Vertical deflection booster for 3 App TV/monitor applications with 0 V flyback generator Features Figure. Heptawatt package Power amplifier Flyback generator Stand-by control Output current up to 3.0 App Thermal protection Description Designed for monitors and high performance TVs, the vertical deflection booster delivers flyback voltages up to 0V. The operates with supplies up to 35V and provides up to 3 A PP output current to drive the yoke. The is offered in a Heptawatt plastic package. In double-supply applications, a stand-by state will be reached by stopping the (+) supply alone. Non-Inverting Input Inverting Input Output Stage Supply 6 + Power Amplifier - Figure 2. Tab connected to pin Flyback Generator 3 Thermal Protection Ground or Negative Supply Heptawatt (Plastic Package) ORDER CODE: pin detail Flyback Generator 6 5 3 2 Supply Voltage 5 Input (Non Inverting) Output Stage Supply Output Ground Flyback Generator Supply Voltage Input (Inverting) 2 Output November 2008 Rev /9 www.st.com
Contents Contents Absolute maximum ratings................................... 3 2 Thermal data............................................... 3 Electrical characteristics..................................... 5 Application hints............................................. DC-coupled application......................................... Application hints............................................ 8..2 Ripple rejection............................................ 9.2 AC-coupled applications...................................... 0.2. Application hints........................................... 0.3 Application with differential-output drivers.........................3. Centering................................................ 2.3.2 Peak current.............................................. 2.3.3 Ripple rejection........................................... 2.3. Secondary breakdown diagrams.............................. 3 5 Mounting instructions....................................... 6 Pin configuration........................................... 5 Package mechanical data.................................... 6. Lead-free packaging......................................... 8 Revision history........................................... 8 2/9
Absolute maximum ratings Absolute maximum ratings Table. Absolute maximum ratings Symbol Parameter Value Unit Voltage V S Supply voltage (pin 2) - Note and Note 2 0 V V 5, V 6 Flyback peak voltage - Note 2 0 V V 3 Voltage at Pin 3 - Note 2, Note 3 and Note 6-0. to (V S + 3) V V, V Amplifier input voltage - Note 2, Note 6 and Note - 0. to (V S + 2) or +0 V Current I 0 () Output peak current at f = 50 to 200 Hz, t 0µs - Note ±5 A I 0 (2) Output peak current non-repetitive - Note 5 ±2 A I 3 Sink Sink current, t<ms - Note 3 2 A I 3 Source Source current, t < ms 2 A I 3 Flyback pulse current at f=50 to 200 Hz, t 0μs - Note ±5 A ESD Susceptibility ESD Human body model (00 pf discharged through.5 kω) 2 kv ESD2 EIAJ standard (200 pf discharged through 0 Ω) 300 V Temperature T s Storage temperature -0 to 50 C T j Junction temperature +50 C Note: Usually the flyback voltage is slightly more than 2 x VS. This must be taken into consideration when setting V S. 2 Versus pin 3 V3 is higher than V S during the first half of the flyback pulse. Such repetitive output peak currents are usually observed just before and after the flyback pulse. 5 This non-repetitive output peak current can be observed, for example, during the Switch- On/Switch-Off phases. This peak current is acceptable providing the SOA is respected (Figure 0 and Figure ). 6 All pins have a reverse diode towards pin, these diodes should never be forward-biased. Input voltages must not exceed the lower value of either V S + 2 or 0 volts. 3/9
Thermal data 2 Thermal data Table 2. Thermal data Symbol Parameter Value Unit R thjc Junction-to-case thermal resistance 3 C/W T T Temperature for thermal shutdown 50 C T J Recommended max. junction temperature 20 C /9
Electrical characteristics 3 Electrical characteristics V S = 3 V, T AMB = 25 C, unless otherwise specified. Table 3. Electrical characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit Figure Supply Operating supply voltage V S See note below () 0 35 V range (V 2 -V ) I 2 Pin 2 quiescent current I 3 = 0, I 5 = 0 5 20 ma Figure 3 I 6 Input Pin 6 quiescent current I 3 = 0, I 5 = 0, V 6 =35v 8 9 50 ma Figure 3 I Input bias current V = V, V = 2.2 V - 0.6 -.5 µa Figure 3 I Input bias current V = 2.2 V, V = V - 0.6 -.5 µa V IR Operating input voltage range 0 V S - 2 V V I0 Offset voltage 2 mv ΔV I0 /dt Output Offset drift versus temperature 0 µv/ C I 0 Operating peak output current 0 o <T case <25 o C ±.25 A Output saturation voltage to V 5L I pin 5 =.25 A 0.9.6 V Figure 5 V 5H Standby Output saturation voltage to pin 6 I 5 = -.25 A.5 2.2 V Figure V 5STBY Output voltage in standby V = V = V s = 0 (2) Figure 6 Miscellaneous G Voltage gain 80 db Diode forward voltage V D5-6 I between pins 5-6 5 =.25 A.5 2. V V D3-2 Diode forward voltage between pins 3-2 I 3 =.25 A.5 2. V V 3SL Saturation voltage on pin 3 I 3 = 20 ma 0. V Figure 5 Saturation voltage to pin 2 V 3SH (2nd part of flyback) I 3 = -.25 A.8 2.6 V. In normal applications, the peak flyback voltage is slightly greater than 2 x (V S - V ). Therefore, (V S - V ) = 35 V is not allowed without special circuitry. 2. Refer to Figure 6, standby condition. 5/9
Electrical characteristics Figure 3. Measurement of I, I 2 and I 6 +Vs I2 I6 2.2V (a): I2 and I6 measurement (b): I measurement Figure. Figure 5. Measurement of V 5H 2.2V V Measurement of V 3L and V 5L V 2.2V 2 6 2 6 2 6 5 5 S V +Vs V 5H 39kΩ (a) (b) I - I5 +Vs I3 or I5 (b) (a) 3 5 V 3L V 5L 5.6kΩ (a): V 5L measurement (b): V 3L measurement 6/9
Application hints Application hints The yoke can be coupled either in AC or DC.. DC-coupled application Figure 6. When DC coupled (see Figure 6), the display vertical position can be adjusted with input bias. On the other hand, 2 supply sources (V S and -V EE ) are required. A standby state will be reached by switching OFF the positive supply alone. In this state, where both inputs are the same voltage as pin 2 or higher, the output will sink negligible current from the deviation coil. Vertical Position Adjustment V M V m DC-coupled application 0µF Vref R3 (*) recommended: 0.µF -V EE Power Amplifier + Ly Ly ------------ < R d < ------------ 50μs 20μs - 6 0µF C F ( to 00µF) 3 2 Flyback Generator Thermal Safety 0.µF 5 +Vs R2 Output Voltage Output Current Rd(*) R I p Yoke Ly.5Ω 0.22µF /9
Application hints.. Application hints For calculations, treat the IC as an op-amp, where the feedback loop maintains V = V. Centering Display will be centered (null mean current in yoke) when voltage on pin is (R is negligible): Peak current V M + V m R V ------------------------ 2 = --------------------- 2 R 2 + R 3 ( V M V m ) R 2 I ---------------------------- P = ------------------ 2 R xr 3 Example: for V m =2V, V M = 5 V and I P =A Choose R in the Ω range, for instance R = Ω From equation of peak current: R 2 ------- R 3 2 I P R ------------------------------ 2 = = -- V M V m 3 Then choose R 2 or R 3. For instance, if R 2 = 0 kω, then R 3 = 5 kω Finally, the bias voltage on pin should be: V M + V m V ------------------------ = ----------------- = --- ------- =.V 2 R 3 2 2.5 + ------- R 2 8/9
Application hints..2 Ripple rejection Figure. When both ramp signal and bias are provided by the same driver IC, you can gain natural rejection of any ripple caused by a voltage drop in the ground (see Figure ), if you manage to apply the same fraction of ripple voltage to both booster inputs. For that purpose, arrange an intermediate point in the bias resistor bridge, such that (R 8 / R ) = (R 3 / R 2 ), and connect the bias filtering capacitor between the intermediate point and the local driver ground. Of course, R should be connected to the booster reference point, which is the ground side of R. Ripple rejection Driver Ground Reference Voltage R 9 Ramp Signal R 8 R Power Amplifier + - 6 3 2 Flyback Generator Thermal Safety R 3 R 2 Source of Ripple 5 Rd R Yoke Ly 9/9
Application hints.2 AC-coupled applications In AC-coupled applications (see Figure 8), only one supply (V S ) is needed. The vertical position of the scanning cannot be adjusted with input bias (for that purpose, usually some current is injected or sunk with a resistor in the low side of the yoke). Figure 8. AC-coupled application 0µF 0.µF C F ( to 00µF) +Vs Output Voltage V M V m R 3 (*) recommended:.2. Application hints Ly Ly ------------ < R d < ------------ 50μs 20μs Gain is defined as in the previous case: 6 3 2 Flyback Generator Power Amplifier + - Thermal Safety R 5 5 0.22µF Output Current.5Ω Rd(*) C s R C L R 2 R V V M m R I ----------------------- 2 p = ---------------------- 2 R R 3 Choose R then either R 2 or R 3. For good output centering, V must fulfill the following equation: V S V M + V m ------- V V 2 ------------------------ V 2 --------------------- = -------------------------------------- + ------- R + R 5 R 3 R 2 I p Yoke Ly 0/9
Application hints or V ------- + ------- + --------------------- = R 3 R R 2 + R 5 V S V M + V m ------------------------------ + ------------------------ 2R ( + R 5 ) 2 R 3 C S performs an integration of the parabolic signal on C L, therefore the amount of S correction is set by the combination of C L and C s..3 Application with differential-output drivers Figure 9. Certain driver ICs provide the ramp signal in differential form, as two current sources i + and i with opposite variations. Using a differential-output driver 0µF 0.µF -V EE (*) recommended: Ly Ly ------------ < R d < ------------ 50μs 20μs C F ( to 00µF) 6 3 2 Differential output Flyback Output driver IC Generator Current Power Amplifier i p + i cm + R 5 - Thermal Safety.5Ω Rd(*) -i i p - cm 0µF 0.µF +Vs R 2 0.22µF Output Voltage R I p Yoke Ly Some definitions: i cm is the common-mode current: i cm = --i ( 2 + + i - ) at peak of signal, i + =i cm +i p and i =i cm -i p, therefore the peak differential signal is i p -(-i p )=2i p, and the peak-peak differential signal, i p. The application is described in Figure 9 with DC yoke coupling. The calculations still rely on the fact that V remains equal to V. /9
Application hints.3. Centering When idle, both driver outputs provide i cm and the yoke current should be null (R is negligible), hence: i cm R = i cm R 2 therefore R = R 2.3.2 Peak current Scanning current should be I P when positive and negative driver outputs provide respectively i cm -i p and i cm +i p, therefore ( i cm i) R = I p R + ( i cm + i) R 2 and since R = R 2 I p ---- = i 2R ---------- R Choose R in the Ω range, the value of R 2 = R follows. Remember that i is one-quarter of driver peak-peak differential signal! Also check that the voltages on the driver outputs remain inside allowed range. Example: for i cm = 0.mA, i = 0.2mA (corresponding to 0.8mA of peak-peak differential current), I p =A Choose R = 0.5Ω, it follows R 2 = R =.85kΩ..3.3 Ripple rejection Make sure to connect R directly to the ground side of R. 2/9
Application hints.3. Secondary breakdown diagrams Figure 0. Output transistor safe operating area (SOA) for secondary breakdown The diagram has been arbitrarily limited to max I0 (2A). Figure. Secondary breakdown temperature derating curve (ISB = secondary breakdown current) 3/9
Mounting instructions 5 Mounting instructions Figure 2. The power dissipated in the circuit is removed by adding an external heatsink. With the Heptawatt package, the heatsink is simply attached with a screw or a compression spring (clip). A layer of silicon grease inserted between heatsink and package optimizes thermal contact. In DC-coupled applications we recommend to use a silicone tape between the device tab and the heatsink to electrically isolate the tab. Mounting examples /9
Pin configuration 6 Pin configuration Figure 3. Pins and 2 Figure. Pins 3, 5 and 6 2 3 2 6 5 5/9
Package mechanical data Package mechanical data Figure 5. -pin Heptawatt package L L E M A C D L5 H3 Dia. L0 L Table. L L6 Heptawatt package D M L2 L3 F E E L H2 G G G2 Dim. mm inches Min. Typ. Max. Min. Typ. Max. A.8 0.89 C.3 0.05 D 2.0 2.80 0.09 0.0 D.20.35 0.0 0.053 E 0.35 0.55 0.0 0.022 E 0.0 0.9 0.028 0.038 F 0.60 0.80 0.02 0.03 F L9 H2 V 6/9
Package mechanical data Table. G 2.3 2.5 2. 0.095 0.00 0.05 G.88 5.08 5.28 0.93 0.200 0.205 G2.2.62.82 0.295 0.300 0.30 H2 0.0 0.09 H3 0.05 0.0 0.396 0.09 L 6.0 6.90.0 0.65 0.668 0.63 L.92 0.58 L2 2.2 2.5 2.8 0.386 0.88 0.860 L3 22.2 22.52 22. 0.8 0.89 0.896 L.29 0.05 L5 2.60 2.80 3.00 0.02 0.0 0.8 L6 5.0 5.50 5.80 0.59 0.60 0.622 L 6.00 6.35 6.60 0.0236 0.250 0.260 L9 0.20 0.008 L0 2.0 2.0 0.082 0.06 L.30.80 0.69 0.90 M 2.55 2.80 3.05 0.00 0.0 0.20 M.83 5.08 5.33 0.90 0.200 0.20 V Heptawatt package (continued) Dim. mm inches. Lead-free packaging 0 (Typ.) Dia. 3.65 3.85 0. 0.52 To meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD9. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. /9
Revision history 8 Revision history Table 5. Document revision history Date Revision Changes August 2003 First issue. November 2003. Datasheet status changed to preliminary data. December 2003.2 Modification to Figure 3. June 200.3 Datasheet status changed to datasheet. February 2005 2 Updated Figure 9. March 2005 3 Status changed to datasheet. 3-Nov-2008 Section. added, new template applied. 8/9
Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9