Siemens DECT Engine MD32

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1 Siemens Technical Description Preliminary Technical Description 4-1 Issue:

2 Table of Contents 1 Introduction History References Terms and abbreviations List of Contents Evaluation Kit Overview Getting started Demonstration Examples MD Block Diagram Description Software Electrical Characteristics Pinning of connectors Circuit Diagram List of Figures Fig. 4-1 Basic Configuration Fig. 4-2 / Connector Overview Fig. 4-3 GAP-PP Demonstration Fig. 4-4 V.24-Replacement Demonstration Fig. 4-5 V.24-Server Demonstration Fig. 4-6 Block Diagram Fig. 4-7 Pinning Testconnector Fig. 4-8 Circuit Diagram page Fig. 4-9 Circuit Diagram page Fig Circuit Diagram page Fig Floor Plan Preliminary Technical Description 4-2 Issue:

3 1 Introduction This Chapter describes the components of the evaluation kit and how to use the kit. 1.1 History Issue Changes first issue new pinning for X4 (Fig. 4-7) 1.2 References /1/ Chapter 2 HW Interface Description /2/ Chapter 6 SW Installation Guide 1.3 Terms and abbreviations DCE Data Circuit-Terminating Equipment DECT Digital Enhanced Cordless Telecommunications ETS European Telecommunication Standard FFC Flexible Flat Cable FP Fixed Part GAP Generic Access Profile GFSK Gaussian Frequency Shift Keying HW Hardware LU10 DECT Data Transmission Protocol PP Portable Part SW Software TBR Technical Based Regulation UART Universal Asynchronous Receiver and Transmitter V.24 ITU version of RS232 2 List of Contents Evaluation Kit 3 power supplies/ AC-adapter 1 handsets 1 handset cord 3 s 3 RS232-cable Preliminary Technical Description 4-3 Issue:

4 3 Overview The Evaluation Kit supports the easy testing of applications with the MD32. Three Demo- Boxes allow You to build up a DECT-System and are used for functional tests of an application. 4 Getting started First step: connect the RS232 cable to the (X2) and a free serial interface at the. Connect the power supply (X1) and the handset (if used, X3) to plug together the Basic Configuration. Second step: install the configuration-sw (see SW Installation Guide /2/) RS 232 cable Handset Handset cord Basic Configuration X2 X1 X3 AC-Adaptor Fig. 4-1 Basic Configuration At last use the configuration SW to chose the operation mode and for subscription. The is ready for use now. The following figure shows the arrangement and pinning of Interface connectors on the : FFC-Jumper Test pins X4 MD32 Application Module RS X2 6 9 Handset X3 Power Supply X4 X5 Lock Indication Dummy LED 20 1 DECT-Engine MD32 MD32 Fig. 4-2 / Connector Overview Preliminary Technical Description 4-4 Issue:

5 5 Demonstration Examples 1) With the GAP-PP-mode the can subscribe to a GAP base station. The is used to set up the voice connection to the Handset: GAP-FP DECT-Module configured as GAP-PP X2 X1 X3 e.g. GIGASET 2010 PSTN Fig. 4-3 GAP-PP Demonstration 2) Two s can be used to replace a Zero-Modem-cable between two s. (V.24-Replacement): X2 X1 X3 X1 X3 X2 DECT-Module configured as V.24-Replacement-PP DECT Module configured as V.24-Replacement-FP Fig. 4-4 V.24-Replacement Demonstration Preliminary Technical Description 4-5 Issue:

6 3) All three s are used to demonstrate the V.24-Server-Application: X2 X1 X3 DECT-Module configured as V.24-Replacement-PP X1 X3 X2 DECT Module configured as V.24-Server X2 X1 X3 DECT-Module configured as V.24-Replacement-PP Fig. 4-5 V.24-Server Demonstration Preliminary Technical Description 4-6 Issue:

7 6 MD Block Diagram MD32 Application Modul Jack 6/6 Power Supply +5V Lock Indication FFC-Cable DECT - Engine MD32 Sub-D 9 Pin fem RS232 Interface 8 Jack 4/4 Audio Interface 4 Test pins Fig. 4-6 Block Diagram 6.2 Description The includes one DECT module wich is connected to an application circuit with a power supply, an Audio interface and a RS232 interface (level shifter). It provides connectors for the AC-adaptor, the handset and the RS232-cable. Test pins provides parallel access to the FFC-Connection (Host Interface). See also Fig. 4-2 / Connector Overview. 6.3 Software under edition Preliminary Technical Description 4-7 Issue:

8 6.4 Electrical Characteristics Electrical characteristics of the : Power Supply AC input voltage typ 9 V Supply current max. 260 ma Handset, Mic Mic input impedance typ Ohm Feeding voltage (no typ. 2,7 V load) Feeding current (short circuit) typ. 880 µa Input voltage for 0dBm0 typ. 189mV (gain = 0dB) Handset, Output impedance typ. 300 Ohm Earpiece Output voltage at typ V 0dBm0 and Receive gain = 0dB, no load RS232 output voltage swing (3 typ. ± 5.4 V kohm load) output short circuit current typ. ± 35 ma Input resistance typ. 5 kohm 6.5 Pinning of connectors (see also Fig. 4-2 / Connector Overview) X1, Power supply Pin-Number Name AC-In NC NC NC GND AC-In X3, Handset Pin-Number Name HSMIC- HSEAR+ HSEAR- HSMIC+ X2, RS232 Pin-Number Name DCD RXD TXD DTR GND DSR RTS CTS RI X4, Testconnector ( in parallel to X5 Host Interface, see also HW Interface Description /1/) 1 2 MIC+ PON CTS RXD DTR LRS+ RST LOCK_IND VCC MIC- TXD DCD RTS LRS- RI DSR frei VCC Fig. 4-7 Pinning Testconnector Preliminary Technical Description 4-8 Issue:

9 6.6 Circuit Diagram All Components marked with "Y" are not mounted. 4k Luft 10k Fig. 4-8 Circuit Diagram page 1 Preliminary Technical Description 4-9 Issue:

10 Luft Fig. 4-9 Circuit Diagram page 2 Preliminary Technical Description 4-10 Issue:

11 Luft Fig Circuit Diagram page 3 Preliminary Technical Description 4-11 Issue:

12 Fig Floor Plan Preliminary Technical Description 4-12 Issue:

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