5-line IPAD, HDMI control line ESD protection Features Datasheet - production data Figure 1. Pin configuration (bump side) and schematic Leed-free Flip-Chip package ( bumps) Low line capacitance High efficiency in ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Complies with the standards: IEC 61000-4-2 Level 4 ± 15 kv (air discharge) ± kv (contact discharge) IEC 61000-4-2 Level 1 ± 2 kv (air discharge) ± 2 kv (contact discharge) Application Where ESD protection for HDMI control lines (CEC, HPD, SCL and SDA) is required: Mobile phones and communication systems Portable multimedia players Camcorder, digital still cameras Description The HDMI05-CL01F3 chip is a low capacitance ESD protection for HDMI control pins. It also integrates a pull-up resistor for I²C bus and a pulldown resistor for hot plug detect. The ESD protection circuitry prevents damage to the protected device when subjected to ESD surges up to 15 kv. TM: IPAD is a trademark of STMicroelectronics. HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC. July 2015 DocID1745 Rev 3 1/ This is information on a product in full production. www.st.com
Characteristics HDMI05-CL01F3 1 Characteristics Table 1. Absolute maximum ratings (T amb = 25 C) Symbol Parameter Value Unit V PP External pins (A1, A2, A3, B3 and C3): ESD IEC 61000-4-2, level 4 - air discharge ESD IEC 61000-4-2, level 4 - contact discharge Internal pin (C1): ESD IEC 61000-4-2, level 1 - air discharge ESD IEC 61000-4-2, level 1 - contact discharge P d Line resistance power dissipation at 70 C 60 mw T op Operating temperature range -30 to + 5 C T stg Storage temperature range -55 to + 150 C 15 2 2 kv Figure 2. Electrical characteristics - definitions I Symbol Parameter V BR = Breakdown voltage I RM = Leakage current @ V V RM = Stand-off voltage C = Line capacitance line RM VBR VRM IR IRM IRM IR VRM VBR V Table 2. Electrical characteristics (T amb = 25 C) Symbol Test condition Min. Typ. Max. Unit V BR I R = 1 ma 14 V I RM V RM = 3 V per line 50 200 na R 1, R 2 1575 1750 1925 Ω R 3 0 100 120 kω C line V line = 0 V, V osc = 30 mv, F = 1 MHz (measured under zero light conditions, B2 and C2 bumps connect together) 10 12 pf 2/ DocID1745 Rev 3
Characteristics Figure 3. S21(dB) versus frequency on A1 Figure 4. Analog crosstalk measurements B3-A3 0 S21 (db) 0 Crosstalk (db) -2-4 -6 A1_0V A1_3.6V A1_2.5V -5-10 B3_A3_0V B3_A3_3.6V B3_A3_2.5V B3_A3_5.5V - A1_5.5V -15-10 -12-14 -20-25 -16-1 -20-22 -30-35 F(Hz) -40 100k 1M 10M 100M 1G 100k 1M 10M 100M 1G F(Hz) Figure 5. Digital crosstalk measurement A3-B3 with 5 V applied on C1 Figure 6. ESD response to IEC 61000-4-2 (+ kv contact discharge) on CEC line (A2) 1 V/Div Output 20 V/Div C2 50 mv/div 20 ns/div Input VCL C1 20 ns/div C2 20 ns/div Figure 7. ESD response to IEC 61000-4-2 (- kv contact discharge) on CEC line (A2) Figure. Line capacitance versus reverse applied voltage on A2-B2 C2 20 V/Div VCL C(pF) 10.0 6.0 4.0 2.0 20 ns/div 0.0 0 2 4 6 V (V) R 10 12 14 DocID1745 Rev 3 3/
Typical application schematic HDMI05-CL01F3 2 Typical application schematic Figure 9. Implementation with HDMI type C connector HDMI DRIVER 4 TMDS channel A1 A2 A3 B1 B3 C1 C2 C3 B2 ESDAULC6-F3 CEC 5V SCL SDA HPD 5V 2 x 1K75 1 2 3 45 6 7 9 10 TYPE C HDMI CONNECTOR TMDS DATA2 SHIELD TMDS DATA2 + TMDS DATA2 - TMDS DATA1 SHIELD TMDS DATA1 + TMDS DATA1 - TMDS DATA0 SHIELD TMDS DATA0 + TMDS DATA0-11 TMDS CLK SHIELD 12 TMDS CLK + 13 TMDS CLK - 14 DDC/ EEC GROUND 15 CEC 16 SCL 17 SDA 1 RESERVED 19 +5V POWER HOT PLUG DETECT 100K HDMI05-CL01F3 4/ DocID1745 Rev 3
Package information 3 Package information Epoxy meets UL94, V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 3.1 Flip-Chip package information Figure 10. Flip-Chip package outline 400 µm ± 40 255 µm ± 40 605 µm ± 55 170 µm 400 µm ± 40 1.14 mm ± 30 µm 1.14 mm ± 30 µm DocID1745 Rev 3 5/
Package information HDMI05-CL01F3 3.2 Packing information Figure 11. Footprint Figure 12. Marking Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening : 220 µm recommended Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year x y x w z w Figure 13. Tape and reel outline Dot identifyng Pin A1 location 4.0 ± 0.1 Ø 1.5 ± 0.1 1.75 ± 0.1.0 ± 0.3 1.24 STE xxz yww STE xxz yww STE xxz yww 3.5 ±- 0.1 0.69 ± 0.05 1.24 4.0 ± 0.1 All dimensions in mm User direction of unreeling 6/ DocID1745 Rev 3
Ordering information 4 Ordering information Figure 14. Ordering information scheme HDMI 05 - CL 01 F3 Function HDMI = HDMI Protection Number of lines 05 = 5 lines Application CL = Control lines Version 01 = without CEC Pull-up integrated Package F3 = Flip-Chip 0.4 mm pitch Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode HDMI05-CL01F3 JN Flip-Chip 1.9 mg 5000 Tape and reel (7 ) 5 Revision history Table 4. Document revision history Date Revision Changes 30-Apr-2010 1 Initial release. 14-Mar-2014 2 Updated Figure 9. 16-July-2015 3 Removed erroneous watermark from the document and reformatted to current standard. DocID1745 Rev 3 7/
IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved / DocID1745 Rev 3