Investor and Analyst Presentation Jochen Hanebeck Division President Automotive London, 28 September 205
Worldwide automotive semiconductor vendor ranking 204; Infineon overpasses Renesas in H CY5 Global market shares 203 Delta 204 Renesas 3.3% -.3%pt 2.0% 2 Infineon 9.6% +0.9%pt 0.5% 3 STM 7.9% -0.%pt 7.8% 4 Freescale 7.4% +0.%pt 7.5% 5 NXP 6.5% +0.3%pt 6.8% According to financial figures, Infineon becomes # in H CY5 reaching $.362m vs. $.34m for Renesas. Others 28.5% Power 24.8% Infineon +3.5% Toshiba 3.7% 4.7% 6.% ST TI 6.2% 6.4% FSL Renesas 9.5% Bosch Source: Strategy Analytics, April 205 Market shares by product Others 36.3% Sensors 2.% Bosch.5% 7.7% 3.7% Micronas 5.9% 7.0% Allegro 6.6% Freescale Melexis ADI Infineon +0.% +/-0% Microcontroller Others NXP.8% Cypress 4.0% 4.6% Microchip 4.8% TI Infineon 7.6% 8.7% 20.8% 37.7% Renesas Freescale 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 2
4 megatrends are shaping ATV market, significantly increasing the semiconductor content of vehicles ADAS/Autonomous driving From ADAS to semi-automated and finally autonomous driving Every world region is striving for 0-accident xev/emobility Mandated CO 2 reductions make electrification of powertrain inevitable Advanced connectivity is driven by making the car part of the Internet The car will be fully connected (V2I, V2V, in-vehicle) Connectivity Increased connectivity and software content increase risk exposure to hackers Internal/external connectivity must be secured Advanced security 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 3
4 megatrends are shaping ATV market, significantly increasing the semiconductor content of vehicles ADAS/Autonomous driving From ADAS to semi-automated and finally autonomous driving Every world region is striving for 0-accident xev/emobility Mandated CO 2 reductions make electrification of powertrain inevitable Advanced connectivity is driven by making the car part of the Internet The car will be fully connected (V2I, V2V, in-vehicle) Connectivity Increased connectivity and software content increase risk exposure to hackers Internal/external connectivity must be secured Advanced security 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 4
The 5 levels of increased automation (VDA/SAE definition) Level 0- Level 2 Level 3 Level 4 Level 5 Permanent monitoring by the driver System is driving, with more or less backup by the driver. In case of failure the system must run for a certain time on a backup. No Automation or Assisted Driver only E. g.: Lane Departure Warning, Blind spot Detection Partial Automation Driver monitors the automated functions E. g.: Traffic Jam Assist, Parking Assistant, Lane Keep Assist High Automation System monitors the car environment and gives control to driver beyond defined parameter values E. g.: Traffic Jam Chauffeur, Highway, Chauffeur, Garage Parking Amendments of current regulations are necessary (e.g. Vienna StVO, ECE-R79) Full Automation System can take full control beyond defined limits of a specific application E. g.: Automated Driving (Highway Pilot, Valet Parking) Autonomous Driving/Driverless System can tackle all driving situations. No Driver necessary from start to destination. E. g.: Google Car, Robot Taxi Source: BASt und VDA 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 5
ADAS system overview Sense Compute Actuate Camera Inside LIDAR Radar Graphics Processor Powertrain Domain Controller Camera V2X Outside Ultrasonic Sensor Fusion µc Safety Domain Controller 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 6
More sensors required for each automation level Sense Sensor technologies 205 Euro- NCAP* 208 Euro- NCAP* Level 2 Level 3 Level 4/5 Front looking camera Front looking radar Front looking lidar 0.5 0.5 Surround camera Corner radar Surround radar 2 2 4 4 4 4 Rear looking camera Rear looking radar Driver monitoring Camera V2X Sensor Ultrasonic sensors Surround Radar 0-2 sensors per car 8 radar sensors e.g. for garage parking Radar Camera Lidar * Euro-NCAP is focusing on collision avoidance, requirements are changing over time 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 7
Innovations for driver, road and pedestrian safety Infineon is the market leader in Radar, 0 millions chips shipped already Sense Freescale Others Infineon Vision Zero + Autonomous Driving ATLAS IC st SiGe 77GHz Transceiver STM Mid Range Radar st 77GHz product in ewlb package Dual Chip Radar Solution st complete System solution: 400 GHz RF, µc, Power Supply Next Gen. of Dual Chip Radar Solution 600 GHz RF, AURIX TM 3 rd Gen, Power Supply Single Chip Radar Solution (CMOS) 2009 Today > 2022 *Source: IHS ADAS Sensor Market Shares 204 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 8
Camera system overview Mono camera Sense AURIX as Host Controller Stereo camera Image processor (e.g. Mobileye, Nvidia) + + Image processor/ FPGA + + Time-of-flight camera + + Image processor 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 9
Infineon AURIX microcontrollers make autonomous driving reliable Compute During the CES 205, Audi demonstrated their autonomous driving capabilities. Audi s piloted driving concept car Jack, an Audi A7 Sportback, completed a 550 mile piloted drive from Silicon Valley to Las Vegas. The central driver assistance ECU ( zfas ) is the core of future systems for piloted driving for Audi. Within zfas Infineon s AURIX is the interface to the car architecture, hosts different functions and acts as safety monitor. Courtesy: AUDI * zfas = zentrales Fahrerassistenzsystem = German term for central driver assistance ECU. 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 0
Fail operational actuators: BOM to grow by factor.3 with level 3 to 5 Actuate EPS System EPS E-Motor EPS Electronic control unit ZF Lenksysteme Sense Compute Actuate Safe power supply 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved.
Camera Radar Lidar Sensor Fusion Total BOM Camera Radar Lidar Sensor Fusion Actuators Total BOM Camera Radar Lidar Sensor Fusion Actuators Total BOM Semiconductor content itemized to automation levels Average ADAS semiconductor content per level of automation Level 2 Level 3 Level 4 0% 20% $550 35% 2% 8% $400 40% 25% 5% 60% $00 45% 40% 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 2
4 megatrends are shaping ATV market, significantly increasing the semiconductor content of vehicles ADAS/Autonomous driving From ADAS to semi-automated and finally autonomous driving Every world region is striving for 0-accident xev/emobility Mandated CO 2 reductions make electrification of powertrain inevitable Advanced connectivity is driven by making the car part of the Internet The car will be fully connected (V2I, V2V, in-vehicle) Connectivity Increased connectivity and software content increase risk exposure to hackers Internal/external connectivity must be secured Advanced security 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 3
Semiconductor content of EV/HEV vehicles falls right into Infineon's core competence Average semiconductor content Other $70 Other $704 Power µc 4% 6% 4% Sensors 27% 76% $372 Power µc % 7% Sensors Other $338 43% Power µc 3% 23% Sensors $338 55% 2% Internal Combustion Engine Vehicle Add-on for Plug-In-Hybrid Electrical Vehicle (PHEV) Electric Vehicle Source: Strategy Analytics, "Automotive Semiconductor Demand Forecast 203 2022", June 205. 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 4
Infineon is best positioned to benefit from xev car ramp Model S Mass Market OEM Kangoo Twingo Premium OEM A3 e-tron V60, Q5 A6 S60, XC90 Passat, Golf Jetta FCEV Soul EV Focus LaCrosse, Regal, Malibu Premium OEM 2 Mass Market OEMs Zoe E-Class S-Class B-Class 508RHX 3008 335i - 535i 2 series - x3 i3 i8 e-golf e-up Panamera Cayenne Qin Ray EV ix35 M Tong Yue China Hybrid Bus EV50 EJ02 Optima/Sonata Grandeur Mass Market OEM HEV in Production HEV Future SOP EV in Production EV Future SOP Fuel Cell in Production 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 5
4 megatrends are shaping ATV market, significantly increasing the semiconductor content of vehicles ADAS/Autonomous driving From ADAS to semi-automated and finally autonomous driving Every world region is striving for 0-accident xev/emobility Mandated CO 2 reductions make electrification of powertrain inevitable Advanced connectivity is driven by making the car part of the Internet The car will be fully connected (V2I, V2V, in-vehicle) Connectivity Increased connectivity and software content increase risk exposure to hackers Internal/external connectivity must be secured Advanced security 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 6
Radar Camera Lidar Basic security considerations Secure On-board communication Firewall & Gateway Basic protection of single ECUs (Immobilizer & Access) Connectivity Gateway/ Data Fusion Sandboxing Driving Domain ADAS Domain Body & Comfort Domain Infotainment Domain Torque Control Dynamics Control Energy Management HVAC Lighting Theft protection Navigation HMI Entertainment 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 7
Infineon s product portfolio for security Gateway / Firewall Powertrain Domain Controller Chassis Domain Controller Body Domain Controller Infotainment Domain Controller Engine Control Car2Car Com Seat Control Head Unit Battery Mgmt. ABS/ESP Door Module E-Call/cell wireless Inverter ACC Air Condition Connectivity ECU Immobilizer AUDO MAX AURIX SLI 76 SLI 97 TPM SLI 97 Car2Car Application: Powertrain/Safety Application: Cellular Com Application: Car Services Application: Car2Car Communication Driver: On Board Security Integrated 2 Driver: Network auth. Driver: Standards reuse Discrete Hardware Security Driver: Network integrity, Privacy 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 8
Infineon ideally positioned to benefit most from megatrends ADAS, xev and security ADAS/Autonomous driving xev/emobility Advanced security Connectivity Connectivity 6,700 0,700 [$m] [$m] [$m] [$m],930 4,030,380 2,760 4,740 5 200 700 875,400 3,290 205 2020 2025 Opt. 2025 Agg. 205 2020 Biggest drivers for automotive Source: IHS, Strategy Analytics, IFX internal estimations 2025 205 2020 2025 Key enabler for connectivity Note: Total IFX considered (ATV - HSM value considered only, not full µc BOM + secure discrete elements from CCS) 205 2020 2025 Market shaped by mobile coms players 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 9
ADAS, CO 2 reduction and adoption of premium features drive Infineon growth Vehicle production Drivers for semiconductor content per car CO 2 reduction Advanced safety Comfort, premium ~2% growth per annum highest growth in emerging markets Western Europe recovering, the US on high level driven by legislation improvements of ICE (e.g. electric steering, electric pumps and motors) adoption of EV/HEV current: crash avoidance next: assisted Driving future: autonomous driving premium cars are early adopters of high-end comfort and safety features trickling down to midrange Sources: IHS Inc., Strategy Analytics, Infineon 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 20
Market growth based on car production growth and increasing number of features Light vehicle production forecast Semiconductor value per car by region CAGR +3.0% ~+2% 02.296 [USD] Total 382 354 CAGR +.6% 88.4 3.328 4.448 8.720 7.47 20.742 +6.% -2.% -0.5% +.6% +2.0% 7.960 4.046 8.508 8.932 22.875 RoW S.Korea Japan N.America Europe China China Europe N. America Japan S. Korea 30 246 497 449 509 455 53 488 46 375 CAGR +4.% CAGR +2.% CAGR +2.3% CAGR +.0% CAGR +2.% 23.366 +5.% ~+3% 29.975 Others 224 208 CAGR +.5% 205 2020 Source: IHS, September 205 2020 205 Source: Strategy Analytics, based on LMC production forecasts Q 205 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 2
Infineon is strong in all markets, balancing exposure to slower growth in China World Europe APAC & RoW (*). Renesas 2.0% 2. Infineon 0.5% (+0.9%pt) 3. STMicro 7.8% 4. Freescale 7.5% 5. NXP 6.8% 2. Infineon (+.0%pt) 4.%. Infineon (+.2%pt) 0.9% 4 4 North America Japan China Korea 5 2 3. Infineon 8.8% (+0.2%pt) 3 4. Infineon (*) 5.2% (+0.9%pt) 2 2 3. Infineon 8.9% (+0.7%pt) 6. Infineon 4.6% (+.3%pt) (*: China, Korea, Russia, India, South America & further countries Source: Strategy Analytics, April 205 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 22
Automotive financials at a glance Revenue and segment result development FY2:,660 +3% FY3:,740 +5% FY4:,965 ~+20% [EUR m] 700 600 50 58 58 484 500 459 455 452 425 428 46 424 39 400 377 300 FY5: ~2,350 598 62 20% 5% 0% 200 00 0 55 63 54 47 20 37 52 57 55 66 70 69 72 64 7 Q FY2 Q2 Q3 Q4 Q FY3 Q2 Q3 Q4 Q FY4 Q2 Q3 Q4 Q FY5 ATV revenue ATV SR SR margin Q2 Q3 Q4* 5% 0% * Based on Q4 guidance, as of 30 July 205 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 23
Summary Automotive track record for 40 years: #2 in Automotive globally first time double digit market share, closing gap to Renesas Consistent revenue growth and profitability Growth drivers: Compound annual car production growth of ~2% Compound annual semiconductor content growth of 3%-4% CO 2 reduction, Advanced safety and comfort Differentiators: System leader in Safety/ADAS, CO 2 reduction Security expertise Quality excellence Broad regional customer base 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 24
Glossary ABS Anti-lock braking system PMD PMD Technologies GmbH ACC Adaptive Cruise Control ROW Rest of world AEB Autonomous Emergency Braking SAE Society of Automotive Engineers ADAS Advanced driver assistance systems SOP Start of production ATV Automotive segment StVO Road traffic act BASt CAGR The Federal Highway Research Institute Compound annual growth rate VDA German Association of the Automotive Industry DC/DC Direct current/direct current converter V2X Vehicle to Infrastructure ECU Electronic control unit xev EV and HEV EMS Engine management system EPS Electric power steering ESC Electronic stability control EV Electric vehicle ewlb embedded wafer-level ball grid array HEV Hybrid electric vehicle IC Integrated circuit ICE Internal combustion engine Disclaimer: This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group. These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected. Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements. 205-09-28 Copyright Infineon Technologies AG 205. All rights reserved. 26