EClamp2357NQ EMI Filter and ESD Protection for Secure Digital Card Interfaces

Transcription

1 EMIClamp Description The EClamp 237NQ is a low pass fi lter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. They have been optimized for protection of touch screen displays, secure digital (SD) card interfaces, and color LCD panels in cellular phones and other portable electronics. The device consists of six pi fi lter circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI fi ltering. A series resistor value of Ω and a component capacitance value of pf are used to achieve 2dB minimum attenuation from.ghz to 3GHz. The device also includes 4 discrete TVS diodes for dedicated ESD protection. All of the TVS diodes provide effective suppression of ESD voltages in excess of ±kv (air discharge) and ±8kV (contact discharge) per IEC 642, level 4. The EClamp237NQ is qualifi ed to AECQ Grade for Automotive use. EClamp237NQ EMI Filter and ESD Protection for Secure Digital Card Interfaces Features u EMI/RFI fi lter with integrated ESD protection u ESD protection to IEC 642 (ESD) Level4, ±kv (air), ±8kV (contact) u Filter performance: >3dB attenuation at.8ghz u TVS working voltage: V u Resistor: Ω +/ % u Component Capacitance: pf (VR = V) u EMI ESD protection for six lines u Dedicated ESD protection for four lines u Solidstate technology u AECQ Grade Qualifi ed. Mechanical Characteristics u 6 pin QFN u RoHS/WEEE Compliant u Nominal Dimensions: 3. x 3. x. mm u Lead Pitch:.mm u Lead Finish: Matte Tin u Marking: Marking Code u Packaging: Tape and Reel per EIA 48 Applications u Touch Screen Display Interfaces u Secure Digital (SD) Memory Card Interfaces u Multimedia Card Interfaces (MCI) u Color LCD Panel Protection u Cell Phone Handsets and Accessories u Automotive Applications. Package Dimensions 6 3. Schematic Pin Configuration = 6 > 3..3 /9@A=;AB9CD. 6> 6>.6 EClamp237NQ2R 6 Pin QFN (Top Side View) Nominal Dimensions (in mm) 9..<44 Revision 6/24/23

2 Absolute Maximum Ratings Rating Symbol Value Units ESD per IEC642 (Air) ESD per IEC642 (Contact) V ESD ±2 ±2 kv Junction Temperature T J 2 O C Operating Temperature T OP 4 to +2 O C Storage Temperature T STG to + O C Electrical Characteristics (T=2 O C unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units TVS Reverse StandOff Voltage V RWM V TVS Reverse Breakdown Voltage V BR It =ma T = 4 to +2 O C TVS Reverse Leakage Current I R VRWM = 3.3V T = 4 to +2 O C 6 8 V. µa Total Series Resistance R Each Line T = 4 to +2 O C 8 Ω Total Capacitance C IN Each Line f = MHz Input to Gnd VR = V 2 22 VR = 2.V 2 pf 23 Semtech Corporation. 2

3 Typical Characteristics Typical Insertion Loss S2 (Each Filter) Analog Crosstalk (Each Line) Insertion Loss I L (db) 2 3 Filter Input to Output Crosstalk C T (db) Frequency (MHz) AR_ILvF 2 Frequency (MHz) CTvF ESD Clamping (+8kV Contact) ESD Clamping (8kV Contact) Clamping Voltage V C (V) Corrected for 4dB attenuation. Measured with Ω, 4dB attenuator; Ω Scope Input Impedance. Clamping Voltage V C (V) Corrected for 4dB attenuation. Measured with Ω, 4dB attenuator; Ω Scope Input Impedance. AR_ESD_ Time (ns) AR_ESD_ Time (ns) 2 Capacitance vs. Temperature Series Resistance vs. Temperature Test Current = ma Junction Capacitance C J (pf) 2 No Filter VR = V No Filter VR = 2.V Filter VR = V Filter VR = 2.V Series Resistance R S (Ω) AR_CAPvT Temperature ( O C) AR_RSvT Temperature ( O C) 23 Semtech Corporation. 3

4 Typical Characteristics (Continued) Breakdown Voltage vs. Temperature I BR = ma I Any BR = Pin ma to GND Pin 6, 8, 3 or to GND 2 2 Capacitance vs. Reverse Voltage f = MHz Breakdown Voltage V BR (V) Capacitance C J (pf) Filter Pins Non Filter Pins AR_VBR_ 7. Temperature ( O C) AR_CAPvV Reverse Voltage VR(V) 3 TLP Charcteristics Positive TLP Charcteristics Positive 2 2 TLP Parameters: tp = ns; tr = 2ps RDYN =.466Ω Best Fit 4A to 6A TLP Parameters: tp = ns; tr = 2ps RDYN =.248Ω Best Fit 4A to 6A TLP Current (A) TLP Current (A) 2 2 AR_TLP+ 2 2 TLP Voltage (V) AR_TLP TLP Voltage (V) Leakage Current I R (na) Leakage Current vs. Temperature V R = 3.3V Pin 6, to 8, GND 3 or to GND Filter Pins are, 2, 3,4,, 7, 9,,, 2, 4 and 6 NonFilter Pins are: 6, 8, 3 and. NonFilter Pins Filter Pins AR_IRvT Temperature ( O C) 23 Semtech Corporation. 4

5 Applications Information Device Connection The EClamp237NQ is comprised of six circuits each consisting of a low pass fi lter for EMI/RFI suppression and dual TVS diodes for ESD protection. It also includes 4 lines of TVS diodes for ESD protection of power lines or high speed I/O lines. The device is housed in a 6pin Quad Flat NoLead (QFN) package. Electrical connection is made via 6 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is designed for easy PCB routing as shown in the application examples. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Matte Tin Lead Finish Matte tin has become the industry standard leadfree replacement for SnPb lead fi nishes. A matte tin fi nish is composed of % tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the refl ow profi le will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both leadfree and SnPb assembly techniques. In addition, unlike other leadfree compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Pin Identification and Configuration (Top Side View) /. %. /.<44 Pin Identifi cation 3, 4,, 7, 9, Input EMI/ESD Protected Lines, 2,, 2, 4, 6 Output EMI/ESD Protected Lines 6, 8, 3, Input/Output ESD Protected Lines Center Tab Ground Pin Configuration and Schematic %. / /..<44 23 Semtech Corporation.

6 Applications Information.<*,) * EG (. / /. % * EG ( *.<4.4 G ) ).<E)!),). / /. % E*) G" ) ) 4F!.<4/4 23 Semtech Corporation. 6

7 Outline Drawing 6L QFN,,, 8 8= B = 8A 8 8% % 8. 8= = 8A 8 8% % 8. 8= = 8. 8A 82 8= 8=2 8A A 777 8= %2= 3A Land Pattern 6L QFN ,,,,,++, 4 38= 8A 8. 38% 8 8. C D A 8=. =9D %2= 23 Semtech Corporation. 7

8 Marking Ordering Information /.. / Part Number Qty per Reel Reel Size. HHFF % % EClamp237NQTCT 3 7 Inch Note: EClamp and EMIClamp are registered marks of Semtech Corporation.. / /. 7!7 *2 7!7 6).<44 Notes: ) YYWW = Date Code 2) Pin indicated by Mouse Bite on the ground pad Tape and Reel Specification 3"8)93" "393 )393 :3 ; < " B 3=93 C.+ ) *"8)"++ ;3 :3"8 +3 =3 : N YYWW 237N YYWW EClamp237NQ9R 3>((...((.@(,A... Tape Specifications Device Orientation in Tape Contact Information for Semtech International AG Taiwan Branch Tel: Fax: Korea Branch Tel: Fax: Shanghai Offi ce Tel: Fax: Japan (Osaka) Offi ce Tel: Fax: Japan (Tokyo) Offi ce Tel: Fax: Semtech Limited (U.K.) Tel: Fax: Semtech France SARL Tel: 33() Fax: 33() Semtech Germany GmbH Tel: 49()86423 Fax: 49()86424 Semtech International AG is a whollyowned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. 23 Semtech Corporation. 8