IR Detector for Mid Range Proximity Sensor



Similar documents
IR Receiver Module for Light Barrier Systems

Preamplifier Circuit for IR Remote Control

IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications

Preamplifier Circuit for IR Remote Control

IR Receiver Modules for Remote Control Systems

Preamplifier Circuit for IR Remote Control

IR Receiver Modules for Remote Control Systems

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Low Current SMD LED PLCC-2

IR Receiver Modules for Remote Control Systems

Power SMD LED PLCC-2 Plus

IR Receiver Modules for Remote Control Systems

TSOP5700. IR Receiver for High Data Rate PCM at 455 khz VISHAY. Vishay Semiconductors

Silicon PIN Photodiode

Dome Lens SMD LED FEATURES APPLICATIONS. WAVELENGTH (nm)

High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW

Standard 0603 SMD LED

Low Current SMD LED PLCC-2

Silicon PIN Photodiode

Standard SMD LED PLCC-2

Silicon PIN Photodiode

Photo Modules for PCM Remote Control Systems

Ambient Light Sensor

Silicon NPN Phototransistor

Standard SMD LED PLCC-2

Optocoupler, Phototransistor Output, 4 Pin LSOP, Long Creepage Mini-Flat Package

Reflective Optical Sensor with Transistor Output

Ultrabright White LED, Ø 3 mm

Reflective Optical Sensor with Transistor Output

Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package

High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW

Optocoupler, Phototransistor Output, AC Input

Photovoltaic MOSFET Driver with Integrated Fast Turn-Off, Solid-State Relay

High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs

Taping, Labeling, Storage, Packing and Marking

Optocoupler, Phototransistor Output, High Reliability, 5300 V RMS, Low Input Current

Optocoupler, Phototransistor Output, with Base Connection

High Speed Infrared Emitting Diode, 870 nm, GaAlAs Double Hetero

Small Signal Fast Switching Diode

1 Form A Solid State Relay

1 Form A Solid State Relay

Aluminum Electrolytic Capacitors Power Eurodin Printed Wiring

Aluminum Electrolytic Capacitors Power Economic Printed Wiring

Electrical Double Layer Energy Storage Capacitors Power and Energy Versions

Optocoupler, Phototransistor Output, with Base Connection

High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs

SMD Aluminum Solid Capacitors with Conductive Polymer

Small Signal Fast Switching Diode FEATURES PART ORDERING CODE INTERNAL CONSTRUCTION TYPE MARKING REMARKS

Aluminum Electrolytic Capacitors Axial Miniature, Long-Life

Optocoupler, Phototransistor Output, with Base Connection, 300 V BV CEO

High Performance Schottky Rectifier, 3.0 A

High Performance Schottky Rectifier, 1.0 A

High Performance Schottky Rectifier, 1 A

2.5 A Output Current IGBT and MOSFET Driver

Optocoupler, Photodarlington Output, Dual Channel, SOIC-8 Package

Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications

AC and Pulse Film Foil Capacitors KP Radial Potted Type

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, High Vibration Capability

50 W Power Resistor, Thick Film Technology, TO-220

Power Resistor Thick Film Technology

SMD PTC - Nickel Thin Film Linear Thermistors

Aluminum Capacitors Solid Axial

Knob Potentiometer with Switch

Knob Potentiometer FEATURES. P16NP P16NM Panel Cutout. Thickness nut 2 mm washer 1.5 mm. Panel sealing ring 12 wrench Thread M10 x

Reflective Optical Sensor with Transistor Output

Standard Thick Film Chip Resistors

Optocoupler, Phototransistor Output, with Base Connection in SOIC-8 Package

Schottky Rectifier, 1.0 A

Fully Integrated Proximity Sensor with Infrared Emitter, I 2 C Interface, and Interrupt Function

Schottky Rectifier, 1.0 A

Optocoupler, Phototransistor Output, with Base Connection

Optocoupler, Phototransistor Output, with Base Connection

ESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips

SMS : Surface Mount, 0201 Zero Bias Silicon Schottky Detector Diode

Metal Film Resistors, Industrial, Precision

P-Channel 20 V (D-S) MOSFET

Pulse Proof Thick Film Chip Resistors

Audio Jack Detector with Send / End Detect

Pulse Proof, High Power Thick Film Chip Resistors

Metal Film Resistors, Industrial, Flameproof

SuperTan Extended (STE) Capacitors, Wet Tantalum Capacitors with Hermetic Seal

AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC, Class Y1, 500 V AC

Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications

CLA LF: Surface Mount Limiter Diode

Solid Tantalum Surface Mount Capacitors TANTAMOUNT, Molded Case, Low ESR

Load Switch with Level-Shift

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Metal Film Resistors, Non-Magnetic, Industrial, Precision

SKY LF: GHz Two-Way, 0 Degrees Power Divider

Silicon PIN Photodiode with Daylight Blocking Filter Version 1.4 BP 104 FS

P-Channel 20-V (D-S) MOSFET

Metal Film Resistors, Pulse Withstanding Protective

Power MOSFET. IRF510PbF SiHF510-E3 IRF510 SiHF510. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

28 V, 56 m, Load Switch with Programmable Current Limit and Slew Rate Control

Power MOSFET FEATURES. IRF610PbF SiHF610-E3 IRF610 SiHF610. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 V Gate-Source Voltage V GS ± 20

P6KE6.8A thru P6KE540A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor. FEATURES PRIMARY CHARACTERISTICS

Transcription:

IR Detector for Mid Range Proximity Sensor 22531-1 DESCRIPTION The is a compact infrared detector module for proximity sensing application. It receives 38 khz modulated signals and has a peak sensitivity of 940 nm. The length of the detector s output pulse varies in proportion to the amount of light reflected from the object being detected. ORDERING CODE Taping: TT1 - top view taped TT2 - top view taped FEATURES Height of 0.8 mm Up to 2 m for proximity sensing Receives 38 khz modulated signal 940 nm peak wavelength Photo detector and preamplifier in one package Low supply current Shielding against EMI Visible light is suppressed by IR filter Insensitive to supply voltage ripple and noise Supply voltage: 2.5 V to 5.5 V Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Object approach detection for activation of displays and user consoles, signaling of alarms, etc. Simple gesture controls Differentiation of car arrival, static, car departure in parking lots Reflective sensors for toilet flush Navigational sensor for robotics PARTS TABLE Carrier frequency 38 khz Package Belobog Pinning 1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = V S Dimensions (mm) 3.95 W x 3.95 H x 0.8 D Mounting SMD Application Proximity sensors BLOCK DIAGRAM 16833_20 4, 5 PROXIMITY SENSING IR emitter +3 V 33 kω V S 1 Envelope signal Input AGC Band pass Demodulator OUT 38 khz +3 V PIN Control circuit 2, 3, 6, 7, 8 GND Out to μc Rev. 1.7, 14-Apr-16 1 Document Number: 82480

ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Supply voltage V S -0.3 to +6 V Supply current I S 5 ma Output voltage V O -0.3 to (V S + 0.3) V Output current I O 5 ma Junction temperature T j 100 C Storage temperature range T stg -25 to +85 C Operating temperature range T amb -25 to +85 C Power consumption T amb 85 C P tot 10 mw Note Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Supply voltage V S 2.5-5.5 V Supply current Receiving distance Output voltage low Minimum irradiance Maximum irradiance V S = 5 V, E e = 0 I SD 0.55 0.7 0.9 ma E v = 40 klx, sunlight I SH - 0.8 - ma Direct line of sight, IR diode TSAL6200, I F = 250 ma, test signal see fig. 1 I OSL = 0.5 ma, E e = 0.7 mw/m 2, test signal see fig. 1 Pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o, test signal see fig. 1 t pi - 5/f o < t po < t pi + 6/f o, test signal see fig. 1 d - 40 - m V OSL - - 100 mv E e min. - 0.2 0.4 mw/m 2 E e max. 50 - - W/m 2 Directivity Angle of half receiving distance ϕ 1/2 - ± 75 - deg TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) E e V O V OH V OL Optical Test Signal (IR diode TSAL6200, I F = 0.4 A, 30 pulses, f = f 0, t = 10 ms) t pi * T * t pi 10/f 0 is recommended for optimal function Output Signal 16110_4 1) 7/f 0 < t d < 15/f 0 2) t pi - 5/f 0 < t po < t pi + 6/f 0 t d 1) t po 2) t t t po - Output Pulse Width (ms) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Output Pulse Width Input Burst Length λ = 950 nm, Optical Test Signal, Fig.1 0 0.1 1 10 10 2 10 3 10 4 E e - Irradiance (mw/m 2 ) Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark Ambient Rev. 1.7, 14-Apr-16 2 Document Number: 82480

E e min. /E e - Rel. Responsivity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 f = f 0.1 0 ± 5 % Δf (3 db) = f 0 /10 0.0 25 30 35 40 45 50 f/f 0 - Relative Frequency t po - Output Pulse Width (ms) 200 180 160 140 120 100 80 60 40 20 Burst length = 300 ms, f = f O 0 0.1 1 10 100 22088 E e - Irradiance (mw/m 2 ) Fig. 3 - Frequency Dependance of Responsivity Fig. 6 - Output Pulse Width vs. Irradiance E e min. - Threshold Irradiance (mw/m 2 ) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Correlation with Ambient Light Sources: 10 W/m 2 = 1.4 klx (Std. illum. A, T = 2855 K) 10 W/m 2 = 8.2 klx (Daylight, T = 5900 K) Wavelength of Ambient Illumination: λ = 950 nm 0 0.01 0.1 1 10 100 E e - Ambient DC Irradiance (W/m 2 ) E e min. - Sensitivity (mw/m 2 ) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0-30 -10 10 30 50 70 90 T amb - Ambient Temperature ( C) Fig. 4 - Sensitivity in Bright Ambient Fig. 7 - Sensitivity vs. Ambient Temperature E e min. - Threshold Irradiance (mw/m 2 ) 1.0 0.9 f = f 0 0.8 0.7 f = 30 khz 0.6 0.5 f = 20 khz 0.4 f = 10 khz 0.3 0.2 0.1 f = 100 Hz 0 1 10 100 1000 ΔV srms - AC Voltage on DC Supply Voltage (mv) S(λ) rel - Relative Spectral Sensitivity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 750 800 850 900 950 1000 1050 1100 1150 λ - Wavelength (nm) Fig. 5 - Sensitivity vs. Supply Voltage Disturbances Fig. 8 - Relative Spectral Sensitivity vs. Wavelength Rev. 1.7, 14-Apr-16 3 Document Number: 82480

t repeat min. (ms) 800 700 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 180 t pi (ms) t po (ms) 120 Emitter: VSMB1940X01 100 80 60 40 I F = 100 ma 20 I F = 10 ma I F = 30 ma I F = 50 ma 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Response Distance (m) Fig. 9 - Max. Rate of Bursts Fig. 11 - t po vs. Distance 1.2 7 Relative Response Distance 1.0 0.8 0.6 0.4 0.2 Directivity Characteristic of a Reflective Sensor using VSMB1940X01 and 0-90 -70-50 -30-10 10 30 50 70 90 d max. /d min. 6 5 4 3 2 1 0 10 20 30 40 50 60 70 80 90 100 110 120 Angle ( ) t pi (ms) Fig. 10 - Angle Characteristic Fig. 12 - Dynamic Range of Sensor vs. t pi The typical application of the is a reflective sensor with analog information contained in its output. Such a sensor is evaluating the time required by the AGC to suppress a quasi continuous signal. The time required to suppress such a signal is longer when the signal is strong than when the signal is weak, resulting in a pulse length corresponding to the distance of an object from the sensor. This kind of analog information can be evaluated by a microcontroller. The absolute amount of reflected light depends much on the environment and is not evaluated. Only sudden changes of the amount of reflected light, and therefore changes in the pulse width, are evaluated using this application. Example of a signal pattern: t pi = 120 ms, 38 khz t repeat = 500 ms Optical signal Response of the (strong reflection) Response of the (weak reflection) Rev. 1.7, 14-Apr-16 4 Document Number: 82480

Example for a sensor hardware: Emitter TSAL6200 Separation to avoid crosstalk by stray light inside the housing IR Receiver There should be no common window in front of the emitter and receiver in order to avoid crosstalk by guided light through the window. The logarithmic characteristic of the AGC in the results in an almost linear relationship between distance and pulse width. Ambient light has also some impact to the pulse width of this kind of sensor, making the pulse shorter. PACKAGE DIMENSIONS in millimeters (0.3) 4 x 0.75 = 3 (0.3) 0.75± 0.05 0.475 0.55 (0.7) (0.95) Not indicated tolerances ± 0.1 technical drawings according to DIN specifications (1.8) (0.4) (8 x) 0.35± 0.05 1.5 3 0.55 (0.3) 0.8 Pin 1 identification Pinning from topview (2) 8 7 6 Proposed pad layout from component side (dim. for reference only) (3.95) (3) (3.95) (0.8) (4x) (2.75) Out GND (GND) (GND) (GND) (Vs) Vs GND 1 2 3 4 5 (2) (2) (2) 0.15 3.95 (3.4) (1) (1) (1) (2.75) 3.95 (1.9) Pin 1 Identification marking area (0.35) (4 x) Drawing-No.: 6.550-5315.01-4 Issue: 2; 12.02.14 Notes (1) Optically effective area (2) Pins connected internally. It is not necessary to connect externally. Rev. 1.7, 14-Apr-16 5 Document Number: 82480

ASSEMBLY INSTRUCTIONS Reflow Soldering Reflow soldering must be done within 168 h while stored under a max. temperature of 30 C, 60 % RH after opening the dry pack envelope Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured Handling after reflow should be done only after the work surface has been cooled off Manual Soldering Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 C Finish soldering within 3 s Handle products only after the temperature has cooled off VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE T ( C) 300 max. 260 C 250 255 C 240 C 245 C 217 C 200 max. 20 s 150 max. 120 s max. 100 s 100 50 max. Ramp Up 3 C/s max. Ramp Down 6 C/s 0 0 50 100 150 200 250 300 19800 t (s) max. 2 cycles allowed ORDERING INFORMATION ORDERING CODE PACKAGING VOLUME (1) REMARKS TT1 MOQ: 1800 pcs Tape and reel TT2 MOQ: 7000 pcs 3.95 mm x 3.95 mm x 0.75 mm Note (1) MOQ: minimum order quantity Rev. 1.7, 14-Apr-16 6 Document Number: 82480

TAPING VERSION DIMENSIONS in millimeters Tape and reel dimensions: Ø 60 min. Reel size "Y" TT1 Ø 180 ± 2 = 1800 pcs. TT2 Ø 330 ± 2 = 7000 pcs. Unreel direction 2 ± 0.5 Tape position coming out from reel Ø Y Ø 21 ± 0.8 Ø 13 ± 0.2 (12.4) 18.4 max. Parts mounted Label posted here Empty leader 400 mm min. 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. (1.2) (0.3) Direction of pulling out X 2:1 (8) (4) (Ø 1.5) (2) (1.75) Technical drawings according to DIN specifications (5.5) 12 ± 0.3 Drawing-No.: 9.700-5347.01-4 Issue: 1; 14.11.11 Not indicated tolerances ± 0.1 Rev. 1.7, 14-Apr-16 7 Document Number: 82480

LABEL www.vishay.com Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 LOT-/serial-number BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - Mixed code indicator MIXED CODE - Origin xxxxxxx+ Company logo Long bar code top Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. 15973 Aluminum bag Reel Label FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Storage temperature 10 C to 30 C Storage humidity 60 % RH max. After more than 168 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C / - 0 C and < 5 % RH (dry air / nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 125 C + 5 C not suitable for reel or tubes. An EIA JEDEC standard J-STD-020 level 3 label is included on all dry bags. Rev. 1.7, 14-Apr-16 8 Document Number: 82480

Caution This bag contains MOISTURE-SENSITIVE DEVICES 1. Calculated shelf life in sealed bag: 12 months at <40 C and <90% relative humidity (RH) 2. Peak package body temperature: C 260 If blank, see adjacent bar code label 3. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within: hours 168 of factory conditions If blank, see adjacent bar code label 30 C/60% RH, or b) Stored per J-STD-033 4. Devices require bake, before mounting, if: LEVEL 3 If blank, see adjacent bar code label VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain specific data. BAR CODE PRODUCT LABEL (Example) a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for level 2 devices when read at 23±5 C b) 3a or 3b are not met 5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure Bag Seal Date: If blank, see adjacent bar code label Note: Level and body temperature defined by IPC/JEDEC J-STD-020 22178 22650 EIA JEDEC standard J-STD-020 level 3 label is included on all dry bags ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. Rev. 1.7, 14-Apr-16 9 Document Number: 82480

Tape and Reel Standards for SMD IR Receiver Modules Vishay Semiconductor SMD IR receivers are packaged on tape and reel. The following specification is based on IEC publication 286, which takes the industrial requirements for automatic insertion into account. Absolute maximum ratings, mechanical dimensions, optical and electrical characteristics for taped devices are identical to the basic catalog types and can be found in the specifications for untaped devices. PACKAGING The tapes of components are available on reels. Each reel is marked with labels which contain the following information: - Vishay - Type - Group - Tape code, normally part of type name - Production code - Quantity MISSING COMPONENTS Up to 3 consecutive components may be missing if the gap is followed by at least 6 components. A maximum of 0.5 % of the components per reel quantity may be missing. At least 5 empty positions are present at the start and the end of the tape to enable tape insertion. Tensile strength of the tape: > 15 N NUMBER OF COMPONENTS A. Panhead SMD: quantity per reel: TT, SMD top view package, 1190 pcs TR, SMD side view package, 1120 pcs B. Heimdall: quantity per reel: TT, Heimdall top view package, 2200 pcs TR, Heimdall side view package, 2300 pcs C. Heimdall without lens: quantity per reel: WTT, top view package, 2200 pcs WTR, side view package, 2300 pcs D. Belobog: quantity per reel: TT1, 1800 pcs TT2, 7000 pcs TR, not available in side view E. Belobog with shield: quantity per reel: TT1, 1500 pcs TT2, 5000 pcs F. Minimold DF1P: quantity per reel: DF1P, 1100 pcs ORDER DESIGNATION The type designation of the device is extended by TT or TT1 for top view or TR for side view. Example: TSOP6238TR (reel packing) TSOP75238TR (reel packing) TSOP75338WTT (reel packing) TSOP57438TT1 (reel packing) TSOP57238HTT1 (reel packing) Rev. 2.2, 01-Jul-16 1 Document Number: 80125

REEL DIMENSIONS FOR PANHEAD SMD AND HEIMDALL in millimeters 16734 Note The body structure of the reel can vary Rev. 2.2, 01-Jul-16 2 Document Number: 80125

TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters A. Panhead SMD (TSOP36...TT, TSSP...TT, TSOP6...TT) 16584 Rev. 2.2, 01-Jul-16 3 Document Number: 80125

TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters B. Heimdall SMD (TSOP75...TT, TSOP77...TT, TSSP77...TT) 3.65 0.3 16 1.75 7.5 Ø 1.5 Ø 1.5 4 8 Direction of feed 2 Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 technical drawings according to DIN specifications Rev. 2.2, 01-Jul-16 4 Document Number: 80125

TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters C. Heimdall SMD without lens (TSOP75...WTT, TSOP77...WTT, TSSP77...WTT) 16 1.75 7.5 4 8 2 0.3 3 Ø 1.5 Ø 1.5 min. Direction of feed Drawing-No.: 9.700-5341.01-4 Issue: 3; 06.10.15 technical drawings according to DIN specifications Rev. 2.2, 01-Jul-16 5 Document Number: 80125

TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters D. Belobog (TSOP37...TT1, TSOP37...TT2, TSOP57...TT1, TSOP57...TT2) Tape and reel dimensions: Ø 60 min. Reel size "Y" TT1 Ø 180 ± 2 = 1800 pcs. TT2 Ø 330 ± 2 = 7000 pcs. Unreel direction 2 ± 0.5 Tape position coming out from reel Ø Y Ø 21 ± 0.8 Ø 13 ± 0.2 (12.4) 18.4 max. Parts mounted Label posted here Empty leader 400 mm min. 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. (1.2) (0.3) Direction of pulling out X 2:1 (8) (4) (Ø 1.5) (2) (1.75) Technical drawings according to DIN specifications (5.5) 12 ± 0.3 Drawing-No.: 9.700-5347.01-4 Issue: 1; 14.11.11 Not indicated tolerances ± 0.1 Rev. 2.2, 01-Jul-16 6 Document Number: 80125

TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters E. Belobog with shield (TSOP37...HTT1, TSOP37...HTT2, TSOP57...HTT1, TSOP57...HTT2) Tape and Reel dimensions: Reel size "Y" GS 08 Ø 180 ± 2 = 1500 pcs. GS 18 Ø 330 ± 2 = 5000 pcs. Unreel direction X Ø 60 min. 2 ± 0.5 Tape position coming out from reel Ø Y Not indicated tolerances ± 0.1 Ø 21 ± 0.8 Ø 13 ± 0.2 (12.4) 18.4 max. Parts mounted Label posted here Empty leader 400 mm min. 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. Direction of pulling out X 2 : 1 Technical drawings according to DIN specifications (0.3) (8) (Ø 1.5) (2) (4) (1.75) (5.5) (12) Reel dimensions and tape Drawing-No.: 9.700-5380.01-4 Issue: 1; 28.10.13 Rev. 2.2, 01-Jul-16 7 Document Number: 80125

TAPING VERSION TSOP..DF1P (SIDE VIEW) DIMENSIONS in millimeters F. Minimold DF1P (TSOP33...DF1P, TSOP53...DF1P) 24.4 +3-0 Ø 60 min. Ø 330 +0-4 Ø 12.8 min. 1.5 min. Technical drawing according to DIN specifications Form of the leave open of the wheel is supplier specific. Dimensions according to IEC EN 60 286-3 Tape width: 24 Reel hub 2:1 Ø 20.2 min. Drawing-No.: 9.800-5052.V3-4 Issue: 1; 17.12.02 (4) (1.55) (2) B (0.4) (24) (11.75) (1.75) (11.5) (1.5 min.) (12) A A B B - B (5.25) A - A Drawing-No.: 9.700-5399.01-4 Issue: 1; 30.06.16 (6.08) Rev. 2.2, 01-Jul-16 8 Document Number: 80125

TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters A. Panhead SMD (TSOP36...TR, TSSP6...TR, TSOP6...TR) 16585 Rev. 2.2, 01-Jul-16 9 Document Number: 80125

TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters B. Heimdall SMD (TSOP75..., TSOP77..., TSSP7...) 16 7.5 1.75 4 8 2 0.3 3.6 1.34 ref. Ø 1.5 Ø 1.5 min. Direction of feed Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 technical drawings according to DIN specifications Rev. 2.2, 01-Jul-16 10 Document Number: 80125

TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters C. Heimdall SMD without lens (TSOP75...WTR, TSOP77...WTR, TSSP...WTR) 1.75 7.5 16 4 8 2 3.6 0.3 Ø 1.5 Ø 1.5 Direction of feed Drawing-No.: 9.700-5342.01-4 Issue: 2; 12.06.13 technical drawings according to DIN specifications Rev. 2.2, 01-Jul-16 11 Document Number: 80125

LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices devices Leader no devices End Start min. 200 min. 400 96 11818 COVER TAPE REEL STRENGTH According to DIN EN 60286-3 0.1 N to 1.3 N 300 mm/min. ± 10 mm/min. 165 to 180 peel angle LABEL Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 LOT-/serial-number BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - Mixed code indicator MIXED CODE - Origin xxxxxxx+ Company logo LONG BAR CODE TOP TYPE LENGTH Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 SHORT BAR CODE TOP TYPE LENGTH Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 Rev. 2.2, 01-Jul-16 12 Document Number: 80125

DRY PACKAGING www.vishay.com The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag 15973 Reel Label RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Storage temperature 10 C to 30 C Storage humidity 60 % RH max. After more than 72 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C / - 0 C and < 5 % RH (dry air / nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 125 C + 5 C not suitable for reel or tubes. An EIA JEDEC standard JSTD-020 level 4 label is included on all dry bags. CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 1. Shelf life in sealed bag: 12 months at < 40 C and < 90 % relative humidity (RH) 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 C) must be 2a. Mounted within 72 hours at factory condition of < 30 C/60 % RH or 2b. Stored at < 5 % RH 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 C ± 5 C or 2a. or 2b. are not met. 4. If baking is required, devices may be baked for: 192 hours at 40 C + 5 C/- 0 C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 C ± 5 C and < 5 % RH for all device containers or 24 hours at 125 C ± 5 C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 22522 LEVEL 4 EIA JEDEC standard JSTD-020 level 4 label is included on all dry bags ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain specific data. 16962 OUTER PACKAGING The sealed reel is packed into a pizza box. CARTON BOX DIMENSIONS in millimeters Thickness Length Pizza Box (SMD and Heimdall) (Taping in reels) 22127 Width THICKNESS WIDTH LENGTH 50 340 340 Rev. 2.2, 01-Jul-16 13 Document Number: 80125

Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 91000