PCB Requirements & Specifications

PCB Requirements & Specifications Version 2013.8

1. INTRODUCTION 1.1. Application This document establishes the minimum technical and qualitative requirements necessary for the printed circuit boards manufactured for the IMI group. It applies to all the types of printed circuits. It will be supplemented, where necessary by a specific schedule of requirements, according to particular IMI requests. This document is to be read in conjunction with the IMI group SQA manual. 1.2. General information The PCBs must be manufactured so as to produce a uniform quality, free from any defect and/or flaw which could affect the lifespan, the appearance or the performance of the product. The circuits must conform to the IPC 600 standard. For automotive PCB, IPC 600 class 2 minimum is required, but class 3 may be requested. Certain specifications from IMI or from IMI s customer may be used to supplement/replace these requirements. Should the supplier be uncertain of the application of the PCB, they should ask their IMI SQE representative without hesitation so that the requirements can be determined. Within quotation phase, the Supplier is required to use and follow PCB Specification form, specifying other specific requirements and standards for each project see Appendix 6. 1.3. Production All the parts manufactured must be the exact copy of the IMI gerber files. Each PCB manufacturer has to make their analysis and make their working data in order to deliver PCB according IMI specification. The data should be in accordance to format RS274-X. Any change affecting the production of the printed circuits will only be permitted after notification and official acceptance from company IMI (see IMI SQA manual) The following paragraph gives the various cases of notification and tender to which the supplier must conform. The PCB manufacturers are fully responsible for to implement all necessary inspections during its manufacturing process to be able to manufacture and deliver PCB according to the technical specifications, the quality and reliability objectives and the delivery requirements defined by IMI. 1.3.1 Prohibition of transfer of production to a third party Whatever the reason, it is forbidden for the supplier to transfer or subcontract any part of an order or contract to another manufacturer without prior written permission from IMI. This, once the purchase order / contract has been validated by both parties. Page 2

1.4. Requirements of notification and tender for IMI. A - Case of notification of modification for IMI The supplier will officially inform (mail, fax, E-Mail) their local Supplier Quality Assurance engineer at IMI for any modification for the design or the process as indicated in the table below. IMI can thereafter choose to require a tender for homologation PPAP. Important: It is responsibility of the supplier to ensure (acknowledgement of delivery etc.) that IMI has acknowledged the notification of change. Requirement 1 - Production starting with new or modified tools (except perishable tools), including additional or replacement tooling. 2 - Production after reconditioning or repairing of tools or of existing equipment. 3 - Production using tools and/or equipment transferred to a new site or starting from an additional site. 4 - Change of subcontractor for a part and/or of a service which affects the printed circuits, their form, their function, their resistance and/or the requirements of performance prescribed by IMI. 5 - Printed circuits manufactured with tools which have remained inactive for the series production for twelve months or more. Clarification or examples This requirement applies only to the specific tools which because of their form or single function, can influence the integrity of the end product. Standard tools (measuring instruments etc.) are not taken into account. Examples of perishable tools: press punch, photo engraving film, stencil key set of screen printing, test points... Reconditioning means the rebuilding and/or the modification of a tool to increase its capacity or to change its existing function. Repairing is defined here as an activity which changes the approved sequence of the product (process flowchart) Tools and/or equipment which has changed place in a workshop or has been transferred between workshops from two different sites For the parts and/or the services that affect none of the cases quoted previously for printed circuits, the supplier is responsible for their homologation For printed circuits which are manufactured following the period of inactivity of the tooling for twelve months or more, a notification is required if IMI does not forward an order request to the supplier Page 3

6 - Modifications by a subcontractor of the supplier of the product and/or production process of the product manufactured which affects the printed circuits, their form, their function, their performance and/or their resistance. 7 - Modification in the testing method/or of inspection of the printed circuits (new technology etc.) The supplier will support its subcontractor in order to carry out the notification. This modification should not have any influence on the criteria of acceptance initially defined. The supplier will have to provide evidence to IMI that the modification provided results at least equivalent to those from the preceding method. B - Case of submission of Initial Samples to IMI Requirement Clarification or examples 1 - A new printed circuit An initial submission or a printed circuit previously approved having a new number and/or is modified is regarded as a new printed circuit 2 - Correction of a failure on a printed A failure can be: circuit previously submitted - the performance of the printed circuit - a dimensional problem and/or a capability problem - a problem with a subcontractor a homologation supplements replacing a provisional homologation - problems of tests, including material, of performance, technical 3 - Engineering change of the files of design, the characteristics and/or the matters intended for the production of the printed circuits validation A submission is required for all the engineering changes concerning the files of design and/or the characteristics of the circuits and/or materials constitutive of the circuits Page 4

2. PROTOCOL FOR DELIVERY OF THE PCBs IN MASS PRODUCTION TO IMI It is responsibility for the supplier to guarantee the conformity of the products delivered to company IMI with the contractual requirements previously formalized. The supplier is not authorized to deliver non conforming parts to IMI criteria, except in the case of an exemption or derogation signed by IMI. 2.1. Electrical test of the circuits. All the printed circuits manufactured for IMI must be 100% electrically checked (all the circuits of all the panels must be tested) prior to delivery. Each individual PCB panel must be identified a having been tested electrically by the supplier, preferably with an automatic test mark (laser, electronic stamp etc). The electric range of the test must known by the supplier and included in his PPAP, for automotive parts. The supplier must set up all the actions necessary so that this range meets 100% of requirements. The supplier has to precise to IMI the type of tester that will be used (flying probes, O/S testing) for prototype, initial sample and mass production. Required characteristics for the testing machine: - Test voltage > or equal to 250V - Minimum continuity resistance: < 50 Ohm - Insulation resistence >10 MOhm If there is a rework on the PCB, new testing is mandatory. Electrical test has to bet he last production work step, except on OSP. 2.2. Visual monitoring of the circuits. All the printed circuits delivered to IMI must be the subject of a 100% visual control guaranteeing the absence of the defects quoted in the table of section 3, or in the IPC 600 standard, according to the appropriate class. The nature of controls carried out will have to be mentioned in the supplier s control plan. 2.2.1 Bad Mark / X-Out parts. Unless otherwise previously agreed in writing, IMI will NOT accept Bad Mark circuits crossed out on panels. All panels should be delivered defect free, without X-out circuits. In the case where agreement is reached on the quantity of Bad Mark / X-out circuits per panel and per delivery, all Bad Mark / X-out circuits will be grouped together in clearly identified packaging, and be delivered in to IMI in one lot only. 2.3. Outgoing QC check of the circuits. The supplier must make sure that all the circuits delivered to IMI conform dimensionally to the tolerances indicated within the approved design. The Page 5

method used by the supplier, to guarantee that the printed circuits conform with respect to dimensional requirements and current drawing plans, is their own responsibility (control 100%, SPC etc). A record of dimensional conformity must accompany the printed circuits with each delivery. The supplier will also provide an outgoing quality report with each batch delivered to demonstrate the conformity of supplied parts with respect to functionality, appearance and engineering requirements. Note: In the case of a batch delivered in several times, an original dimensional statement only needs to accompany the first delivery. The deliveries thereafter will only need to be accompanied by a copy of the statement. 2.3.1 Test coupons Test coupons must be made for each production lot: - after chemical copper application (backlight test). - cross section on plated trough hole with metal thickness measurement - on the finished PCB to verify solderability - for each process that require such inspection to guarantee the PCB conformity Each test coupon shall be identified in order to link it to the corresponding single PCB, delivered panel, production panel or PCB lot number. 2.4. Control of the conformity of materials used. The supplier must make sure that the materials used in the manufacture of the printed circuits conform to all points required by IMI (material, colour etc). It is the supplier s responsibility to ensure its subcontractor s quality - with respect to the requirements of reference ISO 9001 or ISO/TS 16949 (for automotive applications) or ISO 13485 (for medical applications). A material conformity certificate must be provided to IMI with each delivery. Note: In the case of a batch delivered in several times, the material certificate only needs to be supplied with the first delivery. A copy should accompany the others. A history of the material certificate records should be able to be presented by the supplier to IMI over a six months period, when requested by IMI. 2.5. Rework. Unless otherwise stated in written format, for IMI AUTOMOTIVE PCB, rework is FORBIDDEN. Rework may be allowed for non-automotive PCBs, only where the supplier has written procedures for rework and inspection, and these are agreed with IMI prior to reworking. However, rework is ALWAYS FORBIDDEN in the following cases: Retouching due to electrical discontinuity (conductor cut-off, faulty via) Page 6

Rework on ENIG finishing Rework of solder mask when the proximity of the failure is < 1cm from an exposed conductor. Each reworked product must be retested, re-inspected and identified (Double Control is mandatory). In case of doubt, the supplier must contact IMI immediately in order to agree on the actions to take. 2.6. Shelf-life / Expiry date Supplier must clearly state the shelf life of all surface finish types in an official document. Any changes to this agreement shall be communicated to IMI before the delivery is shipped. Regardless of the finish chosen from those mentioned below, the PCB must preserve its solderability features for at least 6 months (this duration will be extended to 12 months for ENIG or HASL finishing). They should be subjected to 3 consecutive soldering operations per J- STD-003 (storage less than ONE week between the first and the last soldering operation). If the PCB supplier is not able to fulfill this requirement or if the finishing chosen does allow it, the PCB supplier must inform IMI. 2.7. Traceability requirements Traceability information (raw materials, COC, production data, test and inspection results, tests coupons, solderability test results, ) shall be kept by the PCB s u p p l i er for a minimum of 10 years for automotive applications, and 5 years for non-automotive applications, after delivery of the conforming PCB, and shall be readily available upon request. A production lot shall have a maximum of 100 production panels. A production lot shall be manufactured with the same process, the same raw materials. It is forbidden to split a production lot into several sub-lot unless the PCB supplier is able to ensure a proper traceability. A production lot shall be manufactured continuously. The production lot shall be identified by specific lot number (different from the date code) The PCB manufacturer shall use a specific lot card for each production lot. This lot card shall contain all necessary information to guarantee a proper traceability of the PCB. 2.8. PCB Materials The choice and qualification of materials and processes used for manufacturing PCB are under PCB manufacturer responsibility (unless it is specified in IMI s other requirement). This choice has to be done in order to ensure that the PCB will satisfy all IMI requirements in terms of quality, delivery and cost competitiveness. Any change of the raw material used on the PCB after IMI PCB qualification requires a validation by IMI before applying this modification. The PCB supplier Page 7

shall present its modification proposal and its validation data to IMI at least 6 months before the modification of the PCB. The PCB raw materials shall withstand the flammability test of: FMVSS 302, Speed 100mm/min. and UL94. The PCB raw materials shall withstand the flammability test. 2.8.1 Single-sided and double-sided PCB The PCB specification form for single and double-sided printed circuits shall specify the overall thickness, if not defined in gerber files. For optical inspection reproducibility, the color level of CEM-1 must be 100±10 on 0 (black) to 255 (white) scale. 2.8.2 Multilayer PCB The PCB specification form shall specify the overall thickness of the insulation layer between every Cu layer and the type of material if not defined in gerber. If the PCB layer stack-up is not defined in the PCB specification form, the supplier will propose a layer stack-up (type of material, supplier, reference, Tg of material, prepreg qty). For multilayer stack-up, the minimum insulation to be observed between 2 Cu layers shall ensure that the insulation defined in IPC 9252 is respected and that PCB will be resistant to electro migration phenomena. 2.8. 3 Metallic layers and finishes Regardless of the finish chosen from those mentioned below, the PCB must preserve its solderability features for at least 6 months. 2.8.3.1 Copper Copper (base copper or electrolytic copper) shall have a 99,5% purity, according to IPC-6012. Copper deposited in holes is obtained by successive layers of electroless Cu and then of electrolytic Cu. % of elongation at failure and tensile strength of the Cu plating shall be inspected on a regular by the supplier (method IPC TM 650). When using another method, the supplier will provide the correlation between their method and the recommended one. The conductive pattern adhesion (base Cu + electrolytic Cu) to the base material shall be ³ 1.1 N/mm. This value shall be maintained after the structural integrity test (see 6.1.2). The conductor width on which the measurement will be performed shall be ³ to 0.8 mm. This feature shall be inspected on a regular basis (at least every 3 months) and shall be available upon an audit or IMI request. 2.8.3.2 Leaded HASL The deposited SnPb alloy has the following composition: Sn63/Pb37 (± 2).The Cu rate in the alloy bath will be limited to 0.25%. The lands are covered and solderable. 2.8.3.3 Lead-free HASL Page 8

The deposited alloy has the following composition: Sn/Cu0.6 ± 0.1%. The lands are covered and solderable. 2.8.3.4 Carbon The Cu should not be visible. The resistance per square of carbon paste for resistive tracks manufacturing is given in the definition file.regarding the layer adhesion to Cu, the layer should withstand an adhesion test according to the Method 2.4.1, IPC TM 650. 2.8.3.5 Electroless Nickel / Immersion Gold (ENIG) The Cu lands are covered and solderable. The Ni layer is fully covered with Au layer. The PCB supplier shall ensure that the gold layer will protect the Ni layer from any corrosion, contamination or any other phenomena leading to a poor solderability. The supplier must ensure that all the parameters (MTO,...) of its nickel bath are in the range specified by its chemical supplier. The supplier shall verify the phosphorus (P) rate in nickel layer on PCB: it shall be in accordance with the ENIG supplier specification and shall avoid having any black pad or brittle fracture phenomena during and after PCBA assembly on IMI lines. 2.8.3.6 Electrolytic NiAu The deposited nickel in the sub-layer shall have no internal stress; hardness shall be >300 HV under a 5 g load. The electrolytic Au deposited on the connector s lands shall have a hardness of 150 to 200 HV under a 5 g load. The overlay between the gold, tin-lead or solder mask deposits shall be done so the copper is not visible. 2.8.3.7 OSP- Organic Solder Preservative (or Passivation) The chemical basis of the used products has to be a substituted benzimidazole. An OSP presence test should be performed for each batch made by the supplier (Silver Nitrate test). The OSP thickness will not be subject to any measurement (values provided below for reference only). The supplier shall specify the OSP coating thickness in its control plan according to its OSP chemical supplier data s. This thickness will be measured during the OSP production line qualification by the PCB supplier. The PCB supplier shall ensure that this thickness will be controlled during mass production (direct and/or indirect measurement and parameter control). OSP coating has to be free of scratches on copper area and free of stains. In case of selective finished PCB, the supplier has to verify that OSP coating will not affect Ni/Au plating. 2.8.3.8 Immersion silver (Ag) and Tin (Sn) All lands shall be covered and solderable. Page 9

2.9 Insulating polymer ink IMI Group 2.9.1 Solder mask The solder mask shall meet the requirements of IPC SM-840, class H. (Hardness, adhesion, chemical behavior, dielectric behavior, insulation resistance). There is full overlay of the conductors by the solder mask. There is no solder mask on solder lands and test points. No Air bubble entrapped under solder mask along the conductors. Double process is allowed after IMI written approval. In case of multi process the supplier will have to confirm with IMI that it will not cause any problem in PCBA assembly process. 2.9.2 Filled vias Filled vias are used for different purposes: avoid the solder under the component to escape on the second side, leading to a poor solder join avoid the creation of bumps and balls on opposite side leading to short-circuits with heat sink pad avoid varnish to escape through vias The filling technology has to be adapted to PCB finish and product design. 2.9.3 Legend ink Exposed conductors must be free of ink. The used inks are compatible with fluxes and cleaning solvents typically used in the circuit board assembling industry. Page 10

3. GENERAL QUALITY REQUIREMENTS OF IMI Defect description * Out-of-tolerance dimensions (with respect to technical drawings) Locating holes missing, shifted, diameter out-of-tolerance Out-of-tolerance planarity Out-of-tolerance thickness Fiducials marks non conforming, absent or badly positioned Hole diameter and position out-of-tolerance Missing or shifted routing or v-scoring Missing or shifted postage stamp fixing Absence of manufacturers stamp Missing or non conforming date code information Absence of customer reference or product reference Absence of the individual circuit number Missing solder mask Screen printing (for component targets) shifted or unreadable Solder mask on contact pads Solder mask on metallic holes Metallic through holes without metalization Blocked or non-drilled holes. Chipped or broken circuits Scratches on the circuit leaving bare copper showing, or damaging solder pads Oxidation of the circuits Non-conforming soldering properties Excess tin plating on SMD contact pads Short circuits or broken tracks Presence of an incorrect photo image on the circuit Missing identification of flammability class UL 94 VO (where appropriate) Absence of Bad Mark identification (flexible circuits) Non conforming colour of solder mask Absence of E-test mark *This list of defects is not exhaustive. IPC 600 is applies. The supplier must fix a target of ZERO defects for its continuous improvement program. Page 11

4. FUNCTIONAL REQUIREMENTS OF PRINTED CIRCUITS The supplier is not authorized, except in the case of an exemption or derogation signed by IMI, to deliver parts non-conforming to IMI specifications. 4.1. Solderability tests All the batches of printed circuits sent to IMI must be subject to testing of solderability, as per IPC-TM-650 testing requirements. Test records for solderability should be able to be presented to IMI covering a period of 6 months, when requested. An additional solderability test may be carried out by IMI. Poor solderability (angle of meniscus > 55 ) is regarded as a MAJOR defect. 4.2. Ionic contamination tests The measurement method should be in accordance with IPC TM 650 ionograph. All the batches of printed circuits sent to IMI must be subjected to testing of Ionic Contamination. Test records for contamination should be able to be presented to IMI covering a period of 6 months, when requested. The maximum allowed residual pollution is 0.5 µg/cm² (NaCl equivalent) for all finishing except HASL where the maximum shall be 0.8 µg/cm² (NaCl equivalent). 4.3. Electrical characteristics The supplier s manufacturing process must guarantee that the electrical characteristics of the PCB meet IPC 9252 standards. 5. SHIP TO STOCK (STS) RECEPTION OF THE PRINTED CIRCUITS 5.1. Initialization of STS for PCBs From the time that IMI deems that the printed circuits delivered by the supplier can be put directly into store without receiving inspection (depending on satisfactory historical delivery quality data), the supplier will be informed officially of this decision (mail, fax, E-mail). The supplier will from then on, starting with the next delivery following this information, to identify all packaging of the printed circuits by a label STS. This label will be clearly visible (on the outside of the packaging), in black Arial font (ref. Microsoft Word), height of font to be minimum 50 (ref. Microsoft Word). Important: The application of STS relates only to the products mentioned in the official information sent by IMI. It does not apply to all PCBs delivered by the supplier to IMI. 5.2. Withdrawal of the application of STS As with the initialization of STS, the possible withdrawal of STS for one or more products will be notified to the supplier in an official way (mail, fax, E-mail). From then on, and from the first delivery following the official information from IMI regarding withdrawal of STS, the supplier will have to withdraw all reference to STS from the packaging of the products concerned. Page 12

6. PACKAGING The damage of the printed circuits due to their packaging will be regarded as a major defect by the reception service at IMI. 6.1. Quality Guarantee The printed circuits delivered to IMI must be packed in a way in which they cannot be damaged, and should also be protected against humidity. They should not be able to ' float' inside their packaging during transport. There should, however, be a protective layer between the circuits and the outside package (bubble wrap etc). All packing must remain intact and preserve its original shape until its point of use, whatever the climatic conditions. The principal conditioning and packaging of the printed circuits must be sufficiently robust so that they can be transported on pallets. The panels must be wrapped in thermoplastic film (except flexible circuits), and it is preferable that the PCBs be vacuum packed. Packaging must ensure that the PCBs are held in place and are kept flat throughout transportation. Packaging must be free of grease and/or marks of acid. 6.2. Loading The weight of principal package should not exceed 10 kg. All packaging must be manageable and be able to be handled manually. Any palletized load should not exceed 800 kg, unless previously agreed with IMI. The height of the palletized loads should not exceed 1m. 6.3 Storage of PCBs The storage of the PCB with the supplier must be carried out using thermoplastic film, in a temperature controlled room (20 c+/-5 c) with the level of humidity not exceeding 60%. The date codes of manufacture of the printed circuits which will be delivered to IMI should not be greater than 6 months old. The supplier is requested to provide to IMI their expiry date commitment for the shelf life expectancy for each surface finish type provided by the supplier. This document is required at the same time as the approval submission. Page 13

7. APPROVAL (BLOCK CAPITALS) Company name: Job Title: Your name: Document read and approved Or Document read and approved with addendum Signed: Date: The name of your SQE contact at IMI: Within one month of receiving this document, please complete the above form, sign it and return a scanned copy by email or a hard copy by post to your SQE contact at IMI. Any other comments should be sent to IMI in a separate Vendor Addendum. Page 14