Knowledge Based Qualification of Semiconductor Devices



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Knowledge Based Qualification of Semiconductor Devices Introduction to the NXP Reliability Knowledge Framework René Rongen, NXP Semiconductors, Nijmegen

Outline Background NXP Reliability Knowledge Framework Web based tool Reliability Knowledge Matrix Mission Profile Library Deployment Summary

Background - Trend New semiconductor technologies and application areas require indepth knowledge on failure mechanisms and mission profiles Sensors (T, RH, ) Automotive high temperature applications (beyond Q100 grade 0) Industry standards and consortia are moving towards knowledge based qualification JEDEC with JESD94 Automotive Electronic Council (AEC) with Q100/Q101 Zentralverband Elektrotechnik- und Elektronikindustrie (ZVEI) with Robustness Validation

Background - Trend - Response Knowledge Based Qualification needs to be described in more detail (systematic approach) AEC Q100 Version H ZVEI Robustness Validation Handbooks NXP Quality & Reliability Qualification (Policy) Knowledge needs to be available and made accessible JEP22 ZVEI Robustness Validation Knowledge Matrix NXP Reliability Knowledge Framework

NXP Reliability Knowledge Framework The principles Starting point The daily user needs to be easily connected to the frame work of knowledge, data, tools and methods that is available in and outside the company The scope of the framework is reliability qualification, monitoring and reliability oriented risk assessment (and will be extended to safe launch) Boundary conditions All elements in the framework need to be up-to-date Examples and training material should support company broad deployment and application

NXP Reliability Knowledge Framework A web based tool

NXP Reliability Knowledge Framework High level structure

NXP Reliability Knowledge Framework Reliability Knowledge Matrix, based on ZVEI RVKM: http://www.zvei.org/verband/fachverbaende/electroniccomponentsandsystems/seiten/robustness-validation-device-level.aspx

NXP Reliability Knowledge Framework Reliability Knowledge Matrix: 2 examples Cu-wire Next to classification and description, more information is available on (not shown here): Observation & Detection Testing & Acceleration References Tools & Rules

NXP Reliability Knowledge Framework Risk Assessment: Mission Profile Library

NXP Reliability Knowledge Framework Risk Assessment: Mission Profile Library A Mission Profile (MP) is a collection of relevant environmental and functional loads that a product will be exposed to during its full life cycle.

NXP Reliability Knowledge Framework Risk Assessment: Mission Profile Library The principle of acceleration Reliability test at stress conditions Failure mechanism at application condition Acceleration factor = Time to failure in application Time to failure in stress

1. Input NXP Reliability Knowledge Framework Risk Assessment: Mission Profile Library 2. Description Mission Profile 3. Output

Deployment In 2011 the Reliability Knowledge Framework has been deployed via a company wide training program Every product reliability qualification strategy consists of a section concerning the application based reliability risk assessment Guidelines are given on how to use the reliability knowledge framework in this risk assessment All the reliability qualification strategies are subjected to a review process During the review the use of the framework is checked by and discussed with peers Since 2012 the correct use of the framework is monitored via a performance indicator The review process is also used to collect user input for future improvements of the framework

Summary Knowledge Based Qualification of Semiconductor Devices can only be successfully applied if knowledge is available and accessible To that purpose NXP developed a Reliability Knowledge Framework that is available since end 2010 It consists of knowledge, data, tools and methods offered to the daily user via a website that also includes explanation, examples, references and training material The NXP Reliability Knowledge Framework is successfully being applied in e.g. the Au to Cu-wire conversion program