EPON ONU Optical Transceiver SFF Module

Transcription

1 Features Integrated Single fiber bi-directional optical subassembly 1310nm DFB FP laser Burst-mode Transmitter and 1490nm PIN Continuous APD Continuous receiver(with WDM) receiver(with WDM) SFF 2 10 metallic package 1000mm receptacle pigtail package with SC/UPC +3.3V single connector power supply +3.3V Low power single consumption power supply Low 0 to 70 power o C operating consumption case temperature 0 to 70 o C operating case temperature LVPECL compatible data LVPECL input compatible data input LVPECL compatible data CML output compatible data output LVTTL transmitter burst LVTTL mode control transmitter burst mode Burst Enable control :H-active Burst LVTTL Enable receiver :H-active LVTTL signal-detected receiver indication signal-detected Class 1 Laser eye indication safety Class Excellent 1 Laser EMI and eye safety EMC Excellent characteristics EMI and EMC RoHs DDM Function compliant DDM implemented Function implemented RoHs compliant The EPON ONU Transceiver module is designed for Gigabit Ethernet Passive Optical Network (EPON) 10km transmission. The module incorporates 1310nm burst-mode transmitter and 1490nm continuous-mode receiver. The transmitter section uses a 1310nm FP laser and an integrated BM laser driver which is designed to perform very small burst enable/disable delay time. The laser driver also includes digital APC and temperature compensation circuit, which are used for keeping the launch optical power and extinction ratio constant over temperature and aging. The receiver section uses an integrated 1490nm InGaAs PIN photodiode and preamplifier mounted together. It has the function that indicates receiver signal-detected status (active high). An integrated WDM coupler can separate 1490nm input light and 1310nm output light. The metallic package guarantees excellent EMI and EMC characteristics, which totally comply with international relevant standards. Specifications Parameter Symbol Unit Value Min typical Max Supply Current Icc ma Single Ended Data Input Swing mv Single Ended Data Output Swing mv Differential Data input impedance Ω Signal Input Level(LVTTL H) V 2.0 Vcc Signal Input Level(LVTTL L) V Signal Output Level(LVTTL H) V 2.4 Vcc Signal Output Level(LVTTL L) V Optical transmitter Characteristics Data Rate Mbps 1250 Center Wavelength Range λ c nm Spectral Width(@RMS) λ nm 3.0 Side Mode Suppression Ratio db Launch Optical Power P o dbm Off level light dbm -45 Extinction Ratio EX db 10 4 Note

2 Burst turn on/off time Ton/Toff ns Rise/Fall time(20%~80%) Tr/Tf ps RIN 15OMA db/hz -115 Tolerance to the Transmitter s incident light power db -15 Applications EPON ONU IEEE 802.3ah PX20 Standards EPON ONU IEEE 802.3ah PX20 Small Form Factor Transceiver Multisource Agreement July 5,2000 Compliant with SFF-8472 v9.5 Transmitter reflectance db -6 TX_SD delay Ttx_sd_del ay λ=1.3 1µm ns TX_SD response error ns Transmitter dispersion penalty TDP db Eye Diagram Compliant with IEEE 802.3ah 8 Optical receive Characteristics Data Rate Mbps 1250 Receiver Sensitivity S dbm Overload Input Optical Power P in dbm -3 9 Center Wavelength Range λ c nm Receiver reflectance db -20 SD(LVTTL) Optical Dessert -44 dbm Optical Assert -30 SD Hysteresis db nm Tx to 1490nm Rx Crosstalk 1550nm Rx to 1490nm Isolation db 30 db -47 λ=1.4 Note1:DC coupled internally and terminated internally (see the recommended circuit below). Note2:CML output, AC coupled internally (see the recommended circuit below). Note3:Coupled into 9/125 SMF Note4:Measured with PRBS test Note5:see Figure 1. Note6: These are unfiltered 20-80% values. Note7:Transmit on 20km SMF. Note8:See Figure 2. Note9:Measured with PRBS test with Tx on, ER =10dB, BER = 10E-12. Note10: TX_SD delay is the edge between TX_SD and TX_Burst_EN, See Figure 3. Note11:TX_SD response error is the difference between TX_SD and TX_Burst_EN, defined by Tw_burst_en Tw_tx_sd, See Figure 3. 9µm

3 TX_Burst_EN TX_SD Figure1 Burst_mode Receiver Dynamic range in GPON system Figure2 Mask of diagram Tw_burst_en Ttx_sd_delay Tw_tx_sd Figure3 Timing diagram of TX_SD

4 Ordering Information Part No Specification Package Data rate Laser Optical Power Detector Sensitivity Temp Reach BM control logic Application Code RTXM SFF Gb/s US 1.25Gb/s DS 1310nm Absolute Maximum Ratings Recommended operating conditions FP 0 ~ 4dBm PIN -27dBm 0~70 C 20km H Enable PX20 Parameter Symbol Unit Min Max Operating Case Temperature Range T c o C 0 70 Storage Temperature Range T s o C Relative Humidity RH % 5 95 Power Supply Voltage V cc V Pin Input Voltage V GND Vcc Receiver Damage Threshold dbm +4 Lead Solder Temperature o C 260 Lead Solder Duration S 10 Fiber Yield Strength kgf 0.5 Fiber Bend Radius mm 30 Parameter Symbol Unit Min Typ Max Operating Voltage V cc V Operating Case Temperature Range T c o C 0 70

5 Principle diagram LVPECL TD+/- LVTTL BEN RD+/- CML LVTTL SD SDA LVTTL SCL LA Bust LD Driver Bias EEPROM Digital Diagnostic Memory Map Rx Power PD Bias PD + TIA LD Tx Power A/D Convertor Temp Digital Diagnostic Monitoring interface 1490nm 1310nm Vcc Figure4 Functional block diagram WDM 2 wire address X (A0) 2 wire address X(A2) Serial ID Defined by SFP MSA(96bytes) Vendor Specific (32bytes) Alarm and Warning Thresholds (56 bytes) Cal Constants (40 bytes) Real-Time Diagnostic Interface (24 bytes) Vendor Specific (8bytes) 255 Reserved in SFP MSA (128bytes) Vendor Specific (120 bytes) Vendor Specific(8bytes)

6 EEPROM Serial ID Memory Contents Accessing Serial ID Memory uses the 2 wire address X (A0). Memory Contents of Serial ID are shown in the Table 1. Table 1 Serial ID Memory Contents Data Address Size (Bytes) Name of Field Contents(Hex) Description BASE ID FIELDS 0 1 Identifier 02 Module/connector soldered to motherboard 1 1 Extended. Identifier Connector 0B Optical pigtail Transceiver EPON ONU SFF 2X PX Encoding 03 NRZ 12 1 BR, Nominal 0C 12*100Mb/s=1.25Gb/s 13 1 Reserved Length (9μm) km Length (9μm) 100m C8 Transceiver transmit 16 1 Length (50μm) 10m 00 distance:20km 17 1 Length(62.5μm)10m Length (Copper) 00 Not compliant 19 1 Reserved Vendor name WTD (ASCII) Reserved Vendor OUI D Vendor PN D Transceiver part number: RTXM (ASCII) Vendor rev Wavelength 05 1E Transceiver wavelength:1310nm 62 1 Reserved CC_BASE Check Sum Check code for Base ID (Variable) Fields EXTENDED ID FIELDS Options Signal Detect is implemented 66 1 BR,max 00

7 67 1 BR,min Vendor SN Serial Number of transceiver (ASCII). For example B Date code Manufactory date code. For example Digital diagnostic monitoring 92 1 implemented, internally Diagnostic 68 calibrated is implemented, Monitoring Type RX measurement type is Average Power Optional Alarm/Warning flags implemented for all 93 1 Enhanced Options C0 monitored quantities, Optional Soft TX_Disable monitoring implemented 94 1 Includes functionality SFF_ described in Rev9.5 Compliance SFF CC_EXT Check Sum Check sum for Extended ID (Variable) Field VENDOR SPECIFIC ID FIELDS Vendor Specific Read only Depends on customer information Reserved Read only

8 Table 2 Memory contents of Diagnostic Monitor Function Data Field Name Contents and Description Address Size (bytes) Alarm and Warning Thresholds Temperature High Alarm Set to Temperature Low Alarm Set to Temperature High Set to 75 Warning Temperature Low Set to -8 Warning Vcc High Alarm Set to 3.6 V Vcc Low Alarm Set to 3.0 V Vcc High Warning Set to 3.5 V Vcc Low Warning Set to 3.1 V Bias High Alarm 90mA Bias Low Alarm 0 ma Bias High Warning 70mA Bias Low Warning 0 ma TX Power High Alarm 6 dbm TX Power Low Alarm -0.5 dbm TX Power High Warning 5.5 dbm TX Power Low Warning 0 dbm RX Power High Alarm -7.0 dbm RX Power Low Alarm -28.0dBm RX Power High Warning -8.0 dbm RX Power Low Warning -27.0dBm Reserved Calibration Constants RX Power Calibration (fixed) Data RX Power Calibration (fixed) Data RX Power Calibration (fixed) Data RX Power Calibration 3F (fixed) Data RX Power Calibration (fixed) Data Bias Calibration Data (fixed) Bias Calibration Data (fixed) TX Power Calibration Data (fixed)

9 TX Power Calibration (fixed) Data Temperature Calibration (fixed) Data Temperature Calibration (fixed) Data Vcc Calibration Data (fixed) Vcc Calibration Data (fixed) Reserved (fixed) 95 1 Check Sum Checksum of bytes 0-94 Real Time Diagnostic Monitor Interface Measured Temperature Internally measured module temperature Measured Vcc Internally measured supply voltage in module Measured Bias Internally measured Tx Bias current Measured TX Power Internally measured Tx Optical Power Measured RX Power Measured Rx input power Reserved Logic Status See Table AD Conversion Updates See Table Alarm and Warning Flags See Table 3.2 Vendor Specific Vendor Specific Don t Access User writable EEPROM Vendor Specific Don t Access Notes: Temperature (Signed twos complement value) A2h Byte 96 (Temperature MSB) A2h Byte 97 (Temperature LSB) S Supply Voltage, Tx Bias Current, Tx Optical Power, Rx Received Power (Unsigned values) A2h Byte 98 (Vcc MSB) A2h Byte 99 (Vcc LSB) A2h Byte 98 (Vcc MSB) A2h Byte 99 (Vcc LSB) A2h Byte 102 (TX Power MSB) A2h Byte 103 (TX Power LSB) A2h Byte 104 (RX Power MSB) A2h Byte 105 (RX Power LSB)

10 All the measured values are Internally Calibrated,Each measurement could be obtained by multiplying digital value by corresponding LSB value: Temperature = Temp (Digital Value) X (1/256); when Temperature<128 Temperature = [Temp (Digital Value) X (1/256)]-256; when Temperature 128 VCC=VCC(Digital Value) X 100µV TX Bias Current = TX Bias Current (Digital Value) X 2µA TX Power = TX Power (Digital Value) X 0.1µW RX Power = RX Power (Digital Value) X 0.1µW Table 3.1 Logic Status and AD Conversion Updates Byte Bit Name Description Reserved Soft Tx Disable 1= disable, 0= enable Control Reserved Set to Rx Rate Select State Not supported (set to 0) Soft Rate Select Not supported (set to 0) Control Tx Fault 1= Fault,0= Normal LOS Digital state of the RX_SD Output Pin Power on Logic Not supported (set to 0) Temp A/D Valid Set to 0 Each of the measured values has a corresponding high alarm, low alarm, high and low threshold level at location 00-39(x0A2) written as the data format of a corresponding valued shown in Table 3.3.Alarm and flags at bytes (0xA2) are defined as follows. (1) Alarm flags indicate conditions likely to result (or have resulted) in link failure and cause for immediate action. (2) Warning flags indicate conditions outside the guaranteed operating specification of transceiver but not necessarily causes of immediate link failures. Table 3.2 Alarm and Warning Flags Byte Bit(s) Name Description Temperature High Alarm Set when temperature monitor value exceeds high alarm level Temperature Low Alarm Set when temperature monitor value exceeds low alarm level Vcc High Alarm Set when Vcc monitor value exceeds high alarm level Vcc Low Alarm Set when Vcc monitor value exceeds Low alarm level

11 112 3 Laser Bias High Alarm Set when laser bias monitor value exceeds high alarm level Laser Bias Low Alarm Set when laser bias monitor value exceeds low alarm level Tx Power High Alarm Set when Tx power monitor value exceeds high alarm level Tx Power Low Alarm Set when Tx power monitor value exceeds low alarm level Rx Power High Alarm Set when Rx power monitor value exceeds high alarm level Rx Power Low Alarm Set when Rx power monitor value exceeds low alarm level Reserved All bits set to Reserved All bits set to Reserved All bits set to Temperature High Set when temperature monitor value exceeds high Temperature Low Set when temperature monitor value exceeds low Vcc High Set when Vcc monitor value exceeds high Vcc Low Set when Vcc monitor value exceeds Low Laser Bias High Set when laser bias monitor value exceeds high Laser Bias Low Set when laser bias monitor value exceeds low Tx Power High Set when Tx power monitor value exceeds high Tx Power Low Set when Tx power monitor value exceeds low Rx Power High Set when Rx power monitor value exceeds high Rx Power Low Set when Rx power monitor value exceeds low Reserved All bits set to Reserved All bits set to Reserved All bits set to 0

12 Pin Description Pin Name Description 1 NC No function Definition 2 Rx GND Receiver ground 3 Rx GND Receiver ground 4 NC No function Definition 5 NC No function Definition 6 Rx GND Receiver ground 7 Rx VCC Receiver power supply 8 Rx_SD LVTTL Signal detect output, internally pull up. Asserts high when input optical power level is above threshold 9 RD- Receiver data output-, AC coupled internally 10 RD+ Receiver data output+, AC coupled internally 11 Tx VCC Transmitter power supply 12 Tx GND Transmitter ground 13 Tx Ben LVTTL Transmitter burst mode control, H : Tx ON 14 TD+ LVPECL Data input+,dc coupled internally, internal 100ohm termination 15 TD- LVPECL Data input-,dc coupled internally, internal 100ohm termination 16 Tx GND Transmitter ground 17 SCL I 2 C Serial Clock (LVTTL) 18 SDA I 2 C Serial Data (LVTTL) 19 Tx-Fault LVTTL Transmitter Fault, internally pull up. Asserts high when the fault is detected by the laser driver. 20 Tx GND Transmitter ground

13 Typical Application Circuit Laser Driver 7.5K TIA +Limiting Amplifier I2C Slave +3.3V +3.3V 7.5K Tx VCC(11) TD+(14) TD-(15) Tx Ben(13) RD+(10) RD-(9) Zo=50 1.2uH +3.3V 0.1uF 10uF 10uF Tx GND(12,16) Tx GND(20) Rx_SD(8) Rx VCC(7) Zo=50 Zo= V R3 +3.3V 0.1uF 10uF 10uF Rx GND(2,3,6) Reset(19) SDA(18) SCL(17) 0.1uF 1.2uH uF Zo=50 R1 R2 R5 2*(4.7~10)K R1=R2=150Ω R3=R4=82Ω R5=R6=130Ω +3.3V R4 R6 Serial data 1.2uH output+ Serial data output- Tx control SD Indicator Serial data input+ Serial data input- SDA SCL GEPON ONU SYSTEM Note: If output+/- in source(pon MAC IC) are CML buffer, R1,R2 can be omitted. If input+/- in source(pon MAC IC) are CML buffer, R3,R4,R5,R6 can be omitted. Default both are LVPECL. Figure5 Typical Application Circuit Package Outline Figure6 Package outline

14 Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) Immunity Electromagnetic Interference (EMI) Immunity Eye Safety MIL-STD-883E Method IEC CISPR22 ITE Class B EN55022 Class B IEC Class 2 EN55024 FDA 21 CFR and UL TUV EN Class 1 (>1.5kV) Human Body Model LV4(Air discharge 15kV,Contact discharge 8kV) Performance criterion B Compliant with standards Typically show no measurable effect from a 3V/m field swept from 80 to 1000MHz applied to the transceiver without a chassis enclosure. Compliant with Class 1 laser product