Neil Jablon Director, Product Management Qualcomm Technologies, Inc Update on Hardware Component Ecosystem

Transcription

1 Neil Jablon Director, Product Management Qualcomm Technologies, Inc Update on Hardware Component Ecosystem 1

2 Hardware Ecosystem Initiatives Increase Selection of Components Verify Components Earlier in Development Cycle Make it Easier to Find Parts Help Vendors to Sell Into Ecosystem Help Vendors to Better Support OEMs Support Various Platforms 2

3 1 Increase Selection of Components Add new types of components to the Preferred Vendor List Verify parts with 3 rd parties to increase verification capacity 3

4 PVL Component Types Supported Were Increased Accelerometer Ambient Light Sensor Auto Focus Balun Buck Camera Coupler CTP Diplexer Display Front End Module Gesture Sensor GPS Low Noise Amplifier Gyroscope Load Switch Low Pass Filter Magnetometer Memory NFC Antenna Power Inductor Pressure Sensor Proximity Sensor RF Antenna Switch Module RF Duplexer RF Power Amplifier RF PAM RF SAW RF Switch TCXO and Crystal USB Type-C WiFi Bandpass Filter 4

5 Verification by Third Parties Increases Capacity Qualcomm Technologies, Inc. Third-Party Labs Location North America, China China, Europe Affiliation Qualcomm Technologies, Inc. Suppliers working with Qualcomm Technologies, Inc. Components All Focused Subset Scope Drivers, Tuning, Testing, Customer Support Drivers, Tuning, Testing 5

6 2 Verify Components Earlier in the Development Cycle Customer Input Vendor Product Roadmaps QTI Product Roadmaps Strategic Component Roadmap Driver Development Verification Scheduling Verification Testing Place on PVL Customer Input Customer Input Vendor Input Strategic Component Roadmap helps support early alignment between vendors and Qualcomm Technologies, Inc. 6

7 3 Make it Easier to Find Parts Enhanced Online PVL (GCDB) GCDB (Global Components Database): Global, searchable online catalog of Hardware Components being offered by Third-Party vendors ( Access: QTI chipset licensees Chipsets: Various tiers supported Component types: 30 major types (as of August 2015) Components tested: 1,000+ parts (as of August 2015) Pin-to-pin compatibility: Shown for I 2 C Sensors and RF parts User Interface: English and Simplified Chinese Export: One-Touch full PVL generation in Excel Search: By component attribute and string-based Drivers: Download links provided Source: Qualcomm CreatePoint screen shot 7

8 4 Help Vendors to Sell Into Ecosystem Bottleneck Revised Approach Only verified by Qualcomm Technologies, Inc. Third-party verification AMSS code not available to vendors License AMSS code to certain vendors for evaluation and testing Development test units not available to vendors Make these units available for purchase by certain vendors 8

9 5 Help Vendors to Better Support OEMs Barrier Revised Approach Simulation models not available to vendors Release simulation models to vendors AMSS code not available to vendors License AMSS code to certain vendors for evaluation, testing, and support Development test units not available to vendors Make these units available for purchase by certain vendors Vendor Field Application Engineering (FAE) staff not fully trained on Qualcomm solutions Train FAE staff, where appropriate 9

10 6 Support of Various Tiers Allows OEMs to Build Full Range of Devices Production Qualcomm Snapdragon 800 SD820 Snapdragon 400 & 600 SD615 SD415 SD410 SD617 SD620/SD618 Snapdragon 200 SD210 The dates in this roadmap are estimated dates only with certain dependencies, and are subject to change without notice by Qualcomm Technologies, Inc. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. 10

11 Live Demo Global Components Database 11

12 For More Information and Further Discussion Please see: Neil Jablon, Director, Product Management Qualcomm Hardware Component Ecosystem 12

13 Thank you Follow us on: For more information, visit us at: & Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved. Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All trademarks of Qualcomm Incorporated are used with permission. Other products and brand names may be trademarks or registered trademarks of their respective owners. References in this presentation to Qualcomm may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business, QCT. 13