ALPHA WS-819 WS-820 Solder Pastes product guide

Transcription

1 the product: A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability. ALPHA WS-819 WS-820 Solder Pastes product guide 1

2 WS-819/WS-820 solder paste A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability. Welcome to the ALPHA WS-819/WS 820 Product Guide CONTENTS 1. Introduction 3 2. Performance Summary 4 3. Print Performance Reflow Performance Post Reflow Cleaning Shelf Life Summary

3 WS-819/WS-820 solder paste Introduction Introducing ALPHA WS-819, WS-820 State of the art in Water Soluble, Lead Free Solder Pastes. Water soluble solder pastes are commonly used for high reliability medical, military and telecom infrastructure applications. Until now, high reliability has had a price-namely poor resistance to variations in relative humidity in the print process, and poor resistance to BGA voiding. WS-819 is designed to offer the widest possible print process window, with consistent high print deposit volumes, IPC Class III resistance to voiding, and ease of cleanability in a ORH0 class solder paste. For best results, especially with soak reflow profiles, an inerting Nitrogen Atmosphere is recommended assure complete coalescence of fine features. WS-820 is designed to offer similar low voiding, ease of cleaning and print volume consistancy in conjunction with air reflow capability. WS-820 may not withstand the same extremes in low and high humidity conditions during printing as WS-819, but Nitrogen is not required for most common reflow profiles. As with all Alpha brand products, WS-819 and WS-820 come with complete process and product support whenever and however you need us. It s the kind of support you would expect from a company that s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years. 3

4 WS-819/WS-820 solder paste Performance Summary SMT Process Step Performance Indicator WS-819 WS-820 Excellent print definition and consistant Excellent print definition and consistant Fine Feature Print Performance volumetric performance to 0.30mm (12 mil) volumetric performance to 0.30mm (12 mil) circles and 0.4mm (16 mil) pitch rectangular circles and 0.4mm (16 mil) pitch rectangular QFP pads. QFP pads. Print Process Window Stencil Life 8 hours at 35-65% Relative Humidity 5 hours at 56% RH and 24 C (76 F) Humidity/Temperature Window Capable of printing in temperatures from 20 C Relative Humidity Should be Controlled to to 28 C at Relative Humidities of 50% +-15% 50% +- 10% (35% to 65%) 3 to 10 prints per wipe, depending on smallest 3 to 10 prints per wipe, depending on smallest Stencil Cleaning Frequency feature printed, and use of apeture reduction and stencil thickness feature printed, and use of apeture reduction and stencil thickness Print Speed Range 25mm/second to 100mm/second (1 inch/second to 4 inches/second) down to 0.30mm (12 mil) circles and.4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second. 25mm/second to 100mm/second (1 inch/second to 4 inches/second) down to 0.30mm (12 mil) circles and.4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second. Solder Spread 88.6% (Average) per JIS-Z-3197: >WS-819 Reflow Yield Post Reflow Resistance to Voids Resistance to Hot and Cold Slump Reflow Process Window Residue Cleaning Cleanability Exceeds requirements of IPC 7095 Class lll using soak and ramp reflow profiles on OSP, Immersion Tin, Immersion Silver and ENIG finishes. Exceeds the requirements of IPC J-STD-005. No slump at 0.2mm gap per JIS-Z Straight Ramp, or <60 second soak profile in air. Nitrogen recommended for longer (>60 second) soak profiles. Meets IPC requirements over range of cleaning temperatures and water pressures, using DI water without additives. Meets/Exceeds IPC Bellcore and HP EL- EN Requirements J-STD-004 Classification ORH0 ORH0 Exceeds requirements of IPC 7095 Class ll using soak and ramp reflow profiles on Entek HT OSP finishes. Exceeds the requirements of IPC J-STD-005. No slump at 0.2mm gap per JIS-Z Capable with straight ramp, short soak or long soak profiles in air Meets IPC requirements over range of cleaning temperatures and water pressures, using DI water. Saponifier helpful especially with high population density and large assemblies. Meets/Exceeds IPC Bellcore and HP EL- EN Requirements Halide Content Halide Free Halide Free 4

5 WS-819 solder paste 8 Hour Stencil Life at High Humidity (66% 27 C) PWS0608A # hr Stencil Life Volume Chart BGA56-12 (12 mil Circles) Theoretical Volume (565 cubic mils) 80F/65-67% RH PWS0608A # hr Stencil Life Volume Chart BGA36 (15 mil Circles) Theoretical Volume (884 cubic mils) Print Process Window 80F/65-67% RH Volume % Trans Efficiency Volume % Trans Efficiency Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH PWS0608A # hr Stencil Life Volume Chart QFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils) Theoretical Volume (3150 cubic mils) 80F/65-67% RH PWS0608A # hr Stencil Life Volume Chart BGA256 (20 mil Circles) Theoretical Volume (1571 cubic mils) 80F/65-67% RH Volume % Trans Efficie Volume % Trans Efficiency Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH PWS-0608A was the pre-commercial laboratory name for WS-819 5

6 WS-819 solder paste 8 Hour Stencil Life at Low Humidity (23% 29 C) PWS0608A # hr Stencil Life Volume Chart BGA56-12 (12 mil Circles) Theoretical Volume (565 cubic mils) 81-94F/23-25% RH PWS0608A # hr Stencil Life Volume Chart BGA36 (15 mil Circles) Theoretical Volume (884 cubic mils) Print Process Window 81-94F/23-25% RH Volume % Trans Efficiency Volume % Trans Efficiency Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH PWS0608A # hr Stencil Life Volume Chart QFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils) PWS0608A # hr Stencil Life Volume Chart BGA256 (20 mil Circles) 2500 Theoretical Volume (2552 cubic mils) 81-94F/23-25% RH Theoretical Volume (1571 cubic mils) 81-94F/23-25% RH Volume % Trans Efficiency Volume % Trans Efficiency Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH PWS-0608A was the pre-commercial laboratory name for WS-819 6

7 WS-820 solder paste 4 Hour Stencil Life at 60% 25 C Print Process Window PWS0820A-1-4hr Stencil Life Volume Chart BGA225 (12 mil Circles) PWS0820A-1-4hr Stencil Life Volume Chart BGA256-2 (15 mil Circles) Theoretical Volume (565 cubic mils) 76-78*f/59-61% Theoretical Volume (884 cubic mils) 76-78*f/59-61% Volume Volume Time T-1hr T-2hr T-3hr 76-78*f/59-61% T-4hr 0 Time T-1hr T-2hr T-3hr 76-78*f/59-61% T-4hr 4000 PWS0820A-1-4hr Stencil Life Volume Chart QFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils) 76-78*f/59-61% 5000 PWS0820A-1-4hr Stencil Life Volume Chart QFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils) 76-78*f/59-61% Volume Theoretical Volume (2552 cubic mils) Volume Theoretical Volume (3150 cubic mils) Time T-1hr T-2hr T-3hr 76-78*f/59-61% T-4hr 0 Time T-1hr T-2hr T-3hr 76-78*f/59-61% T-4hr 7

8 WS-820 solder paste 5 Hour Stencil Life at 56% 24 C) Print Process Window WS M19 lot p Log Viscosity (pas) Shear rate (1/s) t= Initial t= 1 hr. t= 2 hrs t= 3 hrs t= 4 hrs t= 5 hrs 8

9 WS-819 solder paste Fine Feature Print Performance Print Process Window 1 inch (25mm) 4 inches (100 mm)/second 1 PWS0608A # Volume Repeatability Chart BGA56-12 (12 mil Circles) Theoretical Volume (565 cubic mils) Print Speed 1 inch/sec. 2 inches/sec. 4 inches/sec. 400 Volume % Trans Efficiency Board Print Speed inch/sec inches/sec inches/sec. 1) 5 mil laser cut stencil PWS-0608A was the pre-commercial laboratory name for WS-819 9

10 WS-820 solder paste Fine Feature Print Performance Print Process Window 1 inch (25mm) 8 inches (200 mm)/second 1 Volume Board Print Speed WS820 # M - Volume Repeatability Chart BGA225 (12 mil Circles) inch/sec. Theoretical Volume (565 cubic mils) inches/sec inches/sec inches/sec. Print Speed 1 inch/sec. 4 inches/sec. 6 inches/sec. 8 inches/sec. Volume Board Print Speed WS820 # M - Volume Repeatability Chart BGA36 (15 mil Circles) Theoretical Volume (884 cubic mils) inch/sec inches/sec. 1) 5 mil laser cut stencil 1) 5 mil laser cut stencil inches/sec inches/sec. Print Speed 1 inch/sec. 4 inches/sec. 6 inches/sec. 8 inches/sec Area Ratio 0.75 Area Ratio 10

11 WS-819 solder paste IPC Tack Test IPC TM Print Process Window Tack Strength (g / sq mm) Time 25% RH 50% RH 75% RH Initial hr hr Δ Tack < 1 unit over 16 hours at all RH 11

12 WS-820 solder paste IPC Tack Test IPC TM Print Process Window Tack Strength (g/mm²) Time 25% RH 50% RH 75% RH Initial Hours Hours Hours Hours Δ Tack < 1 unit over 16 hours at 25% and 50% RH Δ Tack at 16 hours and 75% RH- Marginal Pass 12

13 WS-819 solder paste Wipe Frequency Number of Print Strokes between Stencil Cleaning Step Print Process Window Paste: ALPHA PWSO608A Lot Number: Solder Paste - Wipe Freqency. Print Parameters: 1 in/s, 1.25 lbs/inch, 0.02 in/s Number of Bridges Number of Bridges Board Set 1 Board Set 2 QFP Device QFP Device Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) > Temperature: Relative Humidity: Inside Printer Inside Printer 80*F Temperature: 80 F 40 % RH Relative Humidity: 40 % RH PWS-0608A was the pre-commercial laboratory name for WS

14 WS-819/WS-820 solder paste Reflow Process Guidelines Reflow Yield Reflow Yield Parameter WS-819 WS-820 Atmosphere Air (Straight Ramp or < 60 Second Soak) N 2 for soak profiles >60 seconds up to 180 seconds Air Reflow Capable SnAgCu alloy melting ranges. Lower temperature=solidus; higher temperature = liquidus SAC305: SAC405: SAC305: SAC405: Profile General Guideline (Typical for SAC305) Setting Zone WS-819 WS o C to 220 o C 105 to 180 seconds <315 seconds 130 o C to 220 o C seconds <135 seconds 170 o C to 220 o C 60 seconds <90 seconds TAL (220 o C) seconds seconds. Peak temp. < 240 o C for standard OSP finish <250 C For Entek HT, Immersion Silver, Immersion Tin or ENIG finishes 14

15 WS-819/WS-820 solder paste Ramp Profile 1: 0.7C/s 235C Peak 60s TAL Reflow Yield 15

16 WS-819/WS-820 solder paste Ramp Profile 2: 1.5C/s 240C Peak 60s TAL Reflow Yield 16

17 WS-819 solder paste Soak Reflow Profile: 175C/60s Soak 240C Peak 60s TAL (Nitrogen Required for Longer Soak Profiles) Reflow Yield 17

18 WS-820 solder paste Reflow Yield Soak Reflow Profile: 175C/60s Soak 240 C Peak 60s TAL (Nitrogen Not Required for Longer Soak Profiles) 18

19 WS-819 solder paste Spread Test Method JIS-Z-3197: Polish the surface of phosphor deoxidized copper plate ( mm) with #500 polishing paper applying drops of alcohol. Wash the surface with alcohol and cool in room temperature. Subject to oxidizing treatment in a dryer set at 150 for 1 hour. Put approx. 0.3g of solder paste on the center of the copper plate and weigh with high accuracy. Place the test panel onto the surface of melted solder in a solder bath set at 250. Keep heating for 30sec. after the solder melts. Remove the flux residues from the test panels with solvent. Measure the height of solder with a micrometer and calculate the spreading rate from the following formula. S=[(D-H)/D] 100. S: Spreading Rate(%) H: Height of Spreading Solder (mm) D: Diameter of Solder assuming it as a sphere (mm) D = 1.24 V 1/3 V: Mass / Specific Gravity of Solder 3.Apparatus Solder Bath POT-200C Reflow Yield 19

20 WS-819 solder paste Result: 88.6% Spread Reflow Yield Density of Solder Alloy [g/cm] 7.4 A. Sam ple Weight of Paste Weight of Solder Height of Solder Spreading Rate Average [g] [g] [mm] [%] [%] # % # % # % # % # % 88.6% #1 #2 #3 #4 #5 20

21 WS-819 solder paste Reflow Yield: Application Note Definition of Voiding Performance Solder Outline Reflow Yield Void Outlines Location of Void Class I Class II Class III Void in Solder 60% of diameter 42% of diameter 30% of diameter (Solder Sphere) = 36% of Area = 20.25% of Area = 9% of Area Void at interface of Solder (Sphere) and Substrate 50% of diameter = 25% of Area 25% of diameter = 12.25% of Area 20% of diameter = 4% of Area 0.1d 0.25d IPC Criteria for Voids in BGAs, IPC Example: Total Void Diameter 0.10d +0.25d = 0.35d The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-pad interface. Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint. d 21

22 WS-819 solder paste Voiding Performance Reflow Yield Void Size Distribution BGA256 % of Joints % 90.00% 80.00% 70.00% 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% WS M17 Cerf HS 160/60 soak 240Cp WS M17 Cerf St.Ramp 0.7C_S 235Cp. ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area WS-819 Meets Criteria for Class lll Voiding Using Soak or Ramp Profile Per IPC

23 WS-820 solder paste Voiding Performance Reflow Yield WS Void Size Distribution BGA % 90% 80% 70% High soak 160/60 sec, 240 C peak % of Joints 60% 50% 40% 30% 20% 10% 0% ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area WS-820 Meets Criteria for Class ll Voiding Using Soak Profile Per IPC

24 WS-820 vs. WS-819 Resistance to BGA Voiding Reflow Yield WS-820 WS

25 WS-819 solder paste Solder Balling Resistance IPC TM-650 Method Reflow Yield Initial After 4 25 C, 50% RH Both Preferred per IPC Standard 25

26 WS-820 solder paste Solder Balling Resistance IPC TM-650 Method Reflow Yield Initial After 4 25 C, 50% RH Both Acceptable per IPC Standard 26

27 WS-819 solder paste Slump Resistance IPC TM Reflow Yield Cold Slump 25C/50% RH/75% RH Hot Slump Oven 150C/ 10 Min. Pad Size 0.63 x 2.30 mm 0.33 x 2.03 mm 0.63 x 2.30 mm 0.33 x 2.03 mm Largest Gap Bridged No Bridges IPC max gap bridge allowed Pass Pass Pass Pass 27

28 WS-820 solder paste Slump Resistance IPC TM Reflow Yield Cold Slump 25C/50% RH/75% RH Hot Slump Oven 150C/ 10 Min. Pad Size 0.63 x 2.30 mm 0.33 x 2.03 mm 0.63 x 2.30 mm 0.33 x 2.03 mm Largest Gap Bridged No Bridges IPC max gap bridge allowed Pass Pass Pass Pass 28

29 WS-819 solder paste Cleanability Study Post Reflow Cleaning Boards were built and cleaned using two water temperatures (120 and 150 F) and two conveyor speed settings (2 and 5 ft/min) in order to assess the relative cleanability. The pre-wash and wash water pressure were both set at 90 psi, while the rinse water pressure was set at approximately 70 psi. IPC J-STD-001 states that the contamination limit for assemblies tested using the dynamic method of detecting ionic surface contamination (method used with the Ionograph) is 10 µg/in 2 (1.56 µg/cm 2 ) sodium chloride equivalent ionic or ionizable flux residue. WS-819 showed Ionograph contamination levels of 1.10 to 1.58 µg/in 2 (0.172 to µg/cm 2 ), after two reflows and a 48 hour delay before cleaning, exceeding the IPC requirement under the pressure and temperature conditions described above Paste 120F/2.5 ft/min. 120F/5 ft/min. 150F/2.5 ft/min. 150F/5 ft/min. WS µg/in 2 Pass µg/in 2 Pass µg/in 2 Pass µg/in 2 Pass 29

30 WS-819 solder paste Post Cleaning Cosmetics Paste Aged 21 Days in Sealed Container Prior to Reflow Post Reflow Cleaning QFP208 High soak profile 160 C, 240 C peak OSP 30

31 WS-819 solder paste Post Cleaning Ionic Contamination Post Reflow Cleaning Mod. IPC-B-24 Processed with WS-819 paste Ionic Contamination Reflow: Mod P5 0.76C/s <2 hour after reflow D.I. water washed 125 C for about 8 minutes in Vitronics/Grams Cleaner Ionograph 500 SMD II FLOWRATE 110±2 cc/ s Conc.IPA CAL. FACTOR TEMPERTURE 45±1 C Test Time 15 minutes <2 hour Baseline Contamination Sample Mohm cm eq µg NaCl eq µg/inch average = 1.69 Ave. dev. = 0.41 Req: Ionic contamination < 10 μg / sq in (PASS) 31

32 WS-819 solder paste Electrical Reliability IPC SIR 85C / 85% RH, -48 V Bias Post Reflow Cleaning SIR (Ω) Reflow & Cleaning 1 day 4 day 7 day Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H Within 2 hours of reflow 2.4 x x x 10 9 Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H Delayed 48 hours after reflow 1.4 x x x 10 9 Requirement: SIR > 1 x 10 8 Ω after 4 & 7 days (PASS) 32

33 WS-819 solder paste Electrical Reliability Bellcore SIR Bellcore SIR TEST REPORT - Request: (per GR-78-CORE 1, 97) Post Reflow Cleaning Test #0707-1b Date: 1/25/2007 T/H/B:35/85/-48 Tested by:.k. Tellefsen Reported by:k. P/F MATERIAL SIR SIR COMMENTS CONDITION 1 Day 4 Days WS E E+11 Visually OK 7.00E E E E E E E E E E E E E E E E E E E E E E Geometric Mean 2.80E E+11 Control Boards 2.00E E E E E E E E E E E E E E E E E E E E E E E E Geometric Mean 6.90E E+11 Requirement: SIR > 1 x Ω after 1 & 4 days (PASS) 33

34 WS-819 solder paste Post Reflow Cleaning Electrical Reliability Bellcore Electromigration Bellcore Electromigration (per GR-78-CO Issue 1, September 1997) Request: Test #0707-1e Start date: 2/2/2007 Bias=10V Temp/Humidity 65/85 Tested by: K. Tellefsen Reported by: K. Tellefsen MATERIAL SIR SIR COMMENTS 96 hr 500 hr Passed all visual and electrical requirements WS E E E E E E E E E E E E E E E E E E E E E E E E+09 Pass/Fail Geometric final > Mean 5.80E E+10 initial/10 Controls 2.20E E+10 Passed all visual and electrical IPC-B E E E E E E E E E E E E E E E E E E E E+10 requirements 2.20E E+10 Pass/Fail Geometric final > Mean 8.70E E+10 initial/10 Requirement: Final SIR > Initial/10 (PASS) 34

35 WS-820 solder paste Post Cleaning Cosmetics Post Reflow Cleaning QFP Mil Pitch QFP 12 Mil Circles (BGA56-12) High soak profile 160 C, 240 C peak OSP Excellent Coalescence and No Visual Residue 35

36 WS-820 solder paste Post Cleaning Ionic Contamination Mod. IPC-B-24 Processed with WS- 820 Paste Ionic Contamination 75/21/2008 Reflow: Mod P5 0.76C/s <2 hours & >67 hours after reflow D.I. water washed 125 C for about 8 minutes in Vitronics/Grams Cleaner Ionograph 500 SMD II FLOWRATE 120±2 cc/ s Conc.IPA 0.77 CAL. FACTOR TEMPERTURE 45±1 C Test Time 15 minutes Cleaning <2 Hours after Reflow Baseline Contamination eq µg Mohm cm Sample NaCl eq µg/inch average = 0.94 Ave. dev. = 0.39 Post Reflow Cleaning Cleaning >67 Hours after Reflow Baseline Contamination eq µg eq Mohm cm Sample NaCl µg/inch average = 0.44 Ave. dev. = 0.07 Req: Ionic contamination < 10 μg / sq in (PASS) 36

37 WS-820 solder paste Electrical Reliability IPC SIR SIR TEST PER J-STD-004 ********************** Test #: i Date: 7/21/2008 T/H/B 85C/85%RH/-48V Tested by: K. Tellefsen P/F limit: Reported by: K. Tellefsen 1.0E+08 ohms MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTS CONDITION ambient (1 day) (4 days)(7 days) ambient WS E E E E E+12 passed electrical Reflowed 2.1E E E E E+12 and visual Hot DI Water cleaned 2.3E E E E E+12 requirements < 2h after reflow 9.6E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E+12 Arithmetic mean: E E E E E+11 WS E E E E+10 >1.0E12 passed electrical Reflowed 3.1E E E E+10 >1.0E12 and visual Hot DI Water cleaned 2.5E E E E+10 >1.0E12 requirements > 67 h after reflow 4.6E E E E+10 >1.0E12 2.3E E E E+10 >1.0E12 1.2E E E E+10 >1.0E12 1.1E E E E+10 >1.0E12 1.2E E E E+10 >1.0E12 7.6E E E E+09 >1.0E12 5.9E E E E+10 >1.0E12 6.0E E E E+10 >1.0E12 6.2E E E E+09 >1.0E Arithmetic mean: 3.8E E E E+10 >1.0E12 Control boards >1.0E12 1.4E E E E E E E E E+11 >1.0E12 4.1E E E E E E E E E E E E E E+11 >1.0E12 6.0E E E E+11 >1.0E12 6.2E E E E+11 >1.0E12 6.7E E E E E E E E E E E E E E+11 >1.0E12 9.4E E E E+11 >1.0E12 1.4E E E E Arithmetic mean: 9.0E E E E E+11 Requirement: SIR > 1 x 10 8 Ω after 4 & 7 days (PASS) Post Reflow Cleaning 37

38 WS-820 solder paste Electrical Reliability Bellcore Electromigration Post Reflow Cleaning Bellcore Electromigration (per GR-78-CO Issue 1 Request: Test #: eStart 10V Bias Temp/Humidity 65/85 Tested by: K. Tellefsen Reported by: MATERIAL SIR SIR COMMENTS CONDITION 96 Hr 500 Hr WS E E E E E E E E+09 cleaned 9.60E E E E E E E E E E E E E E E E+10 Passed Visual and Electrical Requirements Pass/Fail Geometric 1.00E E+09 nal>initial/10 Mean Controls 2.00E E E E E E E+11 >1.0E E E E+11 >1.0E E+11 >1.0E E+11 >1.0E E E E+11 >1.0E E+11 >1.0E E+11 >1.0E Pass/Fail Geometric Mean 3.40E E+11 final>initial/10 Requirement: Final SIR > Initial/10 (PASS) 38

39 WS-819/WS-820 solder paste Post Reflow Cleaning Marginally Lower Foaming with WS-820 versus WS-819 (WS-820 was known as PWS-0821A Prior to Commercialization) 39

40 WS-819 solder paste Weeks Room Temperature Stability (25 C; 77 F) in Unopened Container Shelf Life RPM Malcolm Viscosity (KCPS) WS-819 Viscosity Upper Limit Low er Limit 6 Month Shelf Life When Stored in Sealed Jar at 1 to 10 C (34 to 50 F) Days After Manufacture 40

41 WS-820 solder paste Weeks Room Temperature Stability (25 C; 77 F) in Unopened Container Shelf Life USL LSL WS Month Shelf Life When Stored in Sealed Jar at 0 to 10 C (32 to 50 F) Days After Manufacture 41

42 WS-820 solder paste 2 Weeks Room Temperature Stability (25 C; 77 F) in Unopened Container Shelf Life Rheology for WS-820 Initial, Wk/1 & Wk/ Viscosity (pas) PWS0821A SAC MXX Lot# P1 Initial PWS0821A SAC MXX Lot# P1 PWS0821A SAC MXX Lot# P Shear Rate (1/s) 42

43 WS-819 solder paste Summary Delivers excellent print volume and consistency Prints.4mm (16 mil) pitch QFP s,.3mm (12 mil) circles with Type 3 Powder Consistent Print Volume Repeatability at both Low (<35%) and High (65%) Relative Humidity 8 Hour Stencil Life at Low and High Humidity Excellent post print tack life Wide print speed process window (25mm/sec to 100mm/sec) High Post Reflow Yields IPC Class III Voiding Performance (Using Soak Reflow Profile in Nitrogen) Resistance to cold and hot slump Easily Cleaned with Water, after 2 lead free reflow cycles and 48 hour delay Electrical Reliability IPC SIR Bellcore SIR Bellcore Electromigration Extremely Low Ionic Contamination Post Cleaning 43

44 WS-820 solder paste Summary Delivers excellent print volume and consistency Prints.4mm (16 mil) pitch QFP s,.35mm (15 mil) circles with Type 3 Powder Consistent Print Volume Repeatability at 50% +- 10% Relative Humidity >5 Hour Stencil Life Wide print speed process window (25mm/sec to 100mm/sec) High Post Reflow Yields IPC Class II Voiding Performance (Using Soak Reflow Profile) Resistance to cold and hot slump Easily Cleaned with Water, after 2 lead free reflow cycles and 67 hour delay Capable of Soak Profile in Air Electrical Reliability IPC SIR Bellcore SIR Bellcore Electromigration Extremely Low Ionic Contamination Post Cleaning 44

45 WS-819/WS-820 solder paste Leading Products Summary No Clean, SnPb ALPHA OM-5300 ALPHA OM-5100 No Clean, Lead-free ALPHA OM-338 T ALPHA OM-338 PT ALPHA OM-340 ALPHA OM-350 Water Soluble, SnPb ALPHA WS-809 Water Soluble, Lead-free ALPHA WS-819 ALPHA WS

46 WS-819 solder paste Summary 46