BEST PRACTICES RESEARCH

Transcription

1 2012 Frost & Sullivan 1 We Accelerate Growth

2 Customer Value Enhancement Award 3D Packaging and 3D IC for Mobile Computing North America, 2013 Frost & Sullivan s Global Research Platform Frost & Sullivan is in its 50th year in business with a global research organization of 1,800 analysts and consultants who monitor more than 300 industries and 250,000 companies. The company s research philosophy originates with the CEO s 360-Degree Perspective, which serves as the foundation of its TEAM Research methodology. This unique approach enables us to determine how best-in-class companies worldwide manage growth, innovation and leadership. Based on the findings of this Best Practices research, Frost & Sullivan is proud to present the 2013 North American Customer Value Enhancement Award in 3D Packaging and 3D IC Market for Mobile Computing to Invensas. Significance of the Customer Value Enhancement Award Key Industry Challenges Addressed by Enhancing Customer Value The mobile market constantly needs more bandwidth for the smartphone mania. With the Gen Y generation wanting to run almost all aspects of their lives through smartphones and apps, the demand for speed and bandwidth is increasing. Another cause for concern is power consumption as processing so many apps on a phone drains its battery and reduces its life. Mobile computing requires a lower-cost solution that addresses the bandwidth and the power consumption issues. Through Silicon Via (TSV) is a solution that addresses these issues, but manufacturing it raises many other issues, mainly cost. TSV fabrication has more new steps that have not been proven by the industry or standardized, and hence the devices are prone to errors and are less reliability. TSV is therefore expensive and cannot be mass produced. At present, mobile and smartphone manufacturers do not have a ready-touse solution that addresses the bandwidth and power issues. Impact of Customer Value Enhancement Award on Key Stakeholders The Customer Value Enhancement Award is a prestigious recognition of Invensas s accomplishments in the 3D Packaging and 3D IC Market. An unbiased, third-party recognition can provide a profound impact in enhancing the brand value and accelerating Invensas s growth. As captured in Chart 1 below, by researching, ranking, and recognizing those who deliver excellence and best practices in their respective endeavors, Frost & Sullivan hopes to inspire, influence, and impact three specific constituencies: Investors Investors and shareholders always welcome unbiased and impartial third-party recognition. Similarly, prospective investors and shareholders are drawn to 2012 Frost & Sullivan 2 We Accelerate Growth

3 companies with a well-established reputation for excellence. Unbiased validation is the best and most credible way to showcase an organization worthy of investment. Customers Third-party industry recognition has been proven to be the most effective way to assure customers that they are partnering with an organization that is leading in its field. Employees This Award represents the creativity and dedication of Invensas s executive team and employees. Such public recognition can boost morale and inspire your team to continue its best-in-class pursuit of a strong competitive position for Invensas. Chart 1: Best Practices Leverage for Growth Acceleration Best Practice Award Analysis for Invensas The Frost & Sullivan Award for Customer Value Enhancement is presented each year to the company that has demonstrated excellence in implementing strategies that proactively create value for its customers with a focus on improving the return on the investment that customers make in its services or products. This award recognizes the company's inordinate focus on enhancing the value that its customers receive, beyond simply good customer service, leading to improved customer retention and ultimately customer base expansion Frost & Sullivan 3 We Accelerate Growth

4 Invensas s Performance in 3D Packaging and 3D IC market for Mobile computing Key Performance Drivers for Invensas Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., is a leading provider of semiconductor technology solutions. Invensas has designed the new Bond Via Array technology for Package on Package (BVA PoP) solution for the mobile computing market. This technology is expected to be a good alternative to TSV by offering ultra-high input/output (I/O) through the wide I/O options of TSVs, while utilizing the existing infrastructure and business models of traditional PoPs. Invensas s BVA technology enables high-performance consumer electronics to overcome the processing demands of the nextgeneration designs without altering the existing packaging infrastructure. This makes BVA PoP an ideal low-cost and highly adoptable solution for mobile device manufacturers. The distinct features of BVA PoP technology are listed below. Factor 1: Delivers high-performance, low-power mobile computing solutions The BVA PoP is a novel technology that provides an ultra-high I/O interface between memory and logic layers. The memory package on the top is conventional single- or multichip, chip-scale packaging (CSP) incorporating a multi-channel I/O by using multiple memory chips with wire-bond or flip-chip interconnections within the package. The multicore logic layer on the bottom is a conventional flip-chip packaging of the logic layer on a high-density substrate. A wire-bond contact that interfaces with the upper and lower package sections is encased and reinforced within the mold compound that encapsulates the lower package s semiconductor. The wire contact extends from the top surface of the lower substrate to align with matching contact locations on the bottom surface of the upper package. This reduced contact pitch was made possible to easily accommodate a much higher number of interconnections in the PoP perimeter stacking arrangement. The BVA PoP uses copper wire-bond to connect the top and bottom layers to enables a much higher I/O capability. This is very important for the bandwidth-hungry mobile computing applications. Since the memory and logic layers are separate, the logic layer is free to handle all the processing and none of the memory operation, which significantly reduces the processing overhead and the power consumption. Factor 2: Offers many benefits to original equipment manufacturers, integrated device manufacturers, and system assemblers Invensas s BVA PoP offers many benefits to the different stake holders involved in the supply chain. It is a non-tsv solution that offers a high bandwidth between logic and memory devices. The memory and logic layers are developed through conventional methods and are individually sourced, packaged, and tested for high yield and supply chain flexibility. The memory layer is compatible with any memory, including LPDDR2 and LPDDR3, and it is scalable for future wide I/O as well. Unlike TSV, the BVA processing does not require any 2012 Frost & Sullivan 4 We Accelerate Growth

5 new steps, increases reliability and lowers cost. The logic and memory layers are interconnected using an industry-proven, wire-bond method with the interconnecting wires molded for minimal warping. The printed circuit board design is simple and keeps the high- I/O memory-logic routing off the main board and within the PoP. The conventional board assembly method is employed by placing the logic package on the main board and placing a memory package on top of the logic package for a single reflow pass for full-board assembly. Factor 3: Utilizes the existing infrastructure and business models of the traditional PoP One of the major advantages of the Invensas BVA PoP is that it does not require additional infrastructure or modification to the existing supply chain unlike the TSV. It does not include any additional steps for manufacturing because it utilizes the existing infrastructure and the industry-proven standard methods. It is an extremely reliable technology and has a faster time to market than the TSV. Mobile manufacturers now have a readily available answer to their bandwidth problems. This may even delay the adoption of TSV in the market for a few years. Conclusion Invensas has been awarded the Frost & Sullivan Customer Value Enhancement Award for 2012 in the 3D Packaging and 3D IC Market for Mobile Computing. Invensas s BVA technology provides mobile and smartphone manufacturers with a cost-effective, reliable, and ready-to-use solution that addresses their bandwidth and power consumption needs. The CEO 360-Degree Perspective TM - Visionary Platform for Growth Strategies The CEO 360-Degree Perspective model provides a clear illustration of the complex business universe in which CEOs and their management teams live today. It represents the foundation of Frost & Sullivan's global research organization and provides the basis on which companies can gain a visionary and strategic understanding of the market. The CEO 360-Degree Perspective is also a must-have requirement for the identification and analysis of best-practice performance by industry leaders. The CEO 360-Degree Perspective model enables our clients to gain a comprehensive, action-oriented understanding of market evolution and its implications for their companies growth strategies. As illustrated in Chart 5 below, the following six-step process outlines how our researchers and consultants embed the CEO 360-Degree Perspective into their analyses and recommendations Frost & Sullivan 5 We Accelerate Growth

6 Chart 2: The CEO's 360-Degree Perspective Model Critical Importance of TEAM Research Frost & Sullivan s TEAM Research methodology represents the analytical rigor of our research process. It offers a 360-degree view of industry challenges, trends, and issues by integrating all seven of Frost & Sullivan's research methodologies. Our experience has shown over the years that companies too often make important growth decisions based on a narrow understanding of their environment, leading to errors of both omission and 2012 Frost & Sullivan 6 We Accelerate Growth

7 commission. Frost & Sullivan contends that successful growth strategies are founded on a thorough understanding of market, technical, economic, financial, customer, best practices, and demographic analyses. In that vein, the letters T, E, A and M reflect our core technical, economic, applied (financial and best practices) and market analyses. The integration of these research disciplines into the TEAM Research methodology provides an evaluation platform for benchmarking industry players and for creating high-potential growth strategies for our clients. Chart 3: Benchmarking Performance with TEAM Research About Frost & Sullivan Frost & Sullivan, the Growth Partnership Company, enables clients to accelerate growth and achieve best-in-class positions in growth, innovation and leadership. The company's Growth Partnership Service provides the CEO and the CEO's Growth Team with disciplined research and best-practice models to drive the generation, evaluation and implementation of powerful growth strategies. Frost & Sullivan leverages 50 years of experience in partnering with Global 1000 companies, emerging businesses and the investment community from more than 40 offices on six continents. To join our Growth Partnership, please visit Frost & Sullivan 7 We Accelerate Growth