inand Technical Overview Synnex/FAE Xavier Lin

Transcription

1 inand Technical Overview Synnex/FAE Xavier Lin 1

2 inand Agenda What is inand? Why is inand? Architecture of inand Roadmap and Application 2

3 What is inadn 3

4 inand/sd protocol (Bus Transaction) SD Bus Mode DAT lines Host RESPONSE COMMAND DATA IN/OUT CMD Line 4

5 inadn Standard SanDisk inand devices are fully compatible with the SDA Physical Layer Specification, Version This specification is available from the SD Card Association (SDA). VDD VDD VDD VDD VDD R1 R2 R3 R4 R5 inand CLK, M6 CMD, G4 DAT0, A3 DAT1, A4 DAT2, A5 DAT3, B2 CLK CMD DAT0 DAT1 DAT2 DAT3 SD Controller 5

6 inand to SD Evaluation Board Aligned the two dots 6

7 Why is inand? 7

8 inand Vs. Embedded Raw NAND No support for MLC Supporting each new revision of MLC will mean firmware or hardware changes in host CPU Changing error correction requirements Higher densities bring higher error correction rates MLC brings even more requirements Systems need complex management and reliability algorithms More challenging logical to physical management More frequent exception handling Higher performance requirements 8

9 inand Is Your Design Solution Embedded storage solution in a single package Controller + memory Interface Secure Digital (SD) Internal MLC memory management Wear-leveling Error correction Ever changing block and page sizes Pinout/footprint consistent across capacity points Allows manufacturing flexibility and easy upgradeability Capacity 512MB to 8GB 9

10 inand is JEDEC compatible JEDEC foot print: JEDEC compatible package sizes: 11.5mm x 13mm; 12mm x 16mm; 12mm x 18mm JEDEC compatible Ball-out 1 Common SD/MMC driver - supported by all OS Host should support SD I/F, same as used for SD cards Voltage: Current inand supports 3.3V range (2.7~3.6v) 1.8V I/O support inand external capacitor and timing spec different 1. Note: Balls [C12:M14] (total of 30 balls) in inand are reserved (DNU) for testing/debug and therefore should be left floated. 10

11 inand Pinout One PCB for all capacity options Only 6 signal balls JC64 FBGA 169 ball 0.5mm ball pitch, package 12 x 16 x 1.2 mm 12 x 18 x 1.2 mm Layout recommendation available 11

12 Mass storage SanDisk inand Value Proposition High-capacity embedded flash storage in a small, JEDEC (JC-64.1) compatible package and ball-out. proven reliability easy upgrade Industry-standard interface Based on industry-standard SD interface Offers seamless hardware and software integration Fully backward compatible, significantly minimizing design risks 12

13 Architecture Of inand 13

14 inand Specs at a glance JEDEC package and ball-out compatible. Interface - fully compliant with SD Interface specification 2.0 and 1.1 High Density Coverage High Performance Low pin count inand* Capacity Bytes 512MB to 8GB Packages JEDEC 11.5mm x 13mm 12mm x 16mm 12mm x 18mm Interface SD Fully compatible with SD 2.0 & 1.x Performanc e Power Consumptio n Sustaine d Read Sustaine d Write Core/IO Voltage 10MB / sec 9MB / sec 3.3V / 3.3V 3.3V / 1.8V MCP available in 2007 *All performance numbers are average sustained data rates for large sequential file transfers ** 1.8V I/O support in H

15 inand Parameters Temperature Operating -25 C to 85 C Voltage range 2.7 to 3.6V Current Consumption Read 100 ma (Max) default speed Write 100 ma (Max) default speed Read 200 ma (Max) high speed Write 200 ma (Max) high speed Sleep Mode 250uA (Max) Automatic Sleep Mode Device enter sleep mode 5m sec after the last command has been received Clock Speed Max 25 MHz in default mode Max 50 MHz in High Speed mode 15

16 Roadmap & Application 16

17 inand (esd/jedec package) Capacity Core ; I/O 512MB 3.3V / 3.3V 1GB 3.3V / 3.3V 2GB 3.3V / 3.3V 4GB 3.3V / 3.3V 8GB 3.3V / 3.3V Q 2Q 3Q 4Q 1Q 2Q Q3 Q4 Package BGA12x16 BGA11.5x13 BGA12x16 BGA11.5x13 BGA11.5x13 BGA12x16 BGA12x18 BGA12x16 BGA12x18 BGA12x16 BGA12x16 BGA12x16 BGA12x18 BGA12x18 BGA12x18 BGA12x18 16GB 3.3V / 3.3V BGA12x18 Planned: 1.8V I/O support in H nm 56 nm 43 nm 17

18 Most Host Controllers supports 4 bit SD interface Centrality(AtlasII,AtlasII,Titan..) Freescale Marvell(MonahanL,LV,P...) Qualcomm TI And many more... Native SD support in leading OS s Symbian,Windows CE,Windows Mobile.. Application Mobile Phone, PND, DPF, DV Synnex Synnex SD/iNAND Host Support Ex: Sony Ericsson W950i 18

19 Thank You! 19