EMSENSR-MPU x0.5 9-Axis Motion Sensor

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Augustus Watson
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1 EMSENSR-MPU9.9 x. 9-Axis Motion Sensor Description: The 9DOF MPU-9 is the world s smallest 9-axis MotionTracking MEMS device designed for the low power, low cost, and high performance requirements of consumer electronics equipment including smartphones, tablets and wearable sensors. And guess what? You get to play with it. The EMSENSR- MPU9 makes it easy to prototype with the InvenSense MPU-9 by having all the pins mapped to.mm/. headers. The board also provides IC pull-up resistors, zero ohm jumpers to switch the IC address of the device, switchable between IC and SPI mode, and enable/disable Frame Synch. The MPU-9 is a System in Package (SiP) that combines two chips: the MPU-6, which contains a - axis gyroscope, and -axis accelerometer. The second die houses the AK896 axis magnetometer from Asahi Kasei Microdevices Corporation. The part is offered in a xxmm LGA package and is upgradecompatible with the MPU-6 integrated 6-axis MotionTracking device, providing a simple upgrade path and making it easy to fit on space constrained boards. The EMSENSR-MPU9 pins are all mapped to standard.mm/. headers. The distance between the headers is mil. V. NOTE: There most current EMSENSR-MPU9 is V. and is Notated on the Silkscreen. It is electrically equivalent to the Original EMSENSR-MPU9 it just has a slightly different Pinout to accommodate the standardized EMSENSR pinouts for the EMRF-Wireless Platform and is also smaller than the original version. Both schematics are shown in this Datasheet. Need help with Sensor Fusion Libraries or Custom Embedded PCB/Software, Wireless/Mobile Applications, and general design services can be provided by Embedded Masters for your own application. Contact sales@embeddedmasters.com Want a breakout board that Embedded Masters doesn t currently offer please let us know!! MPU-9 Full Datasheet link: BUY IT NOW!! EMSENSR-MPU9 77 RevA Page

2 Features: Ultra-small.9 x. Breakout board with. /.mm header spacing that can be directly soldered into a prototype or used with breadboard. mil header-header spacing. Supply voltage range of.v.6v; VLOGIC of.8v±% or Tri-Axis angular rate sensor (gyro) with a sensitivity up to LSBs/dps and a fullscale range of ±, ±, ±, and ±dps Tri-Axis accelerometer with a programmable full scale range of ±g, ±g, ±8g and ±6g Tri-axis compass with a full scale range of ±8µT Reduced settling effects and sensor drift by elimination of board-level cross-axis alignment errors between accelerometer, gyroscope, and compass Gyro operating current:.ma (full power, gyro at all rates) Gyro + Accel operating current:.8ma (full power, gyro at all rates, accel at khz sample rate) Gyro + Accel + Compass + DMP operating current:.ma (full power, gyro at all rates, accel at khz sample rate, compass at 8Hz rate) Accel low power mode operating current: 8.uA at Hz, 9.8uA at.hz Full Chip Idle Mode Supply Current: 8µA khz Fast Mode I²C or MHz SPI with byte FIFO On-chip timing generator with ±% frequency variation over full temperature range On board Temperature Sensor,g shock tolerant IC Pullup Resistors populated on board. BOB configured for IC Default can be converted to SPI mode Zero Ohm Resistor Jumper for Switching LSB of IC Address, Switch between IC/SPI mode, enable/disable Frame Synch. EMSENSR-MPU9 77 RevA Page

3 ... DESCRIPTION:... FEATURES:... EMSENSR-MPU9 V. SCHEMATIC... EMSENSR-MPU9 V. SCHEMATIC... EMSENSR-MPU9 V. PCB TOP... 6 EMSENSR- MPU9 V. PCB BOTTOM... 6 EMSENSR- MPU9 V. D PCB TOP... 7 EMSENSR- MPU9 V. D PCB - BOTTOM... 7 EMSENSR-MPU9 V. PCB TOP... 8 EMSENSR-MPU9 V. D PCB TOP... 8 EMSENSR-MPU9 V. D PCB BOTTOM... 8 EMSENSR-MPU9 77 RevA Page

4 A A B P HDR x.mm P HDR x.mm FSY AD/SDO ncs DNI R R R k R6 R k ncs AD/SDO FSY 7 9 U CS AD/SDO FSY MPU-9/6 RESV/ REGOUT RESV/ RESV/ 8 8 Place R => MPU-9 No Place R => MPU-6 C.uF R C.uF C.uF B C Zero Ohm Jumpers: R = ncs IC= SPI = Remove R R = AD/SDO LSB of IC Address SPI = Remove R C R6 = FSY If not used connect to D D EMSENSR-MPU9,6 V. Title Size: Letter Number: Revision:. Date: // Time: :: PM Sheet of File: EMSENSR-9,6, V..SchDoc Embedded Masters LLC

5 A A B P DNI 6 Header 6 P DNI 6 Header 6 AD/SDO FSY ncs DNI R R R k R6 DNI R k ncs AD/SDO FSY 7 9 U CS AD/SDO FSY MPU-9/6 RESV/ REGOUT RESV/ RESV/ Place R => MPU-9 No Place R => MPU-6 C.uF R C.uF C.uF B C Zero Ohm Jumpers: R = ncs IC= SPI = Remove R R = AD/SDO LSB of IC Address SPI = Remove R C R6 = FSY If not used connect to D EMSENSR-9,6-BOB Title Size: A Number: Revision:. Date: // Time: :7: AM Sheet of File: EMSENSR-9,6-BOB.SchDoc Embedded Masters LLC D

6 EMSENSR-MPU9 V. PCB Top EMSENSR- MPU9 V. PCB Bottom EMSENSR-MPU9 77 RevA Page 6

7 EMSENSR- MPU9 V. D PCB Top EMSENSR- MPU9 V. D PCB - Bottom EMSENSR-MPU9 77 RevA Page 7

8 EMSENSR-MPU9 V. PCB Top EMSENSR-MPU9 V. D PCB Top EMSENSR-MPU9 V. D PCB Bottom EMSENSR-MPU9 77 RevA Page 8

InvenSense Motion Sensor Universal Evaluation Board (UEVB) User Guide

Application Note InvenSense Motion Sensor Universal Evaluation Board (UEVB) User Guide PURPOSE This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used