SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS CLASS 3 TRAINING CERTIFICATION TEST (DVD-SMT-E) v.3

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1 This test consists of thirty multiple-choice questions. All questions are from the video: Surface Mount Solder Joint Workmanship Standards (DVD-SMT-E). Use the supplied Answer Sheet and circle the letter corresponding to your selection for each test item. If more than one answer appears to be correct, pick the answer that seems to be the most complete response. Should you wish to change an answer, erase your choice completely. When finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (21 correct answers), or better. Good luck! 1

2 ANSWER SHEET Name: Dat e: 1 True False 2 Yes No 3 True False 4 Yes No 5 True False 6 Yes No 7 True False 8 Yes No 9 Yes No 10 Yes No 11 A B C D 12 A B C D 13 True False 14 True False 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 21 A B C D 22 A B C D 23 A B C D 24 A B C D 25 A B C D 26 A B C D 27 A B C D 28 A B C D 29 A B C D 30 A B C D 2

3 1. The maximum side overhang for chip, J-lead and gull wing components is 50%. 2. If dimension A is 25% of lead width (W), then this component is at the maximum acceptable limit for side overhang. Yes or No 3. The maximum distance that the end of the J-lead may extend over the edge of the land is not specified for class 3 components. 4. Even though this component does not violate minimum electrical clearance, it exceeds the maximum requirement for end / toe overhang, or dimension B. Yes or No 3

4 5. End joint width needs to be a minimum of 50% of the lead width for J-lead and gull wing components. 6. Does this solder joint meet the minimum requirements for end joint width, or dimension C? Yes or No 7. The solder fillet is allowed to touch the body of any component, as long as it does not cover it. 8. Does the following solder joint exceed the maximum requirements for fillet height, or dimension E? Yes or No 4

5 9. This solder joint fails to meet the minimum requirements for heel fillet height, or Dimension F. 10. Must Dimension J be 100% of the component s termination (R) in order to meet minimum requirements for end overlap? Yes or No 11. A process indicator a. is not a defect b. means that the material, equipment or process may require a change c. is an indication the process is causing detectable variations in quality d. all of the above 12. Blowholes and pinholes are examples of a. component misalignment b. process indicators c. solder that has not adhered to the termination d. a gross soldering defect 5

6 13. A void is an allowable condition as long as minimum solder joint requirements have been met. 14. Any adhesive on the land is considered a process indicator for Class 3 products. 15. Nonwetting is when a. there is an open area caused by trapped air within the solder joint b. there is a connection of solder across lands that should not be joined c. solder has not adhered to the land or termination d. solder extends onto the component body 16. Dewetting is when a. a thin film of solder covers the land in some areas and there are irregular mounds in others b. the solder joint is moved while cooling c. stress lines appear on the solder joint d. the component is misaligned 17. The following is an example of a. solder balls b. excess solder c. solder projections d. solder bridging 6

7 18. The following is an example of a. non-coplanarity b. solder bridging c. excessive solder d. solder splashes 19. The following is an example of a. solder splashes b. solder balls c. excessive solder d. solder bridging 7

8 20. The following is an example of a. excessive solder b. solder fines c. disturbed solder d. cracked / fractured joint 21. The following is an example of a. chip out b. insufficient solder c. coplanarity d. tombstoning 8

9 22. The following is an example of a. cracked or fractured joint b. insufficient solder c. cold solder joint d. mounting adhesive on land 23. The following is an example of a. insufficient solder b. non-coplanarity (open connection) c. cracked or fractured joint d. incomplete reflow 9

10 24. The following is an example of a. cracked or fractured joint b. tombstoning c. non-coplanarity d. nicks or chip outs 25. The following is an example of a. solder bridging b. solder fines c. excessive solder d. solder splashes 10

11 26. The following is an example of a. cracked or fractured joint b. disturbed solder c. coplanarity d. insufficient solder 27. The following is an example of a. incomplete reflow b. insufficient solder c. solder fines d. mounting adhesive on land 11

12 28. The following is an example of a. incomplete reflow b. insufficient solder c. tombstoning d. mounting adhesive on land 29. The following is an example of a. incomplete reflow b. nicks or chip outs c. solder fines d. solder splashes 12

13 30. The following is an example of a. disturbed solder joint b. cracks / fractures on component body c. excessive fillet height d. tombstoning 13

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