SVL3535 Datasheet Date of Publish January 2014

Transcription

1 SVL3535 Datasheet Date of Publish January 2014

2 General Information Features Package type: SMD 3535 Based on InGaN on sapphire Viewing angle: 120 High efficiency: ma, ma RoHS compliant Min CRI 70 Applications Architectural lighting Industrial lighting Outdoor lighting Spot lighting Product Code SVL3535-FX-XX-VX SVL3535 Package Type FX Flux Group XX CCT Group VX Voltage Group Example: SVL3535-F140-50A50D-V2 Contents 3 Maximum Ratings 3 Optical Characteristics 4 Brightness Groups 4 Voltage Groups 5 CCT Groups 5 Cool White 6 Neutral White 7 Warm White 8 Package Dimensions 8 Solder Pad Design 9 Relative Luminous Flux vs Forward Current 9 Forward Current vs Forward Voltage 10 Relative Luminous Flux vs Junction Temperature 10 Forward Voltage vs Junction Temperature 11 Spectral Characteristics 11 Radiation Characteristics 12 CCT Shift vs Temperature 12 CCT Shift vs Current 13 Reflow Soldering Profile 14 Packing Information 15 Cautions 2

3 Maximum Ratings Parameter Symbol Values Unit Forward Current If 1500 ma Operation Temperature Range Top - 30 ~ + 85 C Storage Temperature Range Tstg - 40 ~ C Junction Temperature Tj 150 C Thermal Resistance Junction / Solder Point Rth JS 5 K/W Optical Characteristics Parameter Symbol Values Unit Viewing Angle Color Rendering Index* CRI Min Typ *CRI measurement tolerance is ±1 3

4 Brightness Groups* Min Φ (lm) 350 ma Tj=25 C Min Φ 350 ma Tj=85 C Min Φ 700 ma Tj=25 C Min Φ 1500 ma Tj=25 C F F F F F CCTGroup CCT Flux Group Warm White Neutral White Cool White 2700K-3500K 4000K-5000K 5000K-7000K Typ Φ 350 ma (Tj=25 C) F F F F120 *Brightness groups are tested at a tolerance of 10% Voltage Groups* Group Min Vf 350 ma (Tj=25 C) 119 F F F F F Max Vf 350 ma (Tj=25 C) V V V V * Voltage groups are tested at a tolerance of 0.05V 4

5 CCT Groups Cool White 0.38 ANSI 5000K ANSI 5700K 50B 50C K ANSI 6500K 65C 65B 65D 65A 6530K 57B 57A 5665K 6020K 57C 57D 5310K 50A 5028K 50D 4745K Bin Code x y A B C D Bin Code x y A B C D Bin Code x y A B C D

6 CCT Groups Neutral White ANSI 4000K 0.39 ANSI 4500K 40C K 45C 40B 40D B 40A A 45D 3985K 3710K K 4503K Bin Code x y A B C D Bin Code x y A B C D

7 CCT Groups Warm White 0.44 ANSI 2700K 0.43 ANSI 3000K ANSI 3500K 3710K 35C 35B 30A 35D 35A 3045K 3220K 3465K 30B 30D 2870K 30C 27A 2725K 27B 27D 2580K 27C Bin Code x y A 35B 35C 35D Bin Code x y A B C D Bin Code x y A B C D

8 Package Dimensions R ø Cathode 3.45 Anode Notes: 1. Drawings are not to scale 2. All dimensions are all in millimeter 3. All dimensions without tolerance are for reference only Solder Pad Design Recommended Solder Pad Recommended Stencil Pattern (Hatched Area is opening) 8

9 Relative Luminous Flux vs Forward Current Tj=25ºC 350% Relative Luminous Flux 300% 250% 200% 150% 100% 50% 0% If (ma) Forward Current vs Forward Voltage Tj=25ºC If (ma) Vf (v) 9

10 Relative Luminous Flux vs Junction Temperature If=350mA Relative Luminous Flux 120% 100% 80% 60% 40% 20% 0% Tj ( C) Forward Voltage vs Junction Temperature If=350mA Vf (V) Tj ( C) 10

11 Spectral Characteristics Tj=25ºC, If=350 ma 100% 80% 60% CW NW WW 40% 20% 0% Wavelength (nm) Radiation Characteristics Tj=25ºC, If=350 ma Relative Luminous Intensity 100% 80% 60% 40% 20% 0% Angle ( ) 11

12 CCT Shift vs Junction Temperature If=350 ma CCT (K) WW NW CW Tj CCT Shift vs Forward Current Tj=25 ºC CCT (K) WW NW CW If (ma) 12

13 Reflow Soldering Profile T ( C) T P tp Critical Zone T to T LP T L tl Ts max Ts min ts Preheat 25 0 Ramp-up 3 K/s (max) Ramp-down 6 K/s (max) t (s) Profile Feature Lead-Based Solder Lead-Free Solder Preheat: Temperature Min (Ts min ) - Max (Ts max ) 100ºC-150 ºC 150ºC-200 ºC Preheat: Time (ts min to ts max ) seconds seconds Time Maintained Above: Temperature (T L ) 183ºC 217ºC Time Maintained Above: Time (t L ) seconds seconds Peak Temperature (Tp) 215ºC 260ºC Time Within 5ºC of Actual Peak Temperature (tp) seconds seconds Time 25ºC to Peak Temperature 6 minutes max. 8 minutes max. Notes: 1. The encapsulated material of the LEDs is silicone. 2. Precautions should be taken to avoid the strong pressure on the encapsulated part. 3. Please use the picking nozzle that does not affect the silicone resin. 13

14 Packing Information Embossed Tape Dimensions 0.25±0.05 Ø ± ± ± ± ± A A 12.00± ±0.10 B Ø1.50± ±0.10 SECTION B-B 3.67±0.10 Reel Dimensions ± ± ± 0.5 Moisture Proof Bag Ø13± Ø60± ±1.0 Seal Reel Label (Tolerance: ±0,2, Unit: mm) 1. Dimensions are in millimeters. 2. Dimensions conform to JIS-C-0806 and EIA-481. Packing unit Moisture absorbent material Moisture proof foil bag Package Dimensions (mm) No. of Reel/Unit Q ty (pcs) Moisture proof foil bag 1 reel/bag 500 Notes: 1. To avoid possible damages, it is recommended that the same packing arrangement should be used for future transportation. 2. Packing tolerance is ± 0.1% 14

15 Cautions Correct handling and storage will ensure maximum lifetime. (1) Moisture Proof Package Moisture proof bags are used for product delivery. We recommend using the original moisture proof bag after opening with a functioning desiccant such as silica gel. (2) Storage The recommended shelf lifetime of unopened LEDs is six months. LEDs should be soldered within 7 days of opening. It is recommended to store those unused LEDs in the original moisture proof bag with a functioning desiccant such as silica gel. If LEDs have absorbed moisture or have exceeded the recommended storage time, then the LEDs should be baked to ensure the moisture is removed. Baking treatment: > 24 hours at 70 ± 5 C Svetled LED electrode and lead frame are comprised of a silver plated copper alloy. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability and might affect on optical characteristics. Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. (4) Cleaning It is recommended to clean the LEDs using Isopropyl alcohol. When using other solvents, it should be confirmed beforehand whether the chosen solvents will dissolve the package or the resin. Never clean the LEDs with the ultrasonic machines. Freon solvents should not be used to clean LEDs. 15

16 (5) Static Electricity Static electricity or surge voltage can be harmful to LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage on all mounting equipment. When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. Simple but effective tests can identify damaged LEDs such as a light-on test or a VF test at a lower current (below 1 ma is recommended). Damaged LEDs will show abnormal characteristics such as large increase of leak current as the forward voltage becomes lower, or the LEDs will not light at low current. Criteria: (Vf > 2.0V at If=0.5mA) (6) Other Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs without eye protection. The LEDs described in this brochure are intended to be used for ordinary electronic equipment. LED devices used in applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health, must be expressly authorized. Due to the manufacturing processes of LEDs, the typical data or calculated correlations of technical parameters can only reflect statistical calculations. Svetled reserves the right to modify these specifications as it deems necessary. 16