Qualcomm Halo WEVC Interoperability

Transcription

1 Thomas Nindl, Director Business Development Qualcomm, Munich Qualcomm Halo WEVC Interoperability Multi-coil resonant magnetic induction emonday, July 21 st, 2014 Qualcomm Technologies, Inc.

2 Marktzutrittsbarrieren für Elektrofahrzeuge (EV) EVs gewinnen Marktanteile, aber noch sind einige Hürden zu meistern Cost of EV $ Public Infrastructure Range Limitations Ease of Charging Wireless EV Charging is one option to help overcome these barriers 2

3 Die Vorteile von drahtloser Ladetechnik (WEVC)....könnten dazu beitragen, diese Hürden zu meistern Universell und einfach Cost of EV $ Smaller EV Batteries Public Infrastructure No charge post or bollards Range Limitations Charge More Often Ease of Charging No plugs or cables 3

4 Unterschiedliche Plattenabstände bzw Luftspalte müssen berücksichtigt werden. Gleichzeitige Einhaltung von Sicherheits- und Regulierungskriterien mm mm mm 4

5 Berücksichtigung von verschiedenen Spulendesigns No two pads have exactly the same magnetic properties efficiency can be compromised without proper control Multi-coil Secondary Vehicle Pads Single Circular/Square Coil Secondary Vehicle Pad Single Coil Solenoid Secondary Vehicle Pad Multi-coil Primary Base Pad Both Primary and Secondary control is needed to support high pad to pad power transfer, high efficiency, compliant emission levels and high misalignment tolerances 5

6 Single circular/square coil and solenoid magnetic pads generally adapted from factory automation systems developed in the 1990 s Increased pad-to-pad air gap from <20mm Some tolerance to misalignment of primary and secondary pads Power up to 3.3 kw Primary control to achieve high energy transfer efficiency Multi-coil magnetic pads evolved to meet broader charging requirements Entwicklungsgeschichte der magnetischen Induktion (Resonanz) From single coil magnetic pads to multi-coil magnetic pad designs Superior pad-to-pad air gap up to 250mm Supports buried primary base pad and high ground clearance vehicles High power 6.6 kw - 20 kw Increased tolerance to misalignment of charging pads Primary and secondary control for superior energy transfer efficiency Interoperable with single-coil magnetic pads Support for semi-dynamic and dynamic charging Regulatory compliance criteria 6

7 Einfachspule und mehrspulige Konstruktionen im Überblick Single coil and Multi-coil vehicle pad types Single Circular/Square Coil (C) Single Coil Solenoid (S) Double D (DD) Double D Quadrature (DDQ) Multi-coil base pad types Double D (DD) Bi-Polar (BP) 7

8 Circular Vergleich der unterschiedlichen Spulenarchitekturen + Low field emissions Large diameter for z-gap Low x/y tolerance Solenoid High emissions Shielding required Solenoid Multi-coil + Good coupling High emissions Shielding required Multi-coil Double D / DDQ + Low field emissions + High Coupling + Superior z- gap + Superior x/y tolerance Flux path height hz z x y Φal z y x Ferrite Coil a Flux Pipe Length (F l) Pad length P x Coil b Intra-pad flux Flux Pipe Φip = Φab+ Φba Φbl Pole face Leakage Sections of coils contributing to Φip Current flow direction Return portion of coil b Actual flux path Desired flux path Quad DD 8

9 Die multi-coil Lösung von Qualcomm Halo WEVC Interoperable with single circular/square coil, solenoid and Multi-coil secondary pads Low field emissions Good coupling High coupling Superior z- gap range Superior x/y tolerance Interoperability with single coil pads 9

10 Grundsätzliche Untersuchungen von Mehrfachspulen Multi-coil magnetic pad performance Single-coil Multi-coil Magnetic throw height A Multi-coil charging pads: Increase the flux path height of single coil charging pads Can lead to smaller vehicle pads Create a flux pipe to help meet compliance regulations Support wireless charging for high ground clearance vehicles Support interoperability between vehicle and base pads from different manufacturers Support high power charging 6.6 kw - 20 kw Magnetic profile 10

11 Das Prinzip der Mehrfachspulen im Vergleich Multi-coil magnetic pad performance Single-coil Multi-coil Magnetic throw height B Multi-coil charging pads: Increase the flux path height of single coil charging pads Can lead to smaller vehicle pads Create a flux pipe to help meet compliance regulations Support wireless charging for high ground clearance vehicles Support interoperability between vehicle and base pads from different manufacturers Support high power charging 6.6 kw - 20 kw Magnetic profile 11

12 Qualcomm Halo WEVC Zusammenfassend: Qualcomm Halo WEVC makes EV charging simple anywhere anytime - High energy transfer efficiency needs both primary and secondary control Multi-coil base pad magnetics support interoperability of different vehicle pad designs Multi-coil magnetics support charging for high ride height vehicles, even with buried primary pads 12

13 Standards, Sicherheit & Komformität Regulations & Requirements Qualcomm Halo WEVC supports Foreign Object Detection and Living Object Protection Notification to smart phone when charging interrupted 14th Nov SAE announce 85kHz as WEVC frequency of operation! 13

14 Faktoren für Wachstumsraten im EV Markt: eine einfache Handhabung und Zukunftsperspektiven Die drei zukünftigen Ladeoptionen: 14

15 FIA Formula E Drive Very Fast and Charge The ultimate EV racing series Safety cars charged using Qualcomm Halo WEVC WEVC offered to teams for 2015 season Qualcomm is an Official Founding Technology Partner Focus is on enabling an enhanced fan experience Exciting a new generation of motor racing fans 15

16 Besten Dank für Ihre Aufmerksamkeit! Thank you Follow us on: For more information on Qualcomm, visit us at: & Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Halo and the Qualcomm Halo logo are trademarks of Qualcomm Incorporated. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners. References in this presentation to Qualcomm may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business. 16