Memory and CPU Sockets

Transcription

1 Memory and CPU Sockets 2009 Tyco Electronics Corporation. All Rights Reserved. TE logo and Tyco Electronics are trademarks. Other products, logos, and company names herein may be trademarks of their respective owners.

2 Market Environment CPU/Logic Sockets Standards driven by Intel and AMD Markets include server, desktop and notebook Primarily designed in the US Consumed in Asia/Pacific Multiple competitors and commodity pricing Custom ASICs drive lower volume and higher mix AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation.

3 TE Products for Intel Socket B LGA 1366 Server socket (replaces Socket J LGA 771) Tyco Electronics provides three components for LGA1366 socket system Socket: (15au), (30au) ILM: (U Lever), (Straight Lever) Stiffener plate: (DT); (SVR) System of LGA1366 socket Intel is a trademark of Intel Corporation.

4 CPU Socket Roadmap for (Intel & AMD) Socket 700 Socket 604 Socket TW (1248) Micro Contact Socket Server Socket LS (1567) Socket R (2011) Socket J (771) Socket B (1366) Socket B1/B2 (1356) Socket 1207 Socket G34 Desktop Socket 775 AM2 940 AM3 941 Socket H1 (1156) Socket H2 (1155) New AMD FM1 934 Notebook μpga 479 rpga989, rpga988a rpga988b rpga988c rpga II AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation. μpga 638 Socket FS1 (722)

5 TE Products for Intel Socket H LGA 1160 Next generation Intel desktop CPU Replaces Socket T LGA 775 Tyco Electronics provides three components for LGA1366 socket system Socket: ILM: Stiffener Plate: Intel is a trademark of Intel Corporation.

6 TE Products for Socket G rpga 989 Mobile socket (replaces mpga 479) Part number

7 TE Products for AMD Socket G34 LGA 1944 Next generation AMD server CPU Replaces Socket F LGA 1207 Tyco Electronics provides two components for LGA 1944 socket system Socket: ILM: AMD is a trademark of Advanced Micro Devices, Inc.

8 Memory Sockets

9 Market Environment Main Memory Sockets Main Memory module designs are driven by JEDEC standards body. Major memory module makers and computer OEMs are key participants in setting module designs. Tyco Electronic s product focus resides in DDR3

10 DDR3 DIMM LLCR Vertical Through Hole 240 position Retention barb aids during soldering Low level contact resistance Three solder tail lengths available Accepts memory module per JEDEC MO-269 Used in servers and communications equipment Part Number Contact Plating Housing Color Extracto r C olor Tail Length Packaging Gold Flash Natural Natural 2.67 mm Tray Gold Flash Natural Natural 3.18 mm Tray Gold Flash Natural Natural 4.00 mm Tray Gold (15) Natural Natural 2.67 mm Tray Gold (15) Natural Natural 3.18 mm Tray Gold (15) Natural Natural 4.00 mm Tray Gold Flash Black Natural 2.67 mm Tray Gold Flash Black Natural 3.18 mm Tray Gold Flash Black Natural 4.00 mm Tray Gold (15) Black Natural 2.67 mm Tray Gold (15) Black Natural 3.18 mm Tray Gold (15) Black Natural 4.00 mm Tray Gold Flash Black Black 2.67 mm Tray Gold Flash Black Black 3.18 mm Tray Gold Flash Black Black 4.00 mm Tray Gold (15) Black Black 2.67 mm Tray Gold (15) Black Black 3.18 mm Tray Gold (15) Black Black 4.00 mm Tray Gold Flash Orange Natural 2.67 mm Tray Gold Flash Orange Natural 3.18 mm Tray

11 DDR3 DIMM Vertical Surface Mount 240 position Retention barb aids during soldering Accepts memory module per JEDEC MO-269 Used in servers and communications equipment Part Number Contact Plating Housing Color Extractor Color Packaging Gold Flash Black Natural T ray Gold (15) Black Natural T ray Gold (30) Natural Natural T ray Gold (30) Black Black T ray Gold (30) Black Natural T ray

12 DDR3 SODIMM Right Angle Surface Mount 204 position Reverse and Standard module orientation options Available in 4.0 mm and 5.2 mm heights Accepts memory module per JEDEC MO-268 Small form factor enables development of smaller, lighter notebook PCs 4.0 mm Height Part Number Std Keying Part Number Rvs Keying Contact Plating Housing Color Boss Packaging Gold flash Black With Tray Gold (6) Black With Tray Gold (30) Black With Tray Gold flash Gray Without Tray Gold (6) Gray Without Tray Gold (30) Gray Without Tray Gold flash Black With Reel Gold (6) Black With Reel Gold (30) Black With Reel Gold flash Gray Without Reel Gold (6) Gray Without Reel Gold (30) Gray Without Reel 5.2 mm Height Part Number Std Keying Part Number Rvs Keying Contact Plating Housing Color Boss Packaging Gold flash Black With Tray Gold (6) Black With Tray Gold (30) Black With Tray Gold flash Gray Without Tray Gold (6) Gray Without Tray Gold (30) Gray Without Tray Gold flash Black With Reel Gold (6) Black With Reel Gold (30) Black With Reel Gold flash Gray Without Reel Gold (6) Gray Without Reel Gold (30) Gray Without Reel

13 Mini DIMM Right Angle Surface Mount 244 position Reverse and Standard module orientation options Accepts 1.0 mm thick memory module per JEDEC MO-244 Used in servers and communications equipment that require multiple small modules Part Number Keying Contact Plating Height Housing Color Packaging Reverse Gold (30) 9.79 mm Black Tray Standard Gold (30) 9.79 mm Black Tray Reverse Gold (15) 9.79 mm Black Tray Standard Gold (15) 9.79 mm Black Tray