RoHS COMPLIANCE STATEMENT
|
|
|
- Roger Parks
- 9 years ago
- Views:
Transcription
1 Document type: Document number: Version: Form (F) TBD 2.0 Document name: PDE-F-012- compliance statement Author: Reviewer: Approver: Release date: Pages: Sippe ahomi uuspe 2-May COMPLIANCE STATEMENT
2 2 CONTENTS 1 Scope Restricted () materials s List of covered products compliance statement References... 18
3 3 1 SCOPE This statement clarifies Modulight s product compliance with the European Union s directive 2002/95/EC, Restrictions of Hazardous Substances ( directive) and similar regulations that may be adopted by other countries. directive becomes valid on Jul in the member states of European Union. It states that all new electrical and electronic equipment put on the market within the member states must not contain certain hazardous materials. 2 RESTRICTED () MATERIALS Quantity limit 0.1% of weight (1000ppm) of any homogeneous material: 1. Lead (Pb) 2. Mercury (Hg) 3. Hexavalent Chromium (Cr VI) 4. Flame retardants Polybrominated Biphenyls (PBB) and Polybrominated Diphenyl Ethers (PBDE) Quantity limit 0.01% of weight (100 ppm) of any homogeneous material: 1. Cadmium (Cd) Homogeneous material means a material that cannot be mechanically disjointed into different materials by, for example unscrewing, cutting, crushing, grinding and abrasive processes. Homogeneous is further defined as of uniform composition throughout. 3 EXEMPTIONS Following cases are exempted from the requirements: 1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 2. Mercury in straight fluorescent lamps for general purposes not exceeding: halophosphate 10 mg triphosphate with normal lifetime 5 mg triphosphate with long lifetime 8 mg. 3. Mercury in straight fluorescent lamps for special purposes. 4. Mercury in other lamps not specifically mentioned in this Annex. 5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight. 7. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), lead in solders for servers, storage and storage array systems (exemption granted until 2010), lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, lead in electronic ceramic parts (e.g. piezoelectronic devices).
4 8. Cadmium plating except for applications banned under Directive 91/338/EEC ( 1 ) amending Directive 76/769/EEC ( 2 ) relating to restrictions on the marketing and use of certain dangerous substances and preparations 9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for: Deca BDE, mercury in straight fluorescent lamps for special purposes, lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and light bulbs, as a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly. 4 1 OJ L 186, , p OJ L 262, , p. 201.
5 5 4 LIST OF COVERED PRODUCTS Sales part Description ML nm FP laser diode chip for 2.5 Gb/s applications, 7 mw output power YES ML nm DFB laser diode chip for 2.5 Gb/s applications, 7 mw output power YES ML nm DFB laser diode chip for 10 Gb/s applications, 10 mw output power YES ML nm DFB laser diode chip for 2.5 Gb/s applications, 6 mw output power YES ML nm DFB laser diode chip for 2.5 Gb/s applications, 3 mw output power YES ML nm FP laser diode chip for 2.5 Gb/s applications, 5 mw output power YES ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without
6 6 Sales part Description ML1020 ML1021 ML1022 ML1023 ML1024 ML1025 ML1026 ML1027 ML1028 ML1029 ML1030 ML1031 ML1032 ML1033 ML1034 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, without, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, without, M1407, 6, 6, 6, 6
7 7 Sales part Description ML1036 ML1037 ML1038 ML1039 ML1040 ML1041 ML1042 ML1043 ML1044 ML1045 ML1046 ML1047 ML1048 ML1049 ML1050 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, without, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, without, M1407
8 8 Sales part Description ML1052 ML1053 ML1054 ML1055 ML1056 ML1057 ML1058 ML1059 ML1060 ML1061 ML1062 ML1063 ML1064 ML1065 ML1066 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, without, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6
9 9 Sales part Description ML1068 ML1069 ML1070 ML1071 ML1072 ML1073 ML1074 ML1075 ML1076 ML1077 ML1078 ML1079 ML1080 ML1081 ML1082 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, with isolator, with flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 1, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, without, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6
10 10 Sales part Description ML1084 ML1085 ML1086 ML1087 ML1088 ML1089 ML1090 ML1091 ML1092 ML1093 ML1094 ML1095 ML1096 ML1097 ML1098 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 2, with, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 3, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, pin layout 4, with 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, without 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, with isolator, 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 1, with isolator, no flange 1310 nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, without, M nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, without, M1407, 6, 6, 6, 6, 6, 6, 6, 6, 6, 6
11 Sales part Description ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, with isolator,, M1407 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 2, with isolator, no flange, M1407 ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, without ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, without ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, with isolator, ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 3, with isolator, no flange ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, without ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, without ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, with isolator, ML nm FP fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, no connector, pin layout 4, with isolator, no flange ML nm DFB laser diode chip for 2.5 Gb/s applications, 10 mw output power YES ML nm FP laser diode chip, high power YES ML nm FP laser diode chip, high power YES ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 11
12 12 Sales part Description ML1117 ML1118 ML1119 ML1120 ML1121 ML1122 ML1123 ML1124 ML1125 ML1126 ML1127 ML1128 ML1129 ML1130 ML1131 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with 1310 nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange, 6, 6, 6, 6, 6, 6
13 13 Sales part Description ML1133 ML1134 ML1135 ML1136 ML1137 ML1138 ML1139 ML1140 ML1141 ML1142 ML1143 ML1144 ML1145 ML1146 ML1147 ML nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/PC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, SC/APC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/PC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, with isolator, 1550 nm DFB piber pigtailed module for 2.5 Gb/s applications, 2 mw output power, FC/APC connector, with isolator, no flange 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without 1550 nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6, 6, 6, 6, 6, 6, 6
14 Sales part Description ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML nm DFB fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 3 ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 2 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 3 14
15 Sales part Description ML nm FP TO-can for 1.25 Gb/s applications, 3 mw output power, ball lens, pin layout 3 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 3 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 3 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 3 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, without, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, without, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, without ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with 15
16 Sales part Description ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/PC connector, pin layout 2, with ML nm FP fiber pigtailed module for analog applications, 3 mw output power, SC/APC connector, pin layout 2, with ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/PC connector, pin layout 2, with, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, FC/APC connector, pin layout 2, with, 6 ML nm FP fiber pigtailed module for analog applications, 3 mw output power, no connector, pin layout 2, with isolator, no flange ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 1 ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, aspherical lens, pin layout 2 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, ball lens, pin layout 2 ML nm FP TO-can for 2.5 Gb/s applications, 7 mw output power, flat lens, pin layout 1 ML nm FP TO-can for 1.25 Gb/s applications, 3 mw output power, ball lens, pin layout 1 16
17 17 Sales part Description ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 1 ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, aspherical lens, pin layout 3 ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 1 ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 10 mw output power, flat lens, pin layout 3 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 1 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, aspherical lens, pin layout 2 ML nm DFB TO-can for 2.5 Gb/s applications, 6 mw output power, flat lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, aspherical lens, pin layout 2 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, ball lens, pin layout 2 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 1 ML nm FP TO-can for 2.5 Gb/s applications, 5 mw output power, flat lens, pin layout 2 ML nm FP oxide stripe YES ML nm FP diode laser unmounted bar YES ML W 808nm CW diode laser bar YES ML W 795nm CW diode laser bar YES ML W 808nm QCW diode laser bar YES ML W 808nm CW diode laser bar YES ML W 795nm CW diode laser bar YES ML W 808nm CW diode laser bar with narrow Divergence Design (nodd) YES
18 18 5 COMPLIANCE STATEMENT I certify to the best of my knowledge, based on available information conducted to me, as follows: The products listed above, with the listed allowed exceptions, do not contain any homogeneous material that: a) contains lead (Pb) in excess of 0.1 weight-% (1000 ppm) b) contains mercury (Hg) in excess of 0.1 weight-% (1000 ppm) c) contains hexavalent chromium (Cr VI) in excess of 0.1 weight-% (1000 ppm) d) contains polybrominated biphenyls (PBB) or polybrominated dimethyl ethers (PBDE) in excess of 0.1 weight-% (1000 ppm) e) contains cadmium (Cd) in excess of 0.01 weight-% (100 ppm) Exceptions: 1) Sealing glass in TO-can lens cap or discrete lens contains leadborate (PbO). As lead in glass of electric components, it is exempted from requirements (exemption clause 5). 2) FC/PC and FC/APC connectors ring and fixing nut (copper:zinc alloy) contain minor quantities of lead. As the lead content is <4 weight-% it is exempted from requirements (exemption clause 6). Signature: Name (printed): Title: Date: Pekko Sipilä VP New Product Introduction 2-May REFERENCES Directive 2002/95/ec of the European Parliament and of the Council
Directive 2002/95/EC
European Community legislation is reproduced from the EUR-Lex website. Only European Community's legislation printed in the Official Journal of the European Communities is deemed to be authentic. 302L0095
Elimination Of RoHS Substances In Electronic Products
Elimination Of RoHS Substances In Electronic Products NEMI RoHS/Pb-Free Summit October 18-20, 2004 Environmental Regulatory Compliance Manager Microsoft Home & Entertainment Division (425) 707-4364 [email protected]
Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products
Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products General Environmental Policy Wurth Electronics Midcom is committed to the manufacture of environmentally-friendly products
RoHS Test Methods. Presented by: Bruce Peterson
RoHS Test Methods Presented by: Bruce Peterson Motivation for Presentation The EU RoHS directive takes effect July 1, 2006 Customer confusion about - Scope of directive How much testing needs to be performed
Final Report. New No. Continue with amended wording (expiry date 31 July 2014 except for
1 Executive Summary On the basis of the Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment ( RoHS Directive ) the European Commission
COMMISSION DIRECTIVE 2013/28/EU
L 135/14 Official Journal of the European Union 22.5.2013 COMMISSION DIRECTIVE 2013/28/EU of 17 May 2013 amending Annex II to Directive 2000/53/EC of the European Parliament and of the Council on end-of-life
China RoHS Directive Legislation Compliance October 2011
China RoHS Directive compliance information: China RoHS Directive Legislation Compliance October 2011 Declaration & Restriction Scope Packaging Differences to EU RoHS First Catalogue China RoHS2 1 RoHS
Distance Measuring Sensor Unit Measuring distance : 4 to 30 cm Analog output type
GP2Y0A41SK0F Distance Measuring Sensor Unit Measuring distance : 4 to 30 cm Analog output type Description GP2Y0A41SK0F is a distance measuring sensor unit, composed of an integrated combination of PSD
Government Guidance Notes
ROHS REGULATIONS Government Guidance Notes FEBRUARY 2011 URN 11/526 About this guidance This guide is addressed to all businesses and individuals placing electrical and electronic equipment on the UK market.
3M Mini D Ribbon (MDR) Connectors.050 Surface Mount Right Angle Receptacle - Shielded 102 Series
M Mini D Ribbon (MDR) Connectors.050 Surface Mount Right Angle Receptacle - Shielded 102 Series Wiper-on-wiper contact for reliable repetitive plugging Ultra-low signal skew for high data rate transmission
3M Pin Strip Header.100,.295 Mating Length, Straight & Right Angle, Solder Tails 929 Series
M Pin Strip Header.100,.295 Mating Length, Straight & Right Angle, Solder Tails 929 Series Stackable Tin Lead or gold plating available Solder stand-offs facilitate production wave soldering Board pin
RoHS CERTIFICATE OF COMPLIANCE FOR ACCUTOUCH SCREENS (Excluding AT4 Touch Screens)
RoHS CERTIFICATE OF COMPLIANCE FOR ACCUTOUCH SCREENS (Excluding AT4 Touch Screens) TITLE: RoHS Certificate of Compliance for AccuTouch Screens (excluding AT4 Touch Screens) NUMBER: RC600715 REVISION: D
N o n - a u t h o r i z e d t r a n s l a t i o n
Ordinance of the Federal Minister of Agriculture and Forestry, Environment and Water Management on Waste Prevention, Collection and Treatment of Waste Electrical and Electronic Equipment (WEEE Ordinance),
TRU RoHS Products Test Report
TRU RoHS Products Test Report Introduction: RoHS (Restriction of Hazardous Substances) is a directive that places maximum concentration limits on the use of cadmium (Cd), lead (Pb), hexavalent chromium
3M Pin Strip Header Single and Dual Row.100,.235 /.318 Mating Length, Straight & Right Angle, Solder Tails 929 Series
M Pin Strip Header Single and Dual Row.100,.25 /.18 Mating Length, &, Solder Tails 929 Series Stackable Gold, Matte Sn, or -Lead plating options High Temperature (PCT) plastic for Wave or IR soldering
3M High Flex Life Cable.050" 28 AWG Stranded, PVC 3319 Series
M High Flex Life Cable.050" 28 AWG Stranded, PVC 19 Series Flex life of 100 million cycles at 1 /4 inch diameter 19 strands of high strength copper alloy provide the longest flex life available for dynamic
Physical. Electrical. Environmental. Insulation: Contact: Plating: Temperature Rating: -55 C to +85 C
M I/O Interconnect System 2.0 mm for IEEE 194 Wiremount Receptacle (Female) E206 Series Designed to mate to all M I/O Interconnect System 2.0 mm for IEEE 194 Boardmount Plugs Polarized to provide proper
Product Regulatory Compliance Datasheet NBU 5330
Product Regulatory Compliance Datasheet NBU 5330 TABLE OF CONTENTS I. GLOBAL ENVIRONMENTAL INFORMATION...1 II. BATTERIES....1 III. POWER CORDS AND USER DOCUMENTATION.....2 IV. DATASHEET RESPONSIBLE PARTY
RoHS / Lead-Free Initiative. Microsemi Analog Mixed Signal Group
RoHS / Lead-Free Initiative Microsemi Analog Mixed Signal Group Table of Contents RoHS / Pb-Free Initiative............................................... 3 RoHS / Pb-Free Transition Strategy......................................
Product Regulatory Compliance Datasheet BE3600
Product Regulatory Compliance Datasheet BE3600 TABLE OF CONTENTS I. GLOBAL ENVIRONMENTAL INFORMATION...1 II. BATTERIES...1 III. POWER CORDS AND USER DOCUMENTATION.....2 IV. DATASHEET RESPONSIBLE PARTY
GP2Y0D810Z0F. Distance Measuring Sensor Unit Digital output (100 mm) type GP2Y0D810Z0F
GP2Y0D810Z0F Distance Measuring Sensor Unit Digital output (100 mm) type Description GP2Y0D810Z0F is distance measuring sensor unit, composed of an integrated combination of PD (photo diode), IRED (infrared
REACH and RoHS System Supplier Training
REACH and RoHS System Supplier Training 1 Background Increasingly, the EU and other international markets are restricting the presence of hazardous materials in products and packaging. Goal is to eliminate
PC817XNNSZ0F Series. DIP 4pin Photocoupler. Description. Agency approvals/compliance. Applications Features PC817XNNSZ0F
PC817XNNSZ0F Series DIP 4pin Photocoupler Description PC817XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP. Input-output isolation voltage(rms) is
Connection Cable for LED Driver Board
Connection Cable for LED Driver Board 2CBL03 DATA SHEET DOD-PP-07 (st edition) All information is subject to change without notice. Please confirm the sales representative before starting to design your
Product Regulatory Compliance Datasheet ediscovery 8200
Product Regulatory Compliance Datasheet ediscovery 8200 TABLE OF CONTENTS I. GLOBAL ENVIRONMENTAL INFORMATION...1 II. SYSTEM DIMENSION AND WEIGHT...1 III. BATTERIES....2 IV. POWER CORDS AND USER DOCUMENTATION.....2
IT(rms) 1.2A, Non-Zero Cross type DIP 8pin Triac output SSR
PR3BMF51NSLF IT(rms) 1.2A, Non-Zero Cross type DIP 8pin Triac output SSR Description PR3BMF51NSLF Solid State Relay (SSR) is an integration of an infrared emitting diode (IRED), a Phototriac Detector and
GP2Y0A02YK0F. Distance Measuring Sensor Unit Measuring distance: 20 to 150 cm Analog output type GP2Y0A02YK0F
GP2Y0A02YK0F Distance Measuring Sensor Unit Measuring distance: 20 to 150 cm Analog output type Description GP2Y0A02YK0F is a distance measuring sensor unit, composed of an integrated combination of PSD
Product Regulatory Compliance Datasheet ediscovery 8100
Date: August 2014 Product Regulatory Compliance Datasheet ediscovery 8100 TABLE OF CONTENTS I. GLOBAL ENVIRONMENTAL INFORMATION...1 II. SYSTEM DIMENSION AND WEIGHT...1 III. BATTERIES....2 IV. POWER CORDS
MADP-000504-10720T. Non Magnetic MELF PIN Diode
MADP-54-172T Features High Power Handling Low Loss / Low Distortion Leadless Low Inductance MELF Package Non-Magnetic Surface Mountable RoHS Compliant MSL 1 Package Style 172 Dot Denotes Cathode Description
GBIC CWDM 40km Part no: 70257-70264
GBIC CWDM 40km Part no: 7025770264 Description General The GBIC CWDM 40 transceiver is small form factor pluggable module with standard SC duplex connector for fiber communications. This module is designed
No. HKGEC1600277703 Date: 26 Apr 2016 Page 1 of 6
No. HKGEC1600277703 Date: 26 Apr 2016 Page 1 of 6 EIC SEMICONDUCTOR CO.,LTD. 65,68 SOI CHALONGKUNG 31,I-EA-T FREE ZONE LAT KRABAND INDUSTRIAL ESTATE,LUMPLATIEW LAT KRABANG BANGKOK 10520 THAILAND.. The
The following merchandise was (were) submitted and identified by the client as : LAN CABLE LSZH 2006/01/05 2006/01/05 TO 2006/01/19
Page : 1 of 5 The following merchandise was (were) submitted and identified by the client as : Type of Product : Style/Item No : Sample Received : Testing Date : LAN CABLE LSZH 2006/01/05 2006/01/05 TO
BW-500 BED WEIGHER USER MANUAL
BW-500 BED WEIGHER USER MANUAL 0 1 TABLE OF CONTENTS SPECIFICATION... 3 Equipment... 4 INSTALLING WEIGH BEAM... 5 PREPARATION FOR MEASUREMENT... 6 DP3800 Indicator... 8 POWER SUPPLY... 8 PANEL... 9 KEY
PCB RoHS Update OCT08 ELECTRONICS MANUFACTURING SERVICES
PCB RoHS Update CT08 ELECTRNICS MANUFACTURING SERVICES 2006 Sanmina-SCI Corporation. Sanmina-SCI is a trademark of Sanmina-SCI Corporation. All trademarks and registered trademarks are the property of
3M Twisted Pair Flat Cable.050" 28 AWG Stranded, Mass Terminatable Pair, PVC 1700 Series
M Twisted Pair Flat Cable.050" 28 AWG Stranded, Mass Terminatable Pair, PVC 1700 Series Wires are color-coded for easy identification Twist and flat repeat has variable length option Can be mass terminated
TEST REPORT Page 1 of 9
TEST REPORT Page 1 of 9 REPORT NUMBER : APPLICANT NAME ADDRESS SAMPLE DESCRIPTION : TURR120146929 Sarnikon Metal ve Elektronik San. Tic. Ltd. Şti. Deniz Köşkler Mah. Dr. Sadık Ahmet Cad. No:12/A Avcılar
GP2Y1010AU0F. Compact Optical Dust Sensor. Description. Compliance. Applications. Features GP2Y1010AU0F. 1. Compliant with RoHS directive (2002/95/EC)
GPY00AU0F Compact Optical Dust Sensor Description GPY00AU0F is a dust sensor by optical sensing system. An infrared emitting diode (IRED) and an phototransistor are diagonally arranged into this device.
Package Material Declaration
Code Atmel Corporation Material Declaration Datasheet ASE Shanghai REACH Compliant Yes Material Declaration Leadframe Copper (Cu) 7440 50 8 19.730 97.4 974000 26.21 262111 Iron (Fe) 7439 89 6 0.486 2.4
OPERATION MANUAL MARSDEN-200 PLEASE TAKE THE TIME TO READ THESE INSTRUCTIONS BEFORE STARTING TO USE THE SCALES
OPERATION MANUAL MARSDEN-200 PLEASE TAKE THE TIME TO READ THESE INSTRUCTIONS BEFORE STARTING TO USE THE SCALES 1 TABLE OF CONTENTS POWER SUPPLY... 3 SPECIFICATIONS... 3 MAINATENANCE AND GENERAL CARE........
Operating Instructions
Operating Instructions RFID-RDR-1-xxx R. STAHL HMI Systems GmbH Im Gewerbegebiet Pesch 14 50767 Köln Version 1.00.00 Issue date: 09.03.2011 Table of contents Table of contents Description Page Table of
AUPS Series. User Manual MODEL: VESA Mount Intelligent UPS Module 12 V DC Input or 9 V ~ 36 V DC Input Network Remote Management Support
AUPS Series Power Module MODEL: AUPS Series VESA Mount Intelligent UPS Module 12 V DC Input or 9 V ~ 36 V DC Input Network Remote Management Support User Manual Rev. 1.00 November, 2008 Page i Revision
Toxic and Hazardous Materials in Electronics
Toxic and Hazardous Materials in Electronics An Environmental Scan of Toxic and Hazardous Materials in IT and Telecom Products and Waste Final Report For Environment Canada, National Office of Pollution
Hong Kong Green Label Scheme Product Environmental Criteria for Copying Machines, Printers, Fax Machines and Multifunctional Devices (GL-006-003)
BACKGROUND Hong Kong Green Label Scheme The Hong Kong Green Label Scheme (HKGLS) is an independent and voluntary scheme, which aims to identify products that are, based on life cycle analysis consideration,
MP-1919 XNOVA Cube TM SMD LED
MP-1919 XNOVA Cube TM SMD LED Features: Table of Contents Technology Overview.... 2 Product Selection Table... 3 Operating Characteristics.. 4 Chromaticity Binning.... 5 Chromaticity Diagram.... 6 Characteristic
LUXEON S. High Flux Density
LUXEON S Optimized solution for applications requiring high flux and tight beam control Technical Datasheet DS80 LUXEON S High Flux Density Introduction The LUXEON S emitters deliver uniform beam intensity
High flux for outdoor applications
General Illumination LUXEON R High flux for outdoor applications LUXEON R brings illumination grade LED light sources to outdoor and industrial lighting applications and makes it easier than ever to design
Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules
Seite 1 Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules Soldering with alloys containing lead (SnPb) is the standard connection technology
AUPS-C20. User Manual MODEL: VESA Mount Intelligent UPS Module, 9 V ~ 28 V DC Input, 100 W Power Output, Network Remote Management Support
AUPS-C20 UPS Module IEI Technology Corp. MODEL: AUPS-C20 VESA Mount Intelligent UPS Module, 9 V ~ 28 V DC Input, 100 W Power Output, Network Remote Management Support User Manual Page i Rev. 1.01 30 October,
Material Safety Data Sheet For NiMH Batteries
Document Number: RRS0541 Revision: 10 Page 1of 5 IDENTITY (As Used on Label and List) Nickel Metal Hydride Battery Section I Information of Manufacturer Manufacturer's Name GPI International Ltd. Address
Model GS7000 4-Port Node 1 GHz with 40/52 MHz split
Model GS7000 4-Port Node 1 GHz with 40/52 MHz split The Model GS7000 4-Port Node is our latest generation 1 GHz optical node platform and utilizes a completely new housing designed for optimal heat dissipation.
Product environmental attributes THE ECO DECLARATION
Product environmental attributes THE ECO DECLARATION The declaration may be published only when all rows and/or fields marked with an * are filled-in (n.a. for not applicable). Additional information regarding
Gx Tubing. High-quality Gx Glass Tubing for pharmaceutical packaging. Tubular Glass
Gx Tubing High-quality Gx Glass Tubing for pharmaceutical packaging In its two tubing production sites in Pisa (Italy) and Vineland, NJ (USA), Gerresheimer produces clear and amber borosilicate glass tubing
Understanding RoHS and REACH: Impacts on your Global Markets
Understanding RoHS and REACH: Impacts on your Global Markets An overview of two important environmental regulations, their impacts on the global electronics industry. Abstract Companies manufacturing equipment
RoHS RIA November 2003
PARTIAL REGULATORY IMPACT ASSESSMENT ON DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL ON THE RESTRICTION OF THE USE OF CERTAIN HAZARDOUS SUBSTANCES IN ELECTRICAL AND ELECTRONIC EQUIPMENT
(Text with EEA relevance)
L 174/88 Official Journal of the European Union 1.7.2011 DIRECTIVE 2011/65/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 8 June 2011 on the restriction of the use of certain hazardous substances
ECLIPSE MX. Motorized Fader Control Surface. Users Manual
ECLIPSE MX Motorized Fader Control Surface Users Manual Eclipse MX is a trademark of JLCooper Electronics. All other brand names are the property of their respective owners. Eclipse MX User s Manual, First
Connectors for PCMCIA ExpressCard Technology
DESCRIPTION PCMCIA ExpressCard technology is the next generation for the PC Card standard. The 26 pin host and module connectors offer a smaller form factor than existing PC Card technology. The same connectors
Product Environmental Profile Step Down Transformers
Product Environmental Profile Step Down Transformers Product overview Step-down transformers are used to convert a higher input voltage (208-200 V) to a lower output voltage (120-100 V). They are used
Basic Cable Assemblies DELIVERING QUALITY SINCE 1952.
Basic Cable Assemblies DELIVERING QUALITY SINCE 1952. Cable Types Cable Types Hook-up & Lead Wire Most Basic 2 Cable Types Cable Types Twisted Pair Cable A type of cable that consists of two independently
Light Link Series 2 LT1550. Laser Transmitter with Erbium Doped Fibre Amplifier. Description. Features
Description The Light Link Series 2 optical transmitter model employs a high performance thermally stabilised, DFB, low-chirp, isolated laser to transmit CATV signals. Operating on a specific optical wavelength
SpectraTec II. Polarized Multi-Laser Source BLUE SKY RESEARCH WAVELENGTHS. The SpectraTec II
BLUE SKY RESEARCH The SpectraTec II, two wavelength laser module is a highly integrated system comprised of two lasers, individual driving and temperature control electronics, wavelength combining, and
Introduction 1-800-GE LAMPS 1-888-GE BALLAST (1-888-432-2552) Introduction/Overview to Lamps and Ballasts...A
gelighting.com Introduction This latest edition of the GE product catalog has been updated to help you more easily select the GE lighting products that best meet your needs. Technical data in this catalog
TWO/FIFTY/TWO STEREO POWER AMPLIFIER
TWO/FIFTY/TWO STEREO POWER AMPLIFIER MODEL G-2502-S OWNERS MANUAL FRONT PANEL LEFT TO RIGHT 1. VOLUME - Level control for Channel A. 2. LEVEL - Push button switch for controlling input signal level; Out
Service Overview. Chapter
Chapter 1 Service Overview Carefully read through this chapter for a look at various components of the Eee PC 4G (701) and necessary cautions and tools before performing any service and repairs. T o provide
GREEN CHOICE PHILIPPINES
GREEN CHOICE PHILIPPINES NELP-GCP 20080024 COMPUTER MONITOR 1. ENVIRONMENTAL SCENARIO Information and communication technologies which include computers are widely used across any kind of business sector
Organize Sanayi Bölgesi 21.Cadde No:1 ESKİŞEHİR FAX NO: 0222 236 11 26 Attention : Mustafa Günay ([email protected])
TEST REPORT Page 1 of 4 TEST REPORT NUMBER : TURR140141190 DATE: 17 September, 2014 APPLICANT: ADDRESS: Doğan Cam Pvc Sanayi ve Tic. A.Ş. Organize Sanayi Bölgesi 21.Cadde No:1 ESKİŞEHİR FAX NO: 0222 236
LUXEON TX Extreme efficacy that will transform your next market leading luminaire
LUXEON TX Extreme efficacy that will transform your next market leading luminaire Introduction LUXEON TX emitters are illumination grade LEDs designed to deliver high efficacy with high flux density to
Bridgelux ES Array Series
Bridgelux ES Array Series Product Data Sheet Introduction The Bridgelux family of LED Array products delivers high performance, compact and cost-effective solidstate lighting solutions to serve the general
WASTE QUESTIONNAIRE. Legal basis Council Directive 75/442/EEC of 15 July 1975 on waste (OJ L 194 25.07.1975 p. 39) EUR-Lex hyperlink html
WASTE QUESTIONNAIRE Waste Framework Directive Legal basis Council Directive 75/442/EEC of 15 July 1975 on waste (OJ L 194 25.07.1975 p. 39) EUR-Lex hyperlink html A. Which parts of the provisions of the
Multiple colors, a single focal length
Illumination LUXEON C Color Line Multiple colors, a single focal length The LUXEON C Color Line is an optically advanced portfolio of Color and White LEDs. Designed for flawless color mixing, LUXEON C
LUXEON Altilon. Functional solution for forward lighting systems AUTOMOTIVE
AUTOMOTIVE LUXEON Altilon Functional solution for forward lighting systems LUXEON Altilon delivers distinctive brilliant white light for your automotive forward lighting designs. LUXEON Altilon is designed
DIRECTIVE 2000/53/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 18 September2000 on end-of life vehicles
L 269/34 DIRECTIVE 2000/53/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 18 September2000 on end-of life vehicles THE EUROPEAN PARLIAMENT AND THE COUNCIL OF THE EUROPEAN UNION, Having regard to the
IDDUPS-6364120A/636260A
IDDUPS-6364120A/IDDUPS-636260A Converter Module MODEL: IDDUPS-6364120A/636260A 120W/60W DC/DC Converter Module with UPS and Utility Software User Manual Rev. 1.21 May 7, 2014 Page 1 Revision Date Version
: EUROPE, ASIA, AFRICA, AMERICA
TEST REPORT Page 1 of 5 TEST REPORT NUMBER : TURR130025141 DATE: 21 February, 2013 APPLICANT: Emta Kablo San.ve Tic.A.Ş. ADDRESS: Kadirli O.S.B. 1. Cd. No:15 Kadirli Osmaniye TÜRKİYE FAX NO :0328 739 23
LUXEON CoB with CrispWhite Technology Retail lighting that makes an impact
LUXEON CoB with CrispWhite Technology Retail lighting that makes an impact Introduction LUXEON CoB with CrispWhite Technology delivers the warm saturated colors of high 90 CRI solutions while creating
III 29 2-3, - I, - II, - IV,
Assistance to the Commission on Technological Socio-Economic and Cost-Benefit Assessment Related to Exemptions from the Substance Restrictions in Electrical and Electronic Equipment: Study to assess renewal
( ) DIN EN60747-5-2 : successor standard of DIN VDE0884.
PR33MF51NSZF Series I T (rms) 0.3A, Non-Zero Cross type DIP 8pin Triac output SSR Description PR33MF51NSZF Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac
ZTE Blade L2 Mobile Phone Quick Start Guide
ZTE Blade L2 Mobile Phone Quick Start Guide 1 LEGAL INFORMATION Copyright 2014 ZTE CORPORATION. All rights reserved. No part of this publication may be quoted, reproduced, translated or used in any form
TOXIC CHEMICALS IN COMPUTERS EXPOSED
TOXIC CHEMICALS IN COMPUTERS EXPOSED Determining the presence of hazardous substances in five bras of laptop computers GREENPEACE RESEARCH LABORATORIES l TECHNICAL NOTE 05/06 l SEPTEMBER 2006 TOXIC CHEMICALS
Allied Telesis and the Environment
White Paper Allied Telesis and the Environment As a major industry developer and manufacturer of networking equipment, Allied Telesis is committed to providing customers with products designed and built
1 POLE 5 A (CADMIUM FREE CONTACTS TYPE) NY SERIES
POWER RELAY 1 POLE 5 A (CADMIUM FREE CONTACTS TYPE) NY SERIES RoHS compliant FEATURES Ultra slim type with 5 mm thickness Good for high density mounting Low power consumption and high sensitivity Nominal
Plug - Type (Male/Female) Attenuators CAA series Singlemode
Plug - Type (Male/Female) Attenuators CAA series Singlemode Description: The plug-type singlemode attenuators are used directly on the ends of fiber optic jumpers prior to installation in adapters. These
Directive 2000/53/EU on End-of-life vehicles (ELV) Screening SERBIA
Directive 2000/53/EU on End-of-life vehicles (ELV) Screening SERBIA Brussels, 16 September 2014 Outline 1. The E.L.V Directive 2. Extended Producer Responsibility in ELV 3. The importance of car recycling
LUXEON 5630 Mid-Power LEDs Illumination Portfolio
LUXEON 5630 Mid-Power LEDs Illumination Portfolio Introduction LUXEON 5630 delivers optimized performance in combination with quality of light needed for distributed light source applications. In addition
FIBER OPTIC ISOLATORS
Features: >0W Optical power handling capability Polarization Sensitive and Insensitive versions Product offerings over 3 000 nm wavelength range High isolation levels and low return loss Low Insertion
VALVES FOR REFRIGERATING SYSTEMS
VALVES FOR REFRIGERATING SYSTEMS FROM QUALITY OUR NATURAL DEVELOPMENT Achieved the goal of fi fty years working in the industry of Refrigeration and Air Conditioning, Castel Quality Range of Products is
Un-cooled Multimode Pump Laser Module for Telecom Applications
Un-cooled Multimode Pump Laser Module for Telecom Applications BMUT series Features: High fiber output power, up to 6.0W 0.22NA, 105μm core multimode fiber pigtail Hermetically sealed 2 pin package Floating
UNLIMITED VARIETY OF CREATIVE SHEET MATERIAL.
UNLIMITED VARIETY OF CREATIVE SHEET MATERIAL. MADE IN SWITZERLAND Airex AG was founded in 1956 and pioneers with its innovations in the field of foamed plastic materials. Apart from manufacturing technical
USB-Blaster Download Cable User Guide
USB-Blaster Download Cable User Guide Subscribe UG-USB81204 101 Innovation Drive San Jose, CA 95134 www.altera.com TOC-2 Contents Introduction to USB-Blaster Download Cable...1-1 USB-Blaster Revision...1-1
DIRECTIONAL FIBER OPTIC POWER MONITORS (TAPS/PHOTODIODES)
Features: DIRECTIONAL FIBER OPTIC POWER MONITORS (TAPS/PHOTODIODES) PATENT NUMBERS: CANADA 2,494,133, USA 7095931, 7295731 AND CHINA 1672073 Telcordia GR-468 qualified Available in versions for any wavelength
1 USB Modem Introduction
1 USB Modem Introduction 1.1 Introduction Thank you for choosing the ZTE MF636 USB modem. Please read this manual carefully and keep it for future reference. The pictures, symbols and contents in this
Environmental Product Declaration www.siemens.com/healthcare
syngo X Workplace Environmental Product Declaration www.siemens.com/healthcare s Progress that is Impressive Ecological Advantages of the syngo X Workplace The syngo X Workplace allows SW-based 3D reconstruction
2016 Mid Power LED. 2016 Mid Power Product Datasheet. Features: Table of Contents. Applications
2016 Mid Power LED Table of Contents Technology Overview.... 2 Product Selection Table... 3 Operating Characteristics.. 4 Chromaticity Diagram.... 5 Color Ranks.... 5 Features: High efficacy CRI Options: