Intel Xeon Processor E5-1600/2600/4600 v1 and v2 Product Families

Transcription

1 Intel Xeon Processor E5-600/2600/600 v and v2 Product Families Thermal / Mechanical Design Guide September 20 Document Number:

2 INFORMTION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, Y ESTOPPEL OR OTHERWISE, TO NY INTELLECTUL PROPERTY RIGHTS IS GRNTED Y THIS DOCUMENT. EXCEPT S PROVIDED IN INTEL'S TERMS ND CONDITIONS OF SLE FOR SUCH PRODUCTS, INTEL SSUMES NO LIILITY WHTSOEVER, ND INTEL DISCLIMS NY EXPRESS OR IMPLIED WRRNTY, RELTING TO SLE ND/OR USE OF INTEL PRODUCTS INCLUDING LIILITY OR WRRNTIES RELTING TO FITNESS FOR PRTICULR PURPOSE, MERCHNTILITY, OR INFRINGEMENT OF NY PTENT, COPYRIGHT OR OTHER INTELLECTUL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. "Mission Critical pplication" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHSE OR USE INTEL'S PRODUCTS FOR NY SUCH MISSION CRITICL PPLICTION, YOU SHLL INDEMNIFY ND HOLD INTEL ND ITS SUSIDIRIES, SUCONTRCTORS ND FFILITES, ND THE DIRECTORS, OFFICERS, ND EMPLOYEES OF ECH, HRMLESS GINST LL CLIMS COSTS, DMGES, ND EXPENSES ND RESONLE TTORNEYS' FEES RISING OUT OF, DIRECTLY OR INDIRECTLY, NY CLIM OF PRODUCT LIILITY, PERSONL INJURY, OR DETH RISING IN NY WY OUT OF SUCH MISSION CRITICL PPLICTION, WHETHER OR NOT INTEL OR ITS SUCONTRCTOR WS NEGLIGENT IN THE DESIGN, MNUFCTURE, OR WRNING OF THE INTEL PRODUCT OR NY OF ITS PRTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Requires a system with Intel Turbo oost Technology. Intel Turbo oost Technology and Intel Turbo oost Technology 2.0 are only available on select Intel processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright , Intel Corporation. 2 Document Number:

3 Contents Introduction...9. References Definition of Terms LG20-0 Socket Contact/Land Mating Location oard Layout Suggested Silkscreen Marking for Socket Identification ttachment to Motherboard Socket Components Socket ody Housing Solder alls Contacts Pick and Place Cover Socket Standoffs and Package Seating Plane Durability Markings Component Insertion Forces Socket Size Independent Loading Mechanism (ILM) Square ILM Design Concept Square ILM ssembly Design Overview ILM Features ILM Closing sequence ILM Opening Sequence ILM ack Plate Design Overview ILM ssembly..... Manufacturing ssembly Flow.... Processor Installation Narrow ILM Introduction Comparison etween Square ILM and Narrow ILM ILM Keepout Zones ILM Cover Heatsink to ILM interface... 7 LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications Component Mass Package/Socket Stackup Height Loading Specifications Electrical Requirements Environmental Requirements... 5 Thermal Solutions Performance Targets Performance Targets - Square ILM/Heatsink pplication Performance Targets - Narrow ILM/Heatsink pplication Reference Heatsink ssembly Structural Considerations Thermal Design Guidelines Intel Turbo oost Technology Thermal Characterization Parameter Fan Speed Control... 5 Document Number:

4 5.. Thermal Features Tcontrol Relief Short Duration TCC ctivation and Catastrophic Thermal Management for Intel Xeon Processor E5-600/2600 / 600 v and v2 Product Families bsolute Processor Temperature and Thermal Excursion DTS ased Thermal Specification Implementation Considerations for Intel Xeon Processor E5-600/E5-2600/E5-600 v2 Product Family Processors DTS ased Thermal Profile, Tcontrol and Margin for the Intel Xeon Processor E5-600/E5-2600/E5-600 v Product Family Power Calculation for the Intel Xeon Processor E5-600/E5-2600/E5-600 v Product Family veraging the DTS ased Thermal Specification for the Intel Xeon E5-00/E5-2600/E5-600 v Product Family Capabilities for the Intel Xeon Processor E5-600/E5-2600/E5-600 v2 Product Family Quality and Reliability Requirements Use Conditions Intel Reference Component Validation oard Functional Test Sequence Post-Test Pass Criteria Examples Recommended IOS/Processor/Memory Test Procedures Material and Recycling Requirements...65 Mechanical Drawings...67 Socket Mechanical Drawings...9 C Component Suppliers...99 C. Intel Enabled Supplier Information...99 C.. Intel Reference or Collaboration Thermal Solutions...99 C..2 Socket and ILM Components D Thermal Test Vehicle... 0 D. LG20-0 TTV... 0 D.2 Thermocouple ttach Drawing E Embedded Thermal Solutions E. Performance Targets E.2 Thermal Design Guidelines E.2. High Case Temperature Thermal Profile E. Mechanical Drawings and Supplier Information F Heatsink Load Characterization... 5 F. Introduction... 5 F.2 Heatsink Load Fixture... 5 F. Procedure for Measuring Heatsink Load... 5 Figures - Platform Socket Stack Hexagonal rray in LG Contact Wiping Direction Schematic of LG20-0 Socket with Pick and Place Cover Removed LG20-0 Socket Contact Numbering (Top View of Socket) Offset between LG Land Center and Solder all Center LG20-0 Socket Land Pattern (Top View of oard)...7 Document Number:

5 2-7 Suggested oard Marking LG20-0 Pick and Place Cover Pick and Place Cover Square ILM Part Terminology Square ILM ssembly Square ILM as a Universal Retention Mechanism ILM Interlocking Feature ILM Lever Closing Sequence Opening ILM Opening Sequence for ILM and Loadplate (cont.) ILM Keying ILM ack Plate ssembling Socket, ack Plate and ILM onto the Motherboard... - Optional Step: Lock down the Hinge Lever Pin Markings on the ILM Frames... - Package Insertion... - Closing ILM and Loadplate Narrow ILM ILM with Cover Heatsink to ILM Interface Flow Chart of Knowledge-ased Reliability Evaluation Methodology U Square Heatsink Performance Curves Using Socket-LG20-0 TTV U Square Heatsink Performance Curves Using Socket-LG20-0 TTV U Narrow Heatsink Performance Curves Using Socket-LG20-0 TTV Reference Square ILM/Heatsink ssembly Reference Narrow ILM/Heatsink ssembly Processor Thermal Characterization Parameter Relationships Square ILM oard Keepouts of Square ILM oard Keepouts 2 of Square ILM oard Keepouts of Square ILM oard Keepouts of Narrow ILM oard Keepouts of Narrow ILM oard Keepouts 2 of Narrow ILM oard Keepouts of Narrow ILM oard Keepouts of U Square Heatsink ssembly Without TIM of U Square Heatsink ssembly Without TIM 2 of U Square Heatsink Volumetric of U Square Heatsink Volumetric 2 of Heatsink Screw Mx Heatsink Compression Spring Heatsink Retaining Ring Heatsink Delrin Spacer U Square Heatsink ssembly of U Square Heatsink ssembly 2 of U Square Heatsink Geometry of U Square Heatsink Geometry 2 of Heatsink Cup For Spring Retention U Narrow Heatsink ssembly of U Narrow Heatsink ssembly 2 of U Narrow Heatsink Geometry of U Narrow Heatsink Geometry 2 of Socket Mechanical Drawing (Sheet of ) Socket Mechanical Drawing (Sheet 2 of ) Socket Mechanical Drawing (Sheet of ) Socket Mechanical Drawing (Sheet of ) Document Number:

6 D- Groove for Thermocouple ttach on Intel Xeon Processor E Product Family Thermal Test Vehicle E- TC Heatsink Performance Curves E-2 High Case Temperature Thermal Profile E- TC Reference Heatsink Fin and ase (Sheet of 2)... E- TC Reference Heatsink Fin and ase (Sheet 2 of 2)... 2 F- Heatsink Load Fixtures... 5 F-2 Heatsink Fixture ssembly... 6 Tables - Reference Documents Terms and Descriptions LG20-0 Socket ttributes... - Square ILM ssembly Component Thickness and Material Socket and Retention Component Mass land Package and LG20-0 Socket Stackup Height Socket and ILM Mechanical Specifications Electrical Requirements for LG20-0 Socket Intel Xeon Processor E5-600/2600/600 v Product Families, 8 Core/6 Core Processor Reference Thermal oundary Conditions (Square ILM/HS) Intel Xeon Processor E5-600/2600/600 v Product Families, Core Processor Reference Thermal oundary Conditions (Square ILM/HS) Intel Xeon Processor E5-600/2600 v2 Product Families, Processor Reference Thermal oundary Conditions (Square ILM/HS) Performance Curve Data (Graphs in Fig 5- and 5-2) Intel Xeon Processor E5-600/2600/600 v Product Families, 8 Core/6 Core Processor Reference Thermal oundary Conditions (Narrow ILM/HS) Intel Xeon Processor E5-600/2600/600 v Product Families, Core Processor Reference Thermal oundary Conditions (Narrow ILM/HS) Intel Xeon Processor E5-600/2600 v2 Product Families, Processor Reference Thermal oundary Conditions (Narrow ILM/HS) Performance Curve Data TCONTROL and DTS Relationship Sign Convention T CONTROL Relief for E5-600/E5-2600/E5-600 v Product Families veraging Coefficients Server Use Conditions Environment (System Level) Server Use Conditions Environment (System Level) Mechanical Drawing List Socket Drawing List...9 C- Suppliers for the Intel Reference Thermal Solutions...99 C-2 Suppliers for the LG20-0 Socket and ILM C- Suppliers for the LG-20-0 Socket and ILM (Continued)... 0 D- Correction Offsets Intel Xeon Processor E5-600 / E / E5-600 v Product Families D-2 Correction Offsets Intel Xeon Processor E5-600/ E5-2600/ E5-600 v2 Product Families... 0 E- 8-Core/6-Core Processor Reference Thermal oundary Conditions (E5 v Product Family) E-2 Processor Reference Thermal oundary Conditions (E5 v2 Product Family) E- Embedded Heatsink Component Suppliers E- Mechanical Drawings List Document Number:

7 Revision History Revision Number Description Revision Date -00 Initial Release March dded section 5..6 Short Duration TCC ctivation and Catastrophic Thermal Management -00 dded E-5 v2 Product Family information September 202 September 20 Document Number:

8 8 Document Number:

9 Introduction Introduction This document provides guidelines for the design of thermal and mechanical solutions for the: Intel Xeon Processor E5-600/2600/600 v and v2 Product Families processors in 2 and -socket servers, and 2-socket workstations. The processors covered are listed in the processor family datasheets listed in Table -. The components described in this document include: The processor thermal solution (heatsink) and associated retention hardware. The LG20-0 socket, the Independent Loading Mechanism (ILM) and back plate. Figure -. Platform Socket Stack Heatsink Independent Loading Mechanism (ILM) Processor LG 20-0 Socket Motherboard ILM ack Plate The goals of this document are: To assist board and system thermal mechanical designers. To assist designers and suppliers of processor heatsinks. Thermal profiles and other processor specifications are provided in the appropriate processor Datasheet. Document Number:

10 Introduction. References Material and concepts available in the following documents may be beneficial when reading this document. Table -. Reference Documents Document Notes European lue ngel Recycling Standards Platform Environment Control Interface (PECI) Specification Platform Digital Thermal Sensor (DTS) ased Thermal Specifications and Overview Manufacturing With Intel Components Using Lead-Free Technology Entry-level Electronics ay Specification 2 Intel Xeon Processor E5-600/2600/600 v Product Families Datasheet - Volume One (26508) Intel Xeon Processor E5-600/2600/600 v Product Families Datasheet - Volume Two (26509) Intel Xeon Processor E5-600 and E v2 Product Families Datasheet - Volume One (2987) Intel Xeon Processor E5-600 and E v2 Product Families Datasheet - Volume Two (2988) Intel Xeon Processor E5-600/2600/600 v Product Families Specification Update (2650) Intel Xeon Processor E5-600 and E v2 Product Families Specification Update (2989) Intel Xeon Processor E5-600/2600/600 v and v2 Product Families Thermal Model (26608) Intel Xeon Processor E5-600/2600/600 v Product Families Mechanical Model (26609) Intel Xeon Processor E5-600 and E v2 Product Families Mechanical Model (29299) Notes:. vailable at 2. vailable at vailable at (Code: ME709). vailable electronically.. Contact your Intel representative for the latest version..2 Definition of Terms Table -2. Terms and Descriptions (Sheet of 2) Term ypass DTS FSC IHS Square ILM Description ypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature. Fan Speed Control Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. Independent Loading Mechanism provides the force needed to seat the 20-LG package onto the socket contacts and has 80 80mm heatsink mounting hole pattern. 0 Document Number:

11 Introduction Table -2. Terms and Descriptions (Sheet 2 of 2) Term Narrow ILM LG20-0 socket PECI Ψ C Ψ CS Ψ S T CSE T CSE _ MX TCC T CONTROL TDP Thermal Monitor Thermal Profile TIM T L T S U Description Independent Loading Mechanism provides the force needed to seat the 20-LG package onto the socket contacts and has 56 9mm heatsink mounting hole pattern The processor mates with the system board through this surface mount, 20-contact socket for Intel Xeon Processor 5-600/E5-2600/E5-600 Product Families-based platform. The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). measure of thermal solution performance using total package power. Defined as (T CSE T L ) / Total Package Power. Heat source should always be specified for Ψ measurements. Case-to-sink thermal characterization parameter. measure of thermal interface material performance using total package power. Defined as (T CSE T S ) / Total Package Power. Sink-to-ambient thermal characterization parameter. measure of heatsink thermal performance using total package power. Defined as (T S T L ) / Total Package Power. The case temperature of the processor measured at the geometric center of the topside of the IHS. The maximum case temperature as specified in a component specification. Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. T CONTROL is a static value below TCC activation used as a trigger point for fan speed control. When DTS > T CONTROL, the processor must comply to the thermal profile. Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature. Line that defines case temperature specification of a processor at a given power level. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. unit of measure used to define server rack spacing height. U is equal to.75 in, 2U equals.50 in, and so forth. Document Number:

12 Introduction 2 Document Number:

13 LG20-0 Socket 2 LG20-0 Socket This section describes a surface mount, LG (Land Grid rray) socket intended for the processors in the Intel Xeon Processor E5-600/2600/600 v and v2 Product Families-based platform. The socket provides I/O, power and ground contacts. The socket contains 20 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The socket has 20 contacts. The LG20-0 socket is introducing a hexagonal area array ball-out which provides many benefits: Socket contact density increased by 2% while maintaining 0 mil minimum via pitch requirements. Corresponding square pitch array s would require a 8 mil via pitch for the same package size. LG20-0 has.06 mm (0 mil) hexagonal pitch in a 58x grid array with 2x6 grid depopulation in the center of the array and selective depopulation elsewhere. Figure 2-. Hexagonal rray in LG mil.7 mil 0 mil 0 mil Table 2-. LG20-0 Socket ttributes LG20-0 Socket ttributes Component Size 58.5 mm(l)x5 mm (W) Pitch.06 mm (Hex rray) all Count 20 Contact wiping direction is 80 degrees as shown in Figure 2-2. Document Number:

14 LG20-0 Socket Figure 2-2. Contact Wiping Direction Contact Wiping Direction The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints and the contacts. Socket loading specifications are listed in Chapter. Schematic for LG20-0 socket is shown in Figure 2-. The seating plane is shown on the outer periphery of the socket. Figure 2-. Schematic of LG20-0 Socket with Pick and Place Cover Removed Document Number:

15 LG20-0 Socket Figure 2-. LG20-0 Socket Contact Numbering (Top View of Socket) Document Number:

16 LG20-0 Socket 2. Contact/Land Mating Location ll socket contacts are designed such that the contact tip lands within the substrate pad boundary before any actuation load is applied and remain within the pad boundary at final installation, after actuation load is applied. The offset between LG land center and solder ball center is defined in Figure 2-5. Figure 2-5. Offset between LG Land Center and Solder all Center Note: ll dimensions are in mm. 2.2 oard Layout The land pattern for the LG20-0 socket is 0 mils hexagonal array. For CTF (Critical to Function) joints, the pad size will primarily be a circular Metal Defined (MD) pad and these pads should be designated as a Critical Dimension to the PC vendors with a 7 mil ± mil tolerance. Some CTF pads will have a SMD Pad (20 x 7 mil). For additional pad configurations details including the NCTF (Non-Critical to Function) joints, see Section 2.. Note: There is no round-off (conversion) error between socket pitch (.06 mm) and board pitch (0 mil) as these values are equivalent. 6 Document Number:

17 LG20-0 Socket Figure 2-6. LG20-0 Socket Land Pattern (Top View of oard) 2.2. Suggested Silkscreen Marking for Socket Identification Intel is recommending that customers mark the socket name approximately where shown in Figure -7. The final silkscreen location may vary with different motherboard designs, but should always be visible after ILM and component assembly. Document Number:

18 LG20-0 Socket Figure 2-7. Suggested oard Marking Pin of Socket dd Silkscreen In this location 2. ttachment to Motherboard The socket is attached to the motherboard by 20 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so forth) to attach the socket. s indicated in Figure 2-9, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. 2. Socket Components The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to ppendix for detailed drawings. 2.. Socket ody Housing The housing material is thermoplastic or equivalent with UL 9 V-0 flame rating capable of withstanding 260 C for 0 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 6. The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems. 8 Document Number:

19 LG20-0 Socket 2..2 Solder alls 2.. Contacts total of 20 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket has the following solder ball material: Lead free SC05 (SngCu) solder alloy with a silver (g) content %, copper (Cu) 0.5%,tin (Sn) 96.5% and a melting temperature of approximately 27 C. The immersion silver (Img) motherboard surface finish and solder paste alloy must be compatible with the SC alloy solder paste. The co-planarity (profile) and true position requirements are defined in ppendix. The base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.8 μm [5 μinches] minimum gold plating over.27 μm [50 μinches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. 2.. Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 C for 0 seconds (typical reflow/rework profile) and the conditions listed in Chapter 6 without degrading. Document Number:

20 LG20-0 Socket Figure 2-8. LG20-0 Pick and Place Cover s indicated in Figure 2-9, the pick and place (PnP) cover remains on the socket during ILM installation. Once the ILM with its cover is installed, Intel is recommending the PnP cover be removed to help prevent damage to the socket contacts. To reduce the risk of bent contacts the PnP Cover and ILM Cover were designed to not be compatible. See Section. for additional information on ILM assembly to the board. Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. Covers can be removed without tools. The pick and place covers are designed to be interchangeable between socket suppliers. 20 Document Number:

21 LG20-0 Socket Figure 2-9. Pick and Place Cover ILM Pick and Place Cover Note: Figure is representative and may not show the most current revision of parts Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in ppendix. Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section.2 for the calculated IHS height above the motherboard. 2.5 Durability The socket must withstand 0 cycles of processor insertion and removal. The maximum part average and single pin resistances from Table - must be met when mated in the st and 0th cycles. The socket Pick and Place cover must withstand 5 cycles of insertion and removal. 2.6 Markings There are three markings on the socket: LG20-0: Font type is Helvetica old - minimum 6 point (2.25 mm). Manufacturer's insignia (font size at supplier's discretion). Lot identification code (allows traceability of manufacturing date and location). Document Number:

22 LG20-0 Socket ll markings must withstand 260 C for 0 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. LG20-0 and the manufacturer's insignia are molded or laser marked on the side wall. 2.7 Component Insertion Forces ny actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket. 2.8 Socket Size Socket information needed for motherboard design is given in ppendix. This information should be used in conjunction with the reference motherboard keepout drawings provided in ppendix to ensure compatibility with the reference thermal mechanical components. 22 Document Number:

23 Independent Loading Mechanism (ILM) Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) provides the force needed to seat the 20-land LG package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing dvantage Service (MS) document for this platform for additional guidance. The mechanical design of the ILM is a key contributor to the overall functionality of the LG20-0 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be built to print from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters. There are two types of ILMs for socket LG20-0:. Square ILM - This ILM has 80x80 mm heatsink mounting hole pattern. Please refer to Section. for more details 2. Narrow ILM - This ILM has 56x9 mm heatsink mounting hole pattern. Please refer to Section. and Section.5 for common features with square ILM and specific features of narrow ILM. Note: Note: The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting load evenly through the socket solder joints. nother purpose of ILM is to ensure electrical integrity/performance of the socket and package. This design will be built to print from Intel controlled drawings. Document Number:

24 Independent Loading Mechanism (ILM). Square ILM Design Concept The square ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate... Square ILM ssembly Design Overview Figure -. Square ILM Part Terminology Loadplate Hinge Lever ctive Lever Captive Nut (X) Hinge Clevis Heat Sink stud (X) Frame Clevis Rivet (X) ctive Clevis Frame Insulator The square ILM assembly consists of five major pieces as shown in Figure - and Figure -2, hinge lever, active lever, load plate, load frame, ILM cover and the captive fasteners. For clarity the ILM cover is not shown in this view. Note: The ILM assembly also contains an ILM cover as described in Section.6. 2 Document Number:

25 Independent Loading Mechanism (ILM) Figure -2. Square ILM ssembly point load plate (fingers) Hinge lever arm ILM frame ctive lever arm Note: For clarity, the ILM cover is not shown in Figure -2. The hinge lever and active lever are designed to place equal force on both ends of the ILM load plate.the frame provides the hinge locations for the levers. The hinge lever connects the load plate to the frame. When closed, the load plate applies four point loads onto the IHS at the finger features shown in Figure -2. Four point loading contributes to minimizing package and socket warpage as compared to two point loading. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. Table -. Square ILM ssembly Component Thickness and Material Component Thickness (mm) Material ILM Frame.5 0 Stainless Steel ILM Loadplate.5 0 Stainless Steel ILM ackplate 2.2 S50C Low Carbon Steel Figure - shows the attachment points of the thermal solution to the ILM frame and the ILM to the back plate. This attachment method requires four holes in the motherboard for the ILM and no additional holes for the thermal solution. Orientation of the ILM is controlled with a key on the socket body. Orientation of the thermal solution is an option with a key to the ILM. Note: Some customer reference boards (CR) have four additional outer holes in the board. These holes are legacy and are not required for the current ILM reference design. Document Number:

26 Independent Loading Mechanism (ILM) Figure -. Square ILM as a Universal Retention Mechanism.2 ILM Features These features are common to the square and narrow ILM: llows for topside thermal solution attach to a rigid structure. This eliminates the motherboard thickness dependency from the mechanical stackup. Captive nuts clamp the ILM frame to the board, providing good clamping and hence reduced board bending leading to higher solder joint reliability. ILM levers provide an interlocking mechanism to ensure proper opening or closing sequence for the operator. This has been implemented in both square and narrow ILM..2. ILM Closing sequence When closing the ILM, the interlocking features are intended to prevent the hinge lever from being latched first. If an attempt is made to close the hinge lever first, the hinge lever end stop will prevent the user from latching the active lever, indicating something is done wrong. Text on the ILM cover indicates the proper order of operation. Please refer to Figure Document Number:

27 Independent Loading Mechanism (ILM) If hinge lever is pressed down first, it raises the load plate up at an angle higher than the active lever can make contact with, forcing a user to push it down. lso the hinge lever end stop will block the active lever from being able to be latched. Figure -. ILM Interlocking Feature Hinge Lever Interlocking feature on hinge lever. ctive Lever. Document Number:

28 Independent Loading Mechanism (ILM) Figure -5. ILM Lever Closing Sequence Step Close ctive Lever Step 2 Step 2 Close Hinge Lever ILM lever closing sequence is shown in Figure -5.. Latch ctive Lever first. 2. Close Hinge Lever second. Note: The ILM closing sequence is marked on the ILM load plate..2.2 ILM Opening Sequence For the opening sequence, the goal is to always open the hinge lever first to prevent the loadplate from springing open. The only option is to release the hinge lever first. The hinge lever in a closed position will block the active lever from being unlatched. y opening hinge lever first, it creates clearance to open the active lever. 28 Document Number:

29 Independent Loading Mechanism (ILM) Figure -6. Opening ILM Step Open Hinge Lever Opening the hinge lever provides the clearance to open the active lever Step 2 Open ctive Lever The ILM opening sequence is shown in Figure -6.. Open hinge lever 2. Open active lever Note: Figure -7. The opening sequence is also marked on the ILM load plate Opening Sequence for ILM and Loadplate (cont.). Open the load plate by pushing down on the hinge lever Figure -7, this will cause the load plate tab to rise above the socket. Grasp the tab, only after it has risen away from the socket, open load plate to full open position. Document Number:

30 Independent Loading Mechanism (ILM) Note: ILM cover not shown for clarity ILM Keying This feature is incorporated in the square and narrow ILM. s indicated in Figure -8, the socket protrusion and ILM key features prevent 80-degree rotation of ILM assembly with respect to socket. This result in a specific orientation with respect to ILM active lever and pin of the socket body. Figure -8. ILM Keying If the ILM is attempted to be installed 80 out of phase, the ILM frame will interfere with socket protrusion ILM keying feature molded in socket body and corresponding ILM key feature in the frame..2. ILM ack Plate Design Overview The backplate design is common for square and narrow ILM. The back plate for dual processor server products consists of a flat steel back plate with threaded studs to attach to the ILM frame. clearance hole is located at the center of the plate to allow access to test points and backside capacitors. Two additional cut-outs on the backplate provide clearance for backside voltage regulator components. n insulator is pre applied by the vendor to the side with the threaded studs. Note: The ILM ack Plate is designed to work with board thicknesses from to 0.00 inches. If the board is outside of this range, the backplate will require modification. 0 Document Number:

31 Independent Loading Mechanism (ILM) Figure -9. ILM ack Plate Clearance cutouts (x) 6-2 Threaded Studs (x). ILM ssembly The ILM assembly instructions are briefly outlined here.the ILM assembly instructions shown here are for illustration. For High Volume Manufacturing please refer to the appropriate platform Manufacturing dvantage Service document... Manufacturing ssembly Flow The assembly of the ILM to the socket is documented in the steps below and graphically in Figure -0. Figure -0. ssembling Socket, ack Plate and ILM onto the Motherboard 2 2 Note: The steps in Figure -0 are for illustration only and may not show the most current revision of parts. Document Number:

32 Independent Loading Mechanism (ILM). Using SMT, mount the socket onto the circuit board. Intel provides detailed instruction for lead free manufacturing of complex interconnects on the Intel Learning Network ( 2. ssemble the back plate onto the bottom side of the board ensuring that all studs protrude through the board.. Place the Independent Load Mechanism (ILM) with cover onto the board. The load plate should be unlatched. See Section Tighten the () Torx-20 screwed to 9 ± in-lb. 5. Lift the load plate to the open position and with the tool remove the PnP cover from the socket body. 6. Close the ILM and latch it per the instructions in Section.2... Processor Installation Note: For complete ILM assembly instructions please refer to the appropriate Manufacturing dvantage Service document. he hinge lever can be locked down to keep it out of the way when removing the PnP cover and installing the processor (Figure -). If the hinge lever is locked down when the ILM is open, then the load plate will be locked in the open position and less likely to fall closed if bumped. oth the Square and Narrow ILM have a Pin marking on the frame to help indicate proper package alignment (Figure -2). Figure -. Optional Step: Lock down the Hinge Lever Optional Step Lock down Hinge Lever 2 Document Number:

33 Independent Loading Mechanism (ILM) Figure -2. Pin Markings on the ILM Frames Figure -. Package Insertion Matching corner heights x Finger Cutouts for Package insertion & removal Pin indicators Package Keying features x Note: Figure - is for illustration only and may not show the most current revision of parts. tool is available for the installation or removal of the processor. Please work with your local CQE for tool availability. 7. Hold processor along the right and left edges of the package to match socket finger cutouts (East - West edges). Make sure processor s Pin indicator is aligned with Pin indicator on the socket corner. Keeping the processor horizontal, lower it gently into the socket with a purely vertical motion.verify the package is fully seated; package corners must be at the same height with respect to all four socket corners. Document Number:

34 Independent Loading Mechanism (ILM) Figure -. Closing ILM and Loadplate Note: Figure - is for or illustration only and may not show most current parts. 8. Carefully lower the ILM load plate on top of the processor, 9. Verify that Load-lever-cam is over the load-plate-tab; actuate Load lever with a smooth uniform motion and latch to the ILM (with thumb). 0. Close the Hinge lever with a smooth uniform motion and latch to the ILM..5 Narrow ILM.5. Introduction In addition to the square ILM discussed in Section., Intel is enabling a second sku of ILM referred to as the narrow ILM (Figure -5.) This second ILM is targeted for constrained layouts where the space available on either side of the LG20-0 socket requires narrow heatsink mount points. Note: Note: This alternate narrow ILM should only be used if space constraints on the board require it. The topside keepouts and restricted heatsink width associated with this design present increased challenges in routing, component placement, and thermals. This design will be built to print from Intel controlled drawings. Document Number:

35 Independent Loading Mechanism (ILM) Figure -5. Narrow ILM Narrow hinge lever arm Narrow frame Narrow active lever arm.5.2 Comparison etween Square ILM and Narrow ILM.5.2. Part Comparison The narrow ILM is a similar design to the square ILM and shares a majority of the parts. The only parts that are different in the narrow ILM are the ILM frame, hinge lever arm, and active lever arm Mechanical Requirements The narrow ILM has the same mechanical requirements as the square ILM (refer to the LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications in this document.).5. ILM Keepout Zones ILM keepout zones (KOZ) refer to zones around the socket on the top and bottom of the board that must be kept clear of components to accommodate the ILM assembly and back plate. ppendix, Mechanical Drawings shows the different KOZ for both the square and the narrow ILM. Note: The keepout zones only account for the mechanical clearance. It is up to the system/board architect to determine additional clearance required for finger and/or tool access. Document Number:

36 Independent Loading Mechanism (ILM) Note: Some customer reference boards (CR) have four additional outer holes in the board. These holes are legacy and are not required for the current ILM reference design and are thus not shown in the current KOZ..6 ILM Cover Intel has developed a cover that will snap on to the ILM for the LG20 socket family. The ILM cover is intended to reduce the potential for socket contact damage from the operator / customer fingers being close to the socket contacts to remove or install the pick and place cover. y design the ILM cover and pick and place covers can not be installed simultaneously. The ILM cover concept is shown in Figure -6. This cover is intended to be used in place of the pick and place cover once the ILM is assembled to the board. The ILM will be offered with the ILM cover pre assembled as well as a discrete part. ILM cover features: Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component. The ILM cover will pop off if a processor is installed in the socket. ILM Cover can be installed while the ILM is open. Maintain inter-changeability between validated ILM vendors for LG20-0 socket. The ILM cover for the LG20-0 socket will have a flammability rating of V-0 per UL Figure -6. ILM with Cover Note: Intel recommends removing the Pick and Place cover (PnP) of the socket body in manufacturing as soon as possible at the time when ILM is being installed. 6 Document Number:

37 Independent Loading Mechanism (ILM).7 Heatsink to ILM interface Heatsinks for processors in the LG20-0 socket attach directly to the ILM via M fasteners. Figure -7 shows the critical dimension features the thermal solution vendor must meet. Figure -7. Heatsink to ILM Interface Mx0.7 PL / See Note elow Note: For IHS height above board see Table - Document Number:

38 Independent Loading Mechanism (ILM) 8 Document Number:

39 LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LG20-0 socket and the Independent Loading Mechanism.. Component Mass Table -. Socket and Retention Component Mass Component Socket ody, Contacts and PnP Cover Square ILM ssembly Narrow ILM ssembly ackplate Mass 25 g 82g 79g 8g Note:. This is an approximate mass..2 Package/Socket Stackup Height Table -2 provides the stackup height of a processor in the 20-0-land LG package and LG20-0 socket with the ILM closed and the processor fully seated in the socket. Table land Package and LG20-0 Socket Stackup Height Integrated Stackup Height (mm) From Top of oard to Top of IHS 8.0 ±0. mm Notes:. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in ppendix, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor EDS listed in Table This value is a RSS calculation at Sigma.. Loading Specifications The socket will be tested against the conditions listed in Section 6 with heatsink and the ILM attached, under the loading conditions outlined in this chapter. Table - provides load specifications for the LG20-0 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions. Document Number:

40 LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table -. Socket and ILM Mechanical Specifications Parameter Min Max Notes Static compressive load from ILM cover to processor IHS 5 N [00 lbf] 72 N [60 lbf],, 7, 8 Heatsink Static Compressive Load OL 222 N [50 lbf] 56 N [80 lbf], 2,,, 8, 0 Heatsink Static Compressive Load EOL 78 N [0 lbf] 56 N [80 lbf],,, 8, 9 Dynamic Load (with heatsink installed) N/ 50 N [2 lbf],, 5, 6, 8 Pick and Place Cover Insertion / Removal force N/ 6.2 N [.7 lbf] 8 Load Lever actuation force N/ N [7.0 lbf] in the vertical direction 8 Maximum heatsink mass N/ 550g Notes:. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that can be applied by the heatsink and it s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.. Loading limits are for the LG20-0 socket.. This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts. 5. Dynamic loading is defined as an ms duration average load superimposed on the static load requirement. 6. Test condition used a heatsink mass of 550 gm [.2 lb.] with 50 g acceleration measured at heatsink mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load. 7. Conditions must be satisfied at the beginning of life (OL) and the loading system stiffness for nonreference designs need to meet a specific stiffness range to satisfy end of life loading requirements. 8. These loading values are preliminary and subjected to change. 9. End of Life (EOL) minimum heatsink static load. The methods and techniques to evaluate heat sink EOL load are included in ppendix F. 0. eginning of Life (EOL) heat sink load. The methods and techniques to evaluate heat sink OL load will be included in a later release of this document.. The maximum mass includes all components in the thermal solution. This mass limit is evaluated using the POR heatsink attached to a PC.. Electrical Requirements LG20-0 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PC to which it is attached. ll specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. 0 Document Number:

41 LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table -. Electrical Requirements for LG20-0 Socket Parameter Value Comment Maximum Socket Part verage Resistance 00 C) Maximum Single Pin Resistance (mean + sigma) 00 C) Dielectric Withstand Voltage Insulation Resistance 25 mω This is the maximum allowable part average socket resistance allowed under all use conditions (EOL and 00 C). This is monitored by measuring the daisy chain resistance of all socket contacts in series across the socket and dividing by the number of contacts measured. The resulting value must be below 25 mω at all use conditions (EOL) and elevated temperature (00C). 8 mω This is the maximum validated single contact resistance on the socket under all use conditions (EOL) and at elevated temperature (00 C). This accounts for resistance variation across the socket. While it is possible that a single contact may reach a resistance of 8 mω, the maximum socket part average resistance spec insures that all contacts averaged together will not be higher than 25 mω 60 Volts RMS 800 MΩ.5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. simplified process flow of this methodology can be seen in Figure -. Figure -. Flow Chart of Knowledge-ased Reliability Evaluation Methodology Establish the market/expected use environment for the technology Develop Speculative stress conditions based on historical data, content experts, and literature search Freeze stressing requirements and perform additional data turns Perform stressing to validate accelerated stressing assumptions and determine acceleration factors detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q2000/pdf/reliability.pdf Document Number:

42 LG20-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications 2 Document Number:

43 Thermal Solutions 5 Thermal Solutions This section describes a U reference heatsink and design targets for 2U heatsinks. 5. Performance Targets 5.. Performance Targets - Square ILM/Heatsink pplication Table 5-, Table 5-2, and Table 5- provide boundary conditions and performance targets for U, 2U, and Tower heatsinks used in conjunction with the square ILM for 8 core/6 core and core processors, respectively. These values are used to generate processor thermal specifications and to provide guidance for heatsink design. ll oundary Conditions are specified at 5 C system ambient temperature and at sea level. Figure 5- shows Ψ ca and pressure drop for the U heatsink versus the airflow provided. est-fit equations are provided to prevent errors associated with reading the graph. Table 5-. Intel Xeon Processor E5-600/2600/600 v Product Families, 8 Core/6 Core Processor Reference Thermal oundary Conditions (Square ILM/HS) TDP Heatsink Technology Ψ C 2 ( o C/W) T L ( o C) irflow (CFM) Delta P inch of H 2 O (Pa) Heatsink Volumetric (mm) 50W (2S WS Only) 5W(2U) 0W (S WS Only) Cu ase, l Fins (Cu-l)/ Heatpipe Cu ase, l Fins (Cu- l)/heatpipe Cu ase, l Fins (Cu-l)/ Heatpipe x00x x9.5x RPM N/ 00x00x2 0W (U) x9.5x25.5 5W(U) x9.5x W (U) Cu ase, l Fins (Cu-l) W (U) x9.5x W (U) Document Number: