INFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli

Transcription

1 INFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli 1

2 Summary 1) About us: Presentation of the JLAB12 INFN Roma group. 2) Silicon Detector Advantages on SBS: Position. Resolution. 3) Silicon Microstrip Detector: Design. Simulation. 4) Detector Construction: PCBs for Detectors. Assembly. 5) Future Outlook: Current status and next steps. 2

3 INFN Rome Group Franco Meddi Associated Prof. Univ. La Sapienza INFN Associate Guido Maria Urciuoli INFN Researcher Sergiy Kiprich NSC-KIPT Kharkov Engeener Maurizio Zullo Mechanical CAD Designer Giacomo Chiodi Electronic CAD Designer Riccardo Lunadei Electronic CAD Designer Felice Citronelli Electronic CAD Designer Alessandro Ruggieri Programmer Salvatore Sestito Lab. Tecnichan 3

4 Jefferson Laboratory and SBS Spectrometer 4

5 Jefferson Laboratoy JLAB, Newport News, Virginia, USA Upgrade from present 6 GeV electron beam to future 12 GeV (2014) 5

6 Super Bigbite Spectrometer (SBS) Silicon Detectors I max =85 μa L max = cm -2 s Scattering Chamber I=2 ka B= 2 Tm 6

7 Silicon Detector Advantages 7

8 Improved Resolution using silicon detectors before the SBS magnet M. Pentia et al. A fast procedure for geometric parameter determination of a silicon vertex tracker, NIM A369 (1996) 101 8

9 Silicon Microstrip Detector: Design 9

10 Detector Sketch 6.5mm 8.5mm 8.5mm 5mm 10mm A B Custom Design maximum active area from a 6 Wafer D 5mm A B D C 10mm C 10

11 I_leak (na) e-h Det_1 Det_2 Det_3 Det_4 Det_5 I-V Curves Prototype Planes V_r (V) 55 V 11

12 Silicon Microstrip Detector: Close Up Strip Pitch 50 µm Silicon Microstrip Detector DC PAD for bonding (200x40 µm 2 ) Guard Ring PAD (500x90 µm 2 ) 12

13 X-Y Plane Y Only Y Only X X Only X Only Y 13

14 Silicon Microstrip Detector: Simulation 14

15 3D PSPICE Model for a Strip detector Rmet Cm Rimp Cf Cs Rstr Csub Rsub Z X Y Detector Model: 15 strips Al metalization 1 Cell: L strip = 250 µm 400 Cells: L strip = 10 cm p+ implant n- substrate 15

16 0 Modeled detector response to a MIP 0 0 (na) MIP Pulse 20 (µv) Detector Response -40 Tr = 5ns 0 Adjacent strips Tf = 35ns Pulsed Strip (ns) (ns) MIP ( 300 µm Si) 4.2 fc 16

17 Detector Construction: PCBs for Detector 17

18 Strategy for PCB design Minimize the size of PCB and the length of the tracks. Minimize the ground plane. Design a cradle that houses the silicon detector in the PCB. Simplify ultrasonic wirebonding work. 18

19 4 Layers PCB Channels 2070 Layer1 = 518 Ch Layer2 = 518 Ch Layer3 = 517 Ch Layer4 = 517 Ch Silicon Detector 19

20 PCB for X plane and Y Plane Piano X Piano Y 20

21 Complete System F.E. electronics (APV25) Backplane Kapton 21

22 Detector Construction: PCB Simulation 22

23 PCB simulation Detector (400 cells = 10 cm strip) Al WIRE PCB Connector P5KS PCB Kapton Impedance of F.E. (APV25) 23

24 Evaluation of SNR Foundamenal Parameter SNR = Q / ENC Q : simulation ENC :From the noise curve of Read Out Electronics 4.48 pf 1.81 pf Length of tracks Distance from the ground plane Distance between tracks (Crosstalk) 24

25 PCB Simulation Result 60nA 50nA 40nA SNR = Min 18, Max 21 (APV25 gate = 50 ns) Pulsed Strip 30nA 20nA 10nA 0A Adjacent strips -10nA 0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50) Time 25

26 Detector Construction: Assembly 26

27 Activity in Clean Room CL Prepare the clean room for all the assembly task Golden wire bonding points on detector backside for reverse polarization. Glue the detector to PCB. Wirebonding detector strip to the PCB tracks. 27

28 Test of Golden Wire bonding and conductive glue R (Ohm) 25 µm gold wire Ni-Ag wire for V r 400 µm Conductive Glue: Epotek H20E R (A-D) B C 0,15 D 0,12 A Detector Backside 0,09 4 months Time (Hours) 28

29 Gluing Detector and PCB Non-Conductive Glue: Momentive RTV 615 After 5h ( Glue Curing time at 60 C ) : OK 29

30 Custom Ultrasonic wirebonding station Microscope Leica M80 (80X) 60 µm Custom Wedge for fine pitch wirebonding. K&S 4225 semi-automatic bonding machine Programmable motorized long run stage and fine step (50 µm) for a precise and fast skip from a bonding to the next. 30

31 Ultrasonic wirebonding 16 mm 18 µm Al wire 8 mm 3 mm 1.2 mm 31

32 Timeline and Milestones 32

33 Timeline and Milestones Silicon Detector In Hand Detector Glued on PCB and wire-bonded Project Start PCB X In Hand PCB Y In Hand Detector Prototype Ready for Testing End of Test on Prototype Simulation (Detector and PCB) Work on Read Out Electronics Work on Clean Room Prototype Assembly Prototype Test Plane X and Y Assembly Today 33

34 SPARE 34

35 Silicon Detector Advantage 35

36 R (bck_sid-bck_gem) Geant 4 Plane X dimensions: 10.5x20.6 cm 2 Plane Y dimensions: 10.3x21 cm 2 50 µm pitch Distance from target (cm) To cover the whole vertical acceptance the Silicon X plane should be located at 48 cm and Y plane at 50 cm from the center of the target. 36

37 Silicon Microstrip Detector: 37

38 Guard Ring PAD (500x90 µm 2 ) DC PAD for bonding (200x40 µm 2 ) Strip Pitch 50 µm 38

39 850 µm 39

40 PSPICE Final Model: 15 Strips Al metallization p+ implant Tipe N Bulk 40

41 Detector Construction: 41

42 PCB Macroscopic view Read Out Connector Silicon Detector Cradle 42

43 PCB for Y Plane 5 0 Layer 1R Layer 1L Layer 4L Layer 3L Layer 2L 5 0 Layer 2R Layer 3R 800 um 300 µm Layer 4R µm 43

44 Final Design for Half X Plane PCB 23 cm 30 cm 44

45 Final Design for Half Y Plane PCB 45

46 Kapton PCB Backplane for 4 APV25 46

47 Parameters of PCB and Kapton connector 47

48 Results of Simulation on PCB for the X Plane 60nA 50nA 40nA SNR = Min 16, Max 20 30nA 20nA 10nA 0A 50 ns -10nA 0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50) Time 48

49 DPP MPD MPD DPP DPP MPD X Y Y X MPD DPP DPP MPD

50 Detector Construction: 50

51 Gold Wire Bonding A B C D 25 µm gold wire 51

52 Glued Point A B C D Conductive Glue: Epotek H20E 52

53 Golden wire bondingon a mechanical samples Ni wire coated with Ag B C D A Detector Backside 53

54 Gluing Detector and PCB PCB Holder Teflon detector vacuum holder Programable motorized long run stage with fine step (5 µm minimum step) for aligment in X and Y. Micrometrical moviment for fine adjustement ( X, Y, Z, θ) 54

55 Wirebonding strength test Small hook for test Al wire of 18 µm ø Digiatal Dinamometer with fine movimentations 55

56 Wire Loops Sequence Even channel 1 pad to 1 layer 2 pad to 3 layer 3 pad to 2 Layer 4 pad to 4 layer 5 pad to 1 layer. Otherwise!!!!!! Odd channel 56