/ [email protected]. Product Technical Specification & Customer Design Guidelines. AirPrime WS6318

Transcription

1 / [email protected] Product Technical Specification & AirPrime WS March 28, 2012

2 Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided as is. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Customer understands that Sierra Wireless is not providing cellular or GPS (including A-GPS) services. These services are provided by a third party and should be purchased directly by the Customer Rev 2.4 March 28,

3 SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS) SERVICES. Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group. Copyright 2012 Sierra Wireless. All rights reserved. Trademarks AirCard is a registered trademark of Sierra Wireless. Sierra Wireless, AirPrime, AirLink, AirVantage, Watcher and the Sierra Wireless logo are trademarks of Sierra Wireless.,,, insim, WAVECOM, WISMO, Wireless Microprocessor, Wireless CPU, Open AT are filed or registered trademarks of Sierra Wireless S.A. in France and/or in other countries. Windows and Windows Vista are registered trademarks of Microsoft Corporation. Macintosh and Mac OS are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of the respective owners. Contact Information Phone: Sales Desk: Hours: 8:00 AM to 5:00 PM Pacific Time [email protected] Post: Sierra Wireless Wireless Way Richmond, BC Canada V6V 3A4 Fax: Web: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases: Rev 2.4 March 28,

4 Document History Version Date Updates 1.0 September 28, 2011 Creation 1.1 December 13, 2011 Updated for DV December 14, 2011 Updated Figure 1, UART1 baud rate unit Updated: Table 7 Electrical Characteristics of a 2.8V Type (2V8) Digital I/O Table 27 AC Characteristics of the Digital Audio Interface Table 33 Electrical Characteristics of the ON/~OFF Signal 2.0 February 22, 2012 Figure 51 WS6318 Operating Modes Flowchart Table 53 WS6318 Embedded Module Power Consumption Table 56 Applicable Standards and Requirements for the WS6318 Embedded Module 2.1 February 28, 2012 Updated Table 48 Electrical Characteristics of the BUZZER Signal Updated: section 3.3 Conformance with ATEX 94/9/CE Directive section Power ON Figure 33 Power-ON Sequence (no PIN code activated) section Hardware Power OFF 2.2 March 01, 2012 Table 53 WS6318 Embedded Module Power Consumption (Typical Values) Table 56 Applicable Standards and Requirements for the WS6318 Embedded Module Deleted section 10.5 GSM Antenna Updated: Section 1.3 Interfaces Section 1.4 Firmware Figure 1 Functional Architecture Figure 2 Power Supply During Burst Emission Section 4.9 Digital Audio Interface (PCM) 2.3 March 08, 2012 Figure 30 PCM Timing Waveform Table 36 Electrical Characteristics of the VCC_2V8 Output Table 37 Electrical Characteristics of the 2V8_LDO Output Specified the specific AT commands to use in: 4.10 Analog to Digital Converter 4.11 Digital Clock 5.2 VCC_2V8 and 2V8_LDO Outputs Rev 2.4 March 28,

5 Version Date Updates 2.4 March 28, 2012 Removed empty columns from: Table 2 Input Power Supply Voltage Table 10 UART Pin Description Table 12 UART Pin Description Table 14 SIM Interface Pin Description Table 26 PCM Interface Pin Description Table 30 Digital Clock Pin Description Updated: Table 9 GPIO Pin Description Table 15 s footnote Section 5.4 Reset Table 53 WS6318 Embedded Module Power Consumption (Typical Values) Table 54 Consumption/Software Driver Recommendations Fixed blurry schematic diagrams Deleted note from section 10.1 SIM Card Reader Rev 2.4 March 28,

6 Contents 1. INTRODUCTION Overall Dimensions GSM/GPRS Features Interfaces Firmware Connection Interfaces Environment Upgrades Forbidden FUNCTIONAL SPECIFICATIONS Functional Architecture RF Functionalities Baseband Functionalities TECHNICAL SPECIFICATIONS Power Supply Pin Description Application Recommended Components Mechanical Specifications AirPrime WS6318 Dimensions Recommended PCB Landing Pattern Conformance with ATEX 94/9/CE Directive INTERFACES LGA Pads Pin Configuration Pin Description Electrical Information for Digital I/O General Purpose Input/Output Pin Description Main Serial Link (UART1) Pin Description Application Level Shifter Implementation Possible V24/CMOS Designs Auxiliary Serial Link (UART2) Pin Description Application Level Shifter Implementation for Debug Purposes wire Serial Interface Hardware Design SIM Interface Rev 2.4 March 28,

7 Pin Description Electrical Characteristics Application SIM Socket Connection RF Interface RF Connection RF Performances Antenna Specifications Application Analog Audio Interface Pin Description Microphone Electrical Characteristics Application Speaker Electrical Characteristics Application Recommended Filtering Components Audio Track and PCB Layout Recommendation Digital Audio Interface (PCM) Pin Description Electrical Characteristics PCM Waveforms Analog to Digital Converter Pin Description Electrical Characteristics Digital Clock Pin Description Debug Interface Pin Description SIGNALS AND INDICATORS ON/~OFF Signal Pin Description Electrical Characteristics Application Power ON Power OFF VCC_2V8 and 2V8_LDO Outputs Pin Description Electrical Characteristics WISMO_READY Indication Pin Description Electrical Characteristics Reset Pin Description Rev 2.4 March 28,

8 Electrical Characteristics Internal Reset Emergency Reset Application BAT-RTC (Backup Battery) Pin Description Electrical Characteristics Application Super Capacitor Non-Rechargeable Battery Rechargeable Battery Cell Pulse-Width Modulators (PWMs) Pin Description Electrical Characteristics Application BUZZER Output Pin Description Electrical Characteristics Application Recommended Characteristics for the Buzzer TX_CTRL Signal for TX Burst Indication Pin Description Electrical Characteristics Application POWER CONSUMPTION Various Operating Modes Using AT+PSSLEEP to Enter Sleep Mode Power Consumption Recommendations for Less Consumption DESIGN GUIDELINES EMC Recommendations Power Supply PCB Specification for Application Board CERTIFICATION COMPLIANCE AND RECOMMENDED STANDARDS Certification Compliance Applicable Standards Listing RELIABILITY COMPLIANCE AND RECOMMENDED STANDARDS Reliability Compliance Applicable Standards Environmental Specifications Function Status Classification Reliability Prediction Model Rev 2.4 March 28,

9 Life Stress Test Environmental Resistance Stress Tests Corrosive Resistance Stress Tests Thermal Resistance Cycle Stress Tests Mechanical Resistance Stress Tests Handling Resistance Stress Tests PERIPHERAL DEVICES REFERENCES SIM Card Reader Microphone Speaker Antenna Cable REFERENCES Reference Documents Sierra Wireless Reference Documentation List of Abbreviations SAFETY RECOMMENDATIONS (FOR INFORMATION ONLY) RF Safety General Exposure to RF Energy Efficient Terminal Operation Antenna Care and Replacement General Safety Driving Electronic Devices Vehicle Electronic Equipment Medical Electronic Equipment Aircraft Children Blasting Areas Potentially Explosive Atmospheres Rev 2.4 March 28,

10 List of Figures Figure 1. Functional Architecture Figure 2. Power Supply During Burst Emission Figure 3. Reject Filter Diagram Figure 4. AirPrime WS6318 Mechanical Drawing Figure 5. LGA Pad Dimension and Location Figure 6. AirPrime WS6318 Pin Configuration (top view, through component) Figure 7. Example of an RS-232 Level Shifter Implementation for UART Figure 8. Example of a V24/CMOS Serial Link Implementation for 5-wire UART Figure 9. Example of a V24/CMOS Serial Link Implementation for 4-wire UART Figure 10. Example of a V24/CMOS Serial Link Implementation for 2-wire UART Figure 11. Example of a Full Modem V24/CMOS Serial Link Implementation for full UART Figure 12. Example of an RS-232 Level Shifter Implementation for UART Figure 13. Example of a V24/CMOS Serial Link Implementation for 2-wire UART Figure 14. Example of a SIM Socket Implementation Figure 15. Example of an RF 50Ω Line Figure 16. Suggested MIC Connection in Differential Mode Figure 17. Suggested MIC Connection in Single-Ended Mode Figure 18. Example of a MIC Input Connection with LC Filter Figure 19. Example of a MIC Input Connection without LC Filter Figure 20. Example of a Single-Ended MIC Input Connection with LC Filter Figure 21. Example of a Single-Ended MIC Input Connection without LC Filter Figure 22. Capacitor Soldered in Parallel to the Microphone Figure 23. Equivalent Circuit for SPK Figure 24. Example of a Differential Connection for SPK Figure 25. Example of a Differential Connection for SPK Figure 26. Example of a Single-Ended Speaker Connection (typical implementation) Figure 27. Audio Track Design Figure 28. Differential Audio Connection Figure 29. Single-Ended Audio Connection Figure 30. PCM Timing Waveform Figure 31. Example of the ON/~OFF Pin Connection Using a Switch Figure 32. Example of the ON/~OFF Pin Connection via an Open Collector Transistor Figure 33. Power-ON Sequence (no PIN code activated) Figure 34. Software Power OFF Sequence (after the ON/~OFF pin is High) Figure 35. Software Power OFF Sequence (before the ON/~OFF pin is High) Figure 36. Power-OFF Sequence Figure 37. Internal Reset Sequence Rev 2.4 March 28,

11 Figure 38. Reset Sequence Figure 39. Example of ~RESET Pin Connection with a Push Button Configuration Figure 40. Example of ~RESET Pin Connection with a Transistor Configuration Figure 41. RTC Supplied by a Gold Capacitor Figure 42. RTC Supplied by a Non Rechargeable Battery Figure 43. RTC Supplied by a Rechargeable Battery Cell Figure 44. Relative Timing for the PWM Output Figure 45. Example of a LED Driven by the PWM0 or PWM1 Output Figure 46. BUZZER Output Figure 47. Example of Buzzer Implementation Figure 48. Example of an LED Driven by the BUZZER Output Figure 49. TX_CTRL State During TX Burst Figure 50. Example of TX Status Implementation Figure 51. WS6318 Operating Modes Flowchart Figure 52. PCB Structure Example for the Application Board Rev 2.4 March 28,

12 List of Tables Table 1. List of RF Frequency Ranges Table 2. Input Power Supply Voltage Table 3. Power Supply Pin Description Table 4. Recommended Components for the Reject Filter Table 5. Available Interfaces and Signals Table 6. LGA Pads Description Table 7. Electrical Characteristics of a 2.8V Type (2V8) Digital I/O Table 8. Reset State Definition Table 9. GPIO Pin Description Table 10. UART Pin Description Table 11. Recommended Components Table 12. UART Pin Description Table 13. Recommended Components Table 14. SIM Interface Pin Description Table 15. Electrical Characteristics of the SIM Interface Table 16. Recommended Components Table 17. SIM Socket Pin Description Table 18. Antenna Specifications Table 19. Analog Audio Interface Pin Description Table 20. Electrical Characteristics of MIC Table 21. Recommended Components for a Microphone Connection Table 22. Recommended Components for a Single-Ended Microphone Connection Table 23. Speaker Details Table 24. Electrical Characteristics of SPK Table 25. Murata Examples Table 26. PCM Interface Pin Description Table 27. AC Characteristics of the Digital Audio Interface Table 28. Analog to Digital Converter Pin Description Table 29. Electrical Characteristics of the ADC Table 30. Digital Clock Pin Description Table 31. Test Points Pin Description Table 32. ON/~OFF Signal Pin Description Table 33. Electrical Characteristics of the ON/~OFF Signal Table 34. T ready and T rampup Values Table 35. VCC_2V8 and 2V8_LDO Pin Description Table 36. Electrical Characteristics of the VCC_2V8 Output Table 37. Electrical Characteristics of the 2V8_LDO Output Rev 2.4 March 28,

13 Table 38. WISMO_READY Indication Pin Description Table 39. Electrical Characteristics of the WISMO_READY Indication Table 40. Reset Pin Description Table 41. Electrical Characteristics of the ~RESET Signal Table 42. Reset Commands Table 43. BAT-RTC Pin Description Table 44. Electrical Characteristics of BAT-RTC Table 45. PWM Pin Description Table 46. Electrical Characteristics of the PWM Table 47. BUZZER Pin Description Table 48. Electrical Characteristics of the BUZZER Signal Table 49. TX_CTRL Status Table 50. TX_CTRL Signal Pin Description Table 51. Electrical Characteristics of the TX_CTRL Signal for TX Burst Indication Table 52. WS6318 Embedded Module Operating Modes Table 53. WS6318 Embedded Module Power Consumption (Typical Values) Table 54. Consumption/Software Driver Recommendations Table 55. Standards Conformity for the WS6318 Embedded Module Table 56. Applicable Standards and Requirements for the WS6318 Embedded Module Table 57. Standards Conformity for the AirPrime WS6318 Embedded Module Table 58. Applicable Standards and Requirements Table 59. Operating Class Temperature Range Table 60. ISO Failure Mode Severity Classification Table 61. Life Stress Test Table 62. Environmental Resistance Stress Tests Table 63. Corrosive Resistance Stress Tests Table 64. Thermal Resistance Cycle Stress Tests Table 65. Mechanical Resistance Stress Tests Table 66. Handling Resistance Stress Tests Rev 2.4 March 28,

14 1. Introduction The AirPrime WS6318 Intelligent Embedded Module is a highly compact 2G GSM/GPRS 900/1800 module for voice and data connectivity. It includes the radio, baseband, memory, and firmware in a package specifically designed for M2M applications Overall Dimensions Length: mm Width: mm Thickness: 2.5 mm 1.2. GSM/GPRS Features 2 Watts EGSM 900 radio section running under 3.6 Volts (nominal) 1 Watt GSM1800 radio section running under 3.6 Volts (nominal) Hardware GPRS class 10 capable 1.3. Interfaces Digital section running under 2.8 Volts 3V/1V8 SIM interface Complete interfacing and peripheral connectivity: VBATT power supply 10 GPIOs, 1 GPI 2 Serial links (UART1 and UART2, where UART2 is used for debug purposes only) Antenna An analog audio that comprise of: 2 Speakers 1 Microphone Digital audio (PCM) 2 ADCs 2 Clock outs Debug interface ON/OFF VCC_2V8 and 2V8_LDO outputs Module ready indication Reset RTC supply input 2 PWMs Buzzer TX Burst indication Rev 2.4 March 28,

15 Introduction 1.4. Firmware The AirPrime WS6318 is supported with firmware that allows comprehensive control through AT commands over a serial port and supports the following: Full GSM/GPRS Operating System stack with standard and dedicated M2M AT commands FTP and TCP/IP connectivity Real Time Clock with calendar Comprehensive usage and control of hardware interfaces 1.5. Connection Interfaces The AirPrime WS6318 has an LGA form factor with 86 solderable pads, including Ground pads, which provides: One RF connection pad (antenna connection) Power supply, module control and interface signals connection 1.6. Environment The AirPrime WS6318 is compliant with RoHS Directive 2002/95/EC which sets limits for the use of certain restricted hazardous substances. This directive states that from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) Upgrades Forbidden Upgrading WS6318 modules is strictly forbidden as the product is packed in a Tape & Reel pack and sensitive to moisture exposure. Opening the bag for any purpose other than SMT assembly, and particularly for the purpose of upgrading the software, is done at the sole risk of the customer and would not be covered by the standard warranty conditions Rev 2.4 March 28,

16 2. Functional Specifications 2.1. Functional Architecture The global architecture of the AirPrime WS6318 is shown in the figure below. Figure 1. Functional Architecture Rev 2.4 March 28,

17 Functional Specifications 2.2. RF Functionalities The Radio Frequency (RF) range complies with the Phase II EGSM 900/DCS 1800 recommendation. The frequency range for the transmit band and receive band are listed in the table below. Table 1. List of RF Frequency Ranges Transmit Band (Tx) Receive Band (Rx) E-GSM to 915 MHz 925 to 960 MHz DCS to 1785 MHz 1805 to 1880 MHz The RF component of the WS6318 is based on a specific dual band chip which includes: a digital low-if receiver dual-band LNAs (Low Noise Amplifier) an offset PLL (Phase Locked Loop) transmitter a frequency synthesizer a digitally controlled crystal oscillator (DCXO) a Tx/Rx FEM (Front-End Module) for dual-band GSM/GPRS 2.3. Baseband Functionalities The WS6318 s baseband is composed of an ARM9, a DSP and an analog element (with audio signals, I/Q signals and ADC). The core power supply is 1.2V and the digital power supply is 2.8V Rev 2.4 March 28,

18 3. Technical Specifications 3.1. Power Supply The power supply is one of the key elements in the design of a GSM terminal. Due to the burst emission in GSM/GPRS, the power supply must be able to deliver high current peaks in a short time. During the peaks, the ripple (U ripp ) on the supply voltage must not exceed a certain limit (refer to Table 2 Input Power Supply Voltage below). Listed below are the corresponding radio burst rates for the different GPRS classes in communication mode. A GSM/GPRS class 2 terminal emits 577µs radio bursts every 4.615ms. (See Figure 2 Power Supply During Burst Emission below.) A GPRS class 10 terminal emits 1154µs radio bursts every 4.615ms. In connected mode, the peak current (1.4A peak in GSM /GPRS mode) flows with a ratio of: 1/8 of the time (around 577µs every 4.615ms for GSM /GPRS cl. 2) and 1/4 of the time (around 1154µs every 4.615ms for GSM /GPRS cl. 10) with the rising time at around 10µs. Figure 2. Power Supply During Burst Emission The external power supply source, VBATT, provides for the following functions: Directly supplies the RF components with 3.6V. Note that it is essential to keep a minimum voltage ripple at this connection in order to avoid any phase error. Internally used to provide, via several regulators, the supply required for the baseband signals. The following table describes the electrical characteristics of the input power supply voltage that will guarantee nominal functioning of the AirPrime WS6318 embedded module. Table 2. Input Power Supply Voltage V MIN V NOM V MAX I TYP I MAX VBATT 1, A 1.6A 1 This value has to be guaranteed during the burst (with 1.6A Peak in GSM or GPRS mode) 2 Maximum operating Voltage Stationary Wave Ratio (VSWR) 1.5: Rev 2.4 March 28,

19 Technical Specifications When powering the AirPrime WS6318 with a battery, the total impedance (battery + protections + PCB) should be less than 150mΩ Pin Description Table 3. Power Supply Pin Description Signal Pin Number(s) VBATT 61, 62, 63 GND 46, 47, 48, 50, 51, Application A reject filter can be connected between VBATT and the supply sources if the supply source is noisy. Caution: If the reject filter (C1+L1+C2) is an option, a capacitor (C2) is mandatory close to VBATT. Figure 3. Reject Filter Diagram Recommended Components Table 4. Recommended Components for the Reject Filter Component Value Component Reference Manufacturer GRM21BR60J106KE19L MURATA C1, C2 10µF +/-20% CM21X5R106M06AT KYOCERA JMK212BJ106MG-T TAYO YUDEN C2012X5R0J106MT TDK L1 200nH +/-20% XPL ML COILCRAFT 3.2. Mechanical Specifications The WS6318 embedded module has a complete self-contained shield. The mechanical specifications are described in the figures in the following sub-section Rev 2.4 March 28,

20 Technical Specifications AirPrime WS6318 Dimensions Figure 4. AirPrime WS6318 Mechanical Drawing Rev 2.4 March 28,

21 Technical Specifications Figure 5. LGA Pad Dimension and Location Rev 2.4 March 28,

22 Technical Specifications Recommended PCB Landing Pattern Refer to document [2] Customer Process Guideline for AirPrime WS Series Conformance with ATEX 94/9/CE Directive To evaluate the conformity of a product using the WS6318 embedded module with ATEX 94/9/CE directive, the integrator must take into account the following data from the WS6318: Sum of all capacitors: 36µF Sum of all inductors: 6.2µH Biggest single capacitor: 10µF ± 20% Biggest single inductor: 4.7µH ± 30% Rev 2.4 March 28,

23 4. Interfaces 4.1. LGA Pads The WS6318 embedded module has 86 solderable LGA pads, including Ground pads, which provides access to all available interfaces and signals. The following table lists the interfaces and signals available on the LGA pad and specifies whether these are driven by AT commands or not. Table 5. Available Interfaces and Signals Interface/Signal Analog Audio Interface Analog to Digital Converter Auxiliary Serial Link (for debug use only) BAT-RTC (Backup Battery) Buzzer Output Digital Audio Interface (PCM) Embedded Module Ready Indication General Purpose IO Main Serial Link ON/~OFF PWMs Reset SIM Interface TX Burst Indication Signal Driven by AT Commands Yes Yes No No Yes Yes No Yes Yes No Yes No Yes No Rev 2.4 March 28,

24 Interfaces Pin Configuration Figure 6. AirPrime WS6318 Pin Configuration (top view, through component) Rev 2.4 March 28,

25 Interfaces Pin Description Table 6. LGA Pads Description Pin # Signal Name Description I/O Recommendation for Unused Pins 1 GPIO12 2.8V General purpose input/output I/O Open 2 ~CT125/RI1* 2.8V UART1: Ring indicator O Open 3 ~CT105/RTS1* 2.8V UART1: Request to send I Connect to ~CT106/CTS** 4 ~CT106/CTS1* 2.8V UART1: Clear to send O Connect to ~CT105/RTS** 5 CT103/TXD1* 2.8V UART1: Transmit data I 6 CT104/RXD1* 2.8V UART1: Receive data O 7 ~CT108/DTR1* 2.8V UART1: Data terminal ready I Connect to ~CT107/DSR** 8 ~CT109/DCD1* 2.8V UART1: Data carrier detect O 9 ~CT107/DSR1* 2.8V UART1: Data set ready O Connect to ~CT108/DTR** 10 GPIO11 2.8V General purpose input/output I/O Open 11 ~RESET Input reset signal I Open 12 BUZZER 2.8V Buzzer PWM2 O Open 13 PWM1 2.8V DC PWM 1 O Open 14 PWM0 2.8V DC PWM 0 O Open 15 SPK1N Speaker 1 negative output (32Ω impedance) O Open 16 SPK1P Speaker 1 positive output (32Ω impedance) O Open 17 SPK2N Speaker 2 negative output (16Ω impedance) O Open 18 SPK2P Speaker 2 positive output (16Ω impedance) O Open 19 MICP Microphone positive input I Open 20 MICN Microphone negative input I Open 21 BAT-RTC Power supply for RTC backup I/O Open 22 26M_CLKOUT 26M clock output O 23 32K_CLKOUT 32K clock output O 24 AUX_ADC1 Analog to digital converter I Ground 25 AUX_ADC0 Analog to digital converter I Ground 26 SIM-VCC SIM power supply O 27 SIM-CLK SIM clock O 28 SIM-IO SIM data input/output I/O 29 ~SIM-RST SIM reset O 30 SIM-PRES SIM detection I 31 CT103/TXD2* 2.8V UART2: Transmit data I Test point for debug purpose 32 CT104/RXD2* 2.8V UART2: Receive data O Test point for debug purpose 33 PCM_OUT PCM data out O 34 PCM_IN PCM data in I 35 PCM_SYNC PCM sync out I/O 36 PCM_CLK PCM clock I/O Rev 2.4 March 28,

26 Interfaces Pin # Signal Name Description I/O Recommendation for Unused Pins 37 GPIO10 2.8V General purpose input/output I/O 38 GPIO9 2.8V General purpose input/output I/O 39 GPIO8 2.8V General purpose input/output I/O 40 GPIO7 2.8V General purpose input/output I/O 41 GPIO6 2.8V General purpose input/output I/O 42 GPIO5 2.8V General purpose input/output I/O 43 GPI4 2.8V General purpose input I 44 2V8_LDO 2.8V LDO regulator output O Open 45 VCC_2V8 2.8V power supply from the embedded module O Open 46 GND Ground 47 GND Ground 48 GND Ground 49 ANT Radio antenna connection I/O 50 GND Ground 51 GND Ground 52 TP7 Test point 7 O Test point for debug purpose 53 TP6 Test point 6 O Test point for debug purpose 54 TP5 Test point 5 I Test point for debug purpose 55 TP4 Test point 4 I Test point for debug purpose 56 TP3 Test point 3 I Test point for debug purpose 57 TP2 Test point 2 O Test point for debug purpose 58 TP1 Test point 1 I Test point for debug purpose 59 ON/~OFF Power On control signal I 60 TX_CTRL 2.8V TX burst indicator O Not connected 61 VBATT Power supply I 62 VBATT Power supply I 63 VBATT Power supply I 64 WISMO_READY 2.8V Embedded module ready O Open 65 GPIO2 2.8V General purpose input/output I/O Open 66 GPIO1 2.8V General purpose input/output I/O Open GND Ground * UART signal names are according to PC view. ** Please refer to section Application for more information regarding the connection between DSR and DTR; and CTS and RTS Rev 2.4 March 28,

27 Interfaces 4.2. Electrical Information for Digital I/O Refer to the following table for the electrical characteristics of a 2.8V type (2V8) digital I/O. Table 7. Electrical Characteristics of a 2.8V Type (2V8) Digital I/O Parameter I/O Type Minimum Typical Maximum Condition Internal 2.8V power supply VCC_2V8 2.7V 2.8V 2.95V V IL CMOS -0.4V* - 0.4V V IH CMOS 2.4V - VCC_2V V* Input / Output pin V OL CMOS V V OH * Absolute maximum ratings 2.7V - - CMOS 2.4V - - I OH = 1mA Reset states of the I/Os are given in each interface/signal description chapter. Definitions of these states are given in the table below. Table 8. Reset State Definition Reset State Definition 0 Set to GND 1 Set to 2V8 supply Pull-down Internal pull-down with ~60kΩ resistor Pull-up Internal pull-up with ~60kΩ resistor to 2V8 supply Z High impedance Undefined Caution: Undefined must not be used in an application if a specified state is required at reset. These pins may be toggling a signal(s) during reset General Purpose Input/Output The WS6318 embedded module provides ten (10) General Purpose I/Os, and one (1) General Purpose Input. They are used to control any external device such as an LCD or a keyboard backlight Pin Description Table 9. GPIO Pin Description Signal Pin Number I/O I/O Type Reset State Description GPIO1 66 I/O 2V8 Input pull down General purpose input/output GPIO2 65 I/O 2V8 Input pull up General purpose input/output GPI4 43 I 2V8 Input pull down General purpose input GPIO5 42 I/O 2V8 Input pull down General purpose input/output GPIO6 41 I/O 2V8 Input pull up General purpose input/output GPIO7 40 I/O 2V8 Input pull down General purpose input/output Rev 2.4 March 28,

28 Interfaces Signal Pin Number I/O I/O Type Reset State Description GPIO8 39 I/O 2V8 Input pull up General purpose input/output GPIO9 38 I/O 2V8 Input pull down General purpose input/output GPIO10 37 I/O 2V8 Input pull down General purpose input/output GPIO11 10 I/O 2V8 Input pull down General purpose input/output GPIO12 1 I/O 2V8 Input pull down General purpose input/output Note: Pin 43, GPI4, is used as a general purpose input pin ONLY Main Serial Link (UART1) The main serial link (UART1) is used for communication between the WS6318 embedded module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with V24 protocol signaling, but not with V28 (electrical interface) due to its 2.8-Volt interface. To get a V28 (i.e. RS-232) interface, an RS-232 level shifter device is required as described in section Level Shifter Implementation. The UART1 interface is a 2.8V type, but is 3V tolerant. The supported baud rates of the UART1 are 1200, 2400, 4800, 9600, 19200, 38400, and bit/s, with autobauding. The signals used by UART1 are as follows: TX data (CT103/TXD1) RX data (CT104/RXD1) Request To Send (~CT105/RTS1) Clear To Send (~CT106/CTS1) Data Terminal Ready (~CT108/DTR1) Data Set Ready (~CT107/DSR1) Data Carrier Detect (~CT109/DCD1) Ring Indicator (~CT125/RI1) Pin Description Refer to the following table for the pin description of the UART1 interface. Table 10. UART Pin Description Signal* Pin Number I/O I/O Type Description CT103/TXD1 5 I 2V8 Transmit serial data CT104/RXD1 6 O 2V8 Receive serial data ~CT105/RTS1 3 I 2V8 Request to send ~CT106/CTS1 4 O 2V8 Clear to send ~CT107/DSR1 9 O 2V8 Data set ready ~CT108/DTR1 7 I 2V8 Data terminal ready ~CT109/DCD1 8 O 2V8 Data carrier detect ~CT125/RI1 2 O 2V8 Ring indicator * According to PC (DTE) view Rev 2.4 March 28,

29 Interfaces The rising time and falling time of the reception signals (mainly CT103/TXD1) have to be less than 300ns. Tip: The WS6318 embedded module is designed to operate using all the serial interface signals. In particular, it is recommended to use ~CT105/RTS1 and ~CT106/CTS1 for hardware flow control in order to avoid data corruption during transmissions Application Level Shifter Implementation The level shifter must be 2.8V with V28 electrical signal compliance. Figure 7. Example of an RS-232 Level Shifter Implementation for UART1 Note: Table 11. The U1 chip also protects the WS6318 embedded module against ESD (Air Discharge) at 15KV. Recommended Components Component Description/Details Manufacturer R1, R2 15KΩ C1, C2, C3, C4, C5 1µF C6 100nF C7 6.8µF TANTAL 10V CP32136 AVX U1 ADM3307EACP ANALOG DEVICES J1 SUB-D9 female R1 and R2 are necessary only during Reset state to force the ~CT125/RI1 and ~CT109/DCD1 signals to HIGH level. The ADM3307EACP can be powered by the 2V8_LDO (pin 44) of the WS6318 embedded module or by an external regulator at 2.8V. If the UART1 interface is connected directly to a host processor, it is not necessary to use level shifters. The interface can be connected as shown in the following sub-sections Rev 2.4 March 28,

30 Interfaces Possible V24/CMOS Designs wire Serial Interface Hardware Design The signals used in this interface are as follows: CT103/TXD1 CT104/RXD1 ~CT105/RTS1 ~CT106/CTS1 ~CT108/DTR1 The signal ~CT108/DTR1 must be managed following the V24 protocol signaling if we want to use idle mode. Figure 8. Example of a V24/CMOS Serial Link Implementation for 5-wire UART wire Serial Interface Hardware Design The signals used in this interface are as follows: CT103/TXD1 CT104/RXD1 ~CT105/RTS1 ~CT106/CTS1 The signal ~CT108/DTR1 can be looped back to ~CT107/DSR1 from both the WS6318 embedded module side and from the DTE side Rev 2.4 March 28,

31 Interfaces Figure 9. Example of a V24/CMOS Serial Link Implementation for 4-wire UART wire Serial Interface Hardware Design Caution: Although this case is possible for a connected external chip, it is not recommended. The flow control mechanism has to be managed from the customer side. The signals used in this interface are as follows: CT103/TXD1 CT104/RXD1 The signal ~CT108/DTR1 can be looped back to ~CT107/DSR1 from both the WS6318 embedded module side and from the DTE side. Note: The loop back connection of ~CT108/DTR1 to ~CT107/DSR1 is not allowed when AT+PSSLEEP=0 is used, for which sleep mode entry is ~CT108/DTR1 level dependent. (Refer to section 6.1.1Using AT+PSSLEEP to Enter Sleep Mode.) In order to go to sleep mode properly under such configuration, AT+PSSLEEP=1 should be used instead. For details, please refer to document [1] AT Command Manual for AirPrime WS6318. The signal ~CT105/RTS1 can be looped back to ~CT106/CTS1 from both the WS6318 embedded module side and from the DTE side. Because signals ~CT105/RTS1 and ~CT106/CTS1 are not used, the default hardware flow control on UART should be de-activated using the AT command, AT+IFC=0,0. Refer to document [1] AT Command Manual for AirPrime WS6318 for more information. Figure 10. Example of a V24/CMOS Serial Link Implementation for 2-wire UART Rev 2.4 March 28,

32 Interfaces Full Modem Hardware Design The designs shown in the preceding sections are basic designs. Both ~CT109/DCD1 and ~CT125/RI1 can be left open when not used. However, a more flexible design to access this serial link with all modem signals is shown below. Figure 11. Example of a Full Modem V24/CMOS Serial Link Implementation for full UART1 Note that there is an internal 10KΩ pull-up resistor on ~CT109/DCD1 to set it to HIGH level during the reset state; and that it is necessary to add an external pull-up resistor on ~CT125/RI Auxiliary Serial Link (UART2) The auxiliary serial link (UART2) is used for debug purposes only. It consists of a flexible 2-wire serial interface that complies with V24 protocol signaling, but not with V28 (electrical interface) due to its 2.8-Volt interface. To get a V28 (i.e. RS-232) interface, an RS-232 level shifter device is required as described in section Level Shifter Implementation. The UART2 interface is a 2.8V type, but is 3V tolerant. The signals used by UART2 are as follows: TX data (CT103/TXD2) RX data (CT104/RXD2) Pin Description Refer to the following table for the pin description of the UART2 interface. Table 12. UART Pin Description Signal* Pin Number I/O I/O Type Description CT103/TXD2 31 I 2V8 Transmit serial data/test CT104/RXD2 32 O 2V8 Receive serial data * According to PC (DTE) view Rev 2.4 March 28,

33 Interfaces Application Note: It is mandatory to route out a test point for these two UART2 pins as they are reserved for debug purposes Level Shifter Implementation for Debug Purposes The level shifter must be 2.8V with V28 electrical signal compliance. Figure 12. Example of an RS-232 Level Shifter Implementation for UART2 Note: Table 13. The U1 chip also protects the WS6318 embedded module against ESD (Air Discharge) at ±10KV. Recommended Components Component Description/Details Manufacturer C1 220nF C2, C3, C4 1µF L1 10µH U1 LTC2804IGN-1 LINEAR TECHNOLOGY LTC J1 SUB-D9 female The LTC2804IGN-1 can be powered by the 2V8_LDO (pin 44) of the WS6318 embedded module or by an external regulator at 2.8V. If the UART2 interface is connected directly to a host processor, it is not necessary to use level shifters. The interface can be connected as shown in the following sub-section Rev 2.4 March 28,

34 Interfaces wire Serial Interface Hardware Design The signals used in this interface are as follows: CT103/TXD2 CT104/RXD2 Figure 13. Example of a V24/CMOS Serial Link Implementation for 2-wire UART SIM Interface The Subscriber Identification Module (SIM) can be directly connected to the WS6318 embedded module through this dedicated interface. This interface can control both 1.8V and 3V SIM cards and is fully compliant with the GSM recommendations concerning SIM functions. The four (4) signals used by this interface are as follows: SIM-VCC: power supply SIM-CLK: clock SIM-IO: I/O port ~SIM-RST: reset An additional signal for SIM card detection is also available: SIM-PRES: SIM card detection Pin Description Refer to the following table for the pin description of the SIM interface. Table 14. SIM Interface Pin Description Signal Pin Number I/O I/O Type Description SIM-VCC 26 O 2V9/1V8 SIM power supply SIM-CLK 27 O 2V9/1V8 SIM clock SIM-IO 28 I/O 2V9/1V8 SIM data input/output ~SIM-RST 29 O 2V9/1V8 SIM reset SIM-PRES 30 I 2V8 SIM detection Rev 2.4 March 28,

35 Interfaces Electrical Characteristics Refer to the following table for the electrical characteristics of the SIM interface. Table 15. Electrical Characteristics of the SIM Interface Parameter Conditions Minimum Typical Maximum Unit SIM-IO V IH I IH = ± 20µA 0.7xVSIM - - V SIM-IO V IL I IL = 1mA * 0.36** V ~SIM-RST, SIM-CLK V OH Source current = 20µA 0.9xVSIM - - V SIM-IO V OH Source current = 20µA 0.8xVSIM - - V ~SIM-RST, SIM-IO, SIM-CLK V OL SIM-VCC Output Voltage SIM-VCC current SIM-CLK Rise/Fall Time ~SIM-RST, Rise/Fall Time SIM-IO Rise/Fall Time Sink current = -1mA * 0.3** V SIM-VCC = 2.9V V SIM-VCC = 1.8V V Full-power mode ma Sleep mode with 32kHz system clock enabled ma Loaded with 30pF and ESD protection diode ns Loaded with 30pF and ESD protection diode ns Loaded with 30pF and ESD protection diode µs SIM-CLK Frequency Loaded with 30pF MHz SIM-PRES V IH V SIM-PRES V IL V * 3.0V SIM (Class B Electrical) ** 1.8V SIM (Class C Electrical) Note: Sierra Wireless is compliant with ETSI TS (version 2.0, release 8, June 2009) Application It is recommended to add Transient Voltage Suppressor diodes (TVS) on the signals connected to the SIM socket in order to prevent any Electrostatic Discharge. These types of diodes are mandatory for the Full Type Approval. They should be placed as close to the SIM socket as possible. TVS diodes with low capacitance (less than 10pF) also have to be connected on the SIM-CLK and SIM-IO signals to avoid any disturbance from the rising and falling edge Rev 2.4 March 28,

36 Interfaces Figure 14. Example of a SIM Socket Implementation Refer to the table below for the recommended components to use with the SIM interface. Table 16. Recommended Components Component Description/Details Manufacturer R1 100KΩ C1 470pF 100nF C2 (Note that this capacitor, C2, on the SIM-VCC line must not exceed 330nF.) D1 ESDA6V1SC6 ST D2 DALC208SC6 ST Microelectronics J1 ITT CANNON CCM03 series (See section 10.1 SIM Card Reader for more information) CANNON SIM Socket Connection The following table lists the SIM socket pin description. Table 17. SIM Socket Pin Description Signal Pin Number Description VCC 1 SIM-VCC RST 2 ~SIM-RST CLK 3 SIM-CLK CC4 4 SIM-PRES with 100kΩ pull down resistor GND 5 GROUND VPP 6 Not connected I/O 7 SIM-IO CC8 8 VCC_2V8 (pin 45) of the WS6318 embedded module Rev 2.4 March 28,

37 Interfaces 4.7. RF Interface The RF (radio frequency) interface of the WS6318 embedded module allows the transmission of RF signals. This interface has a 50Ω nominal impedance and a 0Ω DC resistance RF Connection The RF input/output of the WS6318 embedded module is through one of the LGA pads (pin 49, ANT). A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for antenna connection. Note: The antenna cable and connector should be chosen in order to minimize loss in the frequency bands used for GSM900MHz and 1800MHz.The maximum loss value that can be considered between the WS6318 embedded module and an external connector is 0.5dB RF Performances RF performances are compliant with the ETSI recommendation GSM The main receiver parameters are: E-GSM900 Reference Sensitivity = -109 dbm (typical) DCS1800 Reference Sensitivity = -109 dbm (typical) 200 khz : > +9 dbc 400 khz : > +41 dbc Linear dynamic range: 63 db Co-channel rejection: >= 9 dbc The main transmitter parameters are: Maximum output power (EGSM): 33 dbm +/- 2 db at ambient temperature Maximum output power (GSM1800): 30 dbm +/- 2 db at ambient temperature Minimum output power (EGSM): 5 dbm +/- 5 db at ambient temperature Minimum output power (GSM1800): 0 dbm +/- 5 db at ambient temperature Antenna Specifications The optimum operating frequency depends on the application. A dual-band antenna will work in these frequency bands and should have the characteristics specified in the following table. Table 18. Antenna Specifications Characteristic E-GSM 900 DCS 1800 TX Frequency 880 to 915 MHz 1710 to 1785 MHz RX Frequency 925 to 960 MHz 1805 to 1880 MHz Impedance 50Ω VSWR Rx max 1.5 :1 Tx max 1.5 :1 Typical radiated gain 0dBi in one direction at least Rev 2.4 March 28,

38 Interfaces Tip: Sierra Wireless strongly recommends working with an antenna manufacturer either to develop an antenna adapted to the application or to adapt an existing solution to the application. Both the mechanical and electrical antenna adaptations are one of the key issues in the design of the GSM terminal Application The RF antenna connection uses one of the LGA pads of the WS6318 embedded module, with ground pads at both sides. This LGA pad must be connected to a 50Ω RF line in order to protect the antenna line from the noise coming from baseband signals. ESD Diode 50Ω RF line LGA pad for ANT (pin 49) Figure 15. Example of an RF 50Ω Line This 50Ω line is surrounded by two ground planes in order to protect this antenna line from noise. The length of the line shouldn t be too long (more than a few centimeters) because of RF insertion loss. The width of the line must be calculated in order to ensure a 50Ω characteristic impedance. For this same reason, the RF embedded line should likewise be kept about 1cm away from any (noisy) baseband signal in order to ensure good RX sensitivity level. The other end of the RF 50Ω line can be connected to an RF connector or a soldering pad in order to connect an antenna. It is also possible to use an antenna chip or to design a PCB antenna directly on the application board. The ANT pin of the WS6318 embedded module is ESD protected, for both ±4KV contact and ±8KV air discharge. One of the suggested ESD diodes is listed below: Manufacturer: INNOCHIPS TECHNOLOGY CO. Part Number: ULCE0505A015FR In order to enhance the antenna s resistance to higher ESD levels, it is recommended to add an ESD diode close to the RF connector of the final application Analog Audio Interface The WS6318 embedded module supports one microphone input and two speaker outputs. It also includes a noise suppression and echo cancellation feature which allows for an enhanced voice call quality. In some cases, ESD protection must be added on the audio interface lines Rev 2.4 March 28,

39 Interfaces Pin Description Refer to the following table for the pin description of the analog audio interface. Table 19. Analog Audio Interface Pin Description Signal Pin Number I/O I/O Type Description SPK1N 15 O Analog Speaker 1 negative output (32Ω impedance) SPK1P 16 O Analog Speaker 1 positive output (32Ω impedance) SPK2N 17 O Analog Speaker 2 negative output (16Ω impedance) SPK2P 18 O Analog Speaker 2 positive output (16Ω impedance) MICP 19 I Analog Microphone positive input MICN 20 I Analog Microphone negative input Microphone The microphone, MIC, can either have a single-ended or a differential connection. However, performance with common mode noise and TDMA noise varies depending on the connection mode and PCB layout. When connecting a microphone to the WS6318, ensure to have a very good ground plane, very good filtering as well as shielding in order to avoid any disturbance on the audio path. The gain of the MIC input is internally adjusted and can be tuned using AT commands. The WS6318 MIC pins already include suitable biasing for an electret microphone. The electret microphone can then be connected directly on the inputs for easy connection. AC coupling is also already embedded in the WS6318 embedded module. Figure 16. Suggested MIC Connection in Differential Mode Figure 17. Suggested MIC Connection in Single-Ended Mode Rev 2.4 March 28,

40 Interfaces Electrical Characteristics Refer to the following table for the electrical characteristics of the microphone interface. Table 20. Electrical Characteristics of MIC Parameters Minimum Typical Maximum Unit Internal biasing DC Characteristics AC Characteristics 200 Hz<F<4 khz Maximum working voltage (MICP-MICN) (THD 10%) Maximum rating voltage (MICP or MICN) MICP V MICN without 2k2Ω to GND V MICN with 2k2Ω to GND V Output current ma Z2 MICP (MICN=Open) Z2 MICN (MICP=Open) 2.2 Z2 MICP (MICN=GND) 2.2 Z2 MICN (MICP=GND) KΩ Impedance between MICP and MICN without 2k2Ω to GND 4.5 Impedance between MICP and MICN with 2k2Ω to GND 3.2 AT+VGT*= mvpp V * The input voltage depends on the input micro gain set by the AT command. Please refer to document [1] AT Command Manual for AirPrime WS6318. Because both MICP and MICN are internally biased, it is necessary to use a coupling capacitor to connect an audio signal provided by an active generator. Only a passive microphone can be directly connected to the MICP input Application It is recommended to add ESD protection to the microphone when it is exposed to the external environment. The ESD protection should be connected between the audio lines and a good ground, and placed as close to the microphone as possible. Also ensure to have a good ground plane, good filtering as well as shielding, in order to avoid any disturbance on the audio path. It is important to select an appropriate microphone and filtering components to avoid TDMA noise Rev 2.4 March 28,

41 Interfaces Differential Connection Example * Z2 is from 200Hz to 4kHz. For more characteristics refer to section Table 20 Electrical Characteristics of MIC. Figure 18. Example of a MIC Input Connection with LC Filter The LC filter (L1, L2, C2, C3, and C4) is used to reduce EMI perturbation created by TDMA noise, but it is not mandatory. Good quality audio can be achieved without an LC filter depending on the design. * Z2 is from 200Hz to 4kHz. For more characteristics refer to section Table 20 Electrical Characteristics of MIC. Figure 19. Example of a MIC Input Connection without LC Filter Capacitor C1 is highly recommended to eliminate TDMA noise. Note that C1 must be close to the microphone. Refer to the table below for the recommended components to use with a microphone connection. Table 21. Recommended Components for a Microphone Connection Component Description/Details Notes C1 12pF to 33pF Needs to be tuned depending on the design C2, C3, C4 47pF Needs to be tuned depending on the design L1, L2 100nH Needs to be tuned depending on the design Rev 2.4 March 28,

42 Interfaces Single-Ended Connection Example When single-ended connection is used for MIC, MICN is just left open. * Z2 is from 200Hz to 4kHz. For more characteristics refer to section Table 20 Electrical Characteristics of MIC. Figure 20. Example of a Single-Ended MIC Input Connection with LC Filter The internal input impedance value becomes 1100Ω, due to the connection of the other end to ground. The single-ended design is very sensitive to TDMA noise; it is recommended to add L1 and C2 footprint as an LC filter to try to eliminate TDMA noise. Very good grounding on the MIC is required in order to ensure good performance against TDMA. Also, special care on the PCB layout must be taken. When not used, the filter can be removed by replacing L1 with a 0Ω resistor and by disconnecting C2, as shown in the following figure. * Z2 is from 200Hz to 4kHz. For more characteristics refer to Table 20 Electrical Characteristics of MIC. Figure 21. Example of a Single-Ended MIC Input Connection without LC Filter The capacitor C1 is highly recommended to eliminate TDMA noise. Note that C1 must be close to the microphone. Refer to the table below for the recommended components to use with a single-ended microphone connection Rev 2.4 March 28,

43 Interfaces Table 22. Recommended Components for a Single-Ended Microphone Connection Component Description/Details Notes C1 12pF to 33pF Needs to be tuned depending on the design C2 12pF to 33pF Needs to be tuned depending on the design L1 100nH Needs to be tuned depending on the design Recommended Microphone Characteristics The following enumerates the recommended microphone characteristics. The impedance of the microphone has to be around 2KΩ Sensitivity should be from -40 db to -50 db SNR > 50 db The frequency response should be compatible with GSM specifications To suppress TDMA noise, it is highly recommended to use microphones with two internal decoupling capacitors: CM1=56pF (0402 package) for the TDMA noise coming from the demodulation of the GSM900 frequency signal CM2=15pF (0402 package) for the TDMA noise coming from the demodulation of the DCS frequency signal The capacitors have to be soldered in parallel to the microphone as shown in the following figure. CM Figure 22. Capacitor Soldered in Parallel to the Microphone Speaker There are two different speaker channels, SPK1 and SPK2, available on the WS6318 embedded module. Both speakers can have either a single-ended or a differential connection. However, it is strongly recommended to use a differential connection in order to reject common mode noise and TDMA noise. Moreover, in single-ended mode, half (1/2) of the power is lost. Figure 23. Equivalent Circuit for SPK Rev 2.4 March 28,

44 Interfaces When using a single-ended connection, be sure to have a very good ground plane, very good filtering as well as shielding in order to avoid any disturbance on the audio path. The following table lists the typical values of both speaker outputs. Table 23. Speaker Details Parameter Typical Value Unit Connection Z (SPKxP, SPKxN) 16 or 32 Ω Differential mode Z (SPKxP, SPKxN) 8 Ω Single-ended mode Electrical Characteristics The maximum specifications given below are available with the maximum power output configuration values set by an AT command. The typical values are recommended. Table 24. Electrical Characteristics of SPK Parameters Minimum Typical Maximum Unit Biasing voltage SPKxP and SPKxN V Output swing voltage RL=8Ω: AT+VGR=6*; single ended Vpp RL=8Ω: AT+VGR=6*; differential Vpp RL=16Ω or 32Ω: AT+VGR=6*; single ended Vpp RL=16Ω or 32Ω: AT+VGR=6*; differential Vpp RL Load resistance Ω IOUT Output current; peak value; RL=8Ω ma POUT RL=8Ω; AT+VGR=10* mw * The output voltage depends on the output speaker gain set by the AT command. Please refer to document [1] AT Command Manual for AirPrime WS6318. If a single-ended connection is used, only SPKxP has to be connected. The result is the maximum output power divided by Application It is recommended to add ESD protection to the speaker when it is exposed to the external environment. The ESD protection should be connected between the audio lines and a good ground, and placed as close to the speaker as possible. It is important to select an appropriate speaker and filtering components to avoid TDMA noise Rev 2.4 March 28,

45 Interfaces SPK Differential Connection Note: Add a 33pF capacitor between the SPKxP and SPKxN pins to reduce TDMA noise. Figure 24. Example of a Differential Connection for SPK1 Figure 25. Example of a Differential Connection for SPK SPK Single-Ended Connection Figure 26. Example of a Single-Ended Speaker Connection (typical implementation) In a single-ended connection: 4.7µF < C1 < 47µF, depending on the speaker characteristics and output power the connection between the WS6318 embedded module pins and the speaker must be designed to keep the serial impedance lower than 1.5Ω SPKxN can be left open output power is lost (-6dB) as compared to a differential connection Recommended Speaker Characteristics The following enumerates the recommended speaker characteristics. Type of speakers: Electro-magnetic /10mW Impedance: 8Ω 32Ω for headset kit Sensitivity: 110dB SPL min Receiver frequency response should be compatible with GSM specifications Rev 2.4 March 28,

46 Interfaces Recommended Filtering Components When designing a GSM application, it is important to select the right audio filtering components. The strongest noise, called TDMA, is mainly due to the demodulation of the GSM900 and DCS1800 signal, where a burst is produced every 4.615ms; and the frequency of the TDMA signal is equal to 216.7Hz plus harmonics. TDMA noise can be suppressed by filtering the RF signal using the right decoupling components. The types of filtering components are: RF decoupling inductors RF decoupling capacitors A good Chip S-Parameter simulator is proposed by Murata. Refer to for more details. Using different Murata components, it can be seen that the value, the package and the current rating can have different decoupling effects. The table below shows some examples with different Murata components. Table 25. Murata Examples Package 0402 Filtered band GSM900 GSM 850/900 DCS/PCS Value 100nH 56pF 15pF Types Inductor Capacitor Capacitor Position Serial Shunt Shunt Manufacturer Murata Murata Murata Rated 150mA 50V 50V Reference Package 0603 LQG15HSR10J02 or LQG15HNR10J02 GRM1555C1H560JZ01 Filtered band GSM900 GSM 850/900 DCS/PCS Value 100nH 47pF 10pF Types Inductor Capacitor Capacitor Position Serial Shunt Shunt Manufacturer Murata Murata Murata Rated 300mA 50V 50V Reference LQG18HNR10J00 GRM1885C1H470JA01 or GRM1885C1H470JB01 GRM1555C1H150JZ01 or GRM1555C1H150JB01 GRM1885C1H150JA01 or GQM1885C1H150JB Rev 2.4 March 28,

47 Interfaces Audio Track and PCB Layout Recommendation To avoid TDMA noise, it is recommended to surround the audio tracks with ground as shown in the following figure: Figure 27. Audio Track Design For differential connections, it is necessary to add a 2.2kΩ resistor from MICN to GND to have a proper bias of the microphone. Refer to the following figure. Figure 28. Differential Audio Connection For single-ended connections, the negative pole of the microphone, MICN, should be connected to GND. Refer to the following figure. Figure 29. Single-Ended Audio Connection Caution: Digital tracks crossing under and over the audio tracks MUST be avoided Rev 2.4 March 28,

48 Interfaces It is highly recommended to have the MIC ground and the LC filter ground to act as an audio analog ground during the PCB layout. This audio ground, together with the MICP signal, should act as the differential line pair; and this audio ground should only be connected to the WS6318 embedded module ground as close as possible to the LGA GND pad of the WS6318. It is the same case for SPKP and SPKN. Also, the audio interface is ESD sensitive. ESD protection MUST be added to the interface once it is externally accessible. The recommended ESD protection to use is ESDA6VIL from ST Digital Audio Interface (PCM) The Digital Audio Interface (PCM) interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals. The signals used by the Digital Audio Interface are as follows: PCM_SYNC: The frame synchronization signal delivers an 8kHz frequency pulse that synchronizes the frame data in and the frame data out. PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral. PCM_OUT: The frame data out relies on the selected configuration mode. PCM_IN: The frame data in relies on the selected configuration mode. The Digital Audio Interface also features the following: Master mode only Bit rate single clock mode at 1 MHz 16 bits word, 13 bits data, MSB first only Data sampling on falling edge Linear Law only (no compression law) Long Frame Synchronization only Note: Default PCM configuration can be updated using AT+WMPCM. Refer to document [1] AT Command Manual for AirPrime WS6318 for more information Pin Description Refer to the following table for the pin description of the digital audio (PCM) interface. Table 26. PCM Interface Pin Description Signal Pin Number I/O I/O Type Description PCM_SYNC 35 I/O 2V8 Frame synchronization 8kHz PCM_IN* 34 I 2V8 Data input PCM_CLK 36 I/O 2V8 Data clock PCM_OUT 33 O 2V8 Data output * When using the analog audio interface, the PCM_IN signal should be in HZ Rev 2.4 March 28,

49 Interfaces Electrical Characteristics Refer to the following table for the AC characteristics of the digital audio interface. Table 27. AC Characteristics of the Digital Audio Interface Signal Description Minimum Typical Maximum Unit Tsync_low + Tsync_high PCM-SYNC period 125 µs Tsync_low PCM-SYNC low time 124 µs Tsync_high PCM-SYNC high time 1 µs TSYNC-CLK PCM-SYNC to PCM-CLK time 651 ns TCLK-cycle PCM-CLK period 1302 ns TIN-setup PCM-IN setup time 50 ns TIN-hold PCM-IN hold time 50 ns TOUT-delay PCM-OUT delay time 20 ns TSYNC-delay PCM-SYNC output delay ns PCM Waveforms The following figure shows the PCM timing waveform. Figure 30. PCM Timing Waveform Rev 2.4 March 28,

50 Interfaces Analog to Digital Converter Two Analog to Digital Converter input, AUX-ADC0 and AUX-ADC1, are provided by the WS6318 embedded module. These converters are 10-bit resolution ADCs ranging from either 0 to 1V or 0 to 3V, depending on the setting of the AT+WMADC command. Refer to document [1] AT Command Manual for AirPrime WS6318 for more information. Typically, the AUX-ADCx input can be used to monitor external temperature. This is very useful for monitoring the application temperature and can be used as an indicator to safely power OFF the application in case of overheating (for Li-Ion batteries) Pin Description Refer to the following table for the pin description of the ADCs. Table 28. Analog to Digital Converter Pin Description Signal Pin Number I/O I/O Type Description AUX-ADC0 25 I Analog A/D converter AUX-ADC1 24 I Analog A/D converter Caution: The AUX-ADCx pin is ESD sensitive. ESD protection must be added to this pin once it is externally accessible. The recommended ESD protection to use is AVL5M02200 from Amotech Electrical Characteristics Refer to the following table for the electrical characteristics of the ADC. Table 29. Electrical Characteristics of the ADC Parameter Minimum Typical Maximum Unit Resolution bits Sampling frequency khz 1 general purpose input 0-1 V Input signal range 1 general purpose input in div-by-3 mode 0-3 V Integral non-linearity (INL) bit Differential non-linearity (DNL) bit Input impedance input resistance KΩ input capacitance pf Digital Clock The WS6318 embedded module supports two clock interfaces. One interface can output a 32kHz frequency signal; and the other interface can output a 26MHz frequency signal, which can be used for external Bluetooth applications. Both interfaces can be independently switched ON or OFF (using AT command AT+WEXTCLK) to provide a clock source to an external application. For more information about this AT command, refer to document [1] AT Command Manual for AirPrime WS Rev 2.4 March 28,

51 Interfaces Pin Description Refer to the following table for the pin description of the digital clock. Table 30. Digital Clock Pin Description Signal Pin Number I/O Frequency PPM 26M_CLKOUT 22 O 26MHz ±10 ppm 32K_CLKOUT 23 O kHz ±20 ppm Caution: The 26M_CLKOUT signal is very sensitive to loading; hence a low load on this clock is required when it s used. A 4.7pF series capacitor is recommended Debug Interface The WS6318 embedded module has 7 pins reserved as test points which can be used for testing/debugging purposes. It is strongly recommended to have test points present in the application; these test points can be used by Sierra Wireless for technical support purposes Pin Description Refer to the following table for the pin description of the test points. Table 31. Test Points Pin Description Signal Pin Number I/O I/O Type Description Notes TP7 52 O 2V8 Test point 7 TP6 53 O 2V8 Test point 6 TP5 54 I 2V8 Test point 5 A 10kΩ resistor to GND is needed TP4 55 I 2V8 Test point 4 TP3 56 I 2V8 Test point 3 TP2 57 O 2V8 Test point 2 TP1 58 I 2V8 Test point 1 Caution: This interface is used for debug purposes and it is mandatory to route out a test point for these pins. It is also necessary to add a 10kΩ resistor on pin 54 to GND Rev 2.4 March 28,

52 5. Signals and Indicators 5.1. ON/~OFF Signal The ON/~OFF pin is used to switch ON or switch OFF the WS6318 embedded module. It is internally connected to the permanent 3.0V supply regulator inside the WS6318 via a pull-up resistor. Once there is VBATT supply to the WS6318 embedded module, this 3.0V supply regulator will be enabled and so the ON/~OFF signal is by default at HIGH level. A LOW level signal has to be provided on the ON/~OFF pin to switch ON the WS6318 embedded module. Caution: All external signals must be inactive when the WS6318 embedded module is OFF to avoid damaging the embedded module when starting and to allow the WS6318 embedded module to start and stop correctly. Avoid using application MCU GPIO to directly control the ON/~OFF signal of the WS6318 embedded module; instead, control this signal via an open collector switching transistor Pin Description Refer to the following table for the pin description of the ON/~OFF signal. Table 32. ON/~OFF Signal Pin Description Signal Pin Number I/O I/O Type Description ON/~OFF 59 I 3V WS6318 embedded module power ON/OFF Electrical Characteristics Refer to the following table for the electrical characteristics of the ON/~OFF signal. Table 33. Electrical Characteristics of the ON/~OFF Signal Parameter I/O Type Minimum Typical Maximum Unit V IH 2V V V IL 2V V Application Figure 31. Example of the ON/~OFF Pin Connection Using a Switch Rev 2.4 March 28,

53 Signals and Indicators Figure 32. Example of the ON/~OFF Pin Connection via an Open Collector Transistor Power ON The ON/~OFF signal level is detected about 250ms after VBATT is available. Note that temperature conditions may affect the timing for powering up. During the power ON sequence, an internal reset is automatically performed for 38ms (typically). During this phase, any external reset should be avoided. Once the WS6318 embedded module is properly powered ON, the WISMO_READY pin will be set to HIGH level to acknowledge the successful power ON of the WS6318 embedded module. The ON/~OFF signal can be left at LOW level until power OFF or the ON/~OFF signal can be released to high impedance (HIGH level) after the WS6318 embedded module is powered ON. Power consumption will be higher if the ON/~OFF pin is kept at low level due to the current drawn into the internal pull-up resistor. Note: The recommended way to release the ON/~OFF signal is to detect the WISMO_READY signal and wait until the WISMO_READY signal goes HIGH. Figure 33. Table 34. Power-ON Sequence (no PIN code activated) T ready and T rampup Values Minimum Typical Maximum Unit T ready s T rampup ms Rev 2.4 March 28,

54 Signals and Indicators Power OFF The WS6318 embedded module can be powered off by either software or hardware Software Power OFF The AT command AT+CPOF is used to power off the WS6318 embedded module. Caution: If the ON/~OFF pin is maintained at LOW level when AT+CPOF is used, the embedded module cannot be switched OFF. Figure 34. Software Power OFF Sequence (after the ON/~OFF pin is High) Figure 35. Software Power OFF Sequence (before the ON/~OFF pin is High) Rev 2.4 March 28,

55 Signals and Indicators Hardware Power OFF A LOW level pulse is applied on the ON/~OFF pin for 5.5 seconds. The WS6318 embedded module will then be deregistered from the network. The WISMO_READY pin will change to LOW level to indicate that AT commands are no longer available, and the WS6318 embedded module will be switched off. Figure 36. Power-OFF Sequence 5.2. VCC_2V8 and 2V8_LDO Outputs The VCC_2V8 output can be used to: Pull-up signals such as I/Os Supply the digital transistors driving LEDs Supply the SIMPRES signal Act as a voltage reference for the ADC interfaces, AUX-ADC0 and AUX-ADC1 The VCC_2V8 output is available when the WS6318 embedded module is switched ON. The 2V8_LDO output on the other hand, is a dedicated 2.8V voltage supply available for the application circuit. It is output disabled by default and can be enabled using the AT+WLDO AT command. Refer to document [1] AT Command Manual for AirPrime WS6318 for more information about AT commands Pin Description Refer to the following table for the pin description of the VCC_2V8 and 2V8 LDO outputs. Table 35. VCC_2V8 and 2V8_LDO Pin Description Signal Pin Number I/O I/O Type Description 2V8_LDO 44 O Supply 2.8V digital supply Rev 2.4 March 28,

56 Signals and Indicators Signal Pin Number I/O I/O Type Description VCC_2V8 45 O Supply 2.8V digital supply Electrical Characteristics Refer to the following table for the electrical characteristics of the VCC_2V8 output. Table 36. Electrical Characteristics of the VCC_2V8 Output Parameter Minimum Typical Maximum Unit Output voltage V Output current Full-power mode* ma Sleep mode* ma * Refer to section 6.1Various Operating Modes for WS6318 operating modes. Refer to the following table for the electrical characteristics of the 2V8_LDO output. Table 37. Electrical Characteristics of the 2V8_LDO Output Parameter Minimum Typical Maximum Unit Output voltage V Full-power mode* ma Output current Low-power mode* ma * Refer to the AT+WLDO command in document [1] AT Command Manual for AirPrime WS6318 for 2V8_LDO output modes WISMO_READY Indication This signal indicates the ready status of the WS6318 embedded module after powering ON. Once the WS6318 embedded module is properly powered ON, the WISMO_READY pin will set to HIGH level to acknowledge the successful powering ON of the WS6318 embedded module before it is ready to operate. On the other hand, the level will go LOW before powering OFF Pin Description Refer to the following table for the pin description of the WISMO_READY indication. Table 38. WISMO_READY Indication Pin Description Signal Pin Number I/O I/O Type Description WISMO_READY 64 O 2V8 WS6318 embedded module ready indication Rev 2.4 March 28,

57 Signals and Indicators Electrical Characteristics Refer to the following table for the electrical characteristics of the WISMO_READY indication. Table 39. Electrical Characteristics of the WISMO_READY Indication Parameter I/O Type Minimum Typical Maximum Unit V OH 2V V V OL 2V V 5.4. Reset The WS6318 embedded module performs two types of resets an internal reset (as part of the power ON sequence) and an emergency reset. Both are described in further detail in the following subsections. The ~RESET signal has a 100KΩ internal pull up resistor to VCC_2V Pin Description Refer to the following table for the pin description of the ~RESET signal. Table 40. Reset Pin Description Signal Pin Number I/O I/O Type Reset State Description ~RESET 11 I 2V8 100KΩ pull-up WS6318 embedded module reset Note: It is recommended to add a varistor (AVL5M02200) on the ~RESET pin in order to enhance ESD immunity Electrical Characteristics Refer to the following table for the electrical characteristics of the ~RESET signal. Table 41. Electrical Characteristics of the ~RESET Signal Parameter Minimum Typical Maximum Unit Input Impedance (R)* - 100K - Ω Input Impedance (C) - 10n F V H** V V IL V V IH V * Internal pull up resistance ** V H : Hysterisis Voltage Rev 2.4 March 28,

58 Signals and Indicators Internal Reset An internal reset is automatically performed during the Power ON sequence of the embedded module. This internal reset lasts for typically 38ms. During this phase, any external reset should be avoided. Refer to the following diagram for the internal reset timing sequence. Figure 37. Internal Reset Sequence Emergency Reset To perform an emergency reset, the ~RESET pin should be kept at low level for at least 500µs to guarantee that a proper reset takes place. This is a hardware reset and should only be used for emergency reset. To activate the emergency reset sequence, the ~RESET signal has to be set to LOW level manually, for example, by a push button. Refer to section Application for more information. Figure 38. Reset Sequence Application If the emergency reset is used, it has to be driven by an open collector or an open drain output (due to the internal pull-up resistor embedded into the WS6318 embedded module) as shown in the figures below. Figure 39. Example of ~RESET Pin Connection with a Push Button Configuration Rev 2.4 March 28,

59 Signals and Indicators Figure 40. Example of ~RESET Pin Connection with a Transistor Configuration An open collector or open drain transistor can be used to drive the ~RESET pin. If an open collector is chosen, the recommended digital transistor to use for T1 is DTC144EE from ROHM. Table 42. Reset Commands Reset Command ~RESET Operating Mode 1 0 Reset activated 0 1 Reset inactive 5.5. BAT-RTC (Backup Battery) The WS6318 embedded module provides an input/output to connect a Real Time Clock power supply. This pin is used as a back-up power supply for the internal Real Time Clock. The RTC is supported by the WS6318 embedded module when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off. If VBATT is available, the back-up battery can be charged by the internal 3.0V power supply regulator via a 2KΩ resistor implemented inside the WS6318 embedded module. If the RTC is not used, this pin can be left open Pin Description Refer to the following table for the pin description of BAT-RTC. Table 43. BAT-RTC Pin Description Signal Pin Number I/O I/O Type Description BAT-RTC 21 I/O Supply RTC Back-up supply Electrical Characteristics Refer to the following table for the electrical characteristics of BAT-RTC. Table 44. Electrical Characteristics of BAT-RTC Parameter Minimum Typical Maximum Unit Input voltage V Input current consumption* µa Output voltage V Rev 2.4 March 28,

60 Signals and Indicators Parameter Minimum Typical Maximum Unit Max charging current ma * Provided by an RTC back-up battery when the WS6318 embedded module is off and VBATT = 0V Application The back-up power supply can be provided by any of the following: A super capacitor A non rechargeable battery A rechargeable battery cell Super Capacitor Figure 41. RTC Supplied by a Gold Capacitor The estimated range with a 0.47Farad gold capacitor is 25 hours. Note: The gold capacitor maximum voltage is 3.9V Non-Rechargeable Battery Figure 42. RTC Supplied by a Non Rechargeable Battery Diode D1 is mandatory to prevent the non-rechargeable battery from being damaged. The estimated range with an 85mAh battery is 800 hours (minimum) Rev 2.4 March 28,

61 Signals and Indicators Rechargeable Battery Cell Figure 43. RTC Supplied by a Rechargeable Battery Cell The estimated range with a fully charged 3.4mAh rechargeable battery is at least 7 days. Caution: Before battery cell assembly, ensure that the cell voltage is lower than 3.0V to avoid damaging the WS6318 embedded module Pulse-Width Modulators (PWMs) The WS6318 embedded module contains two Pulse-Width Modulators (PWMs). They can be used in conjunction with an external transistor for driving a vibrator or a backlight LED. Each PWM uses two 7-bit unsigned binary numbers: one for the output period and one for the pulse width or the duty cycle. The relative timing for the PWM output is shown in the figure below. Figure 44. Relative Timing for the PWM Output Pin Description Refer to the following table for the pin description of the PWMs. Table 45. PWM Pin Description Signal Pin Number I/O I/O Type Description PWM0 14 O 2V8 PWM output PWM1 13 O 2V8 PWM output Rev 2.4 March 28,

62 Signals and Indicators Electrical Characteristics Refer to the following table for the electrical characteristics of the PWM. Table 46. Electrical Characteristics of the PWM Parameter Condition Minimum Typical Maximum Unit V OH High impedance load V Load with I oh = 4mA V V OL V I PEAK ma Frequency khz Duty cycle % Application Both the PWM0 and PWM1 signals can be used in conjunction with an external transistor for driving a vibrator, or a backlight LED. Figure 45. Example of a LED Driven by the PWM0 or PWM1 Output The value of R607 can be harmonized depending on the LED (D605) characteristics. The recommended digital transistor to use for T601 is the DTC144EE from ROHM BUZZER Output The BUZZER signal outputs a square wave at the desired tone frequency. The tone frequencies are programmable and can be re-programmed on-the-fly to generate monophonic audio ringtones or alert tones. The tone level can also be adjusted in 4dB steps, or it can be muted. The BUZZER signal can be used in conjunction with an external transistor/mosfet for driving a buzzer in order to give a maximum current of 100mA (PEAK) and an average of 40mA, depending on the application requirement Rev 2.4 March 28,

63 Signals and Indicators Figure 46. BUZZER Output Pin Description Refer to the following table for the pin description of the BUZZER signal. Table 47. BUZZER Pin Description Signal Pin Number I/O I/O Type Description BUZZER 12 O 2V8 Buzzer output Electrical Characteristics Refer to the following table for the electrical characteristics of the BUZZER signal. Table 48. Electrical Characteristics of the BUZZER Signal Parameter Condition Minimum Typical Maximum Unit V OH High impedance load V Load with I oh = 4mA V I PEAK ma V OL V Frequency ,000 Hz Duty cycle - 0* - 100* % Tone level 4 db step db * Be mindful of the maximum frequency and the minimum/maximum duty cycle. There is a limitation due to the RC environment. The amplitude modulation becomes less fine when the set limits are reached Application The maximum peak current of the transistor/mosfet is 100mA and the maximum average current is 40mA, while the peak current of the BUZZER pin should be less than 4mA. A diode against transient peak voltage must be added as shown below Rev 2.4 March 28,

64 Signals and Indicators Figure 47. Example of Buzzer Implementation Where: R1 must be chosen in order to limit the current at I PEAK max of 100mA and must be adjusted in function of the frequency and the duty cycle used. R2 = 0Ω R3 = 1MΩ D1 = BAV70T-7 or BAS16 (for example) T1 = FDN335N (for example) A low filter is recommended at low frequencies. Refer to the following for more information on how to calculate the low filter. Req is the total resistor in line C is the capacitive charge on T1 and the ground The cut-off frequency (Fc) must be higher than F BUZZ-OUT Due to the conception of this signal, the frequency modulation of the BUZZER signal is 64*F BUZZ-OUT Fc must be at least 64*F BUZZ-OUT Fc = 1/(2*Π*Req*C) The BUZZER output can also be used to drive an LED as shown in the figure below. Figure 48. Example of an LED Driven by the BUZZER Output Rev 2.4 March 28,

65 Signals and Indicators The value of R607 can be harmonized depending on the LED (D605) characteristics. The recommended digital transistor to use for T601 is the DTC144EE from ROHM Recommended Characteristics for the Buzzer Electro-magnetic type Impedance: 7 to 30Ω Sensitivity: 90 db SPL 10 cm Current: 60 to 90mA 5.8. TX_CTRL Signal for TX Burst Indication The TX_CTRL signal is a 2.8V signal for TX Burst indication. Refer to the following table for the status of the TX_CTRL signal depending on the embedded module state. Table 49. TX_CTRL Status WS6318 Embedded Module State During TX burst No TX TX_CTRL Status High Low During TX burst, there will be higher current drain from the VBATT power supply which causes a voltage drop. This voltage drop from VBATT is a good indication of a high current drain situation during TX burst. The blinking frequency is about 216Hz. The output logic high duration, T duration, depends on the number of TX slots and is computed as follows: T duration = T advance + (0.577ms x number of TX slots) + T delay. Figure 49. TX_CTRL State During TX Burst Rev 2.4 March 28,

66 Signals and Indicators Pin Description Refer to the following table for the pin description of the TX_CTRL signal for TX burst indication. Table 50. TX_CTRL Signal Pin Description Signal Pin Number I/O I/O Type Reset State Description TX_CTRL 60 O 2V8 TX burst indication Electrical Characteristics Refer to the following table for the electrical characteristics of the TX_CTRL signal for TX burst indication. Table 51. Electrical Characteristics of the TX_CTRL Signal for TX Burst Indication Parameter Condition Minimum Typical Maximum Unit V OH V V OL V T advance µs T delay µs Application The TX burst indication signal, TX_CTRL, can be used to drive a LED through a transistor. It will then be a good visual indicator for any TX activities. Figure 50. Example of TX Status Implementation The value of R607 can be harmonized depending on the LED (D605) characteristics Rev 2.4 March 28,

67 6. Power Consumption 6.1. Various Operating Modes There are various kinds of operating modes for the WS6318 embedded module as defined in the figure and table below. Figure 51. Table 52. WS6318 Operating Modes Flowchart WS6318 Embedded Module Operating Modes Mode Description OFF Mode Alarm Mode Active Idle Mode Sleep Idle Mode Airplane Mode Connected Mode When VBATT power is supplied to the WS6318 embedded module but has not yet been powered ON. When alarm clock is set for the WS6318 embedded module with ALL of the following conditions: before time is up with AT+CPOF having been entered from a computer that is connected to the WS6318 embedded module with the ON/~OFF signal being left open (remains at HIGH level) When the WS6318 embedded module is active and synchronized with the network, but currently has no communication. When the WS6318 embedded module has a location update with a live network but with no GSM/GPRS connection, while the UART interface is in sleep mode.* When the SIM device and GSM/GPRS features are NOT available and the embedded application is running while the UART remains active. The WS6318 embedded module has GSM voice codec connection with a live network Rev 2.4 March 28,

68 Power Consumption Mode Transfer Mode Description The WS6318 embedded module has GPRS data transfer connection with a live network. * There are two different methods to enter sleep mode through the AT command setting, AT+PSSLEEP, as described in the following sub-section Using AT+PSSLEEP to Enter Sleep Mode AT+PSSLEEP=0 The entry of sleep mode is controlled by the level of DTR signal and the firmware. When DTR (viewed from the embedded module side) is of LOW voltage level, the WS6318 embedded module will never enter sleep mode. When DTR (viewed from the embedded module side) is of HIGH voltage level, the WS6318 embedded module will enter sleep mode. To wake the WS6318 embedded module up, it is necessary to toggle the DTR (viewed from the embedded module side) from HIGH to LOW voltage level. This method should be applied if the application needs to forbid the entry of sleep mode. AT+PSSLEEP=1 For this method, the entry of sleep mode is controlled just by the firmware. When the WS6318 embedded module has had no activities for a certain period of time, it will enter sleep mode automatically, regardless of the DTR level. Any ASCII character on the UART can wake the WS6318 embedded module up. Note that due to the wake-up mechanism of the WS6318 embedded module, it is recommended to have at least 10ms latency time after the wake-up character before sending AT commands to the embedded module. For details of the AT+PSSLEEP command, please refer to document [1] AT Command Manual for AirPrime WS6318. Note that the power consumption level will vary depending on the operating mode used Power Consumption The power consumption level will vary depending on the operating mode, and it is for this reason that the following consumption values are given for each mode and RF band. Three VBATT values are used to measure the power consumption: VBATTmin (3.2V), VBATTmax (4.8V) and VBATTtyp (3.6V). The average current is given for the three VBATT values and the peak current given is the maximum current peak measured with the three VBATT voltages. The following consumption values were obtained by performing measurements on WS6318 embedded module samples at a temperature of 25 C and assumes a 50Ω RF output. TX means that the current peak is the RF transmission burst (Tx burst). RX means that the current peak is the RF reception burst (Rx burst), in GSM mode only (worst case) Rev 2.4 March 28,

69 Power Consumption Table 53. WS6318 Embedded Module Power Consumption (Typical Values) Operating Mode Parameters I average I peak Unit VBATT=4.8V VBATT=3.6V VBATT=3.2V Off Mode 46 N/A µa Alarm Mode 46 N/A µa Active Idle Mode Sleep Idle Mode* Paging 9 (Rx burst occurrence ~2s) Paging 2 (Rx burst occurrence ~0,5s) Paging 9 (Rx burst occurrence ~2s) Paging 2 (Rx burst occurrence ~0,5s) ma ma ma ma Airplane Mode ma Connected Mode Transfer Mode class 8 (4Rx/1Tx) Transfer Mode class 10 (3Rx/2Tx) 900 MHz 1800 MHz 900 MHz 1800 MHz 900 MHz 1800 MHz PCL5 (TX power 33dBm) PCL19 (TX power 6dBm) PCL0 (TX power 33dBm) PCL19 (TX power 6dBm) PCL3 (TX power 33dBm) PCL17 (TX power 5dBm) PCL3 (TX power 30dBm) PCL18 (TX power 0dBm) PCL3 (TX power 33dBm) PCL17 (TX power 5dBm) PCL3 (TX power 30dBm) PCL18 (TX power 0dBm) TX ma TX ma TX ma TX ma TX ma TX ma TX ma TX ma TX ma TX ma TX ma TX ma * Sleep Idle Mode consumption depends on the SIM card used. Some SIM cards respond faster than others, in which case the longer the response time is, the higher the consumption is. Sleep Idle Mode consumption will be higher if the ON/~OFF pin is kept at low voltage level. Refer to Figure 33 Power-ON Sequence (no PIN code activated) for more information Rev 2.4 March 28,

70 Power Consumption 6.3. Recommendations for Less Consumption For better power consumption, particularly for the quiescent current, it is recommended to drive the GPIOs and the WISMO_READY signal as shown in the table below. Table 54. Consumption/Software Driver Recommendations Signal Pin Number I/O I/O Type Reset State SW Driver Recommendation GPIO1 66 I/O 2V8 Input pull down Input Pull Down GPIO2 65 I/O 2V8 Input pull up Input Pull Up GPI4 43 I 2V8 Input pull down Input Pull Down GPIO5 42 I/O 2V8 Input pull down Input Pull Down GPIO6 41 I/O 2V8 Input pull up Input Pull Up GPIO7 40 I/O 2V8 Input pull down Input Pull Down GPIO8 39 I/O 2V8 Input pull up Input Pull Up GPIO9 38 I/O 2V8 Input pull down Input Pull Down GPIO10 37 I/O 2V8 Input pull down Input Pull Down GPIO11 10 I/O 2V8 Input pull down Input Pull Down GPIO12 1 I/O 2V8 Input pull down Input Pull Down WISMO_READY 64 O 2V8 Input pull down Input Pull Down Note: To ensure low consumption, PMU_LDO should be OFF when not used Rev 2.4 March 28,

71 7. Design Guidelines This section provides general design guidelines for the WS6318 embedded module EMC Recommendations EMC tests have to be performed as soon as possible on the application to detect any possible problems. When designing a GSM terminal, make sure to take note of the following items: Possible spurious emissions radiated by the application to the RF receiver in the receiver band. ESD protection is mandatory for all peripherals accessible from outside (SIM, serial link, audio, ADCs, etc.). EMC protection on audio input/output (filters against 900MHz emissions). Biasing of the microphone inputs. Length of the SIM interface lines (preferably <10cm). Ground plane it is recommended to have a common ground plane for analog/digital/rf grounds. It is recommended to use a metallic case or plastic casing with conductive paint. Note: The WS6318 embedded module does not include any protection against overvoltage Power Supply The power supply is one of the key issues in the design of a GSM terminal. A weak power supply design could, in particular, affect: EMC performances The emissions spectrum Phase error and frequency error When designing the power supply, careful attention should be paid to the following: Quality of the power supply low ripple, PFM or PSM systems should be avoided; a PWM converter is preferred. Capacity to deliver high current peaks in a short time (pulsed radio emission) Rev 2.4 March 28,

72 Design Guidelines 7.3. PCB Specification for Application Board In order to save costs for simple applications, a cheap PCB structure can be used for the application board of the WS6318 embedded module. A 4-layer through-hole type PCB structure can be used. Figure 52. PCB Structure Example for the Application Board Due to the limited layers of 4-layer PCBs, sensitive signals like audio, SIM and clocks cannot be protected by 2 adjacent ground layers. As a result, during PCB layout, care must be taken for these sensitive signals by avoiding coupling to noisy baseband through adjacent layers Rev 2.4 March 28,

73 8. Certification Compliance and Recommended Standards 8.1. Certification Compliance The AirPrime WS6318 Embedded Module connected on a development kit board application is compliant with the following requirements. Table 55. Standards Conformity for the WS6318 Embedded Module Domain Applicable Standard Safety standard EN : A11:2009 Health standard (EMF Exposure Evaluation) EN (ed. 2008) Efficient use of the radio frequency spectrum EN (V 9.0.2) EMC EN (v1.8.1) EN (v1.3.1) 8.2. Applicable Standards Listing The table hereafter gives the basic list of standards applicable for the AirPrime WS6318 Embedded Module (2G (R99/Rel. 4)). Note: Table 56. References to any features can be found from these standards. Applicable Standards and Requirements for the WS6318 Embedded Module Document Current Version Title NAPRD.03 N/A Overview of PCS Type certification review board (PTCRB) Mobile Equipment Type Certification and IMEI control GCF-CC GCF Conformance Certification Criteria TS rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 1: Conformance specification TS rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) proforma specification TS rd Generation Partnership Project; Technical Specification Group GSM/EDGE Radio Access Network; Digital cellular telecommunications system (Phase 2+); Mobile Station (MS) conformance specification; Part 4: SIM Application Toolkit Conformance specification ETSI N/A Smart cards; UICC-Terminal interface; Physical, electrical and logical test specification(release 99) Rev 2.4 March 28,

74 9. Reliability Compliance and Recommended Standards 9.1. Reliability Compliance The AirPrime WS6318 embedded module connected on a development kit board application is compliant with the following requirements. Table 57. Standards Conformity for the AirPrime WS6318 Embedded Module Abbreviation IEC ISO Definition International Electro technical Commission International Organization for Standardization 9.2. Applicable Standards The table hereafter gives the basic list of standards applicable to the WS6318 Embedded Module. Note: Table 58. References to any features can be found from these standards. Applicable Standards and Requirements Document Current Version Title IEC Environmental testing - Part 2.6: Test FC: Sinusoidal Vibration. IEC Basic environmental testing procedures part 2: Test FD: random vibration wide band - general requirements Cancelled and replaced by IEC For reference only. IEC Environmental testing - part 2-64: Test FH: vibration, broadband random and guidance. IEC Basic environmental testing procedures - part 2: Test ED: (procedure 1) (withdrawn & replaced by IEC ). IEC Environmental testing part 2-31: Test EC: rough handling shocks, primarily for equipment-type specimens. IEC Basic environmental testing procedures - part 2: Test EB and guidance: bump Withdrawn and replaced by IEC For reference only. IEC Environmental testing - part 2-27: Test EA and guidance: shock. IEC Environmental testing - part 2-14: Test N: change of temperature. IEC Environmental testing - part 2-2: Test B: dry heat. IEC Environmental testing - part 2-1: Test A: cold. IEC Environmental testing - part 2-30: Test DB: damp heat, cyclic (12 h + 12 h cycle). IEC w/a1 Basic environmental testing procedures part 2: Test CA: damp heat, steady State Withdrawn and replaced by IEC For reference only. IEC Environmental testing part 2-78: Test CAB: damp heat, steady state Rev 2.4 March 28,

75 Reliability Compliance and Recommended Standards Document Current Version Title IEC Environmental testing - part 2-38: Test Z/AD: composite temperature/humidity cyclic test. IEC w/a1 Basic environmental testing procedures - part 2: Test Z/AM combined cold/low air pressure tests. ISO ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 1: general. ISO ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 2: electrical loads. ISO ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 3: mechanical loads. ISO ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 4: climatic loads. IEC w/cor2 Degrees of protection provided by enclosures (IP code). IEC Basic environmental testing procedures - part 2: Test Q: sealing. IEC Environmental testing - part 2-18: Tests - R and guidance: water. IEC Environmental testing - part 2: tests - test XB: abrasion of markings and letterings caused by rubbing of fingers and hands. IEC Environmental testing - part 2: tests - test l: dust and sand. IEC Basic environmental testing procedures, part 2: test KA: salt mist. IEC Environmental testing - part 2: Test KE: flowing mixed gas corrosion test. IEC w/cor Environmental testing - part 2: Test KB: salt mist, cyclic (sodium chloride solution) Environmental Specifications The WS6318 embedded module is compliant with the operating classes listed in the table below. The temperature range of the environment for each operating class is also specified. Table 59. Operating Class Temperature Range Conditions Operating/Class A Operating/Class B Storage Temperature Range -30 C to +70 C -40 C to +85 C -40 C to +85 C Function Status Classification The classes reported below comply with the Annex ISO Failure Mode Severity Classification, ISO Standard 7637, and Section 1. Note: The word function as used here concerns only the function performed by the WS6318 Embedded Module Rev 2.4 March 28,

76 Reliability Compliance and Recommended Standards Table 60. ISO Failure Mode Severity Classification Class Class A Class B Description The WS6318 Embedded Module remains fully functional during and after environmental exposure; and shall meet the minimum requirements of 3GPP or appropriate wireless standards. The WS6318 Embedded Module remains fully functional during and after environmental exposure; and shall exhibit the ability to establish a voice, SMS or DATA call at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed Reliability Prediction Model Life Stress Test The following tests the WS6318 s product performance. Table 61. Life Stress Test Designation Performance Test PT3T & PT Condition Standard: N/A Special conditions: Temperature: Class A: -30 C to +70 C Class B: -40 C to +85 C Rate of temperature change: ± 3 C/min Recovery time: 3 hours Operating conditions: Powered Duration: 14 days Environmental Resistance Stress Tests The following tests the WS6318 s resistance to extreme temperature. Table 62. Environmental Resistance Stress Tests Designation Cold Test Active COTA Condition Standard: IEC , Test Ad Special conditions: Temperature: -30 C Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: Powered Duration: 72 hours Rev 2.4 March 28,

77 Reliability Compliance and Recommended Standards Designation Cold Test Active COTP Resistance to Heat Test RH Dry Heat Test DHT Condition Standard: IEC , Test Ab Special conditions: Temperature: -40 C Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: Un-powered Duration: 72 hours Standard: IEC , Test Bb Special conditions: Temperature: +85 C Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: The DUT is switched ON for 1 min and then OFF for 1 min Duration: 50 days Standard: IEC , Test Bb Special conditions: Temperature: +85 C Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: Un-powered Duration: 72 hours Corrosive Resistance Stress Tests The following tests the WS6318 s resistance to corrosive atmosphere. Table 63. Corrosive Resistance Stress Tests Designation Humidity Test HT Condition Standard: IEC Special conditions: Temperature: +65 C RH: 95% Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: The DUT is switched ON for 15 minutes and then OFF for 15 minutes Duration: 10 days Rev 2.4 March 28,

78 Reliability Compliance and Recommended Standards Designation Component Solder Wettability CSW Condition Standard: JESD22 B102, Method 1 Special conditions: Test method: Dip and Look Test with Steam preconditioning Test Time: 8 h+/-15min. dip for 5 +0/-0.5 seconds Operating conditions: Un-powered Duration: 5 days Moist Heat Cyclic Test MHCT Standard: IEC , Test Db Special conditions: Upper temperature: +40 ± 2 C Lower temperature: +25 ± 2 C RH: Upper temperature: 93% Lower temperature: 95% Number of cycles: 21 (1 cycle/24 hours) Rate of temperature change: dt/dt >= ± 3 C/min Recovery time: 3 hours Operating conditions: Un-powered Duration: 21 days Thermal Resistance Cycle Stress Tests The following tests the WS6318 s resistance to extreme temperature cycling. Table 64. Thermal Resistance Cycle Stress Tests Designation Condition Standard: IEC , Test Na Thermal Shock Test TSKT Special conditions: Upper temperature: +90 C Lower temperature: -40 C Rate of temperature change: 30s Number of cycles: 300 Duration of exposure: 20 minutes Recovery time: 3 hours Operating conditions: Un-powered Duration: 8 days Rev 2.4 March 28,

79 Reliability Compliance and Recommended Standards Designation Condition Standard: IEC , Test Nb Temperature Change TCH Special conditions: Upper temperature: +90 C Lower temperature: -40 C Rate of temperature change: dt/dt >= ± 3 C/min Number of cycles: 400 Duration of exposure: 10 minutes Recovery time: 3 hours Operating conditions: Un-powered Duration: 30 days Mechanical Resistance Stress Tests The following tests the WS6318 s resistance to vibrations and mechanical shocks. Table 65. Mechanical Resistance Stress Tests Designation Condition Standard: IEC , Test Fc Sinusoidal Vibration Test SVT Special conditions: Frequency range: 16Hz to 1000Hz Displacement: 0.35mm (peak) Frequency range: 16Hz to 62Hz Acceleration: 5G Frequency range: 62Hz to 200Hz Acceleration: 3G Frequency range: 200Hz to 1000Hz Acceleration: 1G Sweep rate: 1 octave/min Test duration: 20 sweeps/axis (2.3h) Sweep directions: X, Y and Z Operating conditions: Un-powered Duration: 72 hours Rev 2.4 March 28,

80 Reliability Compliance and Recommended Standards Designation Condition Standard: IEC Random Vibration Test RVT Special conditions: Density spectrum: 0.96m2/s3 Frequency range: 0.1 g2/hz at 10Hz 0.01 g2/hz at 250Hz g2/hz at 1000Hz g2/hz at 2000Hz Slope: -3dB/octave Acceleration: 0.9gRMS Number of axis: 3 Operating conditions: Un-powered Mechanical Shock Test MST Duration: 24 hours Standard: IEC , Test Ea Special conditions: Shock Test 1: Wave form: Half sine Peak acceleration: 30G Duration: 11ms Number of shocks: 8 per direction Number of directions: 6 (±X, ±Y, ±Z) Shock Test 2: Wave form: Half sine Peak acceleration: 100G Duration: 6ms Number of shocks: 3 per direction Number of directions: 6 (±X, ±Y, ±Z) Operating conditions: Un-powered Duration: 72 hours Handling Resistance Stress Tests The following tests the WS6318 s resistance to handling malfunctions and damage. Table 66. Handling Resistance Stress Tests Designation ESDC Test Condition Standard: JESD22-A114, JESD22-A115, JEDEC JESD 22 C101C Special conditions: HBM (Human Body Model) : 2KV (Class 2) MM (Machine Model) : 200V (Class B) CDM (Charged Device Model) : 500V (Class III) Operating conditions: Powered Duration: 24 hours Rev 2.4 March 28,

81 Reliability Compliance and Recommended Standards Designation Condition ESD Test Standard: IEC Special conditions: Contact and Air discharges: 10 positive and 10 negative applied Contact Voltage: ±2kV, ±4kV, ±6kV Air Voltage : ±2kV, ±4kV, ±8kV Free Fall Test FFT 1 Free Fall Test FFT 2 Abrasion of Marking and Letterings Test Operating conditions: Powered Duration: 24 hours Standard : IEC , Test Ed Special conditions: Drop: 2 samples for each direction Equivalent drop height: 1m Number of directions: 6 (±X, ±Y, ±Z) Number of drops/face: 2 Operating conditions: Un-powered Duration: 24 hours Standard : Standard Sierra Wireless Methodology Special conditions: Drop: 2 samples for each direction Equivalent drop height: 1.5m Number of directions: 6 (±X, ±Y, ±Z) Number of drops/face: 2 DUT in end-user host device Operating conditions: Un-powered Duration: 24 hours Standard : IEC Special conditions: Load Piston : Silicone, hardness 47±5 Shore A, Ø 20mm, bending diameter 20 mm Test Load : 1N Friction Path : 20mm Strokes : 240 Operating conditions: Un-powered Duration: 24 hours Rev 2.4 March 28,

82 10. Peripheral Devices References This section contains the list of recommended manufacturers or suppliers for the peripheral devices for use with the AirPrime WS6318 embedded module SIM Card Reader ITT CANNON CCM03 series (see AMPHENOL C707 series (see JAE (see Drawer type: MOLEX (see Connector: MOLEX Holder: MOLEX Microphone Microphones can be obtained from the following recommended suppliers: HOSIDEN PANASONIC PEIKER Speaker Speakers can be obtained from the following recommended suppliers: SANYO HOSIDEN PRIMO PHILIPS Antenna Cable Listed below are the recommended antenna cables to mount on the WS6318 embedded module: RG178 RG Rev 2.4 March 28,

83 11. References Reference Documents For more details, several reference documents can be consulted. The Sierra Wireless documents referenced herein are provided in the Sierra Wireless documentation package; however, the general reference documents which are not Sierra Wireless owned are not provided in the documentation package Sierra Wireless Reference Documentation [1] AT Command Manual for AirPrime WS6318 Document number: [2] Customer Process Guideline for AirPrime WS Series Document number: List of Abbreviations Abbreviation AC ADC A/D AF AGC AT AUX CAN CB CBS CEP CLK CMOS CODEC CPU CS CSD CTS DAC DAI db DC DCD Definition Alternative Current Analog to Digital Converter Analog to Digital conversion Audio-Frequency Automatic Gain Control Attention (prefix for modem commands) Auxiliary Controller Area Network Cell Broadcast Cell Broadcast Service Circular Error Probable Clock Complementary Metal Oxide Semiconductor Coder Decoder Central Processing Unit Coding Scheme Circuit Switched Data Clear To Send Digital to Analog Converter Digital Audio Interface Decibel Direct Current Data Carrier Detect Rev 2.4 March 28,

84 References Abbreviation DCE DCS DR DSR DTE DTR EFR E-GSM EMC EMI EMS EN ESD ETSI FIFO FR FTA GND GPI GPC GPIO GPO GPRS GPS GPSI GSM HR Hi Z IC IDE IF IMEI I/O LCD LED LNA LSB MAX MIC MIN MMS MO MS Definition Data Communication Equipment Digital Cellular System Dynamic Range Data Set Ready Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Extended GSM Electromagnetic Compatibility Electromagnetic Interference Enhanced Message Service Enable Electrostatic Discharges European Telecommunications Standards Institute First In First Out Full Rate Full Type Approval Ground General Purpose Input General Purpose Connector General Purpose Input Output General Purpose Output General Packet Radio Service Global Positioning System General Purpose Serial Interface Global System for Mobile communications Half Rate High impedance (Z) Integrated Circuit Integrated Development Environment Intermediate Frequency International Mobile Equipment Identification Input / Output Liquid Crystal Display Light Emitting Diode Low Noise Amplifier Less Significant Bit Maximum Microphone Minimum Multimedia Message Service Mobile Originated Mobile Station Rev 2.4 March 28,

85 References Abbreviation MT na NF NMEA NOM NTC PA Pa PBCCH PC PCB PCL PCM PDA PFM PLL PSM PWM RAM RF RFI RHCP RI RMS RST RTC RTCM RTS RX SCL SDA SIM SMD SMS SPI SPL SPK SW PSRAM TBC TDMA TP TU Definition Mobile Terminated Not Applicable Noise Factor National Marine Electronics Association Nominal Negative Temperature Coefficient Power Amplifier Pascal (for speaker sound pressure measurements) Packet Broadcast Control Channel Personal Computer Printed Circuit Board Power Control Level Pulse Code Modulation Personal Digital Assistant Power Frequency Modulation Phase Lock Loop Phase Shift Modulation Pulse Width Modulation Random Access Memory Radio Frequency Radio Frequency Interference Right Hand Circular Polarization Ring Indicator Root Mean Square Reset Real Time Clock Radio Technical Commission for Maritime services Request To Send Receive Serial Clock Serial Data Subscriber Identification Module Surface Mounted Device/Design Short Message Service Serial Peripheral Interface Sound Pressure Level Speaker Software Pseudo Static RAM To Be Confirmed Time Division Multiple Access Test Point Typical Urban fading profile Rev 2.4 March 28,

86 References Abbreviation TUHigh TVS TX TYP UART USB USSD VSWR WAP Definition Typical Urban, High speed fading profile Transient Voltage Suppressor Transmit Typical Universal Asynchronous Receiver-Transmitter Universal Serial Bus Unstructured Supplementary Services Data Voltage Standing Wave Ratio Wireless Application Protocol Rev 2.4 March 28,

87 12. Safety Recommendations (for Information Only) For the efficient and safe operation of your GSM application based on the AirPrime WS6318, please read the following information carefully RF Safety General Your GSM terminal is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used telecommunication standard. Your GSM terminal is actually a low power radio transmitter and receiver. It sends out and receives radio frequency energy. When you use your GSM application, the cellular system which handles your calls controls both the radio frequency and the power level of your cellular modem Exposure to RF Energy There has been some public concern about possible health effects from using GSM terminals. Although research on health effects from RF energy has focused on the current RF technology for many years, scientists have begun research regarding newer radio technologies, such as GSM. After existing research had been reviewed, and after compliance to all applicable safety standards had been tested, it has been concluded that the product was fit for use. If you are concerned about exposure to RF energy there are things you can do to minimize exposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can reduce RF exposure by operating your cellular terminal efficiently by following the guidelines below Efficient Terminal Operation For your GSM terminal to operate at the lowest power level, consistent with satisfactory call quality: If your terminal has an extendible antenna, extend it fully. Some models allow you to place a call with the antenna retracted. However, your GSM terminal operates more efficiently with the antenna fully extended. Do not hold the antenna when the terminal is «IN USE». Holding the antenna affects call quality and may cause the modem to operate at a higher power level than needed Rev 2.4 March 28,

88 Safety Recommendations (for Information Only) Antenna Care and Replacement Do not use the GSM terminal with a damaged antenna. If a damaged antenna comes into contact with the skin, a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician. Use only the supplied or approved antenna. Unauthorized antennas, modifications or attachments could damage the terminal and may contravene local RF emission regulations or invalidate type approval General Safety Driving Check the laws and the regulations regarding the use of cellular devices in the area where you have to drive as you always have to comply with them. When using your GSM terminal while driving, please: give full attention to driving, pull off the road and park before making or answering a call if driving conditions so require Electronic Devices Most electronic equipment, for example in hospitals and motor vehicles, is shielded from RF energy. However, RF energy may affect some improperly shielded electronic equipment Vehicle Electronic Equipment Check your vehicle manufacturer representative to determine if any on-board electronic equipment is adequately shielded from RF energy Medical Electronic Equipment Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to determine if they are adequately shielded from external RF energy. Turn your terminal OFF in health care facilities when any regulations posted in the area instruct you to do so. Hospitals or health care facilities may be using RF monitoring equipment Rev 2.4 March 28,

89 Safety Recommendations (for Information Only) Aircraft Turn your terminal OFF before boarding any aircraft. Use it on the ground only with crew permission. Do not use it in the air. To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you to have permission from a crew member to use your terminal while the aircraft is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your modem while airborne Children Do not allow children to play with your GSM terminal. It is not a toy. Children could hurt themselves or others (by poking themselves or others in the eye with the antenna, for example). Children could damage the modem, or make calls that increase your modem bills Blasting Areas To avoid interfering with blasting operations, turn your unit OFF when in a «blasting area» or in areas posted: «turn off two-way radio». Construction crews often use remote control RF devices to set off explosives. Note: This is not applicable for final products that are ATEX compliant. For final products that are ATEX compliant, the condition of use depends on specific ATEX requirements instead Potentially Explosive Atmospheres Turn your terminal OFF when in any area with a potentially explosive atmosphere. It is rare, but your application or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodily injuries or even death. Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fuelling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storage facilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders. Do not transport or store flammable gas, liquid, or explosives in the compartment of your vehicle which contains your terminal or accessories. Before using your terminal in a vehicle powered by liquefied petroleum gas (such as propane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the vehicle is to be used. Note: This is not applicable for final products that are ATEX compliant. For final products that are ATEX compliant, the condition of use depends on specific ATEX requirements instead Rev 2.4 March 28,

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