Metal Whisker Discussion (Tin and Zinc Whiskers)



Similar documents
The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coating

Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers

Mitigation Strategies for Tin Whiskers Prepared by M. Osterman CALCE-EPSC

Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics

Zinc Whisker Contamination

Lead-free Electronics Reliability - An Update

A New (Better) Approach to Tin Whisker Mitigation

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region

Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products

REVISION HISTORY APPROVERS

White Paper. Modification of Existing NEBS Requirements for Pb-Free Electronics. By Craig Hillman, PhD

Pure Tin - The Finish of Choice for Connectors

Technical Note Recommended Soldering Parameters

RoHS / Lead-Free Initiative. Microsemi Analog Mixed Signal Group

Anodes and Misc Equipment

Electromechanical Relays - Frequently Asked Questions

White Paper. Moisture in Hermetic Packages By Craig Hillman, PhD

Good Boards = Results

Excerpt Direct Bonded Copper

Flip Chip Package Qualification of RF-IC Packages

Compliant Terminal Technology Summary Test Report

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Customer Service Note Lead Frame Package User Guidelines

MADP T. Non Magnetic MELF PIN Diode

Figure 1 (end) Application Specification provides application requirements for MICTOR Right Angle Connectors for SMT PC Board Applications

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Integrated Circuit Packaging and Thermal Design

CIN::APSE COMPRESSION TECHNOLOGY GET CONNECTED...

CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS

Anodizing Reference Guide

Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC

Lead & Magnet Wire Connection Methods Using the Tin Fusing Method Joyal A Division of AWE, Inc.

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004

Recommended Soldering Techniques for ATC 500 Series Capacitors

Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No /05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007

Atomic Structure. Atoms consist of: Nucleus: Electrons Atom is electrically balanced equal electrons and protons. Protons Neutrons

How to Avoid Conductive Anodic Filaments (CAF)

PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE Dr. Alan Doolittle

Flex Circuit Design and Manufacture.

FLEXIBLE CIRCUITS MANUFACTURING

WIRE, TERMINAL AND CONNECTOR REPAIR CONDUCTORS

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Lead Free Wave Soldering

Flexible Printed Circuits Design Guide

PRODUCT PROFILE. ELECTROLOY in partnership with FCT Asia Pte Limited. in manufacturing. Nihon Superior Lead Free Solder Bar.

Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness

Acceptability of Printed Circuit Board Assemblies

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Mounting Instructions for SP4 Power Modules

Taking the Pain Out of Pb-free Reflow

RI-80 SMD Series Dry Reed Switch

Product Specification

White Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE

Electronic Board Assembly

0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.

Lead-free Defects in Reflow Soldering

Basic Properties and Application Examples of PGS Graphite Sheet

An Ammonium-free, Acid. Zinc/Nickel (12-15% Ni) Process

AMP INCORPORATED. Technical Report. The Tin Commandments: Guidelines For The Use Of Tin On Connector Contacts

Chip-on-board Technology

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

Pb-Free Plating for Electronic Components

Lapping and Polishing Basics

Table of Contents. IV. Interior Doors. 1. Product Training 2. Bilco Quote/Order Checklist

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints

Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules

Figure 1 (end) Updated document to corporate requirements Added text to Paragraph 2.4

SMA Interface Mating Dimensions (Per MIL-STD-348)

SFP Single Port Multi-Port Ganged

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: DS-0042

Ball Grid Array (BGA) Technology

Lead-free Wave Soldering Some Insight on How to Develop a Process that Works

What is surface mount?

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations

COMMISSION DIRECTIVE 2013/28/EU

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3

23-26GHz Reflective SP4T Switch. GaAs Monolithic Microwave IC in SMD leadless package

Assembly and User Guide

Amphenol Sincere. Electronic Integration & Flexible Printed Circuits. Aerospace. Health Care. Heavy Equipment HEV. Industrial

JOHANSON DIELECTRICS INC Bledsoe Street, Sylmar, Ca Phone (818) Fax (818)

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

SMA Connectors. RF Coax Connectors. Product Facts

The following document contains information on Cypress products.

Failure Analysis (FA) Introduction

PCB Board Design. PCB boards. What is a PCB board

Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection

For Touch Panel and LCD Sputtering/PECVD/ Wet Processing

CIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE

3M Pin Strip Header Single and Dual Row.100,.235 /.318 Mating Length, Straight & Right Angle, Solder Tails 929 Series

Coating Thickness and Composition Analysis by Micro-EDXRF

Transcription:

Metal Whisker Discussion (Tin and Zinc Whiskers) Pb-Free Meeting Sponsored by ACI and NAVAIR April 27, 2004 Jay Brusse QSS Group, Inc. @ NASA Goddard

Outline What are Metal Whiskers (Tin and Zinc)? Why are Whiskers a Concern? Some Whisker Mitigation Strategies Closing Comments Cover Photo: Zinc Whiskers on Zinc-Plated Steel Raised Floor Structures April 27, 2004 Metal Whisker Discussion 2

But FIRST A Public Service Announcement BEWARE! ZINC Whiskers May Be Growing on Your Raised Floor Structures 2 Some Floor Tiles Use Zinc-Plated Steel Underside 1 Typical Raised Floor Computer Room http://nepp.nasa.gov/whisker/other_whisker It s Growing ZINC WHISKERS!! Estimate 1-10 MILLION Whiskers on this Single Tile (4 sq ft area) April 27, 2004 Metal Whisker Discussion 3 3

A Mechanism for Distribution of ZINC WHISKERS Throughout Raised Floor Facilities April 27, 2004 Metal Whisker Discussion 4

What are Tin (and Zinc) Whiskers? Hair-Like Crystal Structures that May Grow from Mostly Pure Tin (or Zinc) Finished Surfaces GROWTH: Incubation Period (Days Yrs)+ PROCESS Growth Period (Mos Yrs) + Growth Cessation (???) Grow from Base Not the Tip DENDRITES are NOT Whiskers LENGTH: Typically < 1mm (Up to 10 mm) DIAMETER: Few Microns (mm) Growth Mechanism(s) UNKNOWN!!! Fundamental Research is INCOMPLETE April 27, 2004 Metal Whisker Discussion 5

Metal Whisker Failure Modes Electrical Short Circuits Permanent Short (if current < 10 s of ma) Intermittent (if current > 10 s of ma) Whisker Melts Debris/Contamination Shorts in Areas REMOTE From Whisker Origins (e.g., Zinc Whiskers on Raised Flooring) Interfere with Sensitive Optics or MEMS 50 Volts METAL VAPOR ARC 0 Volts 0 Volts Under Some Electrical/Atmospheric Conditions, Whisker Shorts May Vaporize into Conductive PLASMA of Metal Ions Plasma Forms Arc Capable of Carrying HUNDREDS OF AMPS! With Resulting CATASTROPHIC DAMAGE April 27, 2004 Metal Whisker Discussion 6

The PAST: Converging Issues Fuel Hi-Rel User Concerns Metal Whiskers (Sn, Zn, Cd, other) Known SINCE 1940s!!! HUNDREDS of Independent Studies of TIN Whiskers Alone Numerous Disparities Exist in Published Literature The PRESENT: Combination of CONCERNING Factors Pb-Free Movement Driving Component Suppliers To Introduce Pure Tin Finishes Miniaturization of Electronics Increases Risk of Small Particle Shorts Whisker Mitigation Strategies Pluses and Minuses Still NOT Understood Whisker Growth Mechanism(s) Still NOT Understood Whisker Tests Currently No Accepted Tests April 27, 2004 Metal Whisker Discussion 7

Where Have Tin Whiskers Been Observed In Electronic Assemblies? A Few Examples April 27, 2004 Metal Whisker Discussion 8

Examples of Components with Tin Whiskers Connector Pins (Pure Tin-Plated) ~10 years old Observed in 2000 April 27, 2004 Metal Whisker Discussion 9

Examples of Components with Tin Whiskers Microcircuit Leads ( Matte Tin-Plated) Pin #6 Observed in 2002 Pin #7 Whiskers from this Component Caused a FAILURE in the Electric Power Utility Industry > 20 YEARS!!! After Fielding the System April 27, 2004 Metal Whisker Discussion 10

Examples of Components with Tin Whiskers Exterior Surfaces of Electromagnetic Relays (Tin-Plated Terminals, Case, Header) Whisker Shorts Between Terminal to Terminal, Terminal to Header, Case to Other Component, Whisker to Whisker!!! April 27, 2004 Metal Whisker Discussion 11

Examples of Components with Tin Whiskers INTERIOR Surfaces of Electromagnetic Relays (Tin-Plated Steel Armature) ~14 Years Old Observed in 2002 Beware What May be INSIDE your Devices (Up to 3 mm Long Found in This Part) April 27, 2004 Metal Whisker Discussion 12

200 microns Examples of Components with Tin Whiskers Ceramic Chip Capacitor (Pure Tin-Plate Over Nickel Terminations) Observed in 2001 Conductive Epoxy Mounted Inside Hermetically Sealed Hybrid Whiskers appeared AFTER Thermal Cycle -40 C / +90 C (~200 Cycles Shown Here) April 27, 2004 Metal Whisker Discussion 13

Examples of Components with Tin Whiskers Hybrid Microcircuit Package Lid (Pure Tin-Plated) Observed in 1998 2 mm Long Whiskers Found Growing Toward INSIDE of Package Whiskers Like these Reportedly Have Broken Loose Inside Hybrids Creating Intermittent Shorts/Field Failures April 27, 2004 Metal Whisker Discussion 14

Examples of Components with Tin Whiskers Terminal Lugs Pure Tin-Plated ( AS-RECEIVED / Observed in 2001) Whiskers up to 0.25 mm Long Inside Crimp Barrel And in the Exterior Seam April 27, 2004 Metal Whisker Discussion 15

A Few Words About Tin-Lead (Sn/Pb) Whiskers Sn-Pb Finishes CAN Grow Whiskers, BUT... Typical Lengths 5-15 microns which TODAY are Generally Benign SEM/EDS Analysis Results Why might Pb Inhibit Whisker Formation? Pb has low solubility in Sn (<1%) Almost all Pb collects in Sn grain boundaries Pb in grain boundaries may Limit Sn Diffusion Sn/Pb Whiskers on Reflowed Sn63/Pb37 But Sometimes Even SMALL Sn/Pb Whiskers Can Be DANGEROUS!!! Pb peak Sn peak Pb peak Sn peak Sn peak Sn peak April 27, 2004 Metal Whisker Discussion 16

Whiskers from REFLOWED Sn-Pb Eutectic Solder (Sn63Pb37) Min. Shorting Distance = 3 microns Heat Sink to Semiconductor Is THIS the Melted Tip of what was once a Longer Sn-Pb Whisker? A Bonafide Sn-Pb Whisker Induced Short 10 microns Heat Sink Sn/Pb Solder Die Attach Insulator Splatter Remants from a Melted Sn-Pb Whisker? Semiconductor April 27, 2004 Metal Whisker Discussion 17

Some Whisker Mitigation Strategies Long-Term Effectiveness of these Practices Has NOT Been Quantified MORE Research is NEEDED to Identify Strengths and Weaknesses AVOIDANCE: Do NOT Use Pure Tin Coated Components Stick with Tin-Lead (Sn/Pb) or Other Finishes When Available Often Requires Requires Rigorous Procurement Controls and Incoming Inspection to VERIFY Materials Meet Spec MODIFY Sn FINISH: Post-Procurement Processing Hot Solder (Sn/Pb) Dip Sn Surfaces Strip and Re-Plate with Sn/Pb or Other Finish Prior to Assembly Heat Treat (Anneal) or Reflow to Reduce Intrinsic Stress INSULATE: Apply Barriers On Top of Exposed Sn Surfaces Conformal Coat Tapes No One Practice Fits All Applications Combine MULTIPLE Mitigation Strategies to Increase Effectiveness April 27, 2004 Metal Whisker Discussion 18

NASA Goddard Whisker Mitigation Study Conformal Coat (Uralane 5750 Polyurethane) Whisker Farm = Bright Tin-Plated Brass Coupon ½ Without Uralane Coating, ½ With Uralane Coating NO Conformal Coat Uralane Coated Extensive Whisker Formation (~2mm) on NON-Coated Side HOWEVER, Whisker Escapes thru THIN (~2 to 6 mm thick) Conformal Coat In ~ 1 Year 2 mils of Uralane Keeping Whiskers Beneath Coating For 4+ Years (Ongoing) April 27, 2004 Metal Whisker Discussion 19

Hot Solder Dip Limitations? Bright Tin-Plated Kovar Leads (WITH Nickel Underplate) ONE Year After Assembly Leads were Hot Solder Dipped (Sn63Pb37) within 50 mils of Glass Seal BEFORE Mounting Tin Whiskers (~60 mils) Grew on NON-Dipped Region Shorting to Case NO Whiskers on Hot Solder Dip Region April 27, 2004 Metal Whisker Discussion 20

Conclusions Failures Due to Metal Whiskers Are STILL a Significant Concern PROBLEMS WILL INCREASE with Increased Use of Mostly Pure Tin and Zinc Coatings Until Significant Discoveries are Made Regarding Effective Mitigation Practices Factors Affecting Tin Whisker Formation Are NOT Completely Understood Influence of Individual Variables (Multi-Variable Interactions) Not Well-Understood Control of Variables for Experimentation is Very Complex Risk Assessment Based on SUBSET of Published Literature Can Be DANGEROUS April 27, 2004 Metal Whisker Discussion 21

Recommendations Develop CONSENSUS Model(s) of Whisker Growth Mechanism(s) Comprehensive Model(s) for Tin, Zinc AND Cadmium Whiskers Models that Hinge upon Unique Attributes of One vs. the Others M ay be Off the Mark Models should also explain why many finishes appear to not be whisker prone Accepted Model Needed to have Confidence in Any Proposed Accelerated Test Develop PROVEN Whisker Propensity Test(s) Fundamental Theory FIRST, then test/validate Theory THEN develop Whisker Propensity Tests! -- This is COUNTER to Pb-Free NOW Movement! Environmental Testing vs. Finish Attributes? (grain size, orientation, etc.) Acceleration Factors MUST be Determined for Reliability Prediction Tailorable to Assess Varied Constructions, Materials AND Applications April 27, 2004 Metal Whisker Discussion 22

Recommendations Develop Whisker Risk Assessment & Mitigation Strategies RESEARCH & EXPERIMENTATION Study EFFECTIVENESS of Mitigation Strategies EDUCATION Learn the STRENGTHS & WEAKNESSES Detail the LIMITATIONS & APPLICABILITY DOCUMENT Develop Mitigation Strategy Guidelines April 27, 2004 Metal Whisker Discussion 23

Contact Information Jay Brusse Group, Inc. (@ NASA Goddard) 301-286-2019 Jay.A.Brusse.1@gsfc.nasa.gov Acknowledgments: NASA Goddard Metal Whisker Investigation Team Mike Sampson Dr. Henning Leidecker Jong Kadesch NASA Goddard NASA Goddard Orbital Sciences Corporation NASA Goddard Tin (and Other Metal) Whisker WWW Site http://nepp.nasa.gov/whisker April 27, 2004 Metal Whisker Discussion 24

Backup Material April 27, 2004 Metal Whisker Discussion 25

Plating Process Current Density Bath Temperature Bath Agitation Factors that May Influence Metal Whisker Growth Plating Chemistry Pure Sn Most Prone Some Alloys (Sn-Cu, Sn-Bi, rarely Sn-Pb) Use of Brighteners Incorporated Hydrogen Codeposited Carbon ph Deposit Characteristics Grain Size/Shape Crystal Orientation Deposit Thickness Sn Oxide Formation In General, Factors that Increase STRESS or Promote DIFFUSION Within the Deposit GREATER WHISKER PROPENSITY Substrate Material (Brass, Cu, Alloy 42, Steel, etc.) Substrate Stress (Stamped, Etched, Annealed) Intermetallic Compound Formation Substrate Element Diffusivity into Sn Environment Temperature Temperature Cycling (CTE Mismatch) Humidity (Oxidation, Corrosion) Applied External Stress (Fasteners, bending, scratches) Current Flow or Electric Potential??? HOWEVER. Many Experiments Show Contradictory Results For These Factors April 27, 2004 Metal Whisker Discussion 26

What Kinds of Electronic Systems Have Been Impacted in the Field? A Few Examples April 27, 2004 Metal Whisker Discussion 27

A Few Reported Whisker Problems (Only the Last 15-20 Years Considered) Year Application Industry Failure Cause Whiskers on? 1 1986 Heart Pacemakers Medical (RECALL) Tin Whiskers Crystal Can 2 1986 MIL Aircraft Radar Military Tin Whiskers Hybrid Package Lid 3 1987 MIL/Aerospace MIL/Aerospace Tin Whiskers PWB traces 4 1988 Missile Program A Military Tin Whiskers Relays 5 1989 Missile Program B Military Tin Whiskers Electronics Enclosure 6 1990 Apnea Monitors Medical (RECALL) ZINC Whiskers Rotary Switch 7 1992 Missile Program C Military Tin Whiskers Xsistor Package +Standoff 8 1993 Govt. Electronics Govt. Systems Tin Whiskers Transistor, Diode, Lug 9 1995 Telecom Equipment Telecom ZINC Whiskers Framework 10 1996 Computer Routers Computers ZINC Whiskers Chassis 11 1996 MIL Aerospace MIL Aerospace Tin Whiskers Relays 12 1998 Aerospace Electronics Space Tin Whiskers Hybrid Package Lid 13 1998 Commercial Satellite #1 Space (Complete Loss) Tin Whiskers Relays 14 1998 Commercial Satellite #2 Space Tin Whiskers Relays 15 1998 Commercial Satellite #3 Space Tin Whiskers Relays 16 1998 Computer Hardware Computers ZINC Whiskers Chassis 17 1998 MIL/Aerospace Military Aerospace Tin Whiskers Plastic Film Capacitor 18 1999 Eng Computer Center Architectural ZINC Whiskers Floor Tiles 19 199X Telecom Equipment Telecom ZINC Whiskers PSU Housing 20 2000 Missile Program D Military Tin Whiskers Terminals 21 2000 Commercial Satellite #4 Space (Complete Loss) Tin Whiskers Relays Many of these Incidents Involve Multiple Failures April 27, 2004 Metal Whisker Discussion 28

A Few MORE Whisker Issues (Only the Last 15-20 Years Considered) Year Application Industry Failure Cause Whiskers on? 22 2000 Commercial Satellite #5 Space (Complete Loss) Tin Whiskers Relays 23 2000 Power Mgmt Modules Industrial Tin Whiskers Connectors 24 2001 Commercial Satellite #6 Space Tin Whiskers Relays 25 2001 Space Ground Test Eqpt Ground Support ZINC Whiskers Bus Rail 26 2001 Nuclear Power Plant Power Tin Whiskers Relays 27 2001 Hi-Rel Hi-Rel Tin Whiskers Ceramic Chip Caps 28 2002 Commercial Satellite #7 Space Tin Whiskers Relays 29 2002 Military Aircraft Military Tin Whiskers Relays 30 2002 Electric Power Plant Power Tin Whiskers Microcircuit Leads 31 2002 Hospital Computer Center Medical ZINC Whiskers Floor Tiles 32 2002 Govt Computer Center Commercial ZINC Whiskers Floor Tiles 33 2002 E-Comm. Comp Center Commercial ZINC Whiskers Floor Tiles 34 2002 Library Computer Center Public Service ZINC Whiskers Floor Tiles 35 2002 GPS Receiver Aeronautical Tin Whiskers RF Enclosure 36 2002 MIL Aerospace MIL Aerospace Tin Whiskers Mounting Hardware (nuts) 37 2002 Commercial Electronics Power Supply ZINC Whiskers Mounting Hardware 38 2003 Commercial Electronics Telecom Tin Whiskers RF Enclosure 39 2003 Telecom Equipment Telecom Tin Whiskers Ckt Breaker 40 2003 NASA Data Center Ground Support ZINC Whiskers Floor Tiles 41 2003 Missile Program E Military Tin Whiskers Connectors 42 2003 Missile Program F Military Tin Whiskers Relays NOT Just a Problem of The Past April 27, 2004 Metal Whisker Discussion 29