LTR DESCRIPTION DATE APPROVED
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1 REVISIONS LTR DESCRIPTION DTE PPROVED Prepared in accordance with SME Y REV STTUS REV OF PGES PGES Source control drawing PMIC N/ Original date of drawing 12 September 2011 PREPRED BY Ken Beymer CHECKED BY Ken Beymer PPROVED BY Michael. Radecki DESIGN CTIVITY DL LND ND MRITIME COLUMBUS, OH TITLE INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERNCE, 0805 CODE IDENT. NO. MSC N/ REV PGE 1 OF E03
2 1. SCOPE 1.1 Scope. This drawing describes the requirements for inductors, SMD, chip. These inductors are composed of a single or double layer dielectric thin film and are of small size and tight tolerances. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: J U * Drawing Number Value (see 1.2.1) Tolerance (see 1.2.2) Termination Finish (see 1.2.3) dditional Testing Option (see 1.2.4) Value. The nominal inductance value, expressed in nanohenries (nh), is identified by a three-digit number. The first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 nh, the letter R is used to indicate the decimal point. 1R2 indicates 1.2 nh; 150 indicates 15.0 nh Tolerance. The inductance tolerance is identified by a single letter in accordance with table I. TBLE I. Tolerance. Symbol B C D G J Tolerance (±) 0.1 nh 0.2 nh 0.5 nh 2 percent 5 percent Termination Finish. Termination finish is identified by a single letter as shown in table II. TBLE II. Termination Finish. Symbol U Termination Finish Base metallization-barrier metal-solder coated (tin/lead alloy with a minimum of 4 percent lead) Testing Option. To require additional group C testing, use the appropriate letter from table III. If additional testing is not desired, leave this location blank. TBLE III. Testing Options. Letter Testing Option C Full additional testing L 500 hours life test only H 500 hours steady state humidity only T 100 temperature cycles only - No additional testing DL LND ND MRITIME REV PGE 2
3 2. PPLICBLE DOCUMENTS 2.1 General. The documents listed in this section are specified in section 3 this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in section 3 of this specification, whether or not they are listed. 2.2 Government Documents Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPRTMENT OF DEFENSE STNDRDS MIL-STD Test Methods Standard Electronic and Electrical Component Parts. MIL-STD Test Method Standard Microcircuits. MIL-STD Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https//assist.daps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins venue, Building 4D, Philadelphia, P ). 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. GILENT TECHNOLOGIES gilent pplication Note How To ccurately Evaluate Low ESR, High Q RF Chip Devices. gilent Literature Number E E Family Network nalyzers Configuration Guide. (Copies of these documents are available online at or from gilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara C 95051). INTERNTIONL ELECTROTECHNICL COMMISION (IEC) IEC Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD). IEC Robustness of Terminations and Integral Mounting Devices. (Copies of these documents are available online at or from Global Engineering Documents, ttn: Customer Service Department, 15 Inverness Way East, Englewood CO ). 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. DL LND ND MRITIME REV PGE 3
4 3. REQUIREMENTS 3.1 Item Requirements. The individual item requirements shall be as specified herein. These inductors shall be capable of meeting all stated electrical, environmental, and mechanical requirements. 3.2 Pure Tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of inductor components and solder shall not exceed 96 percent, by mass. Tin shall be alloyed with a minimum of 4 percent lead or 4 percent silver, by mass (see 6.4). 3.3 Interface and Physical Dimensions. The interface and physical dimensions shall be as specified herein (see figure 1). L W B1 T B2 Dimensions L ±.0039 W ±.0039 T ±.0051 B1 ±.0059 B2 ± Inches mm NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3.4 Electrical Characteristics Electrical Testing. FIGURE 1. Physical Dimensions and Configuration. When 100 percent electrically tested, the following conditions will apply: a. (L) (at +25 C): Shall be as specified in b. Quality Factor (Q) (at +25 C): Shall be as specified in c. Direct Current Resistance (Rdc) (at +25 C): Shall be as specified in DL LND ND MRITIME REV PGE 4
5 3.4.2 (L). When tested on gilent RF Impedance/Material nalyzer in accordance with gilent Tecnologies pplication Note , the shall be as shown in table IV within required tolerance as shown in table I. Test Frequency: 450 MHz ±50MHz Quality Factor (Q). When tested on gilent RF Impedance/Material nalyzer in accordance with gilent Tecnologies pplication Note , the Quality Factor shall be as shown in table IV. (nh) Test Frequency: 450 MHz ±50MHz. 450 MHz Test Frequency 900 MHz Test Frequency TBLE IV. Electrical Characteristics MHz Test Frequency 2400 MHz Test Frequency SRF min (GHz) Rdc max (Ohm) L Q L Q L Q L Q (nh) Typical (nh) Typical (nh) Typical (nh) Typical Direct Current Resistance (Rdc). When tested in accordance with Method 303 of MIL-STD-202G, the Direct Current Resistance shall be as shown in table IV Self-Resonant Frequency (SRF). When tested on gilent 8720E Family Network nalyzers according to gilent configuration guide, literature number E, the Self-Resonant Frequency shall be as shown in table IV Working Current (Idc). When tested by root mean square multimeter, the root mean square Working Current shall be as shown in table IV. The following details shall apply: b. Idc max is measured for 15 C rise at 25 C ambient temperature. 3.5 Solderability. When tested in accordance with IEC , the immersed metallized surface shall be at least 95 percent covered with a smooth solder coating. The remaining 5 percent of the surface may contain small pinholes or exposed termination material; however, these shall not be concentrated in one area. The following details shall apply: a. Solder temperature: 235 C ± 5 C. b. Dwell time: 2 + 0, -0.5 seconds. c. Sample size: 20 pieces with zero defects permitted. 3.6 Resistance to Soldering Heat. When tested in accordance with IEC , the following details shall apply: a. Temperature: 260 ± 5 C. b. Test duration: 10 ± 0.5 seconds. c. Direct Current Resistance change: d. Shall change not more than +20% for Resistance values 50 m. Idc max (m) DL LND ND MRITIME REV PGE 5
6 e. Shall change not more than +10 m for Resistance values 50 m. f. Sample size: 20 pieces with zero failures permitted. 3.7 Push-off. When tested in accordance with method Ue2 of IEC , the inductor shall withstand 5 newton force applied for 10 seconds. The following details shall apply: b. Sample size: 20 pieces with zero failures permitted. 3.8 Shear. When tested in accordance with method Ue3 of IEC , the inductor shall withstand 5 newton force applied for 10 seconds. The following details shall apply: b. Sample size: 20 pieces with zero failures permitted. 3.9 Temperature Cycling (air-to-air). When tested in accordance with Method of MIL-STD-883, the following details shall apply: b. Number of cycles: 10. c. Extreme temperatures: +85 C, -40 C. d. Exposure time at extreme temperatures: 30 ± 1 minute. e. Direct Current Resistance change: Shall change not more than + 10%, - 20%. f. Sample size: 21 pieces with zero failures permitted Humidity, Steady State. When tested in accordance with Method 103 of MIL-STD-202, the following details shall apply: b. Test duration: 168 hours. c. Temperature: +85 C. d. Humidity: 85% RH. e. Test current: working current Idc as specified in Table IV. f. Direct Current Resistance change: Shall change not more than + 10%, - 20%. g. Sample size: 21 pieces with zero failures permitted Life (at elevated ambient temperature). When tested in accordance with Method 108 of MIL-STD-202, the following details shall apply: b. Test duration: 4 hours. c. Temperature: +125 C. d. Test current: working current Idc as specified in Table IV. e. Direct Current Resistance change: Shall change not more than + 10%, - 20%. f. Sample size: 21 pieces with zero failures permitted Marking. s a minimum, marking shall be on the package due to the small size of the chips. The package marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in paragraph 1.2 with manufacturer s name or CGE code and date code. The manufacturer may, at their option, mark some information on the chips Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall perform the inspections specified herein on a sample of parts agreed upon by the manufacturer and DL Land and Maritime - VT Certificate of compliance. certificate of compliance shall be required from manufacturers requesting to be an approved source of supply Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. DL LND ND MRITIME REV PGE 6
7 4. VERIFICTION 4.1 Qualification inspection. Qualification inspection is not required. 4.2 Conformance inspection (see 3) Inspection of product for delivery. Inspection of product for delivery shall consist of all tests specified herein. PPM testing and calculation are not applicable. 5. PCKGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of material is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Point s packaging activities within the Military Service or Defense gency, or within the military service s system commands. Packaging data retrieval is available from the managing Military Department s or Defense gency s automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Inductors conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this drawing has been qualified for listing, this drawing becomes obsolete and will not be used for new design. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for notification of change of product to acquiring activity, if applicable. d. Requirements for packaging and packing. 6.3 Replaceability. Inductors covered by this drawing will replace the same commercial device covered by a contractor-prepared specification or drawing. 6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. lloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to STM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.5 Users of record. Coordination of this document for future revisions is coordinated only with the approved sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing should be in writing to: DL Land and Maritime, Columbus, TTN: DL Land and Maritime - VT, Post Office Box 3990, Columbus, OH , by to transformer@dla.mil or by telephone (614) or DSN pproved sources of supply. pproved sources of supply are listed herein. dditional sources will be added as they become available. For assistance in the use of this drawing, contact DL Land and Maritime, Columbus, TTN: DL Land and Maritime-VT, Post Office Box 3990, Columbus, OH , by to transformer@dla.mil, or by telephone (614) or DSN DL LND ND MRITIME REV PGE 7
8 2/ DL-Land and Maritme Drawing - 3/ TBLE V. Inductor Values and Tolerances. 1/ (nh) vailable Tolerances Vendor Similar Designation 4/ 1R2 * U * 1.2 B, C, D DQL051R2_EWTR 1R5 * U * 1.5 B, C, D DQL051R5_EWTR 1R8 * U * 1.8 B, C, D DQL051R8_EWTR 2R2 * U * 2.2 B, C, D DQL052R2_EWTR 2R7 * U * 2.7 B, C, D DQL052R7_EWTR 3R3 * U * 3.3 B, C, D DQL053R3_EWTR 3R9 * U * 3.9 B, C, D DQL053R9_EWTR 4R7 * U * 4.7 B, C, D DQL054R7_EWTR 5R6 * U * 5.6 C, D DQL055R6_EWTR 6R8 * U * 6.8 C, D DQL056R8_EWTR 8R2 * U * 8.2 C, D DQL058R2_EWTR 100 * U * 10.0 G, J DQL05100_EWTR 120 * U * 12.0 G, J DQL05120_EWTR 150 * U * 15.0 G, J DQL05150_EWTR 180 * U * 18.0 G, J DQL05180_EWTR 220 * U * 22.0 G, J DQL05220_EWTR 1/ When * is used for coded values, it s the contractors responsibility to select those options alowed by the DL-Land and Maritime drawing. 2/ Parts must be purchased to the DL-Land and Maritime PIN to assure that all performance requirements and tests are met. 3/ Complete PIN shall include symbols to indicate inductance tolerance and testing option (see 1.2). 4/ Complete vendor PIN shall include symbols to indicate inductance tolerance. Vendor Vendor CGE Vendor name and address SNU G VX Israel LTD 3 Hamarpe Har Hahotzvim Jerusalem, Israel VX Czech Republic s.r.o. - zavod Sokolovska Uherske Hradiste, Czech Republic DL LND ND MRITIME REV PGE 8
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