Modules 8 NAND Flash 12 eusb, e MMC Memory 13 Solid State Drives (SSDs) 21 NOR Flash 14 Hybrid Memory Cube (HMC) 24 Server Rigorously Tested for Reliability Server designs demand reliability, performance, and low power consumption. We ve developed a host of solutions from professional-grade SSDs to the industry s lowest-voltage modules that can help you address these challenges and overcome power and space constraints in data centers. We design and build our memory solutions from start to finish beginning with memory component design rigorously testing at each stage of the manufacturing process. We also work with board makers and industry organizations to define and develop the leading technologies that will enable your next server design. LRDIMMs 8 FBDIMMs 10 RDIMMs 8 NAND Flash 12 SATA and PCIe Solid State Drives (SSDs) 22 Hybrid Memory Cube (HMC) 24

DRAM Density Bus Width Voltage Clock Rate Package Temp Range MT40 DDR4 SDRAM 4Gb x4, x8, x16 1.2V 9331200 MHz 78-, 96-ball FBGA 0 C to +95 C 8Gb x4 1.2V 1067 MHz 78-ball FBGA 0 C to +95 C Note: Products meet RoHS standards. MT41 DDR3 SDRAM 1Gb x4, x8, x16 1.35V1.5V 667900 MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 2Gb x4, x8, x16 1.35V1.5V 6671066 MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 4Gb x4, x8, x16 1.35V1.5V 6671000 MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 8Gb x4, x8, x16 1.35V1.5V 533933 MHz 78-, 86-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS standards. MT47 DDR2 SDRAM 512Mb x4, x8, x16 1.8V 400533 MHz 60-, 84-ball FBGA, Wafer 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 1Gb x4, x8, x16 1.55V1.8V 333533 MHz 60-, 84-ball FBGA 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 2Gb x4, x8, x16 1.8V 333533 MHz 60-, 63-, 84-ball FBGA 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 4Gb x4, x8 1.8V 333400 MHz 0 C to +85 C Note: Products meet RoHS standards. MT46 DDR SDRAM 256Mb x4, x8, x16 2.52.6V 167200 MHz 512Mb x4, x8, x16 2.52.6V 167200 MHz 64Mb x4, x8, x16, x32 3.3V 133200 MHz 128Mb x4, x8, x16, x32 3.3V 133167 MHz 256Mb x4, x8, x16 3.3V 133167 MHz 54-, 86-pin TSOP, 54-, 90-ball VFBGA 54-, 86-pin TSOP, 54-, 90-ball VFBGA, 54-, 60-, 86-ball FBGA 54-pin TSOP, 54-ball VFBGA, 60-ball FBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 512Mb x4, x8, x16 3.3V 133 MHz 54-pin TSOP 0 C to +70 C, Note: Products meet RoHS 5/6 standards. 60-ball FBGA, 66-pin TSOP 60-ball FBGA, 66-pin TSOP 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 1Gb x4, x8, x16 2.5V 133167 MHz 66-pin TSOP 0 C to +70 C, Note: Products meet RoHS 5/6 standards. MT48 SDRAM 6

Density Bus Width Voltage Clock Rate Package Temp Range MT44 RLDRAM 3 Memory 576Mb x18, x36 1.35V 8001067 MHz 168-ball FBGA 0 C to +95 C, 40 C to +95 C 1.15Gb x18, x36 1.35V 800 MHz 168-ball FBGA 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS 5/6 standards. MT49 RLDRAM 2 Memory 288Mb x9, x18, x36 1.8V 300533 MHz 144-ball ubga 0 C to +95 C, 40 C to +95 C 576Mb x9, x18, x36 1.8V 300533 MHz 144-ball ubga 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS 5/6 standards. DRAM Density Bus Width Voltage Clock Rate Package Temp Range MT42 Mobile LPDDR2 1Gb x32 1.2V 400 MHz 134-ball VFBGA 25 C to +85 C, 40 C to +105 C 2Gb x16, x32 1.2V 333400 MHz 168-ball PoP 25 C to +85 C 4Gb x32, x64 1.2V 333533 MHz 168-, 216-ball PoP, 134-, 168-, 240-ball WFBGA, 216-ball UFBGA 25 C to +85 C 6Gb x32 1.2V 333400 MHz 168-ball VFBGA 25 C to +85 C 8Gb x32, x64 1.2V 333533 MHz 168-, 216-, 240-ball PoP, 168-, 216-, 272-ball WFBGA 25 C to +85 C 16Gb x64 1.2V 400533 MHz 216-, 220-, 253-ball VFBGA 25 C to +85 C Note: Products meet RoHS standards. MT46 Mobile LPDDR 128Mb x16 1.8V 167200 MHz 60-ball VFBGA 256Mb x16, x32 1.8V 167200 MHz 60-, 90-ball VFBGA 512Mb x16, x32 1.8V 167200 MHz 1Gb x16, x32 1.8V 167200 MHz 2Gb x16, x32 1.8V 167200 MHz 60-, 90-ball VFBGA, WFBGA, 152-ball PoP 60-, 90-ball VFBGA, 168-ball PoP 60-, 90-ball VFBGA, 168-ball PoP, 60-ball WFBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C, 40 C to +105 C 25 C to +85 C, 4Gb x32 1.8V 167200 MHz 168-, 240-ball PoP 25 C to +85 C, 8Gb x32 1.8V 167200 MHz 168-ball PoP 25 C to +85 C, Note: Products meet RoHS standards. MT48 Mobile LPSDR 64Mb x16 1.8V 125133 MHz 54-ball VFBGA 0 C to +70 C, 128Mb x16, x32 1.8V 133167 MHz 54-, 90-ball VFBGA 256Mb x16, x32 1.8V 133167 MHz 54-, 90-ball VFBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 512Mb x16, x32 1.8V 133167 MHz 54-, 90-ball VFBGA Note: Products meet RoHS standards. 128Mb meets RoHS 5/6 standards. 7

Density Bus Width RoHS I/O Voltage Access Time Package Temp Range MT45 PSRAM CellularRAM Memory 16Mb x16 Yes, Green 1.8V 70ns 48-, 54-ball VFBGA, 40 C to +105 C 32Mb x16 Green 1.8V 70ns 48-, 54-ball VFBGA, 40 C to +105 C 64Mb x16 Green 1.8V 70ns 48-, 54-ball VFBGA, 30 C to +85 C 128Mb x16 Green 1.8V 70ns, 85ns 54-ball VFBGA, 40 C to +105 C Modules Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR3 SDRAM 240-pin UDIMM 1GB x64 8 Green 1.351.5V 1333 MT/s Single 0 C to +95 C 2GB x64 4, 8 Green 1.351.5V 13331866 MT/s Single 0 C to +95 C 4GB x64 8, 16 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 8GB x64 16 Green 1.351.5V 13331866 MT/s Dual 0 C to +95 C DDR3 SDRAM 240-pin ECC UDIMM 1GB x72 9 Green 1.351.5V 13331600 MT/s Single 0 C to +95 C 2GB x72 9 Green 1.35 1.5V 13332133 MT/s Single 0 C to +95 C 4GB x72 9, 18 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green 1.351.5V 13331866 MT/s Dual 0 C to +95 C DDR3 SDRAM 240-pin VLP ECC UDIMM 2GB x72 9 Green 1.35V 1333 MT/s Single 0 C to +95 C 4GB x72 9, 18 Green 1.351.5V 13331600 MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green 1.351.5V 1600 MT/s Dual 0 C to +95 C DDR3 SDRAM 204-pin SODIMM 1GB x64 4, 8 Green 1.351.5V 13331600 MT/s Single 0 C to +95 C 2GB x64 4, 8 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 4GB x64 8, 16 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 8GB x64 16 Green 1.351.5V 13331866 MT/s Dual 0 C to +95 C DDR3 SDRAM 204-pin ECC SODIMM 2GB x72 18 Green 1.35V 1333 MT/s Dual 0 C to +95 C 4GB x72 9, 18 Green 1.35V 13331600 MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green 1.35V 13331600 MT/s Dual 0 C to +95 C DDR3 SDRAM 200-pin SORDIMM 16GB x72 36 Green 1.35V 1600 MT/s Quad 0 C to +95 C 8

Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR3 SDRAM 240-pin RDIMM 1GB x72 9 Green 1.5V 13331600 MT/s Single 0 C to +95 C 2GB x72 9, 18 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 4GB x72 9, 18 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 8GB x72 18, 36 Green 1.351.5V 10661866 MT/s Single, Dual, Quad 0 C to +95 C 16GB x72 36 Green 1.351.5V 13331866 MT/s Dual 0 C to +95 C 32GB x72 72 Green 1.351.5V 10661333 MT/s Quad 0 C to +95 C DDR3 SDRAM 240-pin VLP RDIMM 2GB x72 9 Green 1.35 13331600 MT/s Single 0 C to +95 C 4GB x72 9, 18 Green 1.351.5V 13331866 MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green 1.351.5V 10661600 MT/s Single, Dual 0 C to +95 C 16GB x72 36 Green 1.351.5V 13331866 MT/s Dual, Quad 0 C to +95 C 32GB x72 72 Green 1.35V 1333 MT/s Quad 0 C to +95 C DDR3 SDRAM 240-pin LRDIMM 16GB x72 36 Green 1.35V 1600 MT/s Quad 0 C to +95 C 32GB x72 72 Green 1.35V1.5V 13331866 MT/s Quad 0 C to +95 C 64GB x72 144 Green, Yes 1.35V1.5V 13331600 MT/s Octal 0 C to +95 C DRAM Modules DDR3 SDRAM 244-pin Mini-UDIMM 2GB x72 9 Green 1.35V1.5V 13331600 MT/s Single 0 C to +95 C 4GB x72 9, 18 Green 1.35V1.5V 1333 MT/s Single, Dual 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR3 SDRAM 244-pin Mini-RDIMM 4GB x72 18 Green 1.5V 1333 MT/s Dual 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR3 SDRAM 244-pin VLP Mini-UDIMM 2GB x72 9 Green 1.5V 1333 MT/s Single 0 C to +95 C, 40 C to +95 C 4GB x72 9 Green 1.35V 1333 MT/s Single 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1600 MT/s Dual 0 C to +95 C DDR3 SDRAM 244-pin VLP Mini-RDIMM 4GB x72 9 Green 1.35V 1333 MT/s Single 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR2 SDRAM 240-pin UDIMM 512MB x64 4 Yes 1.8V 800 MT/s Single 0 C to +85 C 1GB x64 8 Green 1.8V 800 MT/s Single 0 C to +85 C 2GB x64 16 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin ECC UDIMM 1GB x72 9 Yes 1.8V 667800 MT/s Single 0 C to +85 C 2GB x72 9, 18 Yes 1.8V 667800 MT/s Single, Dual 0 C to +85 C 4GB x72 18 Yes 1.8V 667800 MT/s Dual 0 C to +85 C 9

Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR2 SDRAM 200-pin SODIMM 256MB x64 4 Yes 1.8V 800 MT/s Single 0 C to +85 C 512MB x64 4 Yes, Green 1.8V 800 MT/s Single 0 C to +85 C 1GB x64 8 Yes, Green 1.8V 667800 MT/s Single, Dual 0 C to +85 C 2GB x64 16 Yes 1.8V 667800 MT/s Dual 0 C to +85 C 4GB x64 16 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 200-pin SORDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 9, 18 Yes, Green 1.8V 800 MT/s Single, Dual 0 C to +85 C 4GB x72 18, 36 Yes 1.8V 667800 MT/s Single, Dual 0 C to +85 C 8GB x72 36 Yes 1.8V 667800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin VLP RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Single, Dual 0 C to +85 C 4GB x72 18, 36 Yes 1.8V 800 MT/s Dual 0 C to +85 C 8GB x72 36 Yes 1.8V 667800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin FBDIMM 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +95 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +95 C 4GB x72 36 Yes 1.8V 800 MT/s Dual 0 C to +95 C 8GB x72 36, 72 Yes 1.8V 667800 MT/s Dual, Quad 0 C to +95 C DDR2 SDRAM 244-pin Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 244-pin VLP Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C 4GB x72 18 Yes 1.8V 667800 MT/s Dual 0 C to +85 C DDR SDRAM 184-pin UDIMM 256MB x64 4 Yes 2.5V 400 MT/s Single 0 C to +70 C 512MB x64 8 Yes 2.5V 400 MT/s Single 0 C to +70 C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0 C to +70 C 10

Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR SDRAM 184-pin ECC UDIMM 256MB x64 9 Yes 2.5V 333 MT/s Single 0 C to +70 C 512MB x64 9, 18 Yes, 5/6 2.5V 333400 MT/s Single, Dual 0 C to +70 C 1GB x64 18 Yes 2.5V 400 MT/s Dual 0 C to +70 C DDR SDRAM 200-pin SODIMM 128MB x64 4 Yes 2.5V 333 MT/s Single 0 C to +70 C 256MB x64 4, 8 Yes 2.5V 333400 MT/s Single, Dual 0 C to +70 C, 40 C to +95 C 512MB x64 8 Yes 2.5V 333400 MT/s Single, Dual 0 C to +70 C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0 C to +70 C DDR SDRAM 200-pin ECC SODIMM 256MB x72 9 Yes, 5/6 2.5V 333 MT/s Single 0 C to +70 C, 40 C to +95 C 512MB x72 9 Yes, 5/6 2.5V 333400 MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V 333400 MT/s Dual 0 C to +70 C DDR SDRAM 184-pin RDIMM 256MB x72 9 Yes 2.5V 400 MT/s Single 0 C to +70 C 512MB x72 9 Yes 2.5V 333400 MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V 333400 MT/s Single, Dual 0 C to +70 C 2GB x72 36 Yes 2.5V 333400 MT/s Dual 0 C to +70 C 4GB x72 36 Yes 2.5V 333 MT/s Dual 0 C to +70 C Modules DDR SDRAM 184-pin VLP RDIMM 512MB x72 9 Yes 2.5V 400 MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V 333 MT/s Dual 0 C to +70 C Density Bus Width Component Count RoHS Voltage Clock Rate Module Ranks Temp Range SDRAM 168-pin UDIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0 C to +70 C 128MB x64 4 Yes, 5/6 3.3V 133 MHz Single 0 C to +70 C 256MB x64 8, 16 Yes 3.3V 133 MHz Single, Dual 0 C to +70 C SDRAM 168-pin ECC UDIMM 128MB x72 9 Yes 3.3V 133 MHz Single 0 C to +70 C 256MB x72 18 Yes 3.3V 133 MHz Dual 0 C to +70 C SDRAM 144-pin SODIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0 C to +70 C 128MB x64 4, 8 Yes 3.3V 133 MHz Single, Dual 0 C to +70 C 256MB x64 8 Yes, 5/6 3.3V 133 MHz Dual 0 C to +70 C 512MB x64 16 Yes 3.3V 133 MHz Dual 0 C to +70 C SDRAM 168-pin RDIMM 128MB x72 9 Yes, 5/6 3.3V 133 MHz Single 0 C to +70 C 256MB x72 9 Yes 3.3V 133 MHz Single 0 C to +70 C 512MB x72 18 Yes 3.3V 133 MHz Single 0 C to +70 C 11

NAND Flash Density Bus Width Voltage Interface Package Temp Range MT29 SLC NAND Flash* 1Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 2Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 4Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 8Gb x8, x16 1.8, 3.3V 16Gb x8, x16 1.8, 3.3V 32Gb x8 3.3V 64Gb x8 3.3V 128Gb x8 3.3V Async (ONFI 1.0)/ Sync (ONFI 2.1) Async/Sync (ONFI 2.1/2.2) Async/Sync (ONFI 2.1/2.2/3.0) Async/Sync (ONFI 2.1/2.2/3.0) Async/Sync (ONFI 2.1/2.2/3.0) 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 48-pin TSOP, 100-ball VBGA, 132-ball VBGA 48-pin TSOP, 100-ball VBGA, 100-ball TBGA, 132-ball VBGA, 152-ball VBGA 48-pin TSOP, 100-ball TBGA, 100-ball LBGA, 132-ball TBGA, 152-ball VBGA 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 256Gb x8 3.3V Async/Sync (ONFI 2.2/3.0) 100-, 132-ball LBGA, 152-ball TBGA 0 C to +70 C, 512Gb x8 3.3V Async/Sync (ONFI 3.0) 152-ball LBGA 0 C to +70 C, Density Bus Width Voltage Interface Package Temp Range NAND Small Page (SP) Flash* 128Mb x8 3.3V Async 48-pin TSOP 256Mb x8 3.3V Async 48-pin TSOP, 55-ball VFBGA 512Mb x8 1.83.3V Async 48-pin TSOP, 63-ball VFBGA Density Bus Width Voltage Interface Package Temp Range MT29 MLC NAND Flash* 16Gb x8 3.3V Async/Sync (ONFI 2.2) 48-pin TSOP, Wafer 0 C to +70 C, 32Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0 C to +70 C, 64Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0 C to +70 C, 128Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA, Wafer 0 C to +70 C, 196Gb x8 3.3V Async/Sync (ONFI 3.2) 272-ball VFBGA 0 C to +70 C 256Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA 0 C to +70 C, 512Gb x8 3.3V Async/Sync (ONFI 2.2/3.2) 132-ball LBGA, 152-ball TBGA, 272-ball TFBGA 0 C to +70 C, 1Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball TFBGA/LFBGA 0 C to +70 C, 2Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball LFBGA 0 C to +70 C *Products meet RoHS standards. 12

Density Bus Width Voltage Technology Package Temp Range MT29 Serial NAND Flash* 1Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, 2Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, 4Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, *Products meet RoHS standards. Managed NAND Density Bus Width Voltage Technology JEDEC Package Temp Range Applications MTFC and N2M4 e MMC Memory for Embedded 2GB 4GB 4GB 8GB 8GB 16GB 32GB 64GB x8 x8 x8 x8 x8 x8 x8 x8 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) Density Package RoHS Voltage Interface Temp Range MTED and MTFD Embedded USBs 25nm MLC 4.41 153-ball WFBGA 25 C to +85 C Consumer 25nm MLC 4.41 100-ball LBGA, 153-ball TFBGA, 153-ball WFBGA 25nm MLC 4.51 153-ball WFBGA 25nm MLC 4.41 100-ball LBGA, 153-ball TFBGA, 153-ball WFBGA 25nm MLC 4.51 153-ball WFBGA 25nm MLC 4.41 25nm MLC 4.41 100-ball LBGA, 169-ball TFBGA, 169-ball WFBGA 100-ball LBGA, 169-ball TFBGA, 169-ball VFBGA 25nm MLC 4.41 169-ball LBGA/LFBGA Note: Products meet RoHS standards. Enhanced SLC partition 100% of the user area. 2GB eusb Yes 5V, 3.3V USB 2.0 0 C to +70 C, 4GB eusb Yes 5V, 3.3V USB 2.0 0 C to +70 C, 8GB eusb Yes 5V, 3.3V USB 2.0 0 C to +70 C, 16GB eusb Yes 5V, 3.3V USB 2.0 0 C to +70 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, Consumer, Industrial, Automotive Consumer Consumer, Industrial, Automotive Consumer Consumer, Industrial, Automotive Consumer, Industrial, Automotive Consumer, Industrial, Automotive NAND Flash Managed NAND Density Bus Width RoHS Voltage Bits/Cell Package Temp Range MT29 Enhanced ClearNAND Flash Memory 32GB x8 Yes 3.3V MLC 100-ball LBGA 0 C to +70 C 64GB x8 Yes 3.3V MLC 100-ball LBGA 0 C to +70 C 13

NOR Flash Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M29AW Parallel NOR Flash Automotive 512Mb x16 Yes 2.73.6V 100ns 1Gb x16 Yes 2.73.6V 100ns Note: Available in tape and reel. M29DW Parallel NOR Flash Automotive 56-pin TSOP, 56-ball BGA 56-pin TSOP, 56-ball BGA High/Low Lock High/Low Lock 32Mb x8/x16 Yes 2.73.6V 70ns 48-pin TSOP Multibank 256Mb x16 Yes 2.73.6V 70ns 56-pin TSOP Multibank Note: Available in tray or tape and reel. M29F Parallel NOR Flash Automotive 2Mb x8/x16 Yes 4.55.5V 55ns 4Mb x8/x16 Yes, No 4.55.5V 55ns 8Mb x8/x16 Yes 4.55.5V 55ns 16Mb x8/x16 Yes 4.55.5V 55ns Note: Available in tray or tape and reel. M29W Parallel NOR Flash Automotive 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 4Mb x8/x16 Yes 2.73.6V 55ns 8Mb x8/x16 Yes 2.73.6V 70ns 16Mb x8/x16 Yes 2.73.6V 70ns, 80ns 32Mb x8/x16 Yes 2.73.6V 70ns, 80ns 64Mb x8/x16 Yes 2.73.6V 60ns, 70ns 128Mb x8/x16 Yes 2.73.6V 70ns 256Mb x8/x16 Yes 2.73.6V 70ns 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-, 56-pin TSOP, 48-ball TFBGA, 64-ball TBGA 56-pin TSOP, 64-ball FBGA, 64-ball TBGA 56-pin TSOP, 64-ball FBGA, 64-ball TBGA Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot, High/Low Lock High/Low Lock High/Low Lock, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 512Mb x8/x16 Yes 2.73.6V 70ns 56-pin TSOP Low Lock Note: Available in tray or tape and reel. 14

Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M58BW Parallel NOR Flash Automotive 16Mb x32 Yes, No 2.73.6V M58WR Parallel NOR Flash Automotive 45ns, 55ns, 70ns 32Mb x32 Yes, No 2.73.6V 45ns, 55ns Note: Available in tape and reel. 80-ball LBGA, 80-pin PQFP 80-ball LBGA, 80-pin PQFP Bottom Boot Bottom Boot 40 C to +125 C 40 C to +125 C 32Mb x16 Yes 1.72.0V 70ns 56-ball VFBGA Bottom Boot 64Mb x16 Yes 1.72.0V 70ns 56-ball VFBGA Bottom/Top Boot Note: Available in tray or tape and reel. Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range G18 Parallel NOR Flash Embedded 256Mb x16 Yes 1.72.0V 512Mb x16 Yes 1.72.0V 1Gb x16 Yes 1.72.0V 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync 64-ball Easy BGA 64-ball Easy BGA 64-ball Easy BGA Uniform, AD, AA/D MUX Uniform, AD, AA/D MUX Uniform, AD, AA/D MUX Note: Available in tray or tape and reel. Also available in AD and AA/D MUX configurations for 50%-reduced active ball count. J3 Parallel NOR Flash Embedded 32Mb x8/x16 Yes, No 2.73.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 64Mb x8/x16 Yes, No 2.73.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 128Mb x8/x16 Yes, No 2.73.6V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 256Mb x8/x16 Yes, No 2.73.6V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Uniform M28W Parallel NOR Flash Embedded 16Mb x16 Yes 2.73.6V 70ns 32Mb x16 Yes 2.73.6V 70ns 64Mb x16 Yes 2.73.6V 70ns 48-pin TSOP, 46-ball TFBGA 48-pin TSOP, 47-ball TFBGA 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Notes: Available in tray or tape and reel. Features: Hardware write protection, OTP space, OTP SD, Krypto Flex Lock, Krypto Encrypted Access SD. NOR Flash 15

Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M29DW Parallel NOR Flash Embedded 32Mb x8/x16 Yes 2.73.6V 70ns 48-pin TSOP, 48-ball-TFBGA Multibank 128Mb x8/x16, x16 Yes 2.73.6V 60ns, 70ns 64-ball TBGA, 56-pin TSOP Multibank 256Mb x16 Yes 2.73.6V 70ns 56-pin TSOP, 64-ball TBGA Multibank M29EW Parallel NOR Flash Embedded 32Mb x8/x16 Yes 2.73.6V 60ns, 70ns 64Mb x8/x16 Yes 2.73.6V 60ns, 70ns 128Mb x8/x16 Yes, No 2.73.6V 60ns, 70ns 256Mb x8/x16 Yes, No 2.73.6V 512Mb x8/x16 Yes, No 2.73.6V 1Gb x8/x16 Yes, No 2.73.6V M29W Parallel NOR Flash Embedded 100ns, 110ns 100ns, 110ns 100ns, 110ns 48-pin TSOP, 48-ball BGA 48-, 56-pin TSOP, 64-ball FBGA, 48-ball BGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA Bottom/Top Boot, High/Low Lock Bottom/Top Boot, High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure 2Gb x8/x16 Yes, No 2.73.6V 100ns 64-ball FBGA High/Low Lock 4Mb x8/x16 Yes 2.73.6V 45ns, 55ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 8Mb x8/x16 Yes 2.73.6V 45ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 16Mb x8/x16 Yes 2.73.6V 70ns 64-ball FBGA, 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 32Mb x8/x16 Yes 2.73.6V 70ns 64-ball FBGA, 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 64Mb x8/x16 Yes 2.73.6V 60ns, 70ns, 90ns 64-ball FBGA, 48-ball TFBGA, 48-, 56-pin TSOP, 64-ball TBGA Bottom/Top Boot, High/Low Lock, Secure 128Mb x8/x16 Yes 2.73.6V 60ns, 70ns, 90ns 64-ball FBGA, 64-pin LBGA 64-ball TBGA, 56-pin TSOP High/Low Lock, Secure 256Mb x8/x16 Yes 2.73.6V 70ns 64-ball FBGA, 64-ball TBGA, 56-pin TSOP High/Low Lock, Secure 16

Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range P30 Parallel NOR Flash Embedded 64Mb x16 Yes, No 1.72.0V 65ns, 75ns 128Mb x16 Yes, No 1.72.0V 65ns, 75ns 256Mb x16 Yes, No 1.72.0V 100ns, 110ns 512Mb x16 Yes, No 1.73.6V 100ns, 110ns 1Gb x16 Yes, No 1.72.0V 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP Bottom/Top Boot, OTP Bottom/Top Boot, OTP Bottom/Top Boot, Uniform Bottom/Top Boot, Uniform 2Gb x16 Yes 1.73.6V 105ns 64-ball Easy BGA Uniform P33 Parallel NOR Flash Embedded 64Mb x16 Yes, No 2.33.6V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 128Mb x16 Yes, No 2.33.6V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 256Mb x16 Yes, No 2.33.6V 85ns, 95ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 512Mb x16 Yes, No 2.33.6V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, Uniform, OTP 1Gb x16 Yes 2.33.6V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA 2Gb x16 Yes 2.33.6V 100ns 64-ball Easy BGA Bottom/Top Boot, Uniform Bottom/Top Boot, Uniform NOR Flash 17

Density Bus Width RoHS Voltage Speed Package Type Temp Range M25P Serial NOR Flash Automotive 1Mb x1 Yes 2.33.6V 50 MHz 8-pin SO8 Narrow, 8-pin U-PDFN Data Storage 2Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Data Storage 4Mb x1 Yes 2.33.6V 75 MHz 8Mb x1 Yes 2.73.6V 75 MHz 16Mb x1 Yes 2.73.6V 75 MHz 32Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin U-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide 8-pin SO8 Narrow, 8-pin SO8 Wide 8-pin SO8 Narrow, 8-pin SO8 Wide Data Storage Data Storage Data Storage Data Storage 64Mb x1 Yes 2.73.6V 75 MHz 16-pin SO16 Wide Data Storage Note: Available in tray, tube, or tape and reel. M25PE Serial NOR Flash Automotive, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 1Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Page Erase, 40 C to +125 C 2Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Page Erase 4Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Page Erase 8Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Page Erase Note: Available in tape and reel. N25Q Serial NOR Flash Automotive 32Mb x1/x2/x4 Yes 2.73.6V 108 MHz 8-pin SO8 Narrow, 16-pin SO16 Wide Multi I/O, 40 C to +125 C 32Mb x1/x2/x4 Yes 1.72.0V 108 MHz 8-pin SO8 Wide Multi I/O 40 C to +125 C 64Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 128Mb x1/x2/x4 Yes 2.73.6V 108 MHz 256Mb x1/x2/x4 Yes 2.73.6V 108 MHz 8-pin V-PDFN-8, 8-pin SO8 Wide, 16-pin SO16 Wide, 24-ball TBGA 8-pin V-PDFN-8, 16-pin SO16 Wide, 24-ball TBGA 8-pin V-PDFN-8, 16-pin SO16 Wide, 24-ball TBGA Multi I/O Multi I/O Multi I/O, 40 C to +125 C, 40 C to +105 C, 40 C to +125 C, 40 C to +125 C 512Mb x1/x2/x4 Yes 2.73.6V 108 MHz 16-pin SO16 Wide Multi I/O 40 C to +125 C Note: Available in tape and reel. M25PX Serial NOR Flash Automotive 8Mb x1/x2 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Dual I/O, 40 C to +125 C 16Mb x1/x2 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow Dual I/O 32Mb x1/x2 Yes 2.73.6V 75 MHz 64Mb x1/x2 Yes 2.73.6V 75 MHz Note: Available in tube or tape and reel. 8-pin V-PDFN-8, 24-ball TBGA 16-pin SO16 Wide, 24-ball TBGA Dual I/O Dual I/O 18

Density Bus Width RoHS Voltage Speed Package Type Temp Range M25P Serial NOR Flash Embedded 512K x1 Yes 2.33.6V 50 MHz 1Mb x1 Yes 2.33.6V 50 MHz 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN Data Storage Data Storage 2Mb x1 Yes 2.33.6V 75 MHz 8-pin V-PDFN, 8-pin SO8 Narrow Data Storage 4Mb x1 Yes 2.33.6V 75 MHz 8Mb x1 Yes 2.73.6V 75 MHz 16Mb x1 Yes 2.33.6V 75 MHz 32Mb x1 Yes 2.73.6V 75 MHz 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN 16-pin SO16 Wide, 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN, KGD 16-pin SO16 Wide, 8-pin SO8 Wide, 8-pin V-PDFN Data Storage Data Storage Data Storage Data Storage 64Mb x1 Yes 2.73.6V 75 MHz 16-pin SO16 Wide, 8-pin V-PDFN Data Storage 128Mb x1 Yes 2.33.6V 75 MHz 8-pin V-PDFN, 16-pin SO16 Wide Data Storage Note: Available in tray, tube, or tape and reel. M25PE Serial NOR Flash Embedded 1Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, KGD Page Erase 2Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, KGD Page Erase 4Mb x1 Yes 2.73.6V 75 MHz 8Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN Page Erase Page Erase 16Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Wide, 8-pin V-PDFN Page Erase Note: Available in tray, tube, or tape and reel. M25PX Serial NOR Flash Embedded 8Mb x1/x2 Yes 2.33.6V 75 MHz 16Mb x1/x2 Yes 2.33.6V 75 MHz 32Mb x1/x2 Yes 2.73.6V 75 MHz 64Mb x1/x2 Yes 2.73.6V 75 MHz Note: Available in tray, tube, or tape and reel. 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN, 24-ball T-PBGA, KGD 8-pin SO8 Wide, 8-pin V-PDFN, 24-ball TBGA 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball TBGA, 24-ball T-PBGA Dual I/O Dual I/O Dual I/O Dual I/O NOR Flash 19

Density Bus Width RoHS Voltage Speed Package Type Temp Range M45PE Serial NOR Flash Embedded 1Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN Page Erase 2Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN Page Erase 4Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, 8-pin SO8 Wide Page Erase 8Mb x1 Yes 2.73.6V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, 8-pin SO8 Wide Page Erase 16Mb x1 Yes 2.73.6V 75 MHz 8-pin V-PDFN, 8-pin SO8 Wide Page Erase Note: Available in tray, tube, or tape and reel. N25Q Serial NOR Flash Embedded 16Mb x1/x2/x4 Yes 1.72.0V 108 MHz 8-pin XF-SCSP, 8-pin SO8 Wide, 8-pin SO8 Narrow Multi I/O 32Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN Multi I/O 64Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 8-pin SO8 Wide, 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA, KGD, SOP Multi I/O 128Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA, 8-pin V-PDFN, 8-pin SO8 Wide Multi I/O 256Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O 512Mb x1/x2/x4 Yes 1.72.0V, 2.73.6V 108 MHz 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O 1Gb x1/x2/x4 Yes 2.73.6V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O Note: Available in tray, tube, or tape and reel. Density Bus Width RoHS Voltage Speed Package Type Temp Range N25W Serial NOR Flash Mobile 32Mb x4 Yes 1.72.0V 108 MHz 64Mb x4 Yes 1.72.0V 108 MHz 8-pin V-PDFN, 8-pin SO8 Wide 8-pin V-PDFN, 8-pin SO8 Wide Multi I/O Multi I/O 25 C to +85 C 25 C to +85 C 128Mb x4 Yes 1.72.0V 108 MHz 8-pin V-PDFN Multi I/O 25 C to +85 C 256Mb x4 Yes 1.72.0V 108 MHz 8-pin V-PDFN Multi I/O Note: Available in tray or tape and reel. 20

Solid State Drives SSDs Capacity Package Height MT/s READ Performance WRITE Performance Voltage Interface Operating Temp M500 Self-Encrypting Drive (SED) 120GB 2.5in 7mm 6.0 Gb/s 500 MB/s 130 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 240GB 2.5in 7mm 6.0 Gb/s 500 MB/s 250 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 480GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 960GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 120GB msata 3.75mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 240GB msata 3.75mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 480GB msata 3.75mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 120GB M.2 3.5mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 240GB M.2 3.5mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 480GB M.2 3.5mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C Capacity Package Height Random READ Random WRITE Sequential READ Sequential WRITE Voltage Interface Operating Temp P400e SSD 50GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 100 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 100GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C P400m SSD 100GB 2.5in 7mm 50K IOPS 14K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 55K IOPS 16K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 55K IOPS 17K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C P300 SSD 50GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 100GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C P410m SSD 100GB 2.5in 7mm 50K IOPS 20K IOPS 410 MB/s 235 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 50K IOPS 30K IOPS 410 MB/s 345 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 50K IOPS 30K IOPS 410 MB/s 345 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 21

Capacity Package Height Random READ Random WRITE Sequential READ Sequential WRITE Voltage Interface Operating Temp P320h PCIe SSD 175GB 2.5in 9.5mm 415K IOPS (MAX4KB) 145K IOPS 1.75 GB/s 1.1 GB/s 12V x4 PCIe Gen2 0 C to +70 C 350GB 2.5in 9.5mm 415K IOPS (MAX4KB) 145K IOPS 1.75 GB/s 1.1 GB/s 12V x4 PCIe Gen2 0 C to +70 C 350GB HHHL 9.5mm 785K IOPS 205K IOPS 3.2 GB/s 1.9 GB/s 12V x8 PCIe Gen2 0 C to +50 C 700GB HHHL 9.5mm 785K IOPS 205K IOPS 3.2 GB/s 1.9 GB/s 12V x8 PCIe Gen2 0 C to +50 C P420m PCIe SSD 350GB 2.5in 9.5mm 430K IOPS (MAX 4KB) TBD 1.8 GB/s 325 MB/s 12V x4 PCIe Gen2 0 C to +70 C 700GB 2.5in 9.5mm 430K IOPS (MAX 4KB) TBD 1.8 GB/s 325 MB/s 12V x4 PCIe Gen2 0 C to +70 C 700GB HHHL 9.5mm 750K IOPS 95K IOPS 3.3 GB/s 630 MB/s 12V x8 PCIe Gen2 0 C to +50 C 1.4TB HHHL 9.5mm 750K IOPS 95K IOPS 3.3 GB/s 630 MB/s 12V x8 PCIe Gen2 0 C to +50 C 22

Multichip Packages NAND Density MT29 NAND Flash-Based MCPs 1Gb Bus Width x8, x16 LPDDR Density 256Mb, 512Mb 256Mb, 512Mb x16, x32 1.71.9V 166 MHz, 200 MHz 2Gb x8, x16 1Gb x16, x32 1.71.9V 200 MHz 4Gb x8, x16 2Gb, 4Gb x32 1.71.9V 200 MHz 107-ball TFBGA/VFBGA, 130-ball VFBGA, 137-ball TFBGA, 153-ball VFBGA 107-ball TFBGA, 130-ball VFBGA, 137-ball TFBGA, 153-ball VFBGA 137-ball TFBGA/VFBGA, 168-ball VFBGA 25 C to +85 C 8Gb x8, x16 4Gb x32 1.71.9V 200 MHz 137-ball TFBGA, 168-ball VFBGA 25 C to +85 C Note: Products meet RoHS standards. LPSDR Density Secondary Bus Width Voltage Clock Rate Package Temp Range SSDs MCPs Bare Die and Wafer-Level Products Requirements for increasingly smaller form factors and higher memory densities are fueling the need for an array of bare die memory solutions. Our bare die offerings are designed to enable you to choose the wafer-level products that best meet your project s needs. And we re committed to delivering bare die products that maintain reliability and quality levels similar to our fully tested and burned-in packaged devices. Find out more at micron.com/baredie. 23

Hybrid Memory Cube Hybrid Memory Cube (HMC) is a revolutionary innovation in DRAM memory architecture that sets a new standard for memory performance, power consumption, and cost. Combining high-speed logic process technology with a stack of through-silicon via (TSV) bonded memory die, HMC delivers dramatic improvements in performance and enables ultra-high bandwidth for applications ranging from networking, communications, and computing, to consumer technologies like tablets and graphics cards. Engineering samples of this high-bandwidth, low-energy, high-density memory system are now available. Work with your sales representative or visit micron.com/products/hmc for more information. Increased Bandwidth Provides 15X the performance of a DDR3 module Power Reductions Uses 70% less energy per bit than DDR3-1333 Smaller Physical Systems Uses nearly 90% less space than today s RDIMMs due to HMC s stacked architecture Scalable Includes logic layer flexibility, which enables HMC to be tailored to multiple platforms and applications Reduced Latency Enables significantly lower system latency as a result of HMC s massive parallelism Ultra Reliability Delivers greater resilience and field reparability with a new paradigm of system-level, advanced RAS features that include embedded error checking and correction capabilities Abstracted Memory Enables designers to leverage HMC s revolutionary features and performance without having to interface with complex memory parameters; manages error correction, resiliency, refresh, and other parameters exacerbated by memory process variation Low TCO Lowers TCO thanks to HMC s high performance, low energy, and RAS capabilities Density Link Description (Gb/s) Links MAX Effective BW (GB/s) Package Description Hybrid Memory Cube (HMC) 2GB 15G SR x4 160 896-ball BGA, 21mm x 31mm x 4mm 2GB 15G SR x2 120 666-ball FBGA, 16mm x19.5mm x 3.9mm 24

Part Numbering DDR4, DDR3, DDR2, DDR, SDRAM, Mobile LPDDR2/LPDDR/LPSDR, and RLDRAM Memory Micron Technology Product Family 40 = DDR4 SDRAM 41 = DDR3 SDRAM 42 = Mobile LPDDR2 44 = RLDRAM 3 Memory 46 = DDR SDRAM/ Mobile LPDDR Process Technology A = 1.2V V DD CMOS C = 5.0V V CC CMOS G = 3.0V V DD CMOS H = 1.8V V DD CMOS HC = 1.8V V DD CMOS, 1.2V I/O J = 1.5V V DD CMOS Device Number (depth, width) Blank = Bits M = Megabits K = Kilobits G = Gigabits Device Versions Alphanumeric character(s) specified by individual data sheet. L2, S2, and S4 devices are made with dual die in package. Mobile devices C1 = Single die, 2n prefetch C2 = 2-die stack, 2n prefetch D1 = Single die, 4n prefetch D2 = 2-die stack, 4n prefetch D4 = 4-die stack, 4n prefetch LA = 2-die stack, reduced-page-size addressing LF = Single die, standard addressing LG = Single die, reduced-page-size addressing L2 = 2-die stack, standard addressing L4 = 4-die stack, standard addressing R4 = 4-die stack, reduced-page-size addressing RLDRAM only Blank = Common I/O C = Separate I/O Package Codes Lead Plating DDR4 SDRAM Pb-Free/RoHS- Compliant Plating HA HX TRF 47 = DDR2 SDRAM 48 = SDRAM/ Mobile LPSDR 49 = RLDRAM 1 & 2 Memory 52 = Mobile LPDDR3 MT 48 A 128M16 D1 KL - 25 IT ES :A K = 1.35V V DD CMOS L = 1.2V V DD CMOS LC = 3.3V V DD CMOS N = 1.0V V DD CMOS R = 1.55V V DD CMOS V = 2.5V V DD CMOS Package Description 2, 3 FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (Twindie, 78-ball, 9 x 11.5) Package codes and descriptions continued on page 26. Die Revision Designator Special Processing Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperatures Special Options (Multiple processing codes are separated by a space and are listed in hierarchical order.) A = Automotive L = Low Power G = Graphics Blank = Commercial Temperature IT 1 = Industrial Temperature AT = Automotive Temperature WT = Wireless Temperature 1 The number one (1) and the capital letter I utilize the same laser mark I DRAM Technology Speed Grade Mark All DRAM -0 -A Speed Grade Mark DDR4 SDRAM -107E -107H -093E -093H -083E DDR3 SDRAM -25-25E -187-187E -15-15E -15F -125-125E -107-093 M = Reduced Standby X = Premium Lifecycle Product (PLP) Access/Cycle Time MAX Clock Frequency 933 MHz 933 MHz 1067 MHz 1067 MHz 1200 MHz 400 MHz 400 MHz 533 MHz 533 MHz 667 MHz 667 MHz 667 MHz 800 MHz 800 MHz 933 MHz 1067 MHz t RAC Access Time Untested Untested PC Targets CL- t RCD- t RP 13-13-13 14-13-13 15-15-15 16-15-15 16-16-16 6-6-6 5-5-5 8-8-8 7-7-7 10-10-10 9-9-9 8-8-8 11-11-11 10-10-10 13-13-13 14-14-14 Access/cycle time continued on page 26. HMC Part Numbering 25

DRAM Component Part Numbering (Continued) Package Codes Lead Plating DDR3 SDRAM DDR2 SDRAM FP FG JN HW F6 FN HV HW PK DDR SDRAM CV FG FN TG SDRAM FB FG F4 F5 TG xtg Pb-Free/ RoHS- Plating DA HA HX JP JT RA RE RH SHM STA SMA SLD THD THE THG THV THA TNA THW TRF BP BG CF HR B6 BN HQ HR RT HG EB WTR THM THN THN WTR THT CY BG BN P BB BG B4 B5 P xp RLDRAM 1 and 2 FM HU RLDRAM 3 PA PKM BM HT RB RCT Package Description 2, 3 FBGA (78-ball, 8 x 10.5) FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (78-ball, 8 x 11.5) FBGA (96-ball, 8 x 14) FBGA (78-ball, 10.5 x 12) FBGA (96-ball, 10.5 x 12) FBGA (78-ball, 9 x 10.5) FBGA (QuadDie, 78-ball, 10.5 x 12) FBGA (QuadDie, 3DS, 78-ball, 10.5 x 12) FBGA (QuadDie, 78-ball, 9.5 x 11.5) FBGA (TwinDie, 136-ball, 10 x 14) FBGA (TwinDie, 78-ball, 9 x 11.5 x 1.2) FBGA (TwinDie, 78-ball, 10.5 x 12) FBGA (TwinDie, 3DS, 78-ball, 10.5 x 12) FBGA (TwinDie, 78-ball, 8 x 11.5) FBGA (QuadDie, 78-ball, 10 x 11.5) FBGA (TwinDie, 96-ball, 10x14, x8 + x8) FBGA (QuadDie, 78-ball, 8 x 11.5) FBGA (TwinDie, 78-ball, 9.5 x 11.5) FBGA (60-ball, 8 x 12) FBGA (84-ball, 8 x 14) FBGA (60-ball, 8 x 10) FBGA (84-ball, 8 x 12.5) FBGA (60-ball, 10 x 10) FBGA (84-ball, 10 x 12.5) FBGA (60-ball, 8 x 11.5) FBGA (84-ball, 8 x 12.5) FBGA (84-ball, 9 x 12.5) FBGA (60-ball, 84-ball, 11.5 x 14) FBGA (60-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 12 x 14) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 8 x 10 [1Gb, 50nm only]) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (Quad die, 65-ball, 9 x 11.5) FBGA (84-ball, 60-ball, 8 x 12.5) FBGA (84-ball, 60-ball, 8 x 14) FBGA (54-ball, 60-ball, 84-ball, 10 x 12.5) TSOP (Type II) FBGA (60-ball, 8 x 16) VFBGA (54-ball); FBGA (84-ball, 60-ball, 8 x 14) VFBGA (54-ball, 8 x 8) VFBGA (90-ball, 8 x 13) TSOP (Type II) Stacked TSOP, x = internal stacking code µbga (144-ball, 11 x 18.5) FBGA (144-ball, 11 x 18.5) FBGA (168-, 169-ball, 13.5 x 13.5 x 1.2) SDP FBGA (168-, 169-ball, 13.5 x 13.5 x 1.45) DDP Pb-Free/ RoHS- Plating Mobile LPDDR3 2 Due to space limitations, FBGA- and µbga-packaged components and flip chips in packages have an abbreviated part mark that is different from the part number. See our Web site for more information on abbreviated component marks. 3 Dimensions in millimeters. Note: Some device offerings are available in a VFBGA rather than an FBGA package; this is noted on the data sheet. EL EM EN ET Mobile LPDDR2 AB AC EU EV GU GV KH KJ KL KP KQ KU KV LC LD LE LF LG LH LK LL LM MA MC MG MH MP Mobile LPDDR BF B5 B7 CK CM CX JV KQ MA Mobile LPSDR B4 B5 BF Package Description 2, 3 WFBGA (178-ball SDP, 11 x 11.5 x 0.8) VFBGA (178-ball DDP, 11 x 11.5 x 0.9) VFBGA (253-ball DDP, 11.5 x 11.5 x 0.9) TFBGA (178-ball QDP, 11 x 11.5 x 1.2) PoP (121-ball SDP, 6.5 x 8 x 0.8) PoP (134-ball DDP ICE, 10 x 11.5 x.65) PoP (253-ball DDP, 11 x 11 x 0.9) PoP (253-ball DDP, 11 x 11 x 1.2) PoP (134-ball SDP, 10 x 11 x 0.7) PoP (134-ball DDP, 10 x 11 x.85) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP & DDP, 12 x 12 x 0.8) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball JD32, 12 x 12 x 0.75) PoP (216-ball 3DP, 12 x 12 x 0.9) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (240-ball QDP, 14 x 14 x 1) PoP (220-ball QDP, 14 x 14 x 1) PoP (168-ball 3DP, 12 x 12 x 1, 0.35mm ball) PoP (168-ball SDP, 12 x 12 x 0.75) PoP (168-ball DDP, 12 x 12 x 0.8) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP, 12 x 12 x 0.7) PoP (240-ball DDP, 14 x 14 x 0.8) PoP (134-ball QPD, 11.5 x 11.5 x 1.2) PoP (134-ball QPD, 11 x 11.5 x 1) PoP (220-ball DDP, 14 x 14 x 0.8) VFBGA (60-ball SDP, 8 x 9 x 1) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 10 x 10 x 1) VFBGA (60-ball SDP, 10 x 11.5 x 1) VFBGA (90-ball SDP, 10 x 13 x 1) VFBGA (90-ball SDP, 9 x 13 x 1) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball DDP, 12 x 12 x 0.75) PoP (168-ball SDP, 12 x 12 x 0.7) VFBGA (54-ball SDP, 8 x 8) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 8 x 9 x 1) Speed Grade Mark DDR2 SDRAM -5E -37E -3-3E -25-25E -187E DDR SDRAM -75-6T -6-5B SDRAM -75-7E -7-6 -6A -55-5 Mobile LPDDR3-15 -125 Mobile LPDDR2-18 -25-3 -37-5 Mobile LPDDR -75-6 -54-5 -48 Mobile LPSDR -8-75 -6 MAX Clock Frequency 200 MHz 267 MHz 333 MHz 333 MHz 400 MHz 400 MHz 533 MHz Access/Cycle Time 133 MHz 167 MHz 167 MHz 200 MHz 133 MHz 133 MHz 143 MHz 167 MHz 167 MHz 183 MHz 200 MHz 667 MHz 800 MHz 533 MHz 400 MHz 333 MHz 266 MHz 200 MHz 133 MHz 167 MHz 185 MHz 200 MHz 208 MHz 125 MHz 133 MHz 167 MHz RLDRAM 1 and 2-5 -33-25 -25E -18 RLDRAM 3-125 -125E -107-107E -093-093E 200 MHz 300 MHz 400 MHz 4 400 MHz 5 533 MHz 800 MHz 6 800 MHz 7 933 MHz 7 933 MHz 8 1067 MHz 7 1067 MHz 8 4 Available with t RC 20ns. 5 Available with t RC 15ns. 6 Available with t RC (MIN) 12ns. 7 Available with t RC (MIN) 10ns. 8 Available with t RC (MIN) 8ns. PC Targets CL- t RCD- t RP 3-3-3 4-4-4 5-5-5 4-4-4 6-6-6 5-5-5 7-7-7 2.5-3-3 2.5-3-3 2.5-3-3 3-3-3 3-3-3 2-2-2 3-3-3 3-3-3 3-3-3 3-3-3 3-3-3 10-10-10 12-12-12 26

Hybrid Memory Cube Part Numbering MT 43 A 04G 04 01 00 NGF - S15 ES :A Micron Technology Product Family 43 = HMC DRAM Voltage A = 1.2V V DD CMOS DRAM Die Density per Layer G = Gigabits Number of DRAM Die in Package Logic Design Designator Sequential Number for Product Variations Package Codes Die Revision Designator Special Processing Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperatures Blank = Standard Temperature Electrical & Physical Link Specification -515 -U10 Special Options Blank = No Special Options Link Description SerDes I/O Interface 15 Gb/s 10 Gb/s Codes NFA NFH NGF NGK Package Description (mm) BBGA (896-ball, 4 DRAM high, 31 x 31 x 4) BBGA (896-ball, 8 DRAM high, 31 x 31 x 4) BFBGA (666-ball, 4 DRAM high, 16 x 19.5 x 3.9) BFBGA (666-ball, 8 DRAM high, 16 x 19.5 x 3.9) Part Numbering 27