APPLICATIONS. Battery chargers. DC motor control. Level translating QUANTITY PER REEL. ZXCT1009FTA 7 8mm 3,000 units 109 SOT23



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HIGH-SIDE CURRENT MONITOR DESCRIPTION The is a high side current sense monitor. Using this device eliminates the need to disrupt the ground plane when sensing a load current. It takes a high side voltage developed across a current shunt resistor and translates it into a proportional output current. A user defined output resistor scales the output current into a ground-referenced voltage. The wide input voltage range of 20V down to as low as 2.5V make it suitable for a range of applications. A minimum operating current of just 4 A, combined with its SOT23 package make it a unique solution for portable battery equipment. FEATURES Low cost, accurate high-side current sensing APPLICATIONS Battery chargers Smart battery packs DC motor control Over current monitor Power management Level translating Programmable current source APPLICATION CIRCUIT Output voltage scaling Up to 2.5V sense voltage 2.5V 20V supply range 4µA quiescent current 1% typical accuracy SOT23 and SM8 packages ORDERING INFORMATION DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL PARTMARKING PACKAGE FTA 7 8mm 3,000 units 109 SOT23 T8TA 7 12mm 1,000 units SM8 1

ABSOLUTE MAXIMUM RATINGS Voltage on any pin -0.6V to 20V (relative to Iout) Continuous output current 25mA Continuous sense voltage Vin + 0.5V > Vsense > Vin 5V Operating temperature -40 to 85 C Storage temperature -55 to 125 C Package power dissipation (TA = 25 C) SOT23 450mW - derate to zero at 125 C SM8 2W Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings for extended periods may reduce device reliability. ELECTRICAL CHARACTERISTICS Test Conditions TA = 25 C, Vin = 5V, Rout = 100Ω. SYMBOL PARAMETER CONDITIONS LIMITS UNIT Min Typ Max V in V CC range 2.5 20 V 1 I out Output current V sense =0V V sense =10mV V sense =100mV V sense =200mV V sense =1V 1 90 0.975 1.95 9.6 4 104 1.002 2.0 9.98 15 120 1.025 2.05 10.2 µa µa ma ma ma V sense Sense voltage 0 2500 mv I sense - V sense - input current 100 na Acc Accuracy R sense =0.1Ω V sense =200mV -2.5 2.5 % Gm Transconductance, 10000 µa/v I out /V sense BW Bandwidth RF P in = -20dBm V sense = 10mV dc V sense = 100mV dc 1 Includes input offset voltage contribution Vsense=Vin-Vload -20dBm=63mVp-p into 50Ω 300 2 khz MHz 2

TYPICAL CHARACTERISTICS I OUT - Output Current (A) 10m 1m 100µ 10µ Tamb = 25 C R OUT =0 100µ 1m 10m 100m 1 V SENSE (V) Typical Output v Sense Voltage Output Current Error (%) 5 4 3 2 1 0-1 -2 Typical 10m 100m 1 V SENSE (V) Error v Sense Voltage Tamb = 25 C R OUT =0 I OUT - Output Current (ma) 10.2 10.0 9.8 9.6 V SENSE =1V R OUT =0 9.4-40 -20 0 20 40 60 80 Temperature ( C) Output Current v Temperature Gain (db) 3 0-3 -6-9,Tamb=25 C,RFP IN =-20dBm DC V SENSE =0.01V DC V SENSE =0.1V DC V SENSE =1V -12 0.01 0.1 1 10 Frequency (MHz) Frequency Response I OUT - Output Current (ma) 12 10 8 6 4 2 Tamb = 25 C R OUT =0 V SENSE =1V V SENSE =0.8V 0 0 1 2 3 4 5 V IN - Supply Voltage (V) Transfer Characteristic V SENSE =0.6V V SENSE =0.4V V SENSE =0.2V Rejection (db) 0-10 -20-30 -40-50 -60-70 -80 Tamb = 25 C RF P IN = -20dBm V SENSE =0.01V V SENSE =0.1V V SENSE =1V -90 1 10 100 1k 10k 100k 1M 10M Frequency (Hz) Common Mode Rejection 3

TYPICAL CHARACTERISTICS (Cont.) SCHEMATIC DIAGRAM PIN DESCRIPTION Pin Name V sense+ V sense- Pin Function Supply voltage Connection to load/battery I out Output current, proportional to V in -V load CONNECTION DIAGRAMS SOT23 Package Suffix F SM8 Package Suffix T8 Top View Top View 4

POWER DISSIPATION The maximum allowable power dissipation of the device for normal operation (Pmax), is a function of the package junction to ambient thermal resistance (θja), maximum junction temperature (Tjmax), and ambient temperature (Tamb), according to the expression: Pmax = (Tjmax Tamb) / θja The device power dissipation, PD is given by the expression: PD=Iout.(Vin-Vout) Watts APPLICATIONS INFORMATION The following lines describe how to scale a load current to an output voltage. E.g. Vsense = Vin -Vload Vout = 0.01 x Vsense x Rout 1 A 1A current is to be represented by a 100mV output voltage: 1)Choose the value of Rsense to give 50mV > Vsense > 500mV at full load. For example Vsense = 100mV at 1.0A. Rsense = 0.1/1.0 => 0.1 ohms. 2)Choose Rout to give Vout = 100mV, when Vsense = 100mV. Rearranging 1 for Rout gives: Rout = Vout /(Vsense x 0.01) SM8 Rout = 0.1 / (0.1 x 0.01) = 100 Ω SOT23 TYPICAL CIRCUIT APPLICATION Where Rload represents any load including DC motors, a charging battery or further circuitry that requires monitoring, Rsense can be selected on specific requirements of accuracy, size and power rating. 5

APPLICATIONS INFORMATION (Continued) Charger input FZT789A FMMT3904 ZHCS100 V in Load FMMD914 5V To battery + Transient Protection An additional resistor, Rlim can be added in series with Rout (figure 1.0), to limit the current from Iout. Any circuit connected to Vout will be protected from input voltage transients. This can be of particular use in automotive applications where load dump and other common transients need to be considered. bq2954 MOD pin FMMT451 SNS pin I out Support components omitted for clarity Li-Ion Charger Circuit The above figure shows the supporting the Benchmarq bq2954 Charge Management IC. Most of the support components for the bq2954 are omitted for clarity. This design also uses the Zetex FZT789A high current Super- PNP as the switching transistor in the DC-DC step down converter and the FMMT451 as the drive NPN for the FZT789A. The circuit can be configured to charge up to four Li-Ion cells at a charge current of 1.25A. Charge can be terminated on maximum voltage, selectable minimum current, or maximum time out. Switching frequency of the PWM loop is approximately 120kHz. The is intended as a direct functional replacement for the ZDS1009, which is featured in a complete design from Unitrode/Texas Instruments on the Li-Ion charger circuit shown above. Reference: DVS2954S1H Li-Ion Charger Development System. Figure 1.0 with additional current limiting Resistor Rlim. Assuming the worst case condition of Vout = 0V; providing a low impedance to a transient, the minimum value of Rlim is given by:- R lim V (min) = pk V I max pk Vpk = Peak transient voltage to be withstood Vmax = Maximum working Voltage = 20V Ipk = Peak output current = 40mA The maximum value of Rlim is set by Vin(min), Vout(max) and the dropout voltage (see transfer characteristic on page 3) of the :- R lim R out[vin(min) ( Vdp + V out(max) )] (max) = V (max) out Vin(min) = Minimum Supply OperatingVoltage Vdp =Dropout Voltage Vout (max)= Maximum Operating Output Voltage 6

APPLICATIONS INFORMATION (Continued) PCB trace shunt resistor for low cost solution The figure below shows output characteristics of the device when using a PCB resistive trace for a low cost solution in replacement for a conventional shunt resistor. The graph shows the linear rise in voltage across the resistor due to the PTC of the material and demonstrates how this rise in resistance value over temperature compensates for the NTC of the device. The figure opposite shows a PCB layout suggestion. The resistor section is 25mm x 0.25mm giving approximately 150mΩ using 1oz copper. The data for the normalised graph was obtained using a 1A load current and a 100Ω output resistor. An electronic version of the PCB layout is available at www.zetex.com/isense. Vout Vin Rout Load GND Actual Size Rout Vout Vin Load GND Layout shows area of shunt resistor compared to SOT23 package. Not actual size Normalised Voltage 1.4 1.2 1.0 0.8 Voltage across Copper Sense Resistor V OUT with Ideal Sense Resistor V OUT with Copper Sense Resistor -40-20 0 20 40 60 80 100 120 140 Temperature ( C) Effect of Sense Resistor Material on Temperature Performance 7

N PACKAGE DIMENSIONS SOT23 PACKAGE DIMENSIONS SM8 DIM Millimeters Inches Min Max Min Max A 2.67 3.05 0.105 0.120 B 1.20 1.40 0.047 0.055 C 1.10 0.043 D 0.37 0.53 0.0145 0.021 F 0.085 0.15 0.0033 0.0059 G NOM 1.9 NOM 0.075 K 0.01 0.10 0.0004 0.004 L 2.10 2.50 0.0825 0.0985 N NOM 0.95 NOM 0.037 DIM Millimeters Inches Min Typ Max Min Typ Max A 1.7 0.067 A1 0.02 0.1 0.0008 0.004 b 0.7 0.028 c 0.24 0.32 0.009 0.013 D 6.3 6.7 0.248 0.264 E 3.3 3.7 0.130 0.145 e1 4.59 0.180 e2 1.53 0.060 He 6.7 7.3 0.264 0.287 Lp 0.9 0.035 α 15 15 β 10 10 Zetex Semiconductors plc 2005 Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Zetex Semiconductors plc Zetex Technology Park Chadderton, Oldham, OL9 9LL United Kingdom Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com 8