Würth Elektronik ibe Automotive solutions



Similar documents
SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current

Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC

How To Make A Lightweight Car

SLLP G PRODUCT DATASHEET. RoHS Compliant

Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications

Automotive and Anti-Sulfuration Chip Resistor 0402

Auditing Contract Manufacturing Processes

DATA SHEET LEAD FREE CHIP RESISTORS RC_P series ±0.5%, ±1%, ±5% Sizes 0100/0201/0402/0603/0805/ 1206/1210/1218/2010/2512

Electronic Board Assembly

Self Qualification Results

WCAP-CSGP Ceramic Capacitors

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

SMD PTC - Nickel Thin Film Linear Thermistors

SIL Resistor Network. Resistors. Electrical. Environmental. L Series. Thick Film Low Profile SIP Conformal Coated Resistor Networks RoHS Compliant

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices

5W HI-POWER LED SPECIFICATION

WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors

White Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?

SELECTION GUIDE. Nominal Input

Improved PFC Boost Choke using a Quasi-Planar Winding Configuration Dave Shonts Schott Corporation 1000 Parkers Lake Road Wayzata, MN 55391

DATA SHEET HIGH POWER CHIP RESISTORS RC high power series 5%, 1% sizes 0603/0805/1206/2512. RoHS compliant & Halogen free

SM712 Series 600W Asymmetrical TVS Diode Array

WE-LF SMD Common Mode Power Line Choke

SURFACE MOUNT CERMET TRIMMERS (SINGLE TURN) Rotor. Wiper. Cover. Pin S T - 2 T A Ω ( )

50 W Power Resistor, Thick Film Technology, TO-220

Application Specification SIAMEZE * Standard and Fine Range Terminals 18 Mar 11 Rev C

DYNACAP Double Layer Capacitor

Introduction. Focusing on marketing & sales of standard process equipment as standard systems as well

Multilevel Socket Technologies

Application Note. Soldering Methods and Procedures for 1st and 2nd Generation Power Modules. Overview. Analysis of a Good Solder Joint

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY

January Inductors for Power Circuits. Wound Ferrite. VLCF Series. VLCF Type VLCF5028-2

CMR Series Isolated 0.75W Single and Dual Output Isolated DC/DC Converters

italtec PRINTED CIRCUITS EQUIPMENT PRINTED CIRCUITS EQUIPMENT Insulator machines Echting machines Special equipment and machines

Laserlyte-Flex Alignment System

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada

Flexible Circuits and Interconnection Solutions

Espotel Test Laboratory Services. November 20, 2014

Fab Site Transfer. REASON FOR CHANGE: Closure of Santa Clara Fab and Global Foundries. EXPECTED INFLUENCE ON QUALITY/RELIABILTY/PERFORMANCE: None

DISCONTINUED (1998) FBR46 SERIES. MINIATURE RELAY 2 POLES 1 to 2 A (FOR SIGNAL SWITCHING) RoHS compliant FEATURES

PRODUCT SPECIFICATION

WE-PD SMD Shielded Power Inductor

High Ohmic/High Voltage Metal Glaze Leaded Resistors

Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No /05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007

MADP T. Non Magnetic MELF PIN Diode

LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference Lothar Weitzel 2007 Seite 1

SC-1000/2000 ROTARY CODED SWITCHES FEATURES PART NUMBER DESIGNATION S C T B. RoHS compliant

SUCCESS EPCOS Capacitors

Amphenol Sincere. Electronic Integration & Flexible Printed Circuits. Aerospace. Health Care. Heavy Equipment HEV. Industrial

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

High-ohmic/high-voltage resistors

February Chip Beads. For power line. HF-ACC Series. HFxxACC3216. * Dimensions Code JIS[EIA]

How To Power A Power Control Microprocessor (Power Control) Microprocessor 2 (Power) (Power Power) (Control) (Repower) Microcontroller (Power/Reflow) (Mini) (Microprocessor) (Wired) (Wire

Power distribution systems

Flex Circuit Design and Manufacture.

Soldering And Staking OEpic TOSA/ROSA Flex Circuits To PWBs.

ZIF Connector & Flat Flexible Cable

Everline Module Application Note: Round LED Module Thermal Management

C W COB Series

Use of Carbon Nanoparticles for the Flexible Circuits Industry

WE-CBF SMD EMI Suppression Ferrite Bead

High Ohmic/High Voltage Metal Glaze Leaded Resistors

Investigation of Components Attachment onto Low Temperature Flex Circuit

C W COB Series

November terminal Filters. For signal line. MEM series. * Dimensions Code JIS[EIA]

Cree PLCC6 3 in 1 SMD LED SLV6A-FKB

Understanding SMD Power Inductors. Application Note. July 2011

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: DS-0042

B Recommended land pattern: [mm] C Stencil suggestion: SSt. SKl CHECKED DATE

SPM series. Inductors for Power Circuits. Wound Metallic Magnetic Material

High-ohmic/high-voltage resistors

DC Film Capacitors MKT Radial Potted Type

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999

Surface Mount 905 nm Pulsed Semiconductor Lasers High Power Laser-Diode Family for Commercial Range Finding

EVERLIGHT ELECTRONICS CO.,LTD.

EMOSAFE EN-100. Network Isolators for PCB assembly 1 GENERAL DESCRIPTION. Product Data Sheet ENGLISH

SPECIFICATION MARITEX 06/30/ 08 CHIP INDUCTORS (ROHS)

Relays High Capacity 50 Amp Mini Relays Standard Mini Relays Micro Relays Power Relays Connector Modules

Circular Push-Pull Connector

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie

Solder Reflow Guide for Surface Mount Devices

Harvatek Surface Mount LED Data Sheet. HT-F195 Series

TGP-751 TGP-651. ThermoGenerator-Package (TGP) Thin Film Thermogenerator inside standard package. Preliminary Datasheet

Recommended Soldering Techniques for ATC 500 Series Capacitors

DATA SHEET THICK FILM CHIP RESISTORS Introduction

ERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test

Powering Integrated Circuits (ICs), and managing ripple voltage as it relates

0.45mm Height 0402 Package Pure Green Chip LED Technical Data Sheet. Part No.: LL-S160PGC-G5-1B

BARE PCB INSPECTION BY MEAN OF ECT TECHNIQUE WITH SPIN-VALVE GMR SENSOR

Product Name Hexa-Band Cellular SMD Antenna GSM / CDMA / DCS / PCS / WCDMA /UMTS /HSDPA / GPRS / EDGE 800 MHz to 2200 MHz

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0402 5%, 1% RoHS compliant & Halogen Free

Hardware Documentation. Data Sheet HAL 202. Hall-Effect Sensor. Edition Sept. 18, 2014 DSH000159_002EN

EVERLIGHT ELECTRONICS CO.,LTD.

RI-80 SMD Series Dry Reed Switch

HOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology

Siemens Chemnitz Siemens AG Alle Rechte vorbehalten.

Transcription:

Würth Elektronik ibe Automotive solutions July 2016 Page 1

The Würth Group The Würth Group Over 69,000 employees, 11 billion sales More than 400 companies In more than 80 countries The Würth Elektronik Group Over 7,200 employees, 688 million sales 3 Business Units (eisos, CBT, ICS) In 50 countries The largest production entity of the Würth Group July 2016 Page 2 Figures 2015

The Würth Elektronik Group The Würth Elektronik Group Sales: eisos: 475 million * Electronic & Electromechanical Components Printed Circuit Boards Intelligent Systems Standard Customized eisos eican Passive Components Power Modules LEDs Electromechanical Components Connectors Automotive Magnetics July 2016 Page 3 *Figures 2015

The ibe Group a global footprint July 2016 Page 4

Acquisition Twice strong: the advantages of an innovative partnership July 2016 Page 5

Sales development in million EUR ibe Group w/o Büchele Büchele ibe Group with Büchele 70,0 100,0 41,0 43,7 46,1 48,7 48,0 31,1 20,7 10,8 14,1 15,3 15,7 16,0 16,2 15,0 2005... 2010 2011 2012 2013 2014 2015 Target 2016... 2020 July 2016 Page 6

Product range ibe Group Büchele Customized components & special parts 15 million pcs. Rod Core Chokes 450 million pcs. 225 million pcs. Subsystems 30 million pcs. SMD Components 140 million pcs. On the way to 1 billion components July 2016 Page 7 Figures 2015

Application fields What drives us are the technical challenges of our customers Brush cards July 2016 Page 8 Powertrain Electrification of ancillary units Hybrid and electrical drive ADAS and comfort

We drive solutions Standard components mixed with customized products for: EMC-filter- and noise suppression applications, DC/DC converters, inverters July 2016 Page 9

Key technologies in production Winding: Gluing: Winding of air coils Winding on ferrites and bobbins Round wire from ø 0.28 mm up to ø 4.0 mm Flat wire (vertical and horizontal) Different type of litz wire, self bonding wire Single and multilayer winding Tin coating: duratin : continuous tinning process (thick layer tinning) Dip tinning Lead free / leaded / custom solder material Connection technology: Electric resistance welding of round wire, flat wire, litz wire Welding to contact pin, lead frame, carbon brush High-frequency soldering Spiroflame soldering 1k and 2k gluing (epoxy / anaerob / thermal bonding) UV bonding Fully automated equipment (micro dispensing) Testing: 100% EOL test incl. binning (L; R DC ; etc.) 100% AOI test incl. binning (dimensions / angle / tolerance / missing parts / burrs / cracks) Spot test (test gauge / destructive test / 3D measurement) Printing / marking: Inkjet technology Pad printing Laser marking 170 C REFLOW AOI RoHS AEC-Q TS16949 Pb July 2016 Page 10

Technical equipment and validation Technical equipment: Product validation*: Metallography (materials testing) Measurement of layer thickness Laboratory oven for reflow testing Traction force testing (environmental tests,validation of components) Climate chamber Temperature-shock chamber for environmental testing Pre- and post electrical stress test High temperature exposure (storage) Temperature cycling Biased humidity Operational life External visual Physical dimensions Resistance to solvents and to soldering heat Mechanical and thermal shock Bump test Vibration ESD Solderability Electrical characterization Flammability Board flex Terminal strength *customized testing conditions upon request 170 C REFLOW AOI RoHS AEC-Q TS16949 Pb July 2016 Page 11

Electromagnetic simulation Design support up to final component B-field with 30A B-field with 80A July 2016 Page 12 the ANSYS logo is a registered trademark of ANSYS, Inc.

Certificates ISO / TS 16949 since July 2004 ISO 14001 since September 2007 AEO-F and Known Consignor since 2015 July 2016 Page 13

Würth Elektronik ibe GmbH Gewerbepark 8 94136 Thyrnau Germany Phone +49 8501 9001-0 www.we-online.de/ibe