X7R Dielectric Non-Magnetic Multilayer Ceramic Capacitors
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1 X7R Dielectric Non-Magnetic Multilayer Ceramic Capacitors Product Features Non-Magnetism, Suitable for MRI Part Numbering C 0603 X 222 K 500 P T Chip Capacitor Chip Capacitor Dimensions Temperature Characteristic Rated Tolerance Termination Type Packing Type Dimensions Type Dimensions (Unit:mm) L W T(max) B(min) B(max) ± ± ± ± ± ± ± Temperature Characteristics ± ± (EIA) Temperature Coefficients Operating Temperature X(X7R) ±15% -55 ~ +125 Rated 1000pF pF (DC) (DC) 25 25V V 50 50V V V 1000V V V Tolerance Tolerance J ±5% K ±10% M ±20%
2 Termination Type Packing Type P C Termination Type Non-magnetic Copper Plated 100% Sn(RoHS) Palladium Silver T B Packing Type Tape carrier packing Bulk packing in a bag Rated Table (Unit:pF) Dielectric X7R Size nF nF nF 105 1uF Characteristics Curve vs Temperature Change vs Aging
3 1 Operating Temperature -55 ~ See pages 73 The rated voltage means the maximum direct voltage or peak value of pulse voltage which may be applied continuously to a capacitor 3 No defects or abnormality Visual inspection 4 Dimensions See the previous pages Callipers inspection 5 Dielectric Strength No defects or abnormality No failure shall be observed when the given coefficient of the ratedvoltage is applied betweentheterminationsfor1tos seconds, provided the charge/discharge current is less than 50mA. 6 More than 100MΩ uf The insulation resistance shall be measured with the testing voltage at normal temperature and with humidity, within 2 minute of charging. 7 Within the specified tolerance The capacitance. shall be measured at 25 with the frequency and voltage shown in the table. 8 Dissipation Factor (. ) 5% Frequency Voltage X7R 1±0.1KHz 1±0.2Vrms 9 Temperature Coefficient ± 15% Refer to the test methods of general ceramic Chip capacitors. 10 Adhesive strength of Termination No removal of the terminations or other defect shall occur Solder a capacitor to test jig (glass epoxy board) shown in fig below using a eutectic solder, then apply 10N force in the direction of the arrow. The soldering should be done either by hand iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. 10Newton Glass Epoxy Resin Board
4 11 Vibration No defect or abnormality Within the specified tolerance Solder the capacitor to test jig (glass epoxy board) shown in fig below. Soldering should be done either by hand iron of using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm. The frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total 6 hours). No cracking or marking defects shall occur, C/C<12.5% Solder the capacitor to test jig ( glass epoxy board) direction shown in below fig. 12 Deflection Size a b c Solderability of Termination More than 75% of the terminations is to be soldered evenly and continuously. Immerse the capacitor first in a ethanol solution of rosin. Preheat at 80 to 120 for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2±0.5 seconds at 250±5. 14 to Soldering Heat. Less than ±7.5% Preheat capacitor at 120 to 200 for 1 minute. Then immerse the capacitor in a eutectic solder at 260 to 265 for 10±1 seconds, Set it for 24±2 hours at room temperature, then measure. I.R: More than 100MΩ uf
5 15 Temperature Cycle 7.5% More than 100MΩ uf Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11). Perform the five cycles according to the four heat treatments listed in the following table. Set it for 24±2 hours at room temperature. Step Temperature( ) Time(minutes) 1 Min.operating temp. -3 to 0 30±3 2 Room temperature 2to3 3 Max.operating temp. -3 to 0 30±3 4 Room temperature 2to3 No defect or abnormality 16 Humidity Steady State 12.% Sit the capacitor at 40±2 and 90% to 95% humidity for 500±12 hours.temperature, then measure. More than 50MΩ uf 17 High Temperature Load 12.5% More than 50MΩ uf Apply a DC voltage of 150% of the rated voltage for 1000 hours at the maximun operating temperature, and set it for 48 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
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E M C C o m p o n e n t s November 0 -terminal Filters For signal line MEM series MEM0S MEM0SC MEM0V MEM0F MEM608P 0[0805 inch]* 0[0805 inch] 0[0805 inch] 0[0805 inch] 608[060 inch] * Dimensions Code JIS[EIA]
Single Output Switching Power Supply
.. RS- Code: CLP-A Single Output Switching Power Supply SPECIFICATION MODEL OUTPUT INPUT PROTECTION ENVIRONMENT SAFETY EMC (Note 6) OTHERS NOTE DC VOLTAGE RATED CURRENT CURRENT RANGE RATED POWER RIPPLE
Operating Temperature Range: -30 to +85ç (Note 1) Operating Humidity Range: 40 to 80%
All non- products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website search at www.hirose-connectors.com, or contact your Hirose sales representative.
Metallized Polypropylene Film Capacitors DC-Link Capacitor
Metallized Polypropylene Film Capacitors DC-Link Capacitor FEATURES Slim line, low building height Very long useful life time: Up to 100 000 h at U NDC and 70 C High ripple current capability, low ESR,
ATC 600S Series Ultra-Low ESR, High Q, NPO RF & Microwave Capacitors
AC 600S Series Ultra-Low ESR, High Q, NPO RF & Microwave Capacitors Features: Lowest ESR in Class Highest Working Voltage in class 250V Standard EIA Size: 0603 Laser Marking (Optional) RoHS Compliant High
1 POLE - 5A SLIM POWER RELAY
POWER RELAY POLE - A SLIM POWER RELAY FTR-MY Series RoHS compliant FEATURES Width mm, height mm,(% smaller than NY series) area mm, super slim, low power, compact and light weight.gr. Nominal power: mw
BIPOLAR ANALOG INTEGRATED CIRCUIT
DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT μpc8tk SiGe:C LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS DESCRIPTION The μpc8tk is a silicon germanium carbon (SiGe:C) monolithic integrated circuit
