THERMAL MANAGEMENT SOLUTIONS

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1 THERMAL MANAGEMENT SOLUTIONS Early Design-in of Thermal Management Considerations Delivers Higher Performance for Composite Enclosures... Expands Design Options for Harsh Environments... Saves Cost... Reduces Complexity

2 Reliable, Thermally Managed Electronics Integrated Solutions for Simplified Applications... Excellent Performance... Lower Costs BASELINE What is the geometry? What is the thermal load? What are the ambient conditions? Which thermal management technique should be applied? ANALYSIS VALIDATION Generate thermal model Build prototype Run model at various ambient conditions Test prototype over the ambient conditions Check results and modify model as needed Modify prototype and re-test as needed PRODUCTION Move builds to production Transfer design to sustaining engineering

3 THERMAL MANAGEMENT Solutions FULLY INTEGRATED Co-molded designs for complete integration Conductive composite-to-metal soldering using our new CNT solders Compatible materials with minimal galvanic concerns MECHANICALLY ROBUST Will not diminish EMI shielding or environmental sealing Withstands high-vibration environments High G-force designs available using encapsulated thermal pyrolytic graphite WEIGHT SAVINGS Integration takes advantage of composite s weight savings while minimizing impact of thermal management COMPATIBLE Meet DO160D, ARINC 600 and MIL-STD-2218 standards Solving the Thermal Challenges of Composites Composite enclosures are finding wider use because of their 30% to 40% weight savings over aluminum enclosures. But the lower thermal conductivity of composites also creates new challenges in managing heat. As a leader in advanced composites for enclosures in military and aerospace, TE Connectivity (TE) can help achieve thermal management custom tailored to your design. Custom Designs Using Standard Tools While there are many well-established ways of managing heat, selecting the best ones for a particular use requires careful analysis of the application s thermal characteristics. Common techniques for thermal management include: K-plates Heat pipes Liquid cooling Direct heat sinks Thermal prolytic graphite Thermal electric cooler Design for Thermal Management Early-on Adding thermal management late in the design limits the possibilities and may increase costs. Considering thermal management from the beginning of the design helps allow for the best solution in terms of technology, complexity, weight, and costs. Thermal management must be designed into your system. Making thermal management an integral part of your design: Keeps all potential solutions available Allows integrated solutions, such as insert molding thermal management into the composite enclosure Provides an optimized solution customized to your application not more than you need or less Reduces costs by avoiding late-in-the-design workarounds, which can be expensive and complicated Simplifies complexity and aids manufacturability Tools + Expertise = Solutions Let TE collaborate with your designers to give you the best fully integrated thermal solution. A modular, shielded microcomputer of the type typically used in UAV control is fully thermally managed within a custom composite enclosure to handle the 40-watt power dissipation. TE Components... TE Technology... TE Know-how... AMP Agastat CII Hartman Kilovac Microdot Nanonics Polamco Raychem Rochester DEUTSCH SEACON Phoenix L.L. Rowe Phoenix Optix SEACON Get your product to market faster with a smarter, better solution. PAGE 3

4 Thermal Management Solutions Material Filled Polymer Thermal Conductivity (W/m- K) Density (gm/cc) < 1 typical 0.8 to 1.5 typical Aluminum 200 to Expertise + Tools = Solutions This is no single answer for thermal management. But there is a best answer. That s where TE s thermal management expertise helps optimize your design. We look at your challenge and help devise the best solution, technically and economically, by applying the right mix of techniques. Thermal imaging uses FLIR camera and analysis software to provide insight in the thermal dynamic range and pinpoint spot measurements We have complete analysis capabilities, including advanced thermal modeling and testing. Thermal Management Design Helping Build Better Composite Boxes Thermal management is just one part of TE s complete, integrated approach to composite enclosures. Internal investment has pushed our molding technology to new levels, enabling robust molded parts for harsh environments. Our expertise in compounding materials and molding complex shapes allows you to realize value-added benefits: Design for Composites: we don t just replace aluminum parts with conductive composites, we design parts for ease of molding and higher functionality. Part Functionalization: The features we integrate in the enclosures include: Thermal management DC and RF circuits Fluid resistance Lightning strike protection EMI shielding Integrated connector shells Embedded sensors and antennas Wide temperature tolerance Finite element analysis uses CFD techniques to predict airflow, temperature, and heat transfer Our thermal constants measurement station can measure thermal conductivity, diffusivity and heat capacity of films and slabs from -40 C to +150 C Choose the right solution to satisfy your system needs. PAGE 4

5 Thermal Management Solutions Applying the Right Techniques Yields the Best Thermal Design Solution Thermal Insert and Heat Sink Directly couples to high dissipation components. Effective in directly passing heat through an enclosure wall to the external heat sink. Typically used for short pathways. K-Plate Provides an effective thermal pathway to a thermal via or other dissipation zone. Typically used to cool multiple heat sources over moderate distances. Heat Pipes Cooled Liquid (Wick) A tube and wick structure containing a quantity of working fluid that transports heat by movement of vapor and liquid undergoing a phase change. Effective thermal conductivity greater than any equivalent solid material. Very effective over distances of 5 to 20 cm. Thermal Pyrolytic Graphite Highly anisotropic thermal conductor with over 1600 W/M K conductivity in the plane, and approximately 10 W/m K perpendicular to the plane. May be used as a general heat spreader, as the core of a K-plate or in demanding environments where heat pipes will not function. Fluidic Cooling Cooled Liquid (Wick) Circulation of a high-heat-capacity fluid between a heat exchanger and a radiator. Used in the cases of high watt density components, or where it is desired to have the sink meters away from the source. Thermoelectric Cooling Active, reversible heat pump. Used in cases where the operating ambient temperature is higher than the maximum chip operating temperature. Also used in cases where components need to be kept within a narrow temperature range. Cooled Liquid (Wick) PAGE 5

6 For More Information TE Technical Support Center North America Asia Pacific Austria Baltic Regions Benelux Czech Republic France Germany Hungary Italy Nordic Poland Russia Spain/Portugal Switzerland United Kingdom Follow us on Twitter for all the latest product and on Facebook, TEConnectivity. te.com/thermal 2015 TE Connectivity Ltd. family of companies. All Rights Reserved ADM/RRD 2.5M 06/2015 TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other product or company names mentioned herein may be trademarks of their respective owners. While TE has made every reasonable effort to ensure the accuracy of the information herein, nothing herein constitutes any guarantee that such information is error-free, or any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. The TE entity issuing this publication reserves the right to make any adjustments to the information contained herein at any time without notice. All implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose are expressly disclaimed. The dimensions herein are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications.