RoHS COMPLIANCE STATEMENT



Similar documents
Directive 2002/95/EC

Elimination Of RoHS Substances In Electronic Products

Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products

RoHS Test Methods. Presented by: Bruce Peterson

Final Report. New No. Continue with amended wording (expiry date 31 July 2014 except for

COMMISSION DIRECTIVE 2013/28/EU

China RoHS Directive Legislation Compliance October 2011

Distance Measuring Sensor Unit Measuring distance : 4 to 30 cm Analog output type

Government Guidance Notes

3M Mini D Ribbon (MDR) Connectors.050 Surface Mount Right Angle Receptacle - Shielded 102 Series

3M Pin Strip Header.100,.295 Mating Length, Straight & Right Angle, Solder Tails 929 Series

RoHS CERTIFICATE OF COMPLIANCE FOR ACCUTOUCH SCREENS (Excluding AT4 Touch Screens)

N o n - a u t h o r i z e d t r a n s l a t i o n

TRU RoHS Products Test Report

3M Pin Strip Header Single and Dual Row.100,.235 /.318 Mating Length, Straight & Right Angle, Solder Tails 929 Series

3M High Flex Life Cable.050" 28 AWG Stranded, PVC 3319 Series

Physical. Electrical. Environmental. Insulation: Contact: Plating: Temperature Rating: -55 C to +85 C

Product Regulatory Compliance Datasheet NBU 5330

RoHS / Lead-Free Initiative. Microsemi Analog Mixed Signal Group

Product Regulatory Compliance Datasheet BE3600

GP2Y0D810Z0F. Distance Measuring Sensor Unit Digital output (100 mm) type GP2Y0D810Z0F

REACH and RoHS System Supplier Training

PC817XNNSZ0F Series. DIP 4pin Photocoupler. Description. Agency approvals/compliance. Applications Features PC817XNNSZ0F

Connection Cable for LED Driver Board

Product Regulatory Compliance Datasheet ediscovery 8200

IT(rms) 1.2A, Non-Zero Cross type DIP 8pin Triac output SSR

GP2Y0A02YK0F. Distance Measuring Sensor Unit Measuring distance: 20 to 150 cm Analog output type GP2Y0A02YK0F

Product Regulatory Compliance Datasheet ediscovery 8100

MADP T. Non Magnetic MELF PIN Diode

GBIC CWDM 40km Part no:

No. HKGEC Date: 26 Apr 2016 Page 1 of 6

The following merchandise was (were) submitted and identified by the client as : LAN CABLE LSZH 2006/01/ /01/05 TO 2006/01/19

BW-500 BED WEIGHER USER MANUAL

PCB RoHS Update OCT08 ELECTRONICS MANUFACTURING SERVICES

3M Twisted Pair Flat Cable.050" 28 AWG Stranded, Mass Terminatable Pair, PVC 1700 Series

TEST REPORT Page 1 of 9

GP2Y1010AU0F. Compact Optical Dust Sensor. Description. Compliance. Applications. Features GP2Y1010AU0F. 1. Compliant with RoHS directive (2002/95/EC)

Package Material Declaration

OPERATION MANUAL MARSDEN-200 PLEASE TAKE THE TIME TO READ THESE INSTRUCTIONS BEFORE STARTING TO USE THE SCALES

Operating Instructions

AUPS Series. User Manual MODEL: VESA Mount Intelligent UPS Module 12 V DC Input or 9 V ~ 36 V DC Input Network Remote Management Support

Toxic and Hazardous Materials in Electronics

Hong Kong Green Label Scheme Product Environmental Criteria for Copying Machines, Printers, Fax Machines and Multifunctional Devices (GL )

MP-1919 XNOVA Cube TM SMD LED

LUXEON S. High Flux Density

High flux for outdoor applications

Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules

AUPS-C20. User Manual MODEL: VESA Mount Intelligent UPS Module, 9 V ~ 28 V DC Input, 100 W Power Output, Network Remote Management Support

Material Safety Data Sheet For NiMH Batteries

Model GS Port Node 1 GHz with 40/52 MHz split

Product environmental attributes THE ECO DECLARATION

Gx Tubing. High-quality Gx Glass Tubing for pharmaceutical packaging. Tubular Glass

Understanding RoHS and REACH: Impacts on your Global Markets

RoHS RIA November 2003

(Text with EEA relevance)

ECLIPSE MX. Motorized Fader Control Surface. Users Manual

Connectors for PCMCIA ExpressCard Technology

Product Environmental Profile Step Down Transformers

Basic Cable Assemblies DELIVERING QUALITY SINCE 1952.

Light Link Series 2 LT1550. Laser Transmitter with Erbium Doped Fibre Amplifier. Description. Features

SpectraTec II. Polarized Multi-Laser Source BLUE SKY RESEARCH WAVELENGTHS. The SpectraTec II

Introduction GE LAMPS GE BALLAST ( ) Introduction/Overview to Lamps and Ballasts...A

TWO/FIFTY/TWO STEREO POWER AMPLIFIER

Service Overview. Chapter

GREEN CHOICE PHILIPPINES

Organize Sanayi Bölgesi 21.Cadde No:1 ESKİŞEHİR FAX NO: Attention : Mustafa Günay (mgunay@doganglass.com)

LUXEON TX Extreme efficacy that will transform your next market leading luminaire

Bridgelux ES Array Series

WASTE QUESTIONNAIRE. Legal basis Council Directive 75/442/EEC of 15 July 1975 on waste (OJ L p. 39) EUR-Lex hyperlink html

Multiple colors, a single focal length

LUXEON Altilon. Functional solution for forward lighting systems AUTOMOTIVE

DIRECTIVE 2000/53/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 18 September2000 on end-of life vehicles

IDDUPS A/636260A

: EUROPE, ASIA, AFRICA, AMERICA

LUXEON CoB with CrispWhite Technology Retail lighting that makes an impact

III , - I, - II, - IV,

( ) DIN EN : successor standard of DIN VDE0884.

ZTE Blade L2 Mobile Phone Quick Start Guide

TOXIC CHEMICALS IN COMPUTERS EXPOSED

Allied Telesis and the Environment

1 POLE 5 A (CADMIUM FREE CONTACTS TYPE) NY SERIES

Plug - Type (Male/Female) Attenuators CAA series Singlemode

Directive 2000/53/EU on End-of-life vehicles (ELV) Screening SERBIA

LUXEON 5630 Mid-Power LEDs Illumination Portfolio

FIBER OPTIC ISOLATORS

VALVES FOR REFRIGERATING SYSTEMS

Un-cooled Multimode Pump Laser Module for Telecom Applications

UNLIMITED VARIETY OF CREATIVE SHEET MATERIAL.

USB-Blaster Download Cable User Guide

DIRECTIONAL FIBER OPTIC POWER MONITORS (TAPS/PHOTODIODES)

1 USB Modem Introduction

Environmental Product Declaration

2016 Mid Power LED Mid Power Product Datasheet. Features: Table of Contents. Applications

Transcription:

Document type: Document number: Version: Form (F) TBD 2.0 Document name: PDE-F-012- compliance statement Author: Reviewer: Approver: Release date: Pages: Sippe ahomi uuspe 2-May-06 17 COMPLIANCE STATEMENT

2 CONTENTS 1 Scope... 3 2 Restricted () materials... 3 3 s... 3 4 List of covered products... 5 5 compliance statement... 18 6 References... 18

3 1 SCOPE This statement clarifies Modulight s product compliance with the European Union s directive 2002/95/EC, Restrictions of Hazardous Substances ( directive) and similar regulations that may be adopted by other countries. directive becomes valid on Jul 1 2006 in the member states of European Union. It states that all new electrical and electronic equipment put on the market within the member states must not contain certain hazardous materials. 2 RESTRICTED () MATERIALS Quantity limit 0.1% of weight (1000ppm) of any homogeneous material: 1. Lead (Pb) 2. Mercury (Hg) 3. Hexavalent Chromium (Cr VI) 4. Flame retardants Polybrominated Biphenyls (PBB) and Polybrominated Diphenyl Ethers (PBDE) Quantity limit 0.01% of weight (100 ppm) of any homogeneous material: 1. Cadmium (Cd) Homogeneous material means a material that cannot be mechanically disjointed into different materials by, for example unscrewing, cutting, crushing, grinding and abrasive processes. Homogeneous is further defined as of uniform composition throughout. 3 EXEMPTIONS Following cases are exempted from the requirements: 1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 2. Mercury in straight fluorescent lamps for general purposes not exceeding: halophosphate 10 mg triphosphate with normal lifetime 5 mg triphosphate with long lifetime 8 mg. 3. Mercury in straight fluorescent lamps for special purposes. 4. Mercury in other lamps not specifically mentioned in this Annex. 5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight. 7. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), lead in solders for servers, storage and storage array systems (exemption granted until 2010), lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, lead in electronic ceramic parts (e.g. piezoelectronic devices).

8. Cadmium plating except for applications banned under Directive 91/338/EEC ( 1 ) amending Directive 76/769/EEC ( 2 ) relating to restrictions on the marketing and use of certain dangerous substances and preparations 9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for: Deca BDE, mercury in straight fluorescent lamps for special purposes, lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and light bulbs, as a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly. 4 1 OJ L 186, 12.7.1991, p. 59. 2 OJ L 262, 27.9.1976, p. 201.

5 4 LIST OF COVERED PRODUCTS Sales part Description ML1000 1310 nm FP laser diode chip for 2.5 Gb/s applications, 7 mw output power YES ML1001 1310 nm DFB laser diode chip for 2.5 Gb/s applications, 7 mw output power YES ML1002 1310 nm DFB laser diode chip for 10 Gb/s applications, 10 mw output power YES ML1005 1490 nm DFB laser diode chip for 2.5 Gb/s applications, 6 mw output power YES ML1006 1550 nm DFB laser diode chip for 2.5 Gb/s applications, 3 mw output power YES ML1007 1550 nm FP laser diode chip for 2.5 Gb/s applications, 5 mw output power YES ML1010 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML1011 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML1012 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML1013 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML1014 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML1015 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML1016 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML1017 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML1018 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML1019 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without

6 Sales part Description ML1020 ML1021 ML1022 ML1023 ML1024 ML1025 ML1026 ML1027 ML1028 ML1029 ML1030 ML1031 ML1032 ML1033 ML1034 ML1035 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, without, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, without, M1407, 6, 6, 6, 6

7 Sales part Description ML1036 ML1037 ML1038 ML1039 ML1040 ML1041 ML1042 ML1043 ML1044 ML1045 ML1046 ML1047 ML1048 ML1049 ML1050 ML1051 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, without, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, without, M1407

8 Sales part Description ML1052 ML1053 ML1054 ML1055 ML1056 ML1057 ML1058 ML1059 ML1060 ML1061 ML1062 ML1063 ML1064 ML1065 ML1066 ML1067 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, without, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6

9 Sales part Description ML1068 ML1069 ML1070 ML1071 ML1072 ML1073 ML1074 ML1075 ML1076 ML1077 ML1078 ML1079 ML1080 ML1081 ML1082 ML1083 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, with isolator, with flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, without, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6

10 Sales part Description ML1084 ML1085 ML1086 ML1087 ML1088 ML1089 ML1090 ML1091 ML1092 ML1093 ML1094 ML1095 ML1096 ML1097 ML1098 ML1099 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, with, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, with isolator, 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, with isolator, no flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, without, M1407 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6

Sales part Description ML1100 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, with isolator,, M1407 ML1101 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, with isolator, no flange, M1407 ML1102 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, without ML1103 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, without ML1104 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, with isolator, ML1105 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, with isolator, no flange ML1106 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, without ML1107 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, without ML1108 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, with isolator, ML1109 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, with isolator, no flange ML1110 1490 nm DFB laser diode chip for 2.5 Gb/s applications, 10 mw output power YES ML1111 800 nm FP laser diode chip, high power YES ML1112 900 nm FP laser diode chip, high power YES ML1113 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML1114 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML1115 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML1116 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 11

12 Sales part Description ML1117 ML1118 ML1119 ML1120 ML1121 ML1122 ML1123 ML1124 ML1125 ML1126 ML1127 ML1128 ML1129 ML1130 ML1131 ML1132 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange, 6, 6, 6, 6, 6, 6

13 Sales part Description ML1133 ML1134 ML1135 ML1136 ML1137 ML1138 ML1139 ML1140 ML1141 ML1142 ML1143 ML1144 ML1145 ML1146 ML1147 ML1148 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6, 6, 6, 6, 6, 6, 6

Sales part Description ML1149 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML1150 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML1151 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML1152 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML1153 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML1154 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML1155 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, ML1156 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML1157 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML1158 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML1159 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML1160 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange ML1210 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 3 ML1211 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 3 ML1212 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 3 ML1213 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 3 ML1214 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 2 ML1215 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 3 14

Sales part Description ML1216 1430 nm FP TO-can for 1.25 Gb/s applications, 3 mw output power, ball lens, pin layout 3 ML1217 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 3 ML1218 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 2 ML1219 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 3 ML1220 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 3 ML1221 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 3 ML1222 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 3 ML1223 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML1224 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML1225 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML1226 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML1227 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML1228 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML1229 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML1230 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML1231 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML1232 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML1233 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 15

Sales part Description ML1234 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML1235 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML1236 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML1237 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, ML1238 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML1239 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML1240 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML1241 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML1242 1550 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange ML1243 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 2 ML1244 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 1 ML1245 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 2 ML1246 1310 nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 1 ML1247 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 1 ML1248 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 2 ML1249 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 1 ML1250 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 2 ML1251 1310 nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 1 ML1252 1430 nm FP TO-can for 1.25 Gb/s applications, 3 mw output power, ball lens, pin layout 1 16

17 Sales part Description ML1253 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 1 ML1254 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 2 ML1255 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 3 ML1256 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 1 ML1257 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 2 ML1258 1490 nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 3 ML1259 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 1 ML1260 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 2 ML1261 1490 nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 1 ML1262 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 1 ML1263 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 2 ML1264 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 1 ML1265 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 2 ML1266 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 1 ML1267 1550 nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 2 ML1268 1550 nm FP oxide stripe YES ML1269 1550 nm FP diode laser unmounted bar YES ML1273 60W 808nm CW diode laser bar YES ML1274 60W 795nm CW diode laser bar YES ML1275 100W 808nm QCW diode laser bar YES ML1277 40W 808nm CW diode laser bar YES ML1278 40W 795nm CW diode laser bar YES ML1279 50W 808nm CW diode laser bar with narrow Divergence Design (nodd) YES

18 5 COMPLIANCE STATEMENT I certify to the best of my knowledge, based on available information conducted to me, as follows: The products listed above, with the listed allowed exceptions, do not contain any homogeneous material that: a) contains lead (Pb) in excess of 0.1 weight-% (1000 ppm) b) contains mercury (Hg) in excess of 0.1 weight-% (1000 ppm) c) contains hexavalent chromium (Cr VI) in excess of 0.1 weight-% (1000 ppm) d) contains polybrominated biphenyls (PBB) or polybrominated dimethyl ethers (PBDE) in excess of 0.1 weight-% (1000 ppm) e) contains cadmium (Cd) in excess of 0.01 weight-% (100 ppm) Exceptions: 1) Sealing glass in TO-can lens cap or discrete lens contains leadborate (PbO). As lead in glass of electric components, it is exempted from requirements (exemption clause 5). 2) FC/PC and FC/APC connectors ring and fixing nut (copper:zinc alloy) contain minor quantities of lead. As the lead content is <4 weight-% it is exempted from requirements (exemption clause 6). Signature: Name (printed): Title: Date: Pekko Sipilä VP New Product Introduction 2-May-2006 6 REFERENCES Directive 2002/95/ec of the European Parliament and of the Council http://europa.eu.int/eur-lex/pri/en/oj/dat/2003/l_037/l_03720030213en00190023.pdf