PrioVR Production Plan: 1. System Overview 1.1 Architecture Overview The entire PrioVR system consists of several sub-systems that all must function and integrate in order for the entire system to work. The overview of the entire system can be seen in the figure below and described in the following section: Input Unit Input Unit Wearable Hub Unit Rechargeable Battery Pack USB Device Interface Wireless Communication Module Host USB for Configuration and Charging u Communication Base Station Wireless Communication Module USB Device Interface Host Application API Driver USB Host Interface These units consist of a low-power high-performance MCU along with a 3-axis gyroscope, 3-axis magnetometer, and a 3-axis accelerometer. This sensor data is calibrated, error-compensated, and fused to produce an accurate 3-axis orientation estimate. The sensors are interconnected to form sensor strands which are each, in turn, connected in a star topology with the Wearable Hub Unit at the center of the star. Input Unit These units consist of a low-power MCU along with accessible buttons and a pin-header interface that allows the connection of additional external inputs such as trigger switches and tactile input buttons. The purpose of these nodes is to allow a flexible intuitive interaction mechanism. Wearable Hub Unit This unit consists of a USB rechargeable battery, wireless communications module, and highperformance MCU capable of receiving and aggregating multiple data streams from the multiple sensors on each sensor strand. The aggregated data for all sensors is then collected into packets for wireless transmission to the Communication Base Station or, alternately, communication via USB for wired configuration and usage during charging.
Communication Base Station This unit consists of a wireless communications module and high-performance USB capable MCU. This unit handles the reliable reception of data packets from one or more Wearable Hub Units and forwards the data to the USB host for use in the desired end application. 2. Sub-system Development and Production Schedule 2.1 Development and Production Schedule Overview The following chart illustrates the proposed development and production schedule for each of the major sub-systems and components of the PrioVR project. Date 10/18/13 10/25/13 11/01/13 11/08/13 11/15/13 11/22/13 11/29/13 12/06/13 12/13/13 12/20/13 12/27/13 01/03/14 01/10/14 01/17/14 01/24/14 01/31/14 02/07/14 02/14/14 02/21/14 02/28/14 03/07/14 03/14/14 03/21/14 03/28/14 04/04/14 04/11/14 04/18/14 04/25/14 05/02/14 05/09/14 05/16/14 05/23/14 05/30/14 06/06/14 06/13/14 06/20/14 06/27/14 07/04/14 07/11/14 07/18/14 07/25/14 08/01/14 08/08/14 08/15/14 08/22/14 08/29/14 09/05/14 09/12/14 Week 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 DEV BM Hardware R&P AD AT A2B BD BT Firmware R&P AD(Firmware) AT A2B BD BT Additional R&P(Case) AD (Case) AT A2B BD(Case) BT Wearable Hub Unit DEV BM Hardware R&P AD AT A2B BD BT Firmware R&P AD(Firmware) AT A2B BD BT Additional R&P(Case) AD (Case) AT A2B BD(Case) BT Wireless Base Unit DEV BM Hardware R&P AD AT A2B BD BT Firmware R&P AD(Firmware) AT A2B BD BT Additional R&P(Case) AD (Case) AT A2B BD(Case) BT Host Software DEV Drivers R&P AD AT A2B BD BT API R&P AD AT A2B BD BT Application Software R&P AD AT A2B BD BT Demos R&P AD AT A2B BD BT Final Integration DEV Harness / Suit R&P AD AT A2B BD BT Box and Packaging R&P AD AT A2B BD BT Software Deployment R&P AD AT A2B BD BT Key: Team: R&P = Research and Pre-Engineering = Hardware / embedded systems AD = Alpha Design & Prototyping = Firmware / embedded systems AT = Alpha Testing = Software / applications A2B = Refinement Cycle = Integration / Design / Packaging BD = Beta Design BT = Beta testing BM = Beta Manufacturing
2.2 s 2.2.1 Hardware a) Evaluate feature vs. cost for component options: MCU, gyro, magnetometer, accelerometer, communications, connectors, voltage regulator, etc. Contact manufacturers for availability guarantees. b) Commit to communication method and overall architecture. c) Select major candidate components for initial testing and characterization. d) Perform testing on candidate components e) Determine final component selection. f) Design first alpha PCB g) Complete alpha PCB design h) Manufacture prototype quantities of complete alpha PCB. i) Test alpha PCB design. j) alpha design postmortem and refinement cycles k) Final/beta PCB design, manufacture, and testing. 2.2.2 Firmware a) Adapt and implement boot-loader for new architecture MCU b) Begin adapting firmware to selected MCU architecture and selected sensors. c) Design and document wired sensor protocol based upon system requirements. d) Adapt and implement filter code. e) Adapt and implement protocol handler code. f) Implement sleep and low-power features for new MCU. g) Test communication protocol. h) Write unit and performance test scripts. i) Debugging, refinement, and optimization cycles. j) Final/beta firmware and testing. 2.2.3 Additional a) Evaluate casing options: snap-tight, friction-lock, screw-lock, adhesive-lock. b) Evaluate case to strap options: clip-in, captivated, silicone pocket, silicone strap. c) Evaluate wiring options: spring coil wire, straight wire, retractable wire. d) Evaluate interconnect options. e) Make case prototypes and test form and function. f) Refine prototype g) Finalize prototype case design. h) Optimize design for manufacturing efficiency i) Optimize manufacturing for quality control. j) Release to manufacturing
2.3 Wearable Hub Unit 2.3.1 Hardware a) Select MCU with capacity to support communication architecture as determined in 2.1.1b, wireless communication architecture as determined in 2.2.1c below, and USB 2.0 support. b) Investigate rechargeable battery options, select battery, and design charging circuitry & power distribution subsystem. c) Investigate wireless communication options, select wireless solution, and design wireless hardware sub-system d) Design first alpha PCB e) Complete alpha PCB design f) Manufacture prototype quantities of complete alpha PCB. g) Test alpha PCB design. h) Alpha design postmortem and refinement cycles i) Final/beta PCB design, manufacture, and testing. 2.3.2 Firmware a) Adapt and implement boot-loader for selected MCU. b) Implement wired sensor master protocol as defined in 2.1.2c c) Implement protocol handler code. d) Test wired communication protocol. e) Design and document wireless sensor protocol based upon system requirements. f) Implement wireless protocol handler code. g) Test wireless communication protocol. h) Implement USB stack and USB protocol for configuration, charge-status reporting, and wired communication. i) Implement sleep and low-power features for MCU. j) Write unit and performance test scripts. k) Debugging, refinement, and optimization cycles. l) Final/beta firmware and testing. 2.3.3 Additional a) Evaluate casing and packaging options. b) Evaluate body-mounting options c) Design case and interconnect system consistent with constraints from 2.1.x d) Make case prototypes and test form and function. e) Refine prototype case f) Finalize prototype case design. g) Optimize design for manufacturing efficiency h) Optimize manufacturing for quality control. i) Release to Manufacturing
2.4 Communication Base Station 2.4.1 Hardware a) Utilize same MCU and architecture as determined in 2.2.1a. b) Design USB interface c) Design first alpha PCB d) Complete alpha PCB design e) Manufacture prototype quantities of complete alpha PCB. f) Test alpha PCB design. g) alpha design postmortem and refinement cycle. h) Final/beta PCB design, manufacture, and testing. 2.4.2 Firmware a) Implement host-specific wireless protocol handler code. b) Test host-side wireless communication protocol. c) Write unit and performance test scripts. d) Debugging, refinement, and optimization cycles. e) Final/beta firmware and testing. 2.4.3 Additional a) Evaluate casing and packaging options. b) Design case. c) Make case prototypes and test form and function. d) Refine and select prototype case design. e) Optimize design for manufacturing efficiency f) Optimize manufacturing for quality control. g) Release to Manufacturing 2.5 Host Software 2.5.1 Drivers a) Evaluate CDC driver options versus custom driver options. b) Implement driver as determined in 2.4.1a. c) Test driver. d) Write unit and performance test scripts. e) Optimize code. f) Debugging, refinement, and optimization cycles. g) Final/beta firmware and testing. h) Release
2.5.2 APIs a) Document open protocol b) Define API architecture and specification c) Create APIs to abstract low-level functionality d) Create support and examples illustrating API usage in major programming and game-engine environments. e) Document all APIs and examples f) Release APIs 2.5.3 Application Software a) Integrate final system with existing Mocap Studio and Suite products. b) Determine additional software needs for configuration. c) Write additional configuration software as necessary. d) Test software e) Write unit and performance test scripts. f) Debugging, refinement, and optimization cycles. g) Final alpha software and testing. h) Release 2.5.4 Demonstration software a) Determine additional software needs for demonstration: games, motion capture, game engine integration. b) Write additional demonstration software as necessary. c) Final alpha software and testing. d) Release 3. Final Developer's Kit Product Integration Outline 3.1 Harness / suit design a) Evaluate suit design options, including costing options b) Create rough prototypes to test form / fit / function of several prototypes c) Refine and narrow design based upon manufacturing options vs. costs vs. function d) Select best design e) Create final prototype f) Refine design g) Release to Manufacturing 3.2 Box and packaging design a) Evaluate packaging design options and costs b) Create rough mock-ups of packaging to test design impact / form / function of several package prototypes c) Refine and narrow package design d) Select best design
e) Create final prototype packaging f) Refine packaging g) Freeze packaging design h) Packaging production planning i) Release to Manufacturing 3.3 Software deployment and installation a) Document all software b) Package all software for release c) Make all software available Appendix: Color Key: Color = Planning, investigation, initial engineering Color =Major development, critical development Color = Final development, beta production, bets testing. Color = Release Symbol Key: = Milestone = Major Milestone