PRELIMINARY SPECIFICATION
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1 PRELIMINARY SPECIFICATION MODEL : ( LMETP28A1CWHX060-C80 ) LED PKG PART No. 6500K : LMETP28A1C6K5X060-C K : LMETP28A1C5K7X060-C K : LMETP28A1C5K0X060-C K : LMETP28A1C4K5X060-C K : LMETP28A1C4K0X060-C K : LMETP28A1C3K5X060-C K : LMETP28A1C3K0X060-C K : LMETP28A1C2K7X060-C80 Customer Approval Model LMETP28A1CWHX060-C80 Checked By Approved By Approved By Issued Date Description SMD Type LED Written By Checked By Approved by 1/12
2 Contents 1. Description 1) Feature 2) Part No 3) Outline Dimensions 4) Recommend Solder Pattern 5) LED Circuit Diagram 2. Absolute Maximum Ratings 3. Characteristics 1) Electro / Optical Characteristics 2) Color Coordinates Rank 3) VF Rank 4) CRI Rank 5) Luminous Intensity Rank 6) Rank Description 4. Typical Characteristics 5. Reliability Test Items & Conditions 6. Soldering Conditions 7. Packing 1) Taping Dimensions 2) Reel Dimensions 3) Packing Spec 4) Label Spec 8. Precaution For Use 9. Revision History 2/12
3 1. Description 1) Feature. Built-in 1 chip White Colored LED. Pb-free Reflow Soldering Application. Rohs Compliant. External dimensions: 3.5 x 2.8 x 0.7T mm 2) Part No Part No : LMETP28A1CWHX060-C80 LUMIMICRO LED Part No. Explanation LM E TP 28A 1 C WH X 060 C80 3) Outline Dimensions : LUMIMICRO.Ltd : ENERGYSTAR C.I.E. : Top View LED(SMD Type) : Package Size ( T) : Chip Quantity : Polarity ( A : Anode / C : Cathode) : White Color - [6300K, 5700K, 5000K, 4500K, 4000K, 3500K, 3000K, 2700K] : NO ZENER : Forward Current 60mA : CRI Min (+) 1 (+) 2 (-) 2 (-) 4) Recommend Solder Pattern 5) LED Circuit Diagram 1 (+) 2 (-) 3/12
4 2. Absolute Maximum Ratings 3. Characteristics Parameter Forward Current Power Dissipation Forward Pulse Current *1 Storage Temperature Operating Temperature Soldering Temperature Junction Temperature Symbol I F Value 150 Unit ma P d 500 mw I PF ma T stg -40 ~ +100 T opr -40 ~ +80 T sld 260 (for 10 sec) T j 115 *1 : Forward Pulse Current : Pulse Width < 10msec / Duty Ratio < 1/10 1) Electro / Optical Characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage V F I F =60mA V Reverse Voltage Vr I F =5mA V Luminous Flux Ф v I F =60mA lm Color Correlated Temperature CCT IF=60mA K Color Rendering Index Ra I F =60mA Viewing Angle 2Θ 1/2 I F =60mA deg. ESD 1.5kΩ,100pF KV Thermal Resistance [1] I F =60mA /W R th(j-s) [1] Thermal Resistance : Rth(Junction - Solder) * Tolerance : VF=±0.1V, Iv=±10%, Chromaticity Coordinate=±0.01, CRI=±2 2) Color Coordinates Rank A B M D B A M C A D 4K0 B M C D A 4K5 M C B D 5K0 A C M D 5K7 C 6K5 B A M D C 3K5 A B M D C 3K0 B A M C D 2K7 B /12
5 2K7A 2K7B 2K7C 2K7D 2K7M K0A 3K0B 3K0C 3K0D 3K0M K5A 3K5B 3K5C 3K5D 3K5M K0A 4K0B 4K0C 4K0D 4K0M K5A 4K5B 4K5C 4K5D 4K5M K0A 5K0B 5K0C 5K0D 5K0M K7A 5K7B 5K7C 5K7D 5K7M K5A 6K5B 6K5C 6K5D 6K5M /12
6 3) VF Rank Rank MIN. MAX. Unit 2V V V V V ) CRI Rank Rank MIN. MAX. Symbol C Ra 5) Luminous Intensity Rank Rank Flux(lm) Unit DK DK DK DK DK DK * Luminous Flux : Only reference data. 6) RANK[Bin] Description RANK Name CCT Rank Iv Rank VF Rank 6K5M DK5 2V9 6/12
7 Forward Current [m A] Relative Luminous Flux [a.u.] Relative Forward Voltage [a.u.] Forward Current [ma] Relative Luminous Flux [a.u.] REV Typical Characteristics Forward Voltage vs. Forward Current Forward Voltage vs. Forward Current Forward Current vs. Relative Luminous Intensity Forward Current vs. Relative Flux ] Forward Voltage [V] Forward Current [ma] Ambient Temperature vs. Relative Luminous Intensityrent Ambient Temp. vs. Relative Flux [IF=800mA] Ambient Temperature vs. Relative Voltage Ambient Temp. vs. Relative Voltage Ambient Temp [ ] Ambient Temp [ ] Ambient Temperature vs. Maximum Forward Current View Angle Radiation Characteristics Ambient Temperature [ ] View angle 7/12
8 5. Reliability Test Items & Conditions Test Item No ITEMS CONDITION NOTE Fail /Sample 1 RESISTANCE TO SOLDERING HEAT (REFLOW SOLDERING) TSID=260, 10sec (PRE TREATMENT 30, 70%, 168hr) 2TIMES 2 THERMAL SHOCK -20 ~ 100, 15min AT EACH TEMP. 100CYCLES 3 MOISTURE RESISTANCE CYCLE 25 ~ 65 ~ -10, 90%RH 24hr / 1cycle 500HRS 4 HIGH TEMPERATURE STORAGE Ta = HRS 5 TEMPERATURE HUMIDITY STORAGE Ta = 60, RH = 90% 1,000HRS 6 LOW TEMPERATURE STORAGE Ta = -40 1,000HRS 7 ROOM TEMPERATURE LIFE TEST Ta = 25, IF=60mA/chip each* 1,000HRS 8 HIGH TEMPERATURE HUMIDITY LIFE TEST 60, RH=90%, IF=60mA/chip each* 500HRS 9 LOW TEMPERATURE LIFE TEST Ta = -30, IF=60mA/chip each* 1,000HRS 10 HIGH TEMPERATURE LIFE TEST Ta = 85, IF=60mA/chip each* 500HRS *) ; Tested with our company's standard circuit board Failure Criteria ITEM SYMBOL Failure Criteria MIN MAX Forward Voltage VF - U.S.L*) 1.1 C.I.E x,y L.S.L*) 0.8 U.S.L*) 1.2 Luminous Intensity IV L.S.L*) U.S.L*) ; Upper Standard Level L.S.L*) ; Lower Standard Level 8/12
9 6. Soldering conditions 1) Reflow Conditions ( With Pb ) Preliminary heating to be at 150 C max. for 2 minutes max. Soldering heat to be at 240 C max. for 10 seconds max. Recommended Solder Paste : Alloy- 63Sn/37Pb Model: OL107B, Max 240 C Temp. Max 120 ~ 150 C 120sec.Max 10sec.Max Time 2) Pb free Reflow Conditions Preliminary heating to be at 170 C max. for 2 minutes max. Soldering heat to be at 260 C max. for 10 seconds max. Recommended Pb free Paste Alloy: 96.5Sn/3Ag/0.5Cu. - Model: OL204 Max 260 C Temp. Max 150 ~ 170 C 10sec.Max 90 ~120sec.Max Time 3) For Manual Soldering Not more than C, under soldering iron 9/12
10 7. Packing 1) Taping pocket Dimension 2) Reel Dimensions One Reel Unit Tolerance Max 4,000 EA mm ± 0.1 3) Packing Spec. Aluminum Bag Reel in a Bag Silica in a Bag Goods QNT in a Bag Aluminum Bag 1 Reel 1 Silica, 1 Indicator Max 4,000 EA. Box Spec Dimension(Width/Thickness) Unint : mm Reel in Box Goods QNT in a Bag In Box 270 x 270 x ,000 Dimension(Width/Thickness) Unint : mm InBox in Out Box Goods QNT in a Bag Out Box 560 x 560 x , /12
11 Label <In Box> <Out Box> 4) Label Spec Model : LMETP28A1C6K5X060-C80 Model name Rank : 6K5M-DK5-2V9 Rank name Date : R Taping date QTY : 4,000 EA / - LUMIMICRO Quantity 8. Precaution For Use This device should not be used in any type of fluid such as water, oil, organic solvent, etc When washing is required, IPA should be used. When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3months or more after being shipped from LUMIMICRO, sealed container with a nitrogen atmosphere should be used for storage. The LEDs must be dip soldered within Two days after opening the moisture-proof packing. Repack unused Products with anti-moisture packing, fold to close any opening and then store in dry place. The appearance and specifications of the product may be modified for improvement without notice. These LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If Over voltage which exceeds the absolute maximum rating is applied to LEDs, it will cause damage in LEDs and result in destruction. Damaged LEDs will show some unusual characteristics such as remarkably increased leak current, turn-on voltage becomes lower and the LEDs get unlighted at low current. 11/12
12 9. Revision History Date [REV.00] Revision History Preliminary Drawn S.I. Lee Writer Approved T.K.Kim 12/12
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