How To Buy A Stw8C2Sa (Cool, Neutral, Warm) Led 3030 Series From Aredenox For $99.99 (White) Or $99 (Black) (White Color) (Black Color) For

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1 Achieving the best system cost in Mid/High Power Mid-Power LED 3030 Series STW8C2SA (Cool, Neutral, Warm) RoHS Product Brief Description This White Colored surface-mount LED comes in standard package dimension. Package Size : 3.0x3.0x0.65mm It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Features and Benefits Thermally Enhanced Package Design Mid Power to High Power up to 1W Max. Driving Current 200mA Compact Package Size High Color Quality with CRI Min. 80 Pb-free Reflow Soldering Application Key Applications Interior lighting General lighting Indoor and out door displays Architectural / Decorative lighting Table 1. Product Selection Table Part Number CCT Color Min. Typ. Max. STW8C2SA Cool White 4700K 5600K 7000K STW8C2SA Neutral White 3700K 4200K 4700K STW8C2SA Warm White 2600K 3000K 3700K 1

2 Table of Contents Index Product Brief Table of Contents Product Nomenclature (Labeling Information) Performance Characteristics - Relative Spectral Distribution - Viewing Angle Distribution - Forward Current Characteristics - Junction Temperature Characteristics - Ambient Temperature Characteristics Color Bin Structure Packaging Information - Mechanical Dimensions / Material Structure - Packaging - Emitter Tape & Reel Packing Recommended Solder Pad Reflow Soldering Characteristics Handling of Silicone Resin for LEDs Precaution For Use Company Information 2

3 Product Nomenclature Table 2. Part Numbering System : X 1 X 2 X 3 - X 4 X 5 - X 6 X 7 - X 8 X 9 Part Number Code Description Part Number Value X 1 Company S X 2 Top View LED series T X 3 Color Specification W8 CRI 80 X 4 Package series C C series X 5 X 6 Characteristic code 2S X 7 Revision A Table 3. Lot Numbering System :Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Lot Number Code Description Lot Number Value Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Year Month Day Top View LED series Mass order Internal Number 3

4 Performance Characteristics Table 4-1. Product Selection Guide, IF=100mA, T A = 25ºC, RH30% Part Number CCT (K) [1] RANK Luminous Intensity [2] Luminous Flux [3] I V (cd) Ф V (lm) Typ. Min Max Min Max Min. CRI R a STW8C2SA K K K K K K K K K K K K J K K J K K Notes : 1. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. 3. Calculated performance values are for reference only. 4

5 Performance Characteristics Table 5. Characteristics, IF=100mA, T A = 25ºC, RH30% Parameter Symbol Value Min. Typ. Max. Unit Forward Current I F ma Forward Voltage V F (100mA) V Reverse Voltage V r V Luminous Intensity (5,000 K) Luminous Intensity (3,500 K) I v (100mA) - I v (150mA) - I v (100mA) - I v (150mA) (81.5) 37.0 (115) 25.9 (77.7) 36.5 (109.6) cd (lm) Color Rendering Index [1] Ra Viewing Angle [2] 2Θ 1/2 120 Power Dissipation P d W Junction Temperature T j ºC Operating Temperature T opr ºC Storage Temperature T stg ºC Thermal resistance (J to S) [3] Rθ J-S /W ESD Sensitivity(HBM) [4] V Notes : 1. Tolerance is 2.0 on CRI measurements. 2. 2Θ 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity 3. Thermal resistance: Rth JS (Junction to Solder) 4. A zener diode is included to protect the product from ESD. LED s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. All measurements were made under the standardized environment of Seoul Semiconductor. 5

6 Relative Emission Intensity Product Data Sheet Relative Spectral Distribution Fig 1. Color Spectrum, Ta = 25, RH30% IF=100mA ~3700K 3700~4700K 4700~7000K Wavelength [nm] Fig 2. Viewing Angle Distribution IF=100mA 6

7 Relative Luminous Intensity IF[A] Product Data Sheet Forward Current Characteristics Fig 3. Forward Voltage vs. Forward Current, Ta= VF[V] Fig 4. Forward Current vs. Relative Luminous Flux, Ta= Forward Current I F [ma] 7

8 y y Forward Current Characteristics Product Data Sheet Fig 5. Forward Current vs. CIE X, Y Shift, Ta= (4200K~7000K) mA 50mA 75mA 100mA 150mA mA x (2600K~4200K) mA 50mA mA 20mA 150mA mA x 8

9 Relative Forward Voltage Relative Luminous Intensity Junction Temperature Characteristics Fig 6. Relative Light Output vs. Junction Temperature Product Data Sheet IF=100mA Junction temperature Tj( O C) Fig 7. Junction Temperature vs. Relative Forward Voltage IF=100mA Junction temperature Tj( O C) 9

10 y y Junction Temperature Characteristics Product Data Sheet Fig 8. Chromaticity Coordinate vs. Junction Temperature IF=100mA (4200K~7000K) x IF=100mA (2600K~4200K) x 10

11 Forward Current I F [ma] Ambient Temperature Characteristics Product Data Sheet Fig 9. Maximum Forward Current vs. Ambient Temperature Ambient Temperature T A [ O C] 11

12 Color Bin Structure Table 6. Bin Code description Part Number Luminous Intensity I F = 100mA Color Chromaticity I F = 100mA Typical Forward Voltage (V f ) Bin Code Min. Max. Bin Code Min. Max. J Z J Z STW8C2SA K Refer to page.14 Z K Z K Table 7. Intensity rank distribution CCT CIE IV Rank K A, B, C J19 K21 K24 K K D, E J19 K21 K24 K K F, G, H J19 K21 K24 K27 Current Available Not yet Available Notes All measurements were made under the standardized environment of Seoul Semiconductor. Seoul Semiconductor sorts the LED package according to the luminous intensity IV. The lumen table is only for reference. 12

13 CIE Y CIE Y CIE Y Product Data Sheet Color Bin Structure CIE Chromaticity Diagram Ta=25, IF=100mA K 5000K D1 D0 5300K C1 D3 D2 5600K C0 C3 D5 6000K C2 D4 B1 C5 6500K B0 B3 C4 A1 B2 B5 7000K A0 A3 B4 A2 A5 A4 4200K 4500K E2 E4 4000K E0 E5 E3 3700K E1 F4 F2 3500K F F5 F3 G14 F1 G K 3200K G24 G12 G11 G23 G34 G22 G K G21 G K G32 G43 G31 H14 G42 H13 H K 2900K G K H12 H23 H34 H11 H22 H33 H44 H21 H32 H K H31 H42 H K 2600K CIE X CIE X K 2900K 3000K 3200K H11 H21 G41 G31 G21 H32 H22 G11 H12 G42 G32 G22 H43 G12 H23 H33 H13 G43 G13 G23 G33 H34 H44 H24 H14 G44 G34 G24 G14 H31 H42 H K 0.38 MacADAM 3STEP Rank CIE X Energy Star binning applied to all 2600~7000K. MACADAM 3 Step binning for 2600~3200K. Measurement Uncertainty of the Color Coordinates : ±

14 Color Bin Structure <IF=100mA, Ta=25 > A0 A1 A2 CIE X CIE Y CIE X CIE Y CIE X CIE Y A3 A4 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y B0 B1 B2 CIE X CIE Y CIE X CIE Y CIE X CIE Y B3 B4 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y

15 Color Bin Structure <IF=100mA, Ta=25 > C0 C1 C2 CIE X CIE Y CIE X CIE Y CIE X CIE Y C3 C4 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y D0 D1 D2 CIE X CIE Y CIE X CIE Y CIE X CIE Y D3 D4 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y

16 Color Bin Structure <IF=100mA, Ta=25 > E0 E1 E2 CIE X CIE Y CIE X CIE Y CIE X CIE Y E3 E4 E5 CIE X CIE Y CIE X CIE Y CIE X CIE Y F0 F1 F2 CIE X CIE Y CIE X CIE Y CIE X CIE Y F3 F4 F5 CIE X CIE Y CIE X CIE Y CIE X CIE Y

17 Color Bin Structure <IF=100mA, Ta=25 > G11 G21 G31 G41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y G12 G22 G32 G42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y G13 G23 G33 G43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y G14 G24 G34 G44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y

18 Color Bin Structure <IF=100mA, Ta=25 > H11 H21 H31 H41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y H12 H22 H32 H42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y H13 H23 H33 H43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y H14 H24 H34 H44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y

19 Mechanical Dimensions Top View Bottom View Cathode Mark (-) Cathode Side View Circuit Cathode 1 Anode 2 Zener Diode Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. Undefined tolerance is ±0.2mm 19

20 Reel Packaging ( Tolerance: ±0.2, Unit: mm ) 1) Quantity : Max 4,500pcs/Reel 2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3) Adhesion Strength of Cover Tape Adhesion strength to be N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape. 4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. 20

21 Recommended Solder Pad Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. This drawing without tolerances are for reference only 4. Undefined tolerance is ±0.1mm 21

22 Reflow Soldering Characteristics Table 7. IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) Time maintained above: - Temperature (TL) - Time (tl) 100 C 150 C seconds 183 C seconds 150 C 200 C seconds 217 C seconds Peak Temperature (Tp) Time within 5 C of actual Peak Temperature (tp) seconds seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 22

23 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 23

24 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5 to 30 and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40 Humidity : less than RH30% b. If the package has been opened more than 4 week(msl_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5 (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. 24

25 Company Information Published by Seoul Semiconductor 2013 All Rights Reserved. Company Information Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. The company is the world s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as npola, deep UV LEDs, "Acrich", the world s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company s broad product portfolio includes a wide array of package and device choices such as Acrich, high-brightness LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors. The company is vertically integrated from epitaxial growth and chip manufacture in it s fully owned subsidiary, Seoul Viosys, through packaged LEDs and LED modules in three Seoul Semiconductor manufacturing facilities. Seoul Viosys also manufactures a wide range of unique deep-uv wavelength devices. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 25