24-Bit, 40kHz ANALOG-TO-DIGITAL CONVERTER

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1 SEPTEMBER 2 REVISED JUNE Bit, 4kHz ANALOG-TO-DIGITAL CONVERTER FEATURES 24 BITS NO MISSING CODES 19 BITS EFFECTIVE RESOLUTION UP TO 4kHz DATA RATE LOW NOISE: 2.5ppm DIFFERENTIAL INPUTS INL:.15% (max) EXTERNAL REFERENCE (.5V to 5V) POWER-DOWN MODE SYNC MODE APPLICATIONS CARDIAC DIAGNOSTICS DIRECT THERMOCOUPLE INTERFACES BLOOD ANALYSIS INFRARED PYROMETERS LIQUID/GAS CHROMATOGRAPHY PRECISION PROCESS CONTROL DESCRIPTION The is a precision, wide dynamic range, deltasigma, Analog-to-Digital (A/D) converter with 24-bit resolution operating from a single +5V supply. The delta-sigma architecture is used for wide dynamic range and to ensure 24 bits of no missing code performance. An effective resolution of 19 bits (2.5ppm of rms noise) is achieved for conversion rates up to 4kHz. The is designed for high-resolution measurement applications in cardiac diagnostics, smart transmitters, industrial process control, weight scales, chromatography, and portable instrumentation. The converter includes a flexible, 2-wire synchronous serial interface for low-cost isolation. The is a single-channel converter and is offered in an SO-8 package. V REF CLK +V IN V IN 4th-Order Σ Modulator Digital Filter Serial Interface SCLK DOUT/DRDY +V DD GND Control Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2-26, Texas Instruments Incorporated

2 ABSOLUTE MAXIMUM RATINGS (1) Analog Input: Current... ±1mA, Momentary ±1mA, Continuous Voltage... GND.3V to V DD +.3V V DD to GND....3V to 6V V REF Voltage to GND....3V to V DD +.3V Digital Input Voltage to GND....3V to V DD +.3V Digital Output Voltage to GND....3V to V DD +.3V Lead Temperature (soldering, 1s) C Power Dissipation (any package)... 5mW NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY SO-8 D 4 C to +85 C U U Rails, 1 " " " " " U/2K5 Tape and Reel, 25 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at. PIN CONFIGURATION Top View +V IN 1 8 V REF V IN 2 7 GND U +V DD 3 6 SCLK CLK 4 5 DOUT/DRDY SO PIN DESCRIPTIONS PIN NAME PIN DESCRIPTION 1 +V IN Analog Input: Positive Input of the Differential Analog Input 2 V IN Analog Input: Negative Input of the Differential Analog Input 3 +V DD Input: Power-Supply Voltage, +5V 4 CLK Digital Input: Device System Clock. The system clock is in the form of a CMOScompatible clock. This is a Schmitt-Trigger input. 5 DOUT/DRDY Digital Output: Serial Data Output/Data Ready. A logic LOW on this output indicates that a new output word is available from the data output register. The serial data is clocked out of the serial data output shift register using SCLK. 6 SCLK Digital Input: Serial Clock. The serial clock is in the form of a CMOS-compatible clock. The serial clock operates independently from the system clock, therefore, it is possible to run SCLK at a higher frequency than CLK. The normal state of SCLK is LOW. Holding SCLK HIGH will either initiate a modulator reset for synchronizing multiple converters or enter power-down mode. This is a Schmitt-Trigger input. 7 GND Input: Ground 8 V REF Analog Input: Reference Voltage Input 2

3 ELECTRICAL CHARACTERISTICS All specifications at T MIN to T MAX, V DD = +5V, CLK = 16MHz, and V REF = 4.96V, unless otherwise specified. U PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT Full-Scale Input Voltage ±V REF V Absolute Input Voltage +V IN or V IN to GND.3 V DD V Differential Input Impedance CLK = 3.84kHz 125 MΩ CLK = 1MHz 48 kω CLK = 16MHz 3 kω Input Capacitance 2 pf Input Leakage At +25 C 5 5 pa At T MIN to T MAX 1 na DYNAMIC CHARACTERISTICS Data Rate 41.7 khz Bandwidth 3dB 9 khz Serial Clock (SCLK) 16 MHz System Clock Input (CLK) 16 MHz ACCURACY Integral Nonlinearity (1) ±.3 ±.15 % of FSR THD 1kHz Input;.1dB below FS 97 db Noise ppm of FSR, rms Resolution 24 Bits No Missing Codes 24 Bits Common-Mode Rejection (2) at DC 9 1 db Gain Error.4 1 % of FSR Offset Error ±1 ±2 ppm of FSR Gain Sensitivity to V REF V REF = 4.96V ±.1V 1:1 Power-Supply Rejection Ratio 6 8 db PERFORMANCE OVER TEMPERATURE Offset Drift.7 ppm/ C Gain Drift CLK = 16MHz 7.5 ppm/ C CLK = 14MHz 5.2 ppm/ C CLK = 12MHz 3.9 ppm/ C CLK < 1MHz 3.4 ppm/ C VOLTAGE REFERENCE V REF V DD V Load Current 22 µa DIGITAL INPUT/OUTPUT Logic Family CMOS Logic Level: V IH +4. +V DD +.3 V V IL V V OH I OH = 5µA +4.5 V V OL I OL = 5µA.4 V Input (SCLK, CLK) Hysteresis.6 V Data Format Offset Binary Two s Complement POWER-SUPPLY REQUIREMENTS Operation V Quiescent Current V DD = +5VDC 8 1 ma Operating Power 4 5 mw Power-Down Current 1 1 µa TEMPERATURE RANGE Operating C Storage 6 +1 C NOTES: (1) Applies to full-differential signals. (2) The common-mode rejection test is performed with a 1mV differential input. 3

4 TYPICAL CHARACTERISTICS At T A = +25 C, V DD = +5V, CLK = 16MHz, and V REF = 4.96V, unless otherwise specified. 3. RMS NOISE vs DATA OUTPUT RATE 19.5 EFFECTIVE RESOLUTION vs DATA OUTPUT RATE 2.5 RMS Noise (ppm of FS) Effective Resolution (bits) k 1k 1k k 1k 1k Data Output Rate (Hz) Data Output Rate (Hz) 3. RMS NOISE vs TEMPERATURE 19. EFFECTIVE RESOLUTION vs TEMPERATURE RMS Noise (ppm of FS) Effective Resolution (bits) Temperature ( C) Temperature ( C) 25 RMS NOISE vs V REF VOLTAGE 1 RMS NOISE vs V REF VOLTAGE 9 RMS Noise (µv) RMS Noise (ppm of FS) V REF (V) V REF (V) 4

5 TYPICAL CHARACTERISTICS (Cont.) At T A = +25 C, V DD = +5V, CLK = 16MHz, and V REF = 4.96V, unless otherwise specified. 3. RMS NOISE vs INPUT VOLTAGE 19. EFFECTIVE RESOLUTION vs V REF RMS Noise (ppm of FS) Effective Resolution (Bits) Differential Input Voltage (V) V REF (V) 4. INTEGRAL NON-LINEARITY vs TEMPERATURE 4 INTEGRAL NON-LINEARITY vs DATA OUTPUT RATE INL (ppm of FS) INL (ppm of FS) Temperature ( C) 1 1k 1k 1k Data Output Rate (Hz) Offset Drift (ppm of FS) OFFSET DRIFT vs TEMPERATURE GAIN DRIFT vs TEMPERATURE CLK = 16MHz CLK = 14.3MHz 2 2 CLK < 1MHz 4 CLK < 1MHz CLK = 16MHz Temperature ( C) Temperature ( C) Drift (ppm) 5

6 TYPICAL CHARACTERISTICS (Cont.) At T A = +25 C, V DD = +5V, CLK = 16MHz, and V REF = 4.96V, unless otherwise specified. 1 POWER-SUPPLY REJECTION RATIO vs CLK FREQUENCY 11 COMMON-MODE REJECTION RATIO vs CLK FREQUENCY PSRR (db) CMRR (db) CLK Frequency (MHz) CLK Frequency (MHz) 9.5 CURRENT vs TEMPERATURE 45 POWER DISSIPATION vs CLOCK FREQUENCY 9. 4 Supply Current (ma) Power Dissipation (mw) Temperature ( C) CLK Frequency (MHz) TYPICAL FFT ANALYSIS OF THE 1kHz f S INPUT SIGNAL 2 Dynamic Range (db) Imput Signal Frequency (Hz) 6

7 THEORY OF OPERATION The is a precision, high-dynamic range, 24-bit, deltasigma, A/D converter capable of achieving very high-resolution digital results at high data rates. The analog-input signal is sampled at a rate determined by the frequency of the system clock (CLK). The sampled analog input is modulated by the delta-sigma A/D modulator, which is followed by a digital filter. A Sinc 5 digital low-pass filter processes the output of the delta-sigma modulator and writes the result into the dataoutput register. The DOUT/DRDY pin is pulled LOW, indicating that new data is available to be read by the external microcontroller/microprocessor. As shown in the block diagram, the main functional blocks of the are the 4th-order delta-sigma modulator, a digital filter, control logic, and a serial interface. Each of these functional blocks is described below. ANALOG INPUT The contains a fully differential analog input. In order to provide low system noise, common-mode rejection of 1dB, and excellent power-supply rejection, the design topology is based on a fully differential switched-capacitor architecture. The bipolar input voltage range is from 4.96 to +4.96V, when the reference input voltage equals +4.96V; the bipolar range is with respect to V IN, and not with respect to GND. With regard to the analog input signal, the overall analog performance of the device is affected by three items. First, the input impedance can affect accuracy; therefore, if the source impedance of the input signal is significant, or if there is passive filtering prior to the, a significant portion of the signal can be lost across this external impedance. The magnitude of the effect is dependent on the desired system performance. See application note Understanding the ADS1251, ADS1253, and ADS1254 Input Circuitry (SBAA86), available for download from TI s web site,. Second, the current into or out of the analog inputs must be limited. Under no conditions should the current into or out of the analog inputs exceed 1mA. Third, to prevent aliasing of the input signal, the bandwidth of the analog input signal must be band limited; the bandwidth is a function of the system clock frequency. With a system clock frequency of 16MHz, the data-output rate is kHz with a 3dB frequency of 9kHz, where the 3dB frequency scales with the system clock frequency. To ensure the best linearity of the, a fully differential signal is recommended. BIPOLAR INPUT The differential inputs of the are designed to accept differential signals; however, each analog input voltage must stay between.3v and V DD. With a reference voltage at less than half of V DD, one input can be tied to the reference voltage, and the other input can range from V to 2 V REF. By using a single op amp circuit featuring a single amplifier and four external resistors, the can be configured to accept bipolar inputs referenced to ground. The conventional ±2.5V, ±5V, and ±1V input ranges can be interfaced to the using the resistor values shown in Figure 1. Bipolar Input 1kΩ 2kΩ R 2 BIPOLAR INPUT R1 R2 ±1V 2.5kΩ 5kΩ ±5V 5kΩ 1kΩ ±2.5V 1kΩ 2kΩ FIGURE 1. Level Shift Circuit for Bipolar Input Ranges. R 1 OPA235 REF 2.5V +IN IN OPA235 V REF 7

8 DELTA-SIGMA MODULATOR The operates from a nominal system clock frequency of 16MHz which is fixed in relation to the system clock frequency that is divided by 6 to derive the modulator frequency; therefore, with a system clock frequency of 16MHz, the modulator frequency is 2.667MHz. Furthermore, the oversampling ratio of the modulator is fixed in relation to the modulator frequency. The oversampling ratio of the modulator is 64, and with the modulator frequency running at 2.667MHz, the data rate is kHz; thus, using a slower system clock frequency will result in a lower data output rate, as shown in Table I. REFERENCE INPUT Reference input takes an average current of 22µA with a 16MHz system clock; this current will be proportional to the system clock. A buffered reference is recommended for. The recommended reference circuit is shown in Figure 2. Reference voltages higher than 4.96V will increase the fullscale range, whereas the absolute internal circuit noise of the converter remains the same. This will decrease the noise in terms of ppm of full scale, which increases the effective resolution (see the typical characteristic curve, RMS Noise vs V REF ). CLK (MHz) DATA OUTPUT RATE (Hz) DIGITAL FILTER 16. (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) The digital filter of the, referred to as a sinc 5 filter, computes the digital result based on the most recent outputs from the delta-sigma modulator. At the most basic level, the digital filter can be thought of as simply averaging the modulator results in a weighted form and presenting this average as the digital output. The digital output rate, or data rate, scales directly with the system CLK frequency, this allows the data output rate to be changed over a very wide range (five orders of magnitude) by changing the system CLK frequency. However, it is important to note that the 3dB point of the filter is.216 times the data output rate, so the data output rate must allow for sufficient margin to prevent attenuation of the signal of interest. As the conversion result is essentially an average, the data-output rate determines the location of the resulting notches in the digital filter (see Figure 3). Note that the first notch is located at the data-output rate frequency, and subsequent notches are located at integer multiples of the data-output rate to allow for rejection of not only the fundamental frequency, but also harmonic frequencies. In this manner, the data-output rate can be used to set specific notch frequencies in the digital filter response. NOTE: (1) Standard Clock Oscillator. TABLE I. CLK Rate versus Data Output Rate. +5V +5V.1µF.1µF REF µF 1kΩ + 1µF.1µF 3 OPA µF.1µF To V REF Pin 8 of the FIGURE 2. Recommended External Voltage Reference Circuit for Best Low-Noise Operation with the. 8

9 For example, if the rejection of power-line frequencies is desired, then the data-output rate can simply be set to the power-line frequency. For 5Hz rejection, the system CLK frequency must be 19.2kHz, and this will set the dataoutput rate to 5Hz (see Table I and Figure 4). For 6Hz rejection, the system CLK frequency must be 2.4kHz, and this will set the data-output rate to 6Hz (see Table I and Figure 5). If both 5Hz and 6Hz rejection is required, then the system CLK must be 3.84kHz; this will set the dataoutput rate to 1Hz and reject both 5Hz and 6Hz (see Table I and Figure 6). There is an additional benefit in using a lower data-output rate: it provides better rejection of signals in the frequency band of interest. For example, with a 5Hz data-output rate, a significant signal at 75Hz can alias back into the passband at 25Hz; this is due to the fact that rejection at 75Hz must only be 66dB in the stopband frequencies higher than the first-notch frequency (see Figure 4). However, setting the data-output rate to 1Hz will provide 135dB rejection at 75Hz (see Figure 6). A similar benefit is gained at frequencies near the data-output rate (see Figures 7, 8, 9, and 1). For example, with a 5Hz data-output rate, rejection at 55Hz may only be 15dB (see Figure 7); however, with a 1Hz dataoutput rate, rejection at 55Hz will be 122dB (see Figure 8). If a slower data-output rate does not meet the system requirements, then the analog front end can be designed to provide the needed attenuation to prevent aliasing. Additionally, the data-output rate can be increased and additional digital filtering can be done in the processor or controller. Application note SBAA13, A Spreadsheet to Calculate the Frequency Response of the ADS (available for download at ) provides a simple tool for calculating the ADS125 frequency response for any CLK frequency. The digital filter is described by the following transfer function: Hf () = 5 π f 64 sin f MOD π f 64 sin f MOD or 5 64 z Hz ( ) = ( 1 z ) The digital filter requires five conversions to fully settle. The modulator has an oversampling ratio of 64; therefore, it requires 5 64, or 32 modulator results, or clocks, to fully settle. As the modulator clock is derived from the system clock (CLK) (modulator clock = CLK 6), the number of system clocks required for the digital filter to fully settle is , or 192 CLKs. This means that any significant step change at the analog input requires five full conversions to settle. However, if the analog input change occurs asynchronously to the DOUT/DRDY pulse, then six conversions are required to ensure full settling. CONTROL LOGIC The control logic is used for communications and control of the. Power-Up Sequence Prior to power-up, all digital and analog-input pins must be LOW. At the time of power-up, these signal inputs can be biased to a voltage other than V, however, they must never exceed +V DD. Once the powers up, the DOUT/DRDY line pulses LOW on the first conversion; this data is not valid. The sixth pulse of DOUT/DRDY is valid data from the analog input signal. DOUT/DRDY The DOUT/DRDY output signal alternates between two modes of operation. The first mode of operation is the Data Ready (DRDY) mode to indicate that new data has been loaded into the data-output register and is ready to be read. The second mode of operation is the Data Output (DOUT) mode and is used to serially shift data out of the Data Output Register (DOR). See Figure 11 for the time domain partitioning of the DRDY and DOUT function. See Figure 12 for the basic timing of DOUT/DRDY. During the time defined by t 2, t 3, and t 4, the DOUT/DRDY pin functions in DRDY mode. The state of the DOUT/DRDY pin is HIGH prior to the internal transfer of new data to the DOR. The result of the A/D conversion is written 9

10 NORMALIZED DIGITAL FILTER RESPONSE DIGITAL FILTER RESPONSE Gain (db) Gain (db) Frequency (Hz) Frequency (Hz) FIGURE 3. Normalized Digital Filter Response. FIGURE 4. Digital Filter Response (5Hz). DIGITAL FILTER RESPONSE DIGITAL FILTER RESPONSE Gain (db) Gain (db) Frequency (Hz) Frequency (Hz) FIGURE 5. Digital Filter Response (6Hz). FIGURE 6. Digital Filter Response (1Hz Multiples). DIGITAL FILTER RESPONSE DIGITAL FILTER RESPONSE Gain (db) Gain (db) Frequency (Hz) Frequency (Hz) FIGURE 7. Expanded Digital Filter Response (5Hz with a 5Hz Notch). FIGURE 8. Expanded Digital Filter Response (5Hz with a 1Hz Notch). 1

11 Gain (db) DIGITAL FILTER RESPONSE Frequency (Hz) to the DOR from MSB to LSB in the time defined by t 1 (see Figures 11 and 12). The DOUT/DRDY line then drives the line LOW for the time defined by t 2, and then drives the line HIGH for the time defined by t 3 to indicate that new data is available to be read. At this point, the function of the DOUT/ DRDY pin changes to DOUT mode, and data is shifted out on the pin after t 7. If the MSB is high (because of a negative result) the DOUT/DRDY signal will stay HIGH after the end of time t 3. The device communicating with the can provide SCLKs to the after the time defined by t 6. The normal mode of reading data from the is for the device reading the to latch the data on the rising edge of SCLK (since data is shifted out of the on the falling edge of SCLK). In order to retrieve valid data, the entire DOR must be read before the DOUT/DRDY pin reverts back to DRDY mode. FIGURE 9. Expanded Digital Filter Response (6Hz with a 6Hz Notch). Gain (db) DIGITAL FILTER RESPONSE Frequency (Hz) FIGURE 1. Expanded Digital Filter Response (6Hz with a 1Hz Notch). If SCLKs are not provided to the during the DOUT mode, the MSB of the DOR is present on the DOUT/DRDY line until the beginning of the time defined by t 4. If an incomplete read of the takes place in DOUT mode (that is, fewer than 24 SCLKs are provided), the state of the last bit read is present on the DOUT/DRDY line until the beginning of the time defined by t 4. If more than 24 SCLKs are provided during DOUT mode, the DOUT/DRDY line stays LOW until the beginning of the time defined by t 4. The internal data pointer for shifting data out on DOUT/DRDY is reset on the falling edge of the time defined by t 1 and t 4. This ensures that the first bit of data shifted out of the after DRDY mode is always the MSB of new data. SYNCHRONIZING MULTIPLE CONVERTERS The normal state of SCLK is LOW; however, by holding SCLK HIGH, multiple s can be synchronized. This is accomplished by holding SCLK HIGH for at least four, but less than 2, consecutive DOUT/DRDY cycles (see Figure 13). After the circuitry detects that SCLK has been held HIGH for four consecutive DOUT/DRDY cycles, the DOUT/ DRDY pin pulses LOW for 3 CLK cycles and then held HIGH, and the modulator is held in a reset state. The modulator is released from reset and synchronization occurs on the falling edge of SCLK. It is important to note that prior to synchronization, the DOUT/DRDY pulse of multiple s in the system can have a difference in timing up to one DRDY period. Therefore, to ensure synchronization, the SCLK must be held HIGH for at least five DRDY cycles. The first DOUT/DRDY pulse after the falling edge of SCLK occurs at t 14. Valid data is not present until the sixth DOUT/DRDY pulse. 11

12 POWER-DOWN MODE The normal state of SCLK is LOW; however, by holding SCLK HIGH, the enters power-down mode. This is accomplished by holding SCLK HIGH for at least 2 consecutive DOUT/DRDY periods (see Figure 14). After the circuitry detects that SCLK is held HIGH for four consecutive DOUT/DRDY cycles, the DOUT/DRDY pin pulses LOW for three CLK cycles, then held HIGH, and the modulator will be held in a reset state. If SCLK is held HIGH for an additional 16 DOUT/DRDY periods, the enters power-down mode and the part is released from power-down mode on the falling edge of SCLK. It is important to note that the DOUT/DRDY pin is held HIGH after four DOUT/DRDY cycles, but power-down mode is not entered for an additional 16 DOUT/DRDY periods. The first DOUT/DRDY pulse after the falling edge of SCLK occurs at t 16 ; however, subsequent DOUT/DRDY pulses occur normally. Valid data is not present until the sixth DOUT/DRDY pulse. SERIAL INTERFACE The includes a simple serial interface which can be connected to microcontrollers and digital signal processors in a variety of ways. Communications with the can commence on the first detection of the DOUT/DRDY pulse after power up, although data is valid until the sixth conversion. It is important to note that the data from the is a 24-bit result transmitted MSB-first in Offset Binary Two s Complement format, as shown in Table III. The data must be clocked out before the enters DRDY mode to ensure reception of valid data, as described in the DOUT/DRDY section of this data sheet. DIFFERENTIAL VOLTAGE INPUT +Full-Scale Zero Full-Scale DIGITAL OUTPUT (HEX) 7FFFFF H H 8 H TABLE III. Data Format (Offset Binary Two's Complement). SYMBOL DESCRIPTION MIN TYP MAX UNITS t DRDY Conversion Cycle 384 CLK ns DRDY Mode DRDY Mode 36 CLK ns DOUT Mode DOUT Mode 348 CLK ns t 1 DOR Write Time 6 CLK ns t 2 DOUT/DRDY LOW Time 6 CLK ns t 3 DOUT/DRDY HIGH Time (Prior to Data Out) 6 CLK ns t 4 DOUT/DRDY HIGH Time (Prior to Data Ready) 24 CLK ns t 5 Rising Edge of CLK to Falling Edge of DOUT/DRDY 3 ns t 6 End of DRDY Mode to Rising Edge of First SCLK 3 ns t 7 End of DRDY Mode to Data Valid (Propagation Delay) 3 ns t 8 Falling Edge of SCLK to Data Valid (Hold Time) 5 ns t 9 Falling Edge of SCLK to Next Data Out Valid (Propagation Delay) 3 ns t 1 SCLK Setup Time for Synchronization or Power Down 3 ns t 11 DOUT/DRDY Pulse for Synchronization or Power Down 3 CLK ns t 12 Rising Edge of SCLK Until Start of Synchronization 1537 CLK 7679 CLK ns t 13 Synchronization Time.5 CLK CLK ns t 14 Falling Edge of CLK (After SCLK Goes LOW) Until Start of DRDY Mode CLK ns t 15 Rising Edge of SCLK Until Start of Power Down 7681 CLK ns t 16 Falling Edge of CLK (After SCLK Goes LOW) Until Start of DRDY Mode CLK CLK ns t 17 Falling Edge of Last DOUT/DRDY to Start of Power Down CLK ns TABLE II. Digital Timing. DOUT Mode DRDY Mode DOUT Mode DRDY Mode t 4 t 2 t 3 DOUT/DRDY DATA DATA DATA t 1 FIGURE 11. DOUT/DRDY Partitioning. 12

13 CLK t 5 t 6 SCLK t 1 t 7 t 8 t 9 DOUT/DRDY MSB LSB t 4 t 2 t 3 DRDY Mode DOUT Mode t DRDY FIGURE 12. DOUT/DRDY Timing. Synchronization Mode Starts Here CLK t 1 Synchronization Begins Here SCLK t 12 DOUT/DRDY DATA DATA DATA DOUT Mode t 2 t 3 t 4 t 11 t DRDY 4 t DRDY t 3 t 4 t 2 DOUT t 13 t 14 t DRDY Mode FIGURE 13. Synchronization Mode. Power Down Occurs Here CLK t 1 t 17 SCLK t 15 DOUT/DRDY DATA DATA DATA DOUT Mode t 2 t 3 t 4 t 11 t 11 t DRDY 4 t DRDY t 3 t 4 t 2 DOUT t 16 t DRDY Mode FIGURE 14. Power-Down Mode. 13

14 ISOLATION The serial interface of the provides for simple isolation methods. The CLK signal can be local to the, which then only requires two signals (SCLK and DOUT/DRDY) to be used for isolated data acquisition. LAYOUT POWER SUPPLY The power supply should be well regulated and low noise. For designs requiring very high resolution from the, power-supply rejection will be a concern. Avoid running digital lines under the device because they can couple noise onto the die. High-frequency noise can capacitively couple into the analog portion of the device and will alias back into the passband of the digital filter, affecting the conversion result. GROUNDING The analog and digital sections of the system design must be carefully and cleanly partitionedl; each section must have its own ground plane with no overlap between them. GND must be connected to the analog ground plane, as well as all other analog grounds. Do not join the analog and digital ground planes on the board, but instead connect the two with a moderate signal trace. For multiple converters, connect the two ground planes at one location as central to all of the converters as possible. In some cases, experimentation is required to find the best point to connect the two planes together. The printed circuit board can be designed to provide different analog/digital ground connections via short jumpers; the initial prototype can be used to establish which connection works best. DECOUPLING Good decoupling practices must be used for the and for all components in the design. All decoupling capacitors, and specifically the.1µf ceramic capacitors, must be placed as close as possible to the pin being decoupled. A 1µF to 1µF capacitor, in parallel with a.1µf ceramic capacitor, must be used to decouple V DD to GND. SYSTEM CONSIDERATIONS The recommendations for power supplies and grounding change depending on the requirements and specific design of the overall system. Achieving 24 bits of noise performance is a great deal more difficult than achieving 12 bits of noise performance. In general, a system can be broken up into four different stages: Analog Processing Analog Portion of the Digital Portion of the Digital Processing For the simplest system consisting of minimal analog signal processing (basic filtering and gain), a microcontroller, and one clock source, one can achieve high resolution by powering all components by a common power supply. In addition, all components can share a common ground plane; thus, there would be no distinctions between analog power and ground, and digital power and ground. The layout must still include a power plane, a ground plane, and careful decoupling. In a more extreme case, the design can include: Multiple s Extensive Analog Signal Processing One or More Microcontrollers, Digital Signal Processors, or Microprocessors Many Different Clock Sources Interconnections to Various Other Systems High resolution will be very difficult to achieve for this design. The approach would be to break the system into as many different parts as possible. For example, each may have its own analog processing front end. DEFINITION OF TERMS An attempt has been made to be consistent with the terminology used in this data sheet. In that regard, the definition of each term is given as follows: Analog-Input Differential Voltage for an analog signal that is fully differential, the voltage range can be compared to that of an instrumentation amplifier. For example, if both analog inputs of the are at 2.48V, the differential voltage is V; however, if one analog input is at V and the other analog input is at 4.96V, then the differential voltage magnitude is 4.96V. This is the case regardless of which input is at V and which is at 4.96V. The digital-output 14

15 result, however, is quite different. The analog-input differential voltage is given by the following equation: +V IN ( V IN ) A positive digital output is produced whenever the analog-input differential voltage is positive, whereas negative digital output is produced whenever the differential is negative. For example, a positive full-scale output is produced when the converter is configured with a 4.96V reference, and the analog-input differential is 4.96V, the negative fullscale output is produced when the differential voltage is 4.96V. In each case, the actual input voltages must remain within the.3v to +V DD range. Actual Analog-Input Voltage the voltage at any one analog input relative to GND. Full-Scale Range (FSR) as with most A/D converters, the full-scale range of the is defined as the input which produces the positive full-scale digital output minus the input which produces the negative full-scale digital output. For example, when the converter is configured with a 4.96V reference, the differential full-scale range is: [4.96V (positive full-scale) ( 4.96V) (negative full-scale)] = 8.192V Least Significant Bit (LSB) Weight this is the theoretical amount of voltage that the differential voltage at the analog input has to change in order to observe a change in the output data of one least significant bit. It is computed as follows: Full ScaleRange LSB Weight = N 2 where N is the number of bits in the digital output. Conversion Cycle as used here, a conversion cycle refers to the time period between DOUT/DRDY pulses. Effective Resolution (ER) of the in a particular configuration can be expressed in two different units: bits rms (referenced to output) and µvrms (referenced to input). Computed directly from the converter output data, each is a statistical calculation based on a given number of results. Noise occurs randomly; the rms value represents a statistical measure which is one standard deviation. The ER in bits can be computed as follows: 2 VREF 2 log Vrms noise ER in bits rms = 62. The 2 V REF figure in each calculation represents the full-scale range of the, this means that both units are absolute expressions of resolution the performance in different configurations can be directly compared, regardless of the units. Noise Reduction for random noise, the ER can be improved with averaging. The result is the reduction in noise by the factor N, where N is the number of averages, as shown in Table IV; this can be used to achieve true 24-bit performance at a lower data rate. To achieve 24 bits of resolution, more than 24 bits must be accumulated. A 36-bit accumulator is required to achieve an ER of 24 bits. The following uses V REF = 4.96V, with the outputting data at 4kHz, a 496 point average takes 12.4ms. The benefits of averaging is degraded if the input signal drifts during that 1ms. N NOISE ER ER (NUMBER REDUCTION IN IN OF AVERAGES) FACTOR µvrms BITS rms µV µV µV µV µV µV µV µV µV µV nV nV nV 24 TABLE IV. Averaging. 15

16 Revision History DATE REVISION PAGE SECTION DESCRIPTION 6/6 D 11 DOUT/DRDY Text changes to DOUT/DRDY section. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 16

17 PACKAGE OPTION ADDENDUM 3-Jun-216 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) U/2K5 ACTIVE SOIC D 8 25 Green (RoHS & no Sb/Br) U/2K5G4 ACTIVE SOIC D 8 25 Green (RoHS & no Sb/Br) UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) CU NIPDAU Level-2-26C-1 YEAR -4 to 85 ADS 1252U CU NIPDAU Level-2-26C-1 YEAR -4 to 85 ADS 1252U CU NIPDAU Level-2-26C-1 YEAR -4 to 85 ADS 1252U CU NIPDAU Level-2-26C-1 YEAR -4 to 85 ADS 1252U Device Marking (4/5) Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

18 PACKAGE OPTION ADDENDUM 3-Jun-216 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

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21 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components ) are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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